Rev.1.00
S1R72V27
Data Sheet
NOTICE
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©SEIKO EPSON CORPORATION 2007, All rights reserved.
Scope
This document applies to the S1R72V27 USB 2.0 device/host controller LSI.
S1R72V27 Data Sheet (Rev. 1.00) EPSON i
Contents
1. Overview............................................................................................................................................ 1
2. Features............................................................................................................................................. 2
3. Block Diagram................................................................................................................................... 3
4. Explanation of Functions ................................................................................................................. 4
4.1 Power Supply ............................................................................................................................. 4
4.2 Reset .......................................................................................................................................... 5
4.2.1 Hard Reset ........................................................................................................................ 5
4.2.2 Soft Reset.......................................................................................................................... 5
4.3 Clock .......................................................................................................................................... 5
4.4 Power Management ................................................................................................................... 6
4.5 CPU-I/F....................................................................................................................................... 7
4.6 USB Device I/F ........................................................................................................................... 7
4.6.1 Speed Mode and Transfer Type ........................................................................................ 7
4.6.2 Resources ......................................................................................................................... 7
4.6.2.1 Endpoint ......................................................................................................................... 7
4.6.2.2 FIFO ............................................................................................................................... 8
4.6.3 Data Flow .......................................................................................................................... 8
4.6.4 USB Device Port External Circuits .................................................................................... 9
4.7 USB Host I/F............................................................................................................................. 10
4.7.1 Speed Mode and Transfer Type ...................................................................................... 10
4.7.2 Resources .......................................................................................................................10
4.7.2.1 Channels ...................................................................................................................... 10
4.7.2.2 FIFO ............................................................................................................................. 10
4.7.3 Data Flow ........................................................................................................................ 10
4.7.4 USB Host Port External Circuits ...................................................................................... 12
4.8 FIFO ......................................................................................................................................... 12
5. Terminal Layout Diagrams ............................................................................................................. 13
6. Terminal Functions ......................................................................................................................... 15
7. Electrical Characteristics ............................................................................................................... 18
7.1 Absolute Maximum Ratings ...................................................................................................... 18
ii EPSON S1R72V27 Data Sheet (Rev. 1.00)
7.2 Recommended Operating Conditions....................................................................................... 18
7.3 DC Characteristics.................................................................................................................... 19
7.3.1 Current Consumption ...................................................................................................... 19
7.3.2 Input Characteristics........................................................................................................ 21
7.3.3 Output Characteristics..................................................................................................... 22
7.3.4 Terminal Capacitance ...................................................................................................... 23
7.4 AC Characteristics.................................................................................................................... 24
7.4.1 Reset Timing ................................................................................................................... 24
7.4.2 Clock Timing....................................................................................................................24
7.4.3 CPU/DMA I/F Access Timing........................................................................................... 26
7.4.3.1 Specifications for CVDD = 1.65 V to 3.6 V ................................................................... 26
7.4.3.2 Specifications when limited to CVDD = 3.0 V to 3.6 V (relaxed specifications).......... 27
7.4.4 USB I/F Timing ................................................................................................................ 28
8. Connection Examples .................................................................................................................... 29
8.1 CPU I/F Connection Example................................................................................................... 29
8.2 USB I/F Connection Example ................................................................................................... 30
9. Product Codes ................................................................................................................................ 31
10. External Dimension Diagrams ..................................................................................................... 32
1. Overview
S1R72V27 Data Sheet (Rev. 1.00) EPSON 1
1. Overview
The S1R72V27 is a USB host/device controller LSI that supports the USB 2.0 high-speed mode. A single
USB port can be operated as a USB host or USB device depending on how control is switched.
This LSI maintains high compatibility with the S1R72V17 but includes additional functions such as support
for USB host isochronous transfers.
