LT4294
1
Rev. A
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TYPICAL APPLICATION
FEATURES DESCRIPTION
IEEE 802.3bt
PD Interface Controller
The LT
®
4294 is an IEEE 802.3af/at/bt (Draft 3.7)-compliant
powered device (PD) interface controller. The T2P output
indicates the number of classification events received
during IEEE 802.3bt-compliant mutual identification and
negotiation of available power.
The LT4294 utilizes an external, low RDS(ON) N-channel
hot swap MOSFET and supports the LT4320/LT4321 ideal
diode bridges, to extend the end-to-end power delivery
efficiency and eliminate costly heat sinks. The LT4294
also includes a power good output, onboard signature
resistor, undervoltage lockout, and thermal protection.
Start-up inrush current is adjustable with an external
capacitor. Auxiliary power override is supported as low
as 9V with the AUX pin.
The LT4294 can be configured to support all possible
802.3bt, 802.3at and 802.3af power levels with external
component changes. Pin-for-pin compatibility with the
LT4275 family of PD Interface Controllers enables easy
migration between LTPoE++ PDs and IEEE 802.3bt-
compliant PDs.
IEEE 802.3bt Single-Signature Powered Device Interface
APPLICATIONS
n IEEE 802.3af/at/bt (Draft 3.7) Powered Device (PD)
Controller
n Supports Up to 71.3W PDs
n 5-Event Classification Sensing
n Superior Surge Protection (100V Absolute Maximum)
n Wide Junction Temperature Range (40°C to 125°C)
n Overtemperature Protection
n Integrated Signature Resistor
n External Hot Swap N-Channel MOSFET for Lowest
Power Dissipation and Highest System Efficiency
n Configurable Aux Power Support as Low as 9V
n Easy Migration Between LTPoE++
®
PDs and IEEE
802.3bt PDs
n Pin Compatible with LT4275A/B/C
n Available in 10-Lead MSOP and 3mm × 3mm DFN
Packages
n High Power Wireless Data Systems
n Outdoor Security Camera Equipment
n Commercial and Public Information Displays
n High Temperature Industrial Applications
Single-Signature
Power Classification
CLASS
AVAILABLE
POWER
AT PD INPUT
0 13W
1 3.84W
2 6.49W
3 13W
4 25.5W
5 40W
6 51W
7 62W
8 71.3W
LT4294
VPORT HSGATE
GND
4294 TA01a
HSSRC
AUX
RCLASS
RCLASS++
RCLS++
PWRGD
T2P
RCLS
CPD
0.1µF
VPORT
DATA
PAIR
SPARE
PAIR
RUN
47nF
3.3k
PSMN040-100MSE
VIN
VOUT
+
ISOLATED
POWER
SUPPLY
OPTO PSE TYPE
(TO µP)
+
~
~
+
~
~
+
CPORT
VAUX (9V TO 60V)
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LT4294
2
Rev. A
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ORDER INFORMATION
ABSOLUTE MAXIMUM RATINGS
VPORT, HSSRC Voltages ......................... 0.3V to 100V
HSGATE Current.................................................. ±20mA
RCLASS, RCLASS++
Voltages .......................... 0.3V to 8V (and VPORT)
AUX Current ........................................................ ±1.4mA
T2P, PWRGD Voltage ............................... 0.3V to 100V
T2P, PWRGD Current ...............................................5mA
(Notes 1, 3)
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT4294IDD#PBF LT4294IDD#TRPBF LHBX 10-Lead (3mm × 3mm) Plastic DFN –40°C to 85°C
LT4294HDD#PBF LT4294HDD#TRPBF LHBX 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT4294IMS#PBF LT4294IMS#TRPBF LTHBW 10-Lead Plastic MSOP –40°C to 85°C
LT4294HMS#PBF LT4294HMS#TRPBF LTHBW 10-Lead Plastic MSOP –40°C to 125°C
Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
TOP VIEW
11
GND
DD PACKAGE
10-LEAD (3mm × 3mm) PLASTIC DFN
TJMAX = 150°C, θJC = 5°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND
10
9
6
