LXA08T600, LXA08B600, LXA08FP600
Qspeed™ Family
600 V, 8 A X-Series PFC Diode
www.powerint.com January 2011
Product Summary
IF(AVG) 8 A
VRRM 600 V
QRR (Typ at 125 °C) 82 nC
IRRM (Typ at 125 °C) 3.5 A
Softness tb/ta (Typ at 125 °C) 0.55
TO-220AC TO-263AB
LXA08T600 LXA08B600
TO-220 FullPak
LXA08FP600
General Description
This device has the lowest QRR of any 600V
Silicon diode. Its recovery characteristics
increase efficiency, reduce EMI and eliminate
snubbers.
Applications
• Power Factor Correction (PFC) Boost Diode
• Motor drive circuit s
• DC-AC Inverters
Features
• Low QRR, Low IRRM, Low tRR
• High dIF/dt capable (1000A/µs)
• Soft recovery
• FullPak Insulation = 2500VRMS
Benefits
• Increases efficiency
• Eliminates need for snubber circuit s
• Reduces EMI filter component size & count
• Enables extremely fast switching
RoHS Compliant
Package uses Lead-free plating and
Green mold compound.
Halogen free per IEC 61249-2-21.
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional
operation under these conditions is not implied.
Symbol Parameter Conditions Rating Units
VRRM Peak repetitive reverse voltage 600 V
TJ = 150 °C, TC = 122 °C (220AC, 263AB) 8 A
IF(AVG) Average forward current TJ = 150 °C, TC = 81°C. (FullPak)
IFSM Non-repetitive peak surge current 60 Hz, ½ cycle 60 A
IFSM Non-repetitive peak surge current ½ cycle of t=28 µs Sinusoid, TC=25 °C 350 A
TJ(MAX) Maximum junction temperatur e 150 °C
TSTG Storage temperature –55 to 150 °C
Lead soldering temperature Leads at 1.6 mm from case, 10 sec 300 °C
TC = 25 °C. (220AC, 263AB) 83 W
PD Power dissipation TC = 25°C. (FullPak) 34 W
Pin Assignment
AKAK
K
K
A
K
K
K
K
A
NC
K
A
K
NCNC
K
A
K
A
K
A
K
www.powerint.com Rev 1.10 01/11
LXA08T600/8B600/8FP600
2
Thermal Resistance
Symbol Resistance from: Conditions Rating Units
RθJA Junction to ambient TO-220AC (Only) 62 °C/W
TO-220AC, TO-263AB 1.5 °C/W
RθJC Junction to case TO-220AC FullPak 3.7 °C/W
Rev 1.10 01/11 www.powerint.com
LXA08T600/8B600/8FP600
3
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
Symbol Parameter Conditions Min Typ Max Units
DC Characteristics
IR Reverse current VR = 600V, TJ = 25 °C - - 250 µA
V
R = 600V, TJ = 125 °C - 0.85 - mA
VF Forward voltage IF = 8A, TJ = 25 °C - 2.35 2.94 V
I
F = 8A, TJ = 150 °C - 2.1 - V
CJ Junction capacitance VR = 10V, 1 MHz - 40 - pF
Dynamic Characteristics
tRR T
J=25 °C - 21.5 34 ns
Reverse recovery time dI/dt =200 A/µs
VR=400V, IF=8 A TJ=125 °C - 33 53 (1) ns
QRR T
J=25 °C - 31 48 nC
Reverse recovery charge dI/dt =200 A/µs
VR=400V, IF=8 A TJ =125 °C - 82 130 (1) nC
IRRM T
J =25 °C - 2.2 2.8 A
Maximum reverse
recovery current dI/dt =200 A/µs
VR=400V, IF=8 A TJ=125 °C - 3.5 4.5 (1) A
S TJ =25 °C - 0.74 -
Softness factor = a
b
t
t dI/dt =200 A/µs
VR=400V, IF=8 A TJ=125 °C - 0.55 -
Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction.
Therefore, Component Engin eers sh ould p lan their test s etups to be sim ilar to thos e for traditi onal Sch ottky test setups .
(For additional details, see Application Note AN-300.)