2. Features
2 EPSON S1R72V27 Data Sheet (Rev. 1.00)
2. Features
<<USB 2.0 host functions>>
Supports HS (480 Mbps), FS (12 Mbps), and LS (1.5 Mbps) transfer
Built-in pull-down resistor for downstream ports (no external circuit required)
Built-in HS termination (no external circuit required)
Supports control, bulk, interrupt, and isochronous transfers
Proven channel system designed specifically for embedded host
Dedicated control transfer channel x1
Dedicated bulk transfer channel x1
Bulk, interrupt, and isochronous transfer channels x4
USB power switching interface
<<USB 2.0 device functions>>
Supports HS (480 Mbps) and FS (12 Mbps) transfer
Built-in FS/HS termination (no external circuit required)
VBUS 5V I/F (requires external protective circuit)
Supports control, bulk, interrupt, and isochronous transfers
Supports five bulk, interrupt, and isochronous transfers and Endpoint 0
<<MCU I/F>>
Supports 16-bit width standard CPU bus I/F
Includes DMA 1ch for each port (multi-word sequence)
Big Endian (Includes bus-swapping function to support Little Endian CPUs)
I/F variable voltage (3.3 V to 1.8 V)
<<Miscellaneous>>
Clock input: Supports 12 MHz/24 MHz crystal oscillator. (built-in oscillator circuit and 1 M feedback
resistor)
Dedicated terminals for 12/24/48 MHz clock input
Power supply voltage: 3-voltage system including 3.3 V, 1.8 V, and CPU I/F power supply (3.3 V to 1.8 V)
Package type QFP14-80, PFBGA5UX60, PFBGA8UX81
Guaranteed operating temperature range: -40°C to 85°C
3. Block Diagram
S1R72V27 Data Sheet (Rev. 1.00) EPSON 3
3. Block Diagram
USB FIFO
CPU I/F Controller
XRD
XI
XO
USB
FIFO Controller
DMA Controller
XWRH
XWRL
CA[8:1]
CD[15:0]
XCS
XINT
Channel/Endpoint
XDACK
XDREQ
OSC
XBEL
Host
SIE
VBUSFLG
VBUSEN
Device
SIE
DP
DM
MTM
R1
VBUS
PLL
CLKIN
Test
MUX
TSTEN
ATPGEN
BURNIN
XRESET
Figure 3-1 Overall block diagram
4. Explanation of Functions
4 EPSON S1R72V27 Data Sheet (Rev. 1.00)
4. Explanation of Functions
For details of the register names used in the following discussion, refer to the Technical Manual for this LSI.
4.1 Power Supply
This LSI has three power supply systems and a common GND. The power supply systems consist of
HVDD (3.3 V) for the USB I/O power supply, CVDD (3.3 V to 1.8 V) for the CPU I/F power supply,
and LVDD (1.8 V) for internal circuits and TEST I/O. (See Figure 4-1.)
I
O
CPU
-I/F FIFO
SIE MTM
CPU USB
LVDD HVDDCVDD
1.8V to 3.3V 1.8V 3.3V
TEST
IO
Figure 4-1 S1R72V27 power supply circuit diagram
The sequence of steps for turning the power supplies on and off are described below.
This LSI cannot be operated with only the LVDD or CVDD power supplies turned on or off. The
HVDD can be turned off if the LVDD or CVDD power supplies are on. The synchronous register
cannot be accessed while HVDD is off, since the PLL does not operate.
Also, the following restrictions apply to the sequence for turning the CVDD/HVDD I/O power
supplies and LVDD internal power supply on or off. There are no restrictions on the sequence for
turning the CVDD and HVDD power supplies on or off.
The LVDD must be turned on before turning on the CVDD and HVDD power supplies.
In the powering off sequence, the CVDD and HVDD must be turned off before turning off the
LVDD.
If power supply circuit characteristics or the power supply load make this sequence impossible to
follow, the CVDD or HVDD must not be on for more than 1 second while the LVDD is off.
4. Explanation of Functions
S1R72V27 Data Sheet (Rev. 1.00) EPSON 5
4.2 Reset
This LSI includes a hard reset function using the external XRESET terminal and a soft reset function
using register settings.
4.2.1 Hard Reset
Start up from reset status when power is turned on, then cancel the reset after confirming
power on.
4.2.2 Soft Reset
Circuits related to the USB port or individual internal USB analog macros can be reset via
software. This LSI can be soft reset using the ChipReset.AllReset bit. The
ChipReset.ResetMTM bit is used to reset USB analog macros. Note, however, that analog
macros should only be reset in the sleep state.
4.3 Clock
This LSI contains an internal oscillator and feedback resistor (1 M) and supports clock generation
using an external oscillator. External clock input is supported via the CLKIN terminal.
The oscillator frequency supports 12 MHz or 24 MHz using the internal oscillator. Frequencies of 12,
24, or 48 MHz are supported via the external input.
Figure 4-2 shows a typical connection arrangement for an oscillation circuit. Contact the oscillator
manufacturer to determine circuit constants, as Cd, Cg, and Rd in the oscillator circuit must be
matched, based on the oscillator.