7
8
4
5
3
2
1VPORT
HSGATE
HSSRC
PWRGD
T2P
GND
AUX
RCLASS
RCLASS++
GND
1
2
3
4
5
GND
AUX
RCLASS
RCLASS++
GND
10
9
8
7
6
VPORT
HSGATE
HSSRC
PWRGD
T2P
TOP VIEW
MS PACKAGE
10-LEAD PLASTIC MSOP
TJMAX = 150°C, θJC = 45°C/W
PIN CONFIGURATION
Operating Junction Temperature Range (Note 4)
LT4294I ................................................40°C to 85°C
LT4294H ............................................ 40°C to 125°C
Storage Temperature Range .................. 65°C to 150°C
Lead Temperature (Soldering, 10 sec.) ..................300°C
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VPORT Operating Input Voltage At VPORT Pin l60 V
VSIG VPORT Signature Range At VPORT Pin l1.5 10 V
VCLASS VPORT Classification Range At VPORT Pin l12.5 21 V
VMARK VPORT Mark Range At VPORT Pin, Preceded by VCLASS l5.6 10 V
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 3)
LT4294
3
Rev. A
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ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 3)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VPORT Aux Mode Range At VPORT Pin, AUX > VAUXT l8 60 V
Signature/Class Hysteresis Window l1.0 V
VRESET Reset Threshold At VPORT Pin, Preceded by VCLASS l2.6 5.6 V
VHSON Hot Swap Turn-On Voltage l35 37 V
VHSOFF Hot Swap Turn-Off Voltage l30 31 V
Hot Swap On/Off Hysteresis Window l3 V
Supply Current
Supply Current VVPORT = VHSSRC = 57V l2 mA
Supply Current During Classification VVPORT = 17.5V, RCLASS and RCLASS++ Open l0.4 0.7 0.9 mA
Supply Current During Mark Event VVPORT = VMARK After 1st Classification Event l0.5 2.2 mA
Detection and Classification Signature
Detection Signature Resistance VSIG (Note 2) l23.7 24.4 25.2
Resistance During Mark Event VMARK (Note 2) l5.8 8.3 11
RCLASS/RCLASS++ Operating Voltage –10mA ≥ IRCLASS ≥ –36mA, VCLASS l1.32 1.40 1.43 V
Classification Signature Stability Time VVPORT Step to 17.5V,
34.8Ω from RCLASS or RCLASS++ to GND
l2 ms
Analog/Digital Interface
VAUXT AUX Threshold l6.1 6.3 6.5 V
IAUXH AUX Pin Hysteresis Current VAUX = 6.1V l3.2 5 7 µA
T2P Output Low 1mA Load l0.8 V
PWRGD Output Low 1mA Load l0.8 V
PWRGD Leakage Current VPWRGD = 60V l5 µA
T2P Leakage Current T2P = 60V l5 µA
Hot Swap Control
IGPU HSGATE Pull-Up Current VHSGATE – VHSSRC = 5V (Note 6) l–27 –22 –18 µA
VGOC HSGATE Open Circuit Voltage –10µA Load, with Respect to HSSRC l10 18 V
HSGATE Pull-Down Current VHSGATE – VHSSRC = 5V l200 µA
Timing
fT2P T2P Frequency After PWRGD Valid, if IEEE802.3bt PSE Is Mutually Identified l690 840 990 Hz
T2P Duty Cycle in PoE Operation (Note 5) After 4-Event Classification
After 5-Event Classification
(RCLASS++ Has Resistor to GND)
50
25 %
%
T2P Duty Cycle in Auxiliary
Supply Operation (Note 5) VAUX > VAUXT, and RCLASS++ Has Resistor to GND 25 %
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Signature resistance specifications do not include resistance
added by the external diode bridge which can add as much as 1.1k to the
port resistance.
Note 3: All voltages with respect to GND unless otherwise noted. Positive
currents are into pins; negative currents are out of pins unless otherwise
noted.
Note 4: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 150°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
Note 5: Specified as the percentage of the period which T2P is low
impedance with respect to GND.
Note 6: IGPU available in PoE powered operation. That is, available after
VVPORT > VHSON and VAUX < VAUXT, over the range where VVPORT is
between VHSOFF and 60V.
