LXA08T600, LXA08B600, LXA08FP600 QspeedTM Family 600 V, 8 A X-Series PFC Diode Product Summary IF(AVG) VRRM QRR (Typ at 125 C) IRRM (Typ at 125 C) Softness tb/ta (Typ at 125 C) 8 600 82 3.5 0.55 General Description A V nC A This device has the lowest QRR of any 600V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. Applications * * * Pin Assignment Power Factor Correction (PFC) Boost Diode Motor drive circuits DC-AC Inverters K K NC Features K K A A TO-220AC TO-263AB LXA08T600 LXA08B600 * * * * Low QRR, Low IRRM, Low tRR High dIF/dt capable (1000A/s) Soft recovery FullPak Insulation = 2500VRMS Benefits * K A TO-220 FullPak A K LXA08FP600 Increases efficiency * Eliminates need for snubber circuits * Reduces EMI filter component size & count * Enables extremely fast switching RoHS Compliant Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21. Absolute Maximum Ratings Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Symbol Parameter VRRM Peak repetitive reverse voltage IF(AVG) Average forward current IFSM IFSM TJ(MAX) TSTG Non-repetitive peak surge current Non-repetitive peak surge current Maximum junction temperature Storage temperature Lead soldering temperature PD Power dissipation www.powerint.com Conditions TJ = 150 C, TC = 122 C (220AC, 263AB) TJ = 150 C, TC = 81C. (FullPak) 60 Hz, 1/2 cycle 1/2 cycle of t=28 s Sinusoid, TC=25 C Leads at 1.6 mm from case, 10 sec TC = 25 C. (220AC, 263AB) TC = 25C. (FullPak) Rating Units 600 8 V A 60 350 150 -55 to 150 300 83 34 A A C C C W W January 2011 LXA08T600/8B600/8FP600 Thermal Resistance Symbol Resistance from: Conditions RJA Junction to ambient RJC Junction to case TO-220AC (Only) TO-220AC, TO-263AB TO-220AC FullPak Rating Units 62 1.5 3.7 C/W C/W C/W 2 www.powerint.com Rev 1.10 01/11 LXA08T600/8B600/8FP600 Electrical Specifications at TJ= 25 C (unless otherwise specified) Symbol Parameter Conditions Min Typ Max Units - 0.85 2.35 2.1 40 250 2.94 - A mA V V pF - 21.5 33 31 82 2.2 3.5 0.74 0.55 34 53 (1) 48 130 (1) 2.8 4.5 (1) - ns ns nC nC A A DC Characteristics IR Reverse current VF Forward voltage CJ Junction capacitance VR = 600V, TJ = 25 C VR = 600V, TJ = 125 C IF = 8A, TJ = 25 C IF = 8A, TJ = 150 C VR = 10V, 1 MHz Dynamic Characteristics tRR Reverse recovery time dI/dt =200 A/s VR=400V, IF=8 A QRR Reverse recovery charge dI/dt =200 A/s VR=400V, IF=8 A IRRM Maximum reverse recovery current dI/dt =200 A/s VR=400V, IF=8 A S t Softness factor = b dI/dt =200 A/s VR=400V, IF=8 A ta TJ=25 C TJ=125 C TJ=25 C TJ =125 C TJ =25 C TJ=125 C TJ =25 C TJ=125 C Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups. (For additional details, see Application Note AN-300.) VR D1 DUT L1 tRR IF dIF/dt ta 15V Pulse generator tb + Rg Q1 0 0.1xIRRM IRRM Figure 1. Reverse Recovery Definitions Figure 2. Reverse Recovery Test Circuit 3 Rev 1.10 01/11 www.powerint.com LXA08T600/8B600/8FP600 24 22 20 18 16 14 12 10 8 6 4 2 0 160 140 Tj=125C 120 Cj (pF) IF (A) Electrical Specifications at TJ= 25 C (unless otherwise specified) Tj=25C 100 80 60 40 20 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 40 60 80 VF (V) Figure 3. Typical IF vs VF 120 140 160 180 Figure 4. Typical Cj vs VR dI/dt=1000A/us 160 dI/dt=200A/us 40 140 35 dI/dt=500A/us 30 tRR (ns) 120 QRR (nC) 100 VR (V) 100 80 dI/dt=200A/us 60 dI/dt=500A/us 25 20 15 40 dI/dt=1000A/us 