XIXO
Cd
Rd
Cg
Figure 4-2 Clock generation using the internal oscillator and external oscillator
4. Explanation of Functions
6 EPSON S1R72V27 Data Sheet (Rev. 1.00)
4.4 Power Management
This LSI includes a power management function featuring two power management states, SLEEP
and ACTIVE, together with the CPU_Cut power management state. (See Figure 4-3.)
All function blocks are active in the ACTIVE state, whereas only the bare minimum circuits
necessary for restarting from standby mode are active in SLEEP state. CPU_Cut mode minimizes
power consumption attributable to the CPU-I/F input buffer.
ACTIVE
CPU
-I/F FIFO
SIE UTM
OSC
SLEEP
CPU
-I/F* FIFO
SIE UTM
OSC
CPU_Cut
CPU
-I/F** FIFO
SIE UTM
OSC
Active Inactive
* The CPU-I/F is only partially active in SLEEP state.
The asynchronous access register can be accessed.
** CPU-I/F operation is suspended in CPU_Cut to minimize
power consumption attributable to the I/O input buffer.
Figure 4-3 Power management states
4. Explanation of Functions
S1R72V27 Data Sheet (Rev. 1.00) EPSON 7
4.5 CPU-I/F
This LSI is connected to the CPU via a 16-bit interface. Endian settings can be set as Big Endian or
Little Endian in 16-bit steps. For Big Endian, registers with even addresses can be accessed above the
bus (CD[15:8]), while registers with odd addresses can be accessed below the bus (CD[7:0]). For
Little Endian, registers with even addresses can be accessed below the bus (CD[7:0]), while registers
with odd addresses can be accessed above the bus (CD[15:8]).
The bus mode can be set to either Strobe mode for access using high/low strobe (XWRH/XWRL) or
Byte Enable mode for access using high/low byte enable (XBEH/XBEL) for writing the first or last 8
bits. Endian and bus mode is set by the CPUIF_MODE register immediately cancelling of hard reset.
The CPU-I/F on this LSI includes 1-ch DMA (slave).
The registers that can be accessed will depend on the power management state. For details, refer to
the LSI Technical Manual.
4.6 USB Device I/F
This LSI supports High-Speed specification USB device functions complying with the USB 2.0
(Universal Serial Bus Specification Revision 2.0) standards.
4.6.1 Speed Mode and Transfer Type
This LSI’s USB device function supports HS (480 Mbps) and FS (12 Mbps) speed modes.
The speed mode is set automatically by the speed negotiation performed when resetting the
bus. For example, HS transfer mode is selected automatically by speed negotiation if
connected to a USB host that supports HS speed mode. In addition, the register can be set
so that FS speed mode is always selected in speed negotiations.
All transfer types stipulated under the USB 2.0 standard are supported, including control
transfers (endpoint 0), bulk transfers, interrupt transfers, and isochronous transfers.
4.6.2 Resources
4.6.2.1 Endpoint
This LSI’s USB device function includes endpoint 0 and five standard
endpoints. Endpoint 0 supports control transfers. The standard endpoints
support bulk transfers, interrupt transfers, and isochronous transfers. The
standard endpoint numbers, maximum packet size, and transfer direction
(in/out) can be set as desired.
4. Explanation of Functions
8 EPSON S1R72V27 Data Sheet (Rev. 1.00)
4.6.2.2 FIFO
The LSI ports include 4.5 kB of FIFO for use with USB data transfers. This
forms the data transfer route with USB. The FIFO capacity of each endpoint
can be assigned as desired by the software. For example, performance can be
improved by assigning a sufficient size FIFO area to the endpoints for bulk
transfers.
4.6.3 Data Flow
Endpoints are assigned to USB FIFO areas on a one-to-one basis, and responses are
returned to USB transactions automatically, depending on effective USB FIFO free
capacity (for OUT transfers) or effective data quantity (for IN transfers). This means the
software does not need to be directly involved in individual transactions, allowing USB
data transfers to be controlled as data flows at the USB FIFO.