LT4294
4
Rev. A
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TYPICAL PERFORMANCE CHARACTERISTICS
Detection Signature Resistance
vs Input Voltage Reset Threshold
PWRGD, T2P Output Low
Voltage vs Current VPORT Classification Thresholds T2P Frequency
Input Current vs Input Voltage 25k
Detection Signature Range
VPORT Hot Swap Thresholds Supply Current During Power-On
VPORT VOLTAGE (V)
0
VPORT CURRENT (mA)
0.2
0.3
0.4
0.5
0.1
08
4294 G01
1062 4
T = –40°C
T = 25°C
T = 75°C
T = 125°C
TEMPERATURE (°C)
–50
VPORT VOLTAGE (V)
32
33
34
35
36
37
31
30 100
4294 G02
12575–25 50250
Hot Swap OFF
Hot Swap ON
VPORT VOLTAGE (V)
35
SUPPLY CURRENT (mA)
1.0
1.5
2.0
0.5
055
4294 G03
605040 45
T = –40°C
T = 25°C
T = 75°C
T = 125°C
VPORT VOLTAGE (V)
1
SIGNATURE RESISTANCE (kΩ)
25.25
25.75
26.25
24.75
24.25
23.75
4294 G04
973 5
T = –40°C
T = 25°C
T = 75°C
T = 125°C
TEMPERATURE (°C)
–50
VPORT VOLTAGE (V)
3.6
4.1
5.1
4.6
5.6
3.1
2.6 100
4294 G05
12575–25 50250
CURRENT (mA)
0
VOLTAGE (V)
2
3
4
1
04
4294 G06
531 2
T = –40°C
T = 25°C
T = 75°C
T = 125°C
TEMPERATURE (°C)
–50
VPORT VOLTAGE (V)
11.0
11.5
12.0
12.5
10.5
10.0 100
4294 G07
12575–25 50250
DETECT OR MARK TO CLASS
CLASS TO MARK
TEMPERATURE (°C)
–50
T2P FREQUENCY (Hz)
840
740
890
940
990
790
690 100
4294 G08
12575–25 50250
LT4294
5
Rev. A
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PIN FUNCTIONS
GND (Pins 1, 5, DFN Exposed Pad Pin 11): Device Ground.
Exposed Pad must be electrically and thermally connected
to pin 5 and PCB GND.
AUX (Pin 2): Auxiliary Sense. A resistive divider from the
auxiliary power input to AUX sets the voltage at which the
auxiliary supply takes over. In auxiliary power operation,
HSGATE pulls down, the signature resistor disconnects,
classification is disabled, the PWRGD pin is high imped-
ance and T2P indicates max available power. The AUX pin
sinks IAUXH when below its threshold voltage of VAUXT to
provide hysteresis. Connect to GND when not used.
RCLASS (Pin 3): Configurable PoE Classification Resistor.
See Table 2.
RCLASS++ (Pin 4): Configurable PoE Classification Resis-
tor. See Table 2.
T2P (Pin 6): PSE Type Indicator, Open-Drain Output. See
the Applications Information section for pin behavior.
PWRGD (Pin 7): Power Good Indicator, Open-Drain Output.
Pulls to GND during VCLASS and inrush.
HSSRC (Pin 8): External Hot Swap MOSFET Source. Con-
nect to source of the external MOSFET.
HSGATE (Pin 9): External Hot Swap MOSFET Gate Control,
Output. Connect to gate of the external MOSFET.
VPORT (Pin 10): PD interface upper power rail and external
Hot Swap MOSFET drain connection.
LT4294
6
Rev. A
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BLOCK DIAGRAM
4294 BD
CONTROL
LOGIC
CLASSIFICATION
LOGIC
VOLTAGE AND
CURRENT REFERENCES
CHARGE
PUMP
OVERTEMP
ON
GND
VPORT VPORT
VGOC
6.3V
~6.5V
1.4V 1.4V
+
+
EN
+
EN
VPORT
VPORT
AUX
RCLASS RCLASS++
T2P
HSSRC
HSGATE
PWRGD
LT4294
7
Rev. A
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APPLICATIONS INFORMATION
OVERVIEW
Power over Ethernet (PoE) continues to gain popularity
as products take advantage of DC power and high speed
data available from a single RJ45 connector. Powered
device(PD) equipment vendors are running into the 25.5W
power limit established by the IEEE 802.3at standard.