10 20 5 0 2 4 6 8 10 12 14 0 2 4 6 IF (A) 8 10 12 14 IF (A) Figure 6. Typical tRR vs IF at TJ = 125 C Figure 5. Typical QRR vs IF at TJ = 125 C 25 100 90 TO-220 & TO-263 20 80 P (W) I F (A V) (A) 70 15 FullPak 10 TO-220 & TO-263 60 50 40 FullPak 30 5 20 10 0 0 25 50 75 100 125 o Case Temperature, TC ( C) Figure 7. DC Current Derating Curve 150 25 50 75 100 125 150 o Case Temperature, TC ( C) Figure 8. Power Derating Curve 4 www.powerint.com Rev 1.10 01/11 55 50 45 40 35 30 25 20 15 10 5 0 30 Duty=10% Duty=30% Duty=10% 25 Duty=30% Duty=50% Duty=50% 20 DC IF (PEAK) (A) IF (PEA K) (A ) LXA08T600/8B600/8FP600 DC 15 10 5 0 25 50 75 100 T C(C) 125 25 150 Figure 9. IF(PEAK) vs TC, f=70 kHz, TO-220 and TO-263 50 75 100 T C(C) 125 150 Figure 10. IF(PEAK) vs TC, f=70 kHz, FullPak LXA08T600, LXA08B600 1 D= 0.5 D = 0.3 0.1 D= 0.1 Zth(j-c)/Rth(j-c) D= 0.05 D= 0.02 D= 0.01 0.01 D= 0.005 D= 0.002 Single Pulse 0.001 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 t1(sec) Figure 11. Normalized Maximum Transient Thermal Impedance, TO-220 and TO-263 5 Rev 1.10 01/11 www.powerint.com LXA08T600/8B600/8FP600 LXA08FP600 1 D= 0.5 D = 0.3 0.1 D= 0.1 Zth(j-c)/Rth(j-c) D= 0.05 D= 0.02 0.01 D= 0.01 D= 0.005 D= 0.002 0.001 Single Pulse 0.0001 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 t1(sec) Figure 12. Normalized Maximum Transient Thermal Impedance, FullPak 6 www.powerint.com Rev 1.10 01/11 LXA08T600/8B600/8FP600 Dimensional Outline Drawings TO-220AC Millimeters FullPak A D H4 Dim MIN MAX A 4.32 4.70 A1 1.14 1.40 A2 2.03 2.79 C 0.34 0.610 D 9.65 10.67 E 2.49 2.59 E1 4.98 5.18 F 0.508 1.016 F1 1.14 1.78 H 14.71 16.51 H1 5.84 6.55 H2 8.51 9.25 H3 3.53 3.96 H4 2.54 3.05 L 12.70 14.22 L1 - 6.35 A1 H3 H1 H H2 Millimeters Dim MIN MAX A 4.54 4.80 A1 2.57 2.83 A2 2.51 2.62 C 0.42 0.58 D 10.25 10.72 E E1 L1 F1 F L F C A2 E E1 2.54 (BSC) 5.08 (BSC) 0.624 0.776 F1 1.10 1.65 H 15.86 16.12 H1 6.06 6.56 H2 9.55 9.81 H3 2.95 3.05 H4 3.15 3.25 L 13.33 14.18 L1 3.18 3.43 7 Rev 1.10 01/11 www.powerint.com LXA08T600/8B600/8FP600 TO-263AB Millimeters Dim MIN MAX A 4.40 4.70 A1 0.00 0.25 A2 2.59 2.79 b 0.77 0.90 b2 1.23 1.36 c2 1.22 1.32 D 9.05 9.25 E 10.06 10.26 e 2.54 BSC 2.54 BSC H 14.70 15.50 L 2.00 2.60 L1 1.17 1.40 L2 - 1.75 L3 0.25 BSC 0.25 BSC L4 2.00 BSC 2.00 BSC 0 8 1 5 9 2 1 5 Mechanical Mounting Method Maximum Torque / Pressure specification Screw through hole in package tab Clamp against package body 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2 Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 C, for up to 10 seconds. See Application Note AN-303, for more details. Ordering Information Part Number Package Packing LXA08T600, LXA08FP600 LXA08B600 TO-220AC, FullPak TO-263AB 50 units/tube 800 units/reel The information contained in this document is subject to change without notice. 8 www.powerint.com Rev 1.10 01/11 LXA08T600/8B600/8FP600 Revision 1.9 1.10 Notes Released by Qspeed Converted to Power Integrations Document Date 06/10 01/11 9 Rev 1.10 01/11 www.powerint.com LXA08T600/8B600/8FP600 For the latest updates, visit our website: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. PATENT INFORMATION The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations' patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. 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