USB FIFO Endpoint USB Host
IN token
Data quantity <
MaxPktSize
NAK handshake
IN token
Data quantity >=
MaxPktSizeDATA packet
ACK handshake
CPU
Write
FIFO_Empty
FIFO_Empty
Write
IN token
Data quantity <
MaxPktSize
Write Read
IN transaction
(NAK response)
IN transaction
(Data reply)
IN transaction
(NAK response)
Transfer sent
NAK handshake
FIFO_Full
FIFO_Full
IN token
Data quantity >=
MaxPktSizeDATA packet
ACK handshake
IN transaction
(Data reply)
Empty
Data
Figure 4-4 Typical data flow (with FIFO assigned for MaxPktSize and IN transfer)
4. Explanation of Functions
S1R72V27 Data Sheet (Rev. 1.00) EPSON 9
USB FIFO Endpoint USB Host
PING token
Free quantity >=
MaxPktSize
ACK handshake
OUT token
CPU
FIFO_Empty
PING token
Free quantity <
MaxPktSize
Read Write
PING transaction
(ACK response)
OUT transaction
(Data receipt)
PING transaction
(NAK response)
Transfer received
NAK handshake
FIFO_Full
FIFO_Empty
PING token
Free quantity >=
MaxPktSize
PING transaction
(ACK response)
Empty
Data
DATA packet
NYET handshake
Read
ACK handshake
Note: PING transactions are performed only in High Speed mode.
Figure 4-5 Typical data flow (with FIFO assigned for MaxPktSize and OUT transfer)
4.6.4 USB Device Port External Circuits
The LSI USB Port 0 has internal FS and HS device termination resistors, eliminating the
need for the components normally used to adjust impedance. This allows a DP/DM line to
be connected directly between the LSI terminal and the connector. Note that the
appropriate components must be used to ensure static electricity protection and to
implement EMI precautions.
The VBUS terminal uses a 5 V input and does not require external voltage conversion. A
protection circuit is recommended, since certain commercially-available USB host and hub
products may apply surge voltages exceeding VBUS ratings.
Refer to the separately provided PCB Design Guidelines for S1R72V Series USB 2.0
Hi-Speed.
4. Explanation of Functions
10 EPSON S1R72V27 Data Sheet (Rev. 1.00)
4.7 USB Host I/F
The LSI USB Port 0 and Port 1 support high-speed specification USB host functions complying with
the USB 2.0 (Universal Serial Bus Specification Revision 2.0) standards.
4.7.1 Speed Mode and Transfer Type
This LSI’s USB host function supports HS (480 Mbps), FS (12 Mbps) and LS (1.5 Mbps)
speed modes. The speed mode is automatically set by speed negotiations performed on
resetting the bus.
All transfer types stipulated in the USB 2.0 standard are supported, including control
transfers, bulk transfers, interrupt transfers, and isochronous transfers.
4.7.2 Resources
4.7.2.1 Channels
In the LSI USB host functions, sets of register settings for transfers with end
points on a one-to-one basis are called channels. The LSI USB host function
features one dedicated channel for control transfers, one dedicated channel for
bulk transfers, and four general channels that support bulk transfers, interrupt
transfers, and isochronous transfers. The endpoint number, maximum packet
size, and transfer direction (IN/OUT) can be set as desired for all channels.
Transfers are also possible for a number of endpoints exceeding the channel
number using software-based time-multiplexing for the channels.
4.7.2.2 FIFO
Each port on the LSI includes 4.5 kB of FIFO for use with USB data transfers.
This forms the data transfer route with USB. The FIFO capacity for each
channel can be assigned as desired by the software. For example, to improve
performance, assign a FIFO area of adequate size to the endpoints for bulk
transfers.
4.7.3 Data Flow
The channels are assigned to FIFO areas on a one-to-one basis. Transactions are sent
automatically to USB, depending on the FIFO effective free capacity (for IN transfers) or
effective data quantity (for OUT transfers). The software does not need to be directly
involved in individual transactions, allowing USB data transfers to be controlled as data
flow at the FIFO.