The LT4294 is an IEEE 802.3bt (Draft 3.7)-compliant PD
interface controller, and allows up to 71.3W operation while
maintaining backwards compatibility with existing PSE
systems. The T2P output indicates the number of clas-
sification events received during IEEE 802.3bt-compliant
mutual identification and negotiation of available power.
The LT4294 controls a low RDS(ON) N-channel MOSFET
to maximize efficiency and delivered power.
Analog Devices also provides the LT4295, an IEEE 802.3bt-
compliant PD with an integrated switching regulator to
service applications that require a more compact and
integrated solution.
IEEE 802.3bt vs LTPoE++ Available Power
The LT4294 supports IEEE 802.3bt PD power levels up
to 71.3W.
The LT4275 and LT4276 are available to support PD power
levels up to 90W under the LTPoE++ standard. See the
Related Parts section for a list of LTPoE++ products.
MODES OF OPERATION
Detection Signature
During detection, the PSE looks for a 25k signature resis-
tor which identifies the device as a PD. The PSE will apply
two voltages in the range of 2.7V to 10.1V and measure
the corresponding currents. Figure 1 shows the detection
voltages. The PSE calculates the signature resistance using
a ∆V/∆I measurement technique.
The LT4294 presents its precision, temperature-compen-
sated 24.4k resistor between the VPORT and GND pins,
allowing the PSE to recognize a PD is present and request-
ing power to be applied. The LT4294 signature resistor is
Figure 1. Type 3 or 4 PSE, 1-Event Class Sequence
smaller than 25k to compensate for the additional series
resistance introduced by the IEEE required bridge or the
LT4321-based ideal diode bridge.
IEEE 802.3bt Single-Signature vs Dual-Signature PDs
IEEE 802.3bt defines two PD topologies: single-signature
and dual-signature. The LT4294 primarily targets single-
signature PD topologies, eliminating the need for a second
PD controller. All PD descriptions and IEEE 802.3 standard
references in this data sheet are limited in scope to single-
signature PDs.
The LT4294 may be deployed in dual-signature PD ap-
plications. For more information, contact Analog Devices
Applications.
Classification Signature and Mark
The classification/mark process varies depending on the
PSE type. A PSE, after a successful detection, may ap-
ply a classification probe voltage of 14.5V to 20.5V and
measure the PD classification signature current. Once the
PSE applies a classification probe voltage, the PSE returns
the PD voltage to the mark voltage range before applying
another classification probe voltage, or powering up the PD.
An example of 1-Event classification is shown in Figure 1. In
2-Event classification, a PSE probes for power classification
twice as shown in Figure 2. An IEEE 802.3bt PSE may apply
as many as 5 events before powering up the PD.
4294 F01
V
VPORT
VHSON
VHSOFF
VCLASSMIN
VMARKMAX
VSIGMIN
VRESET
DETECT
1ST MARK
1ST CLASS
POWER ON
LT4294
8
Rev. A
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Figure 2. Type 2 PSE, 2-Event Class Sequence
APPLICATIONS INFORMATION
Table 2. Single-Signature Classification Codes, Power Levels and Resistor Selection
PD REQUESTED
CLASS PD POWER AVAILABLE PD TYPE NOMINAL CLASS CURRENT
RESISTOR (1%)
RCLS RCLS++
0 13W Type 1 2.5mA 1.00kΩ Open
1 3.84W Type 1 or 3 10.5mA 140Ω Open
2 6.49W Type 1 or 3 18.5mA 76.8Ω Open
3 13W Type 1 or 3 28mA 49.9Ω Open
4 25.5W Type 2 or 3 40mA 34.8Ω Open
5 40W Type 3 40mA/2.5mA 1.00kΩ 37.4Ω
6 51W Type 3 40mA/10.5mA 140Ω 46.4Ω
7 62W Type 4 40mA/18.5mA 76.8Ω 64.9Ω
8 71.3W Type 4 40mA/28mA 49.9Ω 118Ω
Figure 3. Type 3 or 4 PSE, 3-Event Class Sequence
IEEE 802.3bt Physical Classification and Demotion
IEEE 802.3bt defines physical classification to allow a PD
to request a power allocation from the connected PSE and
to allow the PSE to inform the PD of the PSEs available
power. Demotion is provided if the PD requested power
level is not available at the PSE. If demoted, the PD must
operate in a lower power state.