Figure 1. Reverse Recovery Definitions
Figure 2. Reverse Recovery Test Circuit
Pulse generator
Rg Q1
VR
+
15V
D1
DUT
L1
IF
dIF/dt
IRRM
tRR
tb
ta
0
0.1xIRRM
www.powerint.com Rev 1.10 01/11
LXA08T600/8B600/8FP600
4
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
0
2
4
6
8
10
12
14
16
18
20
22
24
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
I
F
(A)
V
F
(V)
Tj=125C
Tj=25C
Figure 3. Typical IF vs VF
0
20
40
60
80
100
120
140
160
0 20406080100120140160180
C
j
(pF)
V
R
(V)
Figure 4. Typical Cj vs VR
20
40
60
80
100
120
140
160
02468101214
Q
RR
(nC)
I
F
(A)
dI/dt=1000A/us
dI/dt=200A/us
dI/dt=500A/us
Figure 5. Typical QRR vs IF at TJ = 125 °C
5
10
15
20
25
30
35
40
02468101214
t
RR
(ns)
I
F
(A)
dI/dt=200A/us
dI/dt=1000A/us
dI/dt=500A/us
Figure 6. Typical tRR vs IF at TJ = 125 °C
0
5
10
15
20
25
25 50 75 100 125 150
Case Temperature, T
C
(
o
C)
I
F(AV)
(A)
TO-220 & TO-263
FullPak
Figure 7. DC Current Derating Curve
0
10
20
30
40
50
60
70
80
90
100
25 50 75 100 125 150
Case Temperature, T
C
(
o
C)
P (W)
TO-220 & TO-263
FullPak
Figure 8. Power Derating Curve
Rev 1.10 01/11 www.powerint.com
LXA08T600/8B600/8FP600
5
0
5
10
15
20
25
30
35
40
45
50
55
25 50 75 100 125 150
TC(°C)
IF(PEAK) (A)
Duty=10%
Duty=50%
Duty=30%
DC
Figure 9. IF(PEAK) vs TC, f=70 kHz,
TO-220 and TO-263
0
5
10
15
20
25
30
25 50 75 100 125 150
TC(°C)
IF(PEAK) (A)
Duty=10%
Duty=50%
Duty=30%
DC
Figure 10. IF(PEAK) vs TC, f=70 kHz, FullPak
LXA08T600, LXA 08B600
0.001
0.01
0.1
1
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
t1(sec)
Zth(j-c)/Rth(j-c
)
D= 0. 002
D= 0. 005
D= 0.01
D= 0. 02
D= 0.05
D= 0. 1
D = 0.3
D= 0. 5
Single Pulse
Figure 11. Normalized Maximum Transient Thermal Impedance, TO-220 and TO-263
www.powerint.com Rev 1.10 01/11
LXA08T600/8B600/8FP600
6
LXA08FP600
0.0001
0.001
0.01
0.1
1
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
t1(sec)
Zth(j-c)/Rth(j-c
)
D= 0. 002
D= 0. 005
D= 0. 01
D= 0. 02
D= 0. 05
D= 0. 1
D = 0. 3
D= 0. 5
Single Pulse
Figure 12. Normalized Maximum Transient Thermal Impedance, FullPak
Rev 1.10 01/11 www.powerint.com
LXA08T600/8B600/8FP600
7
Dimensional Outline Drawings
TO-220AC
Millimeters
Dim MIN MAX
A 4.32 4.70
A1 1.14 1.40
A2 2.03 2.79
C 0.34 0.610
D 9.65 10.67
E 2.49 2.59
E1 4.98 5.18
F 0.508 1.016
F1 1.14 1.78
H 14.71 16.51
H1 5.84 6.55
H2 8.51 9.25
H3 3.53 3.96
H4 2.54 3.05
L 12.70 14.22
L1 - 6.35
FullPak
Millimeters
Dim MIN MAX
A 4.54 4.80
A1 2.57 2.83
A2 2.51 2.62
C 0.42 0.58
D 10.25 10.72
E 2.54 (BSC)
E1 5.08 (BSC)
F 0.624 0.776
F1 1.10 1.65
H 15.86 16.12
H1 6.06 6.56
H2 9.55 9.81
H3 2.95 3.05
H4 3.15 3.25
L 13.33 14.18
L1 3.18 3.43
C
AA1
A2
H3
D
H4
H
H2
EE1
L
L1
F
F1
H1
C
AA1
A2
H3
D
H4
H
H2
EE1
L
L1
F
F1
H1
www.powerint.com Rev 1.10 01/11
LXA08T600/8B600/8FP600
8
TO-263AB
Mechanical Mounting
Method Maximum Torque / Pressure specification
Screw through hole in package tab 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in)
Clamp against package body 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2
Soldering time and temperature: This product has been designed for use with high-
temperature, lead-free solder. The component leads can be subjected to a maximum
temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more
details.
Ordering Information
Part Number Package Packing
LXA08T600, LXA08FP600 TO-220AC, FullPak 50 units/tube
LXA08B600 TO-263AB 800 units/reel
The information contained in this document is subject to change without notice.
Millimeters
Dim MIN MAX
A 4.40 4.70
A1 0.00 0.25
A2 2.59 2.79
b 0.77 0.90
b2 1.23 1.36
c2 1.22 1.32
D 9.05 9.25
E 10.06 10.26
e 2.54 BSC 2.54 BSC
H 14.70 15.50
L 2.00 2.60
L1 1.17 1.40
L2 – 1.75
L3 0.25 BSC 0.25 BSC
L4 2.00 BSC 2.00 BSC
Θ 0° 8°
Θ1 5° 9°
Θ2 1° 5°
Rev 1.10 01/11 www.powerint.com
LXA08T600/8B600/8FP600
9
Revision Notes Date
1.9 Released by Qspeed 06/10
1.10 Converted to Power Integrations Document 01/11
www.powerint.com Rev 1.10 01/11
LXA08T600/8B600/8FP600
10
For the latest updates, visit our website: www.powerint.com
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability.
Power Integrations do es not assume an y li abilit y arisi ng from the use of any device or circuit descri bed here in. POW ER
INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING,
WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, AND NON-INFRINGEMENT OF THIRD PART Y RIGHT S.
PATENT INFORMATION
The products and applications illustrated herein (including transformer construction and circuits external to the products)
may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applicatio ns
assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power
Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm.
The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS,
Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are t ra de ma rks of Power Integrations, Inc.
Other trademarks are property of their respective companies. © Cop yright 2011 Power Integrations, Inc.
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