4. Explanation of Functions
S1R72V27 Data Sheet (Rev. 1.00) EPSON 11
FIFOCPU Channel USB Device
NAK handshake
IN token
Free quantity >=
MaxPktSize
Free quantity <
MaxPktSize
Transfer received
Free quantity >=
MaxPktSize
FIFO_Empty
Read Write
FIFO_Full
FIFO_Empty
Empty
Data
Read
DATA packet
IN token
ACK handshake
IN token
NAK handshake
IN transaction
(NAK response)
IN transaction
(NAK response)
IN transaction
(Data reply)
Figure 4-6 Typical data flow (with FIFO assigned for MaxPktSize and IN transfer)
FIFO Channel USB Device
Data quantity <
MaxPktSize
Data quantity >=
MaxPktSize
CPU
Write
FIFO_Empty
FIFO_Empty
Write
Data quantity <
MaxPktSize
Write Read
Transfer sent
FIFO_Full
FIFO_Full
Data quantity >=
MaxPktSize
OUT token
DATA packet
ACK handshake
OUT token
DATA packet
ACK handshake
Empty
Data
OUT transaction
OUT transaction
Transfer sent
Figure 4-7 Typical data flow (with FIFO assigned for MaxPktSize and OUT transfer)
4. Explanation of Functions
12 EPSON S1R72V27 Data Sheet (Rev. 1.00)
4.7.4 USB Host Port External Circuits
The LSI ports have internal USB host termination resistors, including an HS termination
resistor, eliminating the need for the external components normally used to adjust
impedance. This allows a DP/DM line to be connected between the LSI terminal and the
connector. Note that the appropriate components must be used to ensure static electricity
protection and to implement EMI precautions.
An external VBUS control component is required for the VBUS.
4.8 FIFO
The LSI includes 4.5 kB of USB FIFO for use with USB data transfers. The USB FIFO capacity for
each endpoint or channel can be assigned as desired using the register settings.
Transfers are possible between the USB-I/F and CPU-I/F via the USB FIFO.
5. Terminal Layout Diagrams
S1R72V27 Data Sheet (Rev. 1.00) EPSON 13
5. Terminal Layout Diagrams
BURNIN
LVDD
XI
XO
VSS
VSS
CLKIN
CVDD
N.C.
CD15
CD14
CD13
CD12
CD11
CVDD
VSS
CD10
CD9
LVDD
VSS
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
N.C. 61 40 ATPGEN
N.C. 62 39 CD8
N.C. 63 38 CD7
N.C. 64 37 CD6
LVDD 65 36 CD5
VSS 66 35 CD4
R1 67 34 CD3
VSS 68 33 LVDD
N.C. 69 32 VSS
HVDD 70 31 CVDD
DM 71 30 CD2
VSS 72 29 CD1
DP 73 28 CD0
HVDD 74 27 XDACK
VBUS 75 26 XDREQ
LVDD 76 25 XWRL
VSS 77 24 XWRH
N.C. 78 23 XRD
N.C. 79 22 XCS
N.C. 80 21 XINT
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
LVDD
VSS
VBUSFLG
VBUSEN
HVDD
XRESET
XBEL
CA1
CA2
CA3
CA4
VSS
CVDD
CA5
CA6
CA7
CA8
TESTEN
LVDD
VSS
Figure 5-1 QFP package terminal layout diagram (QFP14-80)
12345678
ANC LVDD DP DM HVDD R1 LVDD BURNIN A
BVBUSFLG VSS HVDD VSS VSS VSS VSS XI B
CVBUSEN HVDD VBUS CA1 CA3 CD15 LVDD XO C
DXRESET XBEL CA5 CD13 CVDD CLKIN D
ECA2 CA4 XINT CD4 CD11 CD14 E
FCA7 CA8 XWRH XDACK CD3 CD7 CD10 CD12 F
GCA6 LVDD XRD XDREQ CD1 CD6 VSS CD9 G
HTESTEN XCS XWRL CD0 CD2 CD5 CD8 ATPGEN H
12345678
Top View
Figure 5-2 BGA package terminal layout diagram (PFBGA5UX60)
5. Terminal Layout Diagrams
14 EPSON S1R72V27 Data Sheet (Rev. 1.00)
123456789
ANC LVDD HVDD DP DM HVDD R1 LVDD NC A
BVSS VSS VBUS VSS VSS VSS VSS VSS XI B
C
VBUSFLG
HVDD LVDD XBEL CA1 CVDD BURNIN LVDD XO C
DXRESET VBUSEN CA3 NC NC NC CD12 CD15 CLKIN D
ECA2 VSS CA4 NC NC NC VSS CD13 CD14 E
FCVDD CA5 CA8 NC NC NC CD7 CD9 CD11 F
GCA7 CA6 TESTEN XCS XDACK CD0 CD4 CD8 CD10 G
HLVDD XINT XWRL XRD CD1 CVDD CD6 ATPGEN LVDD H
JNC VSS XWRH XDREQ CD2 CD3 CD5 VSS NC J
123456789
Top View
Figure 5-3 BGA package terminal layout diagram (PFBGA8UX81)
6. Terminal Functions
S1R72V27 Data Sheet (Rev. 1.00) EPSON 15
6. Terminal Functions
OSC
QFP
Pin
BGA5
Ball
BGA8
Ball Name I/O RESET Terminal
type Terminal description
58 B8 B9 XI IN - Analog Internal oscillator circuit input
(12 MHz, 24 MHz)
57 C8 C9 XO OUT - Analog Internal oscillator circuit output
The clock inputs from the crystal oscillator and CLKIN for XI and XO are used exclusively by the register settings. Fix XI
at Low when using CLKIN.