The number of class/mark events issued by the PSE
directly indicates the power allocated to the PD and is
summarized in Table 1.
IEEE 802.3bt provides nine PD classes and four PD types,
as shown in Table 2. The LT4294 class is configured by
setting the RCLS and RCLS++ resistor values.
Table 1. PSE Allocated Class Power
PD REQUESTED
CLASS
NUMBER OF PSE CLASS/MARK EVENTS
12345
0 13W
1 3.84W
2 6.49W
3 13W
413W 25.5W
513W 25.5W 40W
613W 25.5W 51W
713W 25.5W 51W 62W
813W 25.5W 51W 71.3W
Note: Bold indicates the PD has been demoted.
4294 F02
V
PORT
VHSON
VHSOFF
VCLASSMIN
VMARKMAX
VSIGMIN
VRESET
DETECT
1ST CLASS
1ST MARK 2ND MARK
2ND CLASS
POWER ON
PORT
VHSON
VHSOFF
VCLASSMIN
VMARKMAX
VSIGMIN
VRESET
DETECT
1ST CLASS
1ST MARK 2ND MARK 3RD MARK
2ND CLASS 3RD CLASS
LT4294
9
Rev. A
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IEEE 802.3bt PSEs present a single classification event
(see Figure 1) to Class 0 through 3 PDs. A Class 0 through
3 PD presents its class signature to the PSE and is then
powered on if sufficient power is available. Power limited
IEEE 802.3bt PSEs may issue a single event to Class 4 and
higher PDs in order to demote those PDs to Class 3 (13W).
IEEE 802.3bt PSEs present up to three classification events,
depending on PSE Type, to Class 4 PDs (see Figure 3). Class
4 PDs present a class signature 4 on all events. The third
event differentiates a Class 4 PD from a higher Class PD.
Power-limited IEEE 802.3bt PSEs may issue three events
to Class 5 and higher PDs in order to demote those PDs
to Class 4 (25.5W).
IEEE 802.3bt PSEs present four classification events (see
Figure 4) to Class 5 and 6 PDs. Class 5 and 6 PDs present
a class signature 4 on the first two events, then present
a class signature 0 or 1, respectively, on the remaining
events. Power limited IEEE 802.3bt PSEs may issue four
events to Class 7 and higher PDs in order to demote those
PDs to Class 6 (51W).
IEEE 802.3bt PSEs present five classification events (see
Figure 5) to Class 7 and 8 PDs. Class 7 and 8 PDs present
a class signature 4 on the first two events, then present a
class signature 2 or 3, respectively, on the remaining events.
The number of classification/mark events is communicated
through the LT4294 T2Ppin. See T2P Output section for
more details.
Classification Resistors (RCLS and RCLS++)
The RCLS and RCLS++ resistors set the classification currents
corresponding to the PD power classification. Select the
value of RCLS and RCLS++ from Table 2 and connect each
1% resistor between the RCLASS, RCLASS++ pins and GND.
Detection Signature Corrupt During Mark Event
During the mark event, the LT4294 presents <11kΩ to the
port as required by the IEEE 802.3 specification.
Inrush and Power On
Once the PSE detects and classifies the PD, the PSE then
powers on the PD. When the port voltage rises above the
VHSON threshold, it begins to source IGPU out of the HSGATE
pin. This current flows into an external capacitor, CGATE in
Figure 6, that causes a voltage to ramp up the gate of the
external MOSFET. The external MOSFET acts as a source
follower and ramps the voltage up on the output bulk
capacitor, CPORT, thereby determining the inrush current,
IINRUSH. Design IINRUSH to be approximately ~100mA.
See equation below:
IINRUSH =IGPU CPORT
C
GATE
Figure 5. Type 4 PSE, 5-Event Class Sequence
APPLICATIONS INFORMATION
Figure 4. Type 3 or 4 PSE, 4-Event Class Sequence
Figure 6. Configuring IINRUSH
4294 F04
VPORT
VHSON
VHSOFF
VCLASSMIN
VMARKMAX
VSIGMIN
VRESET
DETECT
1ST
CLASS 2ND
CLASS 3RD
CLASS 4TH
CLASS
POWER ON
1ST
MARK 2ND
MARK 3RD
MARK 4TH
MARK
4294 F05
VPORT
VHSON
VHSOFF
VCLASSMIN
VMARKMAX
VSIGMIN
VRESET
DETECT
1ST
CLASS 2ND
CLASS 3RD
CLASS 4TH
CLASS 5TH
CLASS
POWER ON
1ST
MARK 2ND
MARK 3RD
MARK 4TH
MARK 5TH
MARK
LT4294
HSGATE
GND
4294 F06
VPORT HSSRC
CGATE
3.3k
+
C
PORT
VPORT
I
INRUSH
LT4294
10
Rev. A
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The LT4294 internal charge pump provides an N-channel
MOSFET solution, eliminating a larger and more costly
P-channel MOSFET. The low RDS(ON) MOSFET also maxi-
mizes power delivery and efficiency, reduces power and
heat dissipation, and eases thermal design.
Power Good
The PWRGD pin is held low by its open drain output until
HSGATE charges up to approximately 7V above HSSRC.
The PWRGD pin is used to hold off the downstream cir-
cuitry until inrush is complete and the external MOSFET
is fully enhanced. The HSGATE pin remains high and the
PWRGD pin remains open-drain until the port voltage
falls below VHSOFF.
Delay Start
When the PSE powers up the port, the PD application
should not draw more than 350mA for 80ms to comply
with the IEEE 802.3 standard.
Auxiliary Supply Override
If the AUX pin is held above VAUXT, the LT4294 enters
auxiliary power supply override mode. In this mode the
signature resistor disconnects, classification is disabled,
HSGATE pulls down, the PWRGD pin is open drain and
T2P pin indicates max available power.
The AUX pin allows for setting the auxiliary supply turn
on and turn off voltage thresholds, VAUXON, and VAUXOFF
respectively. The auxiliary supply hysteresis voltage,
VAUXHYS, is generated with sinking current, IAUXH, and is
active only when the AUX pin voltage is less than VAUXT.
Use the following equations to set VAUXON and VAUXOFF
via R1 and R2 in Figure 7. Note that an internal 6.5V Zener
limits the voltage on the AUX pin.
APPLICATIONS INFORMATION
A capacitor up to 1000pF may be placed between the AUX
pin and GND to improve noise immunity. VAUXON must be
lower than VHSOFF.
T2P Output
The LT4294 communicates the PSE allocated power to
the PD application via the T2P pin. The T2P pin state is
determined by the AUX pin, the RCLASS++ pin, and the
number of classification events. The LT4294 uses a 4-state
encoding for the T2P output. T2P state and the associated
PSE allocated power are shown in Table 3.
Table 3. T2P Response to Determine PSE Allocated Power
AUX
STATE
PD
REQUESTED
CLASS
(RCLASS/
RCLASS++)
NUMBER
OF CLAS-
SIFICATION
EVENTS
T2P WITH
RESPECT TO
GND
PSE
ALLOCATED
POWER
Auxiliary
0-4 N/A Low-Z AUX Power
5-8 N/A 25% Low-Z,
75% Hi-Z AUX Power
PoE
0-4 1 Hi-Z 13W
≥ 2 Low-Z 25.5W
5-8
1 Hi-Z 13W
2 or 3 Low-Z 25.5W
450% Low-Z,
50% Hi-Z
Min (PD
Requested
Class, 51W)
525% Low-Z,
75% Hi-Z
Min (PD
Requested
Class, 71.3W)
The highest priority input is the AUX pin. AUX is asserted
to enter the auxiliary power state and deasserted to enter
the PoE state. In the auxiliary power state, the T2P pin
indicates the highest available power, based on PD Re-
quested Class. The auxiliary power supply must be sized
to provide at least the PD Requested Class Power.
Figure 8. Response Example for 25% Low-Z, 75% Hi-Z
LT4294
4294 F08
VCC
GND
T2P
V(T2P)
GND
VCC
25%
Low-Z
75%
Hi-Z
TIME
Figure 7. AUX Threshold and Hysteresis Calculation
LT4294
GND
4294 F07
AUX
R1
VAUX
+
R2
R1=
V
AUXON
V
AUXOFF
IAUXH =
V
AUXHYS
IAUXH
R2 =R1
VAUXOFF
VAUXT 1
R1VAUX(MAX) VAUXT
1.4mA
LT4294
11
Rev. A
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Second, the PD Requested Class is configured using the
RCLASS and RCLASS++ pins. The RCLASS++ pin alone
can be used to determine if the PD Class is 0-4 or 5-8, as
shown in Table 2.