TEST
QFP
Pin
BGA5
Ball
BGA8
Ball Name I/O RESET Terminal
type Terminal description
18 H1 G3 TESTEN IN (PD) (PD) Test terminal (Set to Low)
40 H8 H8 ATPGEN IN (PD) (PD) Test terminal (Set to Low)
60 A8 C7 BURNIN IN (PD) (PD) Test terminal (Set to Low)
USB
QFP
Pin
BGA5
Ball
BGA8
Ball Name I/O RESET Terminal
type Terminal description
67 A6 A7 R1 IN - Analog
Internal operation reference current setting
terminal
Connect 6.2 kW ±1% resistance between
terminal and VSS
73 A3 A4 DP BI Hi-Z Analog USB port 0, data line (Data +)
71 A4 A5 DM BI Hi-Z Analog USB port 0, data line (Data -)
3 B1 C1 VBUSFLG IN (PU)
Schmitt
(PU)
USB power switch fault detection signal
(1: Normal, 0: Error)
4 C1 D2 VBUSEN OUT Lo 2mA USB power switch control signal
75 C3 B3 VBUS IN (PD) (PD) USB device bus detection signal
PD: Pull Down
PU: Pull Up
6. Terminal Functions
16 EPSON S1R72V27 Data Sheet (Rev. 1.00)
CPU I/F
QFP
Pin
BGA5
Ball
BGA8
Ball Name I/O RESET Terminal
type Terminal description
Bus Mode Strobe Mode BE Mode
6 D1 D1 XRESET IN - Schmitt Reset signal
54 D8 D9 CLKIN IN - - External clock input
23 G3 H4 XRD IN - - Read/strobe
25 H3 H3
XWRL
(XWR) IN - - Write/strobe (lower) Write/strobe
24 F3 J3
XWRH
(XBEH) IN - - Write/strobe
(upper) High-byte enable
22 H2 G4 XCS IN - Schmitt Chip select signal
21 E3 H2 XINT OUT High 2mA
(Tri-state) Interrupt output signal
26 G4 J4 XDREQ OUT High 2mA DMA request
27 F4 G5 XDACK IN - - DMA acknowledge
7 D2 C4 XBEL IN - - Set to High or
Low Low-byte enable
8 C4 C5 CA1 IN - -
9 E1 E1 CA2 IN - -
10 C5 D3 CA3 IN - -
11 E2 E3 CA4 IN - -
14 D3 F2 CA5 IN - -
15 G1 G2 CA6 IN - -
16 F1 G1 CA7 IN - -
17 F2 F3 CA8 IN - -
CPU bus address
28 H4 G6 CD0 BI Hi-Z 2mA
29 G5 H5 CD1 BI Hi-Z 2mA
30 H5 J5 CD2 BI Hi-Z 2mA
34 F5 J6 CD3 BI Hi-Z 2mA
35 E6 G7 CD4 BI Hi-Z 2mA
36 H6 J7 CD5 BI Hi-Z 2mA
37 G6 H7 CD6 BI Hi-Z 2mA
38 F6 F7 CD7 BI Hi-Z 2mA
39 H7 G8 CD8 BI Hi-Z 2mA
43 G8 F8 CD9 BI Hi-Z 2mA
44 F7 G9 CD10 BI Hi-Z 2mA
47 E7 F9 CD11 BI Hi-Z 2mA
48 F8 D7 CD12 BI Hi-Z 2mA
49 D6 E8 CD13 BI Hi-Z 2mA
50 E8 E9 CD14 BI Hi-Z 2mA
51 C6 D8 CD15 BI Hi-Z 2mA
CPU data bus
The XINT terminal can be set to 1/0 or Hi-Z/0 mode, depending on register settings. Note, however, that it cannot be
pulled up with a voltage exceeding the rated value even in Hi-Z/0 mode, since it is not an open drain.
The clock inputs from the crystal oscillator and CLKIN for XI and XO are used exclusively by the register settings. Fix
CLKIN at Low when using XI and XO.
PD: Pull Down
PU: Pull Up
6. Terminal Functions
S1R72V27 Data Sheet (Rev. 1.00) EPSON 17
POWER
QFP Pin BGA5 Ball BGA8 Ball Name Voltage Terminal description
5, 70, 74 A5, B3, C2 A3, A6, C2 HVDD 3.3V USB I/O power supply
13, 31, 46, 53 D7 C6, F1, H6 CVDD 1.8 to 3.3V CPU I/F I/O power supply
1, 19, 33, 42,
59, 65, 76
A2, A7, C7,
G2
A2, A8, C3,
C8, H1, H9 LVDD 1.8V
OSC I/O, TEST I/O, and internal power
supply
2, 12, 20, 32,
41, 45, 55,
56, 66, 68,
72, 77
B2, B4, B5,
B6, B7, G7
B1, B2, B4,
B5, B6, B7,
B8, E2, E7,
J2, J8
VSS 0V GND
52, 61, 62,
63, 64, 69,
78, 79, 80
A1
A1, A9, D4,
D5, D6, E4,
E5, E6, F4,
F5, F6, J1,
J9
N.C. 0V NC terminal (connect to GND)
7. Electrical Characteristics
18 EPSON S1R72V27 Data Sheet (Rev. 1.00)
7. Electrical Characteristics
7.1 Absolute Maximum Ratings
Item Symbol Rating Units
HVDD VSS - 0.3 to 4.0 V
CVDD VSS - 0.3 to 4.0 V
Power supply voltage
LVDD VSS - 0.3 to 2.5 V
HVI VSS - 0.3 to HVDD + 0.5 V
CVI*1 VSS - 0.3 to CVDD + 0.5 V
VVI*2 VSS - 0.3 to 6.0 V
Input voltage
LVI*3 VSS - 0.3 to LVDD + 0.5 V
HVO VSS - 0.3 to HVDD + 0.5 V Output voltage
CVO*1 VSS - 0.3 to CVDD + 0.5 V
Output current/terminal IOUT ±10 mA
Storage temperature Tstg -65 to 150 °C
*1 CPU-IF
*2 VBUS
*3 XI, TESTEN, ATPGEN, BURNIN
7.2 Recommended Operating Conditions
Item Symbol MIN TYP MAX Units
HVDD 3.00 3.30 3.60 V
CVDD 1.65 - 3.60 V
Power supply voltage
LVDD 1.65 1.80 1.95 V
HVI -0.3 - HVDD+0.3 V
CVI*1 -0.3 - CVDD+0.3 V
VVI*2 -0.3 - 6.0 V
Input voltage
LVI*3 -0.3 - LVDD+0.3 V
Ambient temperature Ta -40 25 85 °C
*1 CPU-I/F
*2 VBUS
*3 XI, TESTEN, ATPGEN, BURNIN
Turn on power to the IC in the sequence shown below.
LVDD (internal) HVDD, CVDD (IO section)
Likewise, turn off power to the IC in the sequence shown below.
HVDD, CVDD (IO section) LVDD (internal)
Note:
Avoid leaving the HVDD or CVDD on continuously (for more than 1 second) when the LVDD is off,
as doing so may affect chip reliability.
7. Electrical Characteristics
S1R72V27 Data Sheet (Rev. 1.00) EPSON 19
7.3 DC Characteristics
7.3.1 Current Consumption
Item Symbol Condition MIN TYP MAX Units
Power supply feed
current
*1
Power supply
current
IDDH HVDD = 3.3V(typ) - 7.9 12.0 mA
IDDCH CVDD = 3.3V(typ) - 1.6 5.0 mA
IDDCL CVDD = 1.8V(typ) - 0.7 2.0 mA
IDDL LVDD = 1.8V(typ) - 40.2 62.0 mA
Stationary current *2
Power supply
current
IDDS VIN = HVDD,CVDD,LVDD or
VSS
HVDD = 3.6V
CVDD = 3.6V
LVDD = 1.95V
- - 25 µA
Input leakage
Input leakage
current
IL HVDD = 3.6V
CVDD = 3.6V
LVDD = 1.95V
HVIH = HVDD
CVIH = CVDD
LVIH = LVDD
VIL = VSS
-5 - 5 µA
Input leakage
Input leakage
current