Last, the number of classification events determines the
amount of power allocated by the PSE as described in
Table 1.
Overtemperature Protection
The IEEE 802.3 specification requires a PD to withstand
any applied voltage from 0V to 57V indefinitely. During
classification, however, the power dissipation in the LT4294
may be as high as 1.5W. The LT4294 can easily tolerate
this power for the maximum IEEE classification timing but
overheats if this condition persists abnormally.
The LT4294 includes an overtemperature protection feature
which is intended to protect the device during momentary
overload conditions. If the junction temperature exceeds
the overtemperature threshold, the LT4294 pulls down
HSGATE pin, and disables classification.
EXTERNAL INTERFACE AND COMPONENT SELECTION
PoE Input Bridge
A PD is required to polarity-correct its input voltage. There
are several different options available for bridge rectifiers;
silicon diodes, Schottky diodes, and ideal diodes. When
silicon or Schottky diode bridges are used, the diode for-
ward voltage drops affect the voltage at the VPORT pin.
The LT4294 is designed to tolerate these voltage drops.
Note, the voltage parameters shown in the Electrical
Characteristics are specified at the LT4294 package pins.
A silicon diode bridge consumes up to 4% of the avail-
able power. In addition, silicon diode bridges exhibit poor
pairset-to-pairset unbalance performance. Each branch of
a silicon diode bridge shares source/return current, and
thermal runaway can cause large, non-compliant current
unbalances between pairsets.
While using Schottky diodes can help reduce the power
loss with a lower forward voltage, the Schottky bridge
may not be suitable for high temperature PD applications.
Schottky diode bridges exhibit temperature induced leakage
currents. The leakage current has a voltage dependency
that can invalidate the measured detection signature. In
addition, these leakage currents can back-feed through
the unpowered branch and the unused bridge, violating
IEEE 802.3 specifications.
For high efficiency applications, the LT4294 supports an
LT4321-based PoE ideal diode bridge that reduces the
forward voltage drop from 0.7V to 20mV per diode while
maintaining IEEE 802.3 compliance. The LT4321 simpli-
fies thermal design, eliminates costly heatsinks, and can
operate in space-constrained applications.
Auxiliary Input Diode Bridge
Some PDs are required to receive AC or DC power from an
auxiliary power source. A diode bridge is typically required
to handle the voltage rectification and polarity correction.
In high efficiency applications, or in low auxiliary input
voltage applications, the voltage drop across the rectifier
cannot be tolerated. The LT4294 can be configured with
an LT4320-based ideal diode bridge to recover the diode
voltage drop and ease thermal design.
For applications with auxiliary input voltages below 10V,
the LT4294 must be configured with an LT4320-based ideal
diode bridge to recover the voltage drop and guarantee the
minimum VPORT voltage is within the VPORT AUX Mode
Range as specified in the Electrical Characteristics table.
An example of a high efficiency typical application circuit
is show in the Typical Application section.
Input Capacitor
A 0.1μF capacitor is needed from VPORT to GND to meet
the input impedance requirement in IEEE 802.3 and to
properly bypass the LT4294. When operating with the
LT4321, locally bypass each with a 0.047μF capacitor, thus
keeping the total port capacitance within specification.
Transient Voltage Suppressor
The LT4294 specifies an absolute maximum voltage of
100V and is designed to tolerate brief overvoltage events
APPLICATIONS INFORMATION
LT4294
12
Rev. A
For more information www.analog.com
due to Ethernet cable surges. To protect the LT4294 from
an overvoltage event, install a unidirectional transient volt-
age suppressor (TVS) such as an SMAJ58A between the
VPORT and GND pins. For PD applications that require an
auxiliary power input, install a TVS between VIN and GND.
See Layout Considerations for TVS placement.
For extremely high cable discharge and surge protection,
contact Analog Devices Applications.
Exposed Pad
The LT4294 DFN package has an exposed pad that is
internally electrically connected to GND. The exposed pad
may only be connected to GND on the printed circuit board.
LAYOUT CONSIDERATIONS
Avoid excessive parasitic capacitance on the RCLASS
and RCLASS++ pins and place resistors RCLS and RCLS++
close to the LT4294.
It is strictly required for maximum protection to place the
0.1μF input capacitor, CPD, and transient voltage suppres-
sor as close to the LT4294 as possible. When operating
the LT4294 with the LT4321, place a 0.047μF capacitor,
CPD1, as close as possible to the LT4294 VPORT and
GND pins (pin 10 and pin 5, respectively), and a 0.047μF
capacitor, CPD2, as close as possible to the LT4321 OUTP
and OUTN pins.
TYPICAL APPLICATIONS
4294 TA03
LT4321
TG36BG12
PSMN075-100MSE ×4
BSZ110N06NS3 ×4
PSMN075-100MSE ×4
WURTH 749022017
BG36
IN36
IN45
IN78
IN12
DATA
PAIRS
1
2
3
6
4
5
8
7
SPARE
PAIRS
OUTN
EN
OUTP SMAJ58A
VPORT
158k
931k
PWRGD
AUX RCLASS
HSGATE
PSMN075-100MSE
VAUX
9V TO 57VDC
OR 24VAC
MMSD4148
×3
LT4294
GND
EN
TG12
BG45TG78 TG45BG78
HSSRC
ISOLATED
POWER
SUPPLY
GND
RUN
VOUT
VIN
150nF
680µF
+
34.8Ω
3.3k
BG1
BG2
IN2
IN1
TG1
TG2 OUTP
OUTN
LT4320
+
100k
1µF
0.1µF
CPD2
0.047µF
CPD1
0.047µF
High Efficiency 25.5W PD Solution with 12VDC and 24VAC Auxiliary Input
APPLICATIONS INFORMATION
LT4294
13
Rev. A
For more information www.analog.com
PACKAGE DESCRIPTION
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV C 0310
0.25 ±0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.70 ±0.05
3.55 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
LT4294
14
Rev. A
For more information www.analog.com
PACKAGE DESCRIPTION
MSOP (MS) 0213 REV F
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1234 5
4.90 ±0.152
(.193 ±.006)
0.497 ±0.076
(.0196 ±.003)
REF
8910 76
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010) 0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ±0.038
(.0120 ±.0015)
TYP
0.50
(.0197)
BSC
0.1016 ±0.0508
(.004 ±.002)
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev F)
LT4294
15
Rev. A
For more information www.analog.com
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 09/18 Updated to IEEE 802.3af/at/bt (Draft 3.5)
Revised T2P Output Applications Information
Revised External Interface and Component Selection Applications Information
1-16
10, 11
11, 12
LT4294
16
Rev. A
For more information www.analog.com
ANALOG DEVICES, INC. 2017-2018
D17136-0-9/18(A)
www.analog.com
TYPICAL APPLICATION
RELATED PARTS
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PART NUMBER DESCRIPTION COMMENTS
LT4295 IEEE 802.3bt PD with Forward/Flyback
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Operation, Frequency, PG/SG Delays, Soft-Start, and Aux Support as Low as 9V,
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Including Housekeeping Buck, Slope Compensation
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50kHz to 250kHz, Aux Support
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to 500kHz, Aux Support
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50kHz to 250kHz, 12V Aux Support
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4294 TA02
LT4321
TG36BG12
PSMN075-100MSE ×4
PSMN075-100MSE ×4
WÜRTH 749022016
BG36
IN36
IN45
IN78
IN12
DATA
PAIRS
1
2
3
6
4
5
8
7
SPARE
PAIRS
OUTN
EN
OUTP SMAJ58A
VPORT
PWRGD
AUX
RCLASS
T2P
RCLASS++
HSGATE
PSMN040-100MSE
LT4294
GND
EN
TG12
BG45TG78 TG45BG78
HSSRC
ISOLATED
POWER
SUPPLY
GND
RUN
V
OUT
VIN
22µF
+
RCLS
49.9Ω
RCLS++
118Ω
+
47nF
3.3k
100k
CPD2
0.047µF
CPD1
0.047µF
OPTO PSE TYPE
(TO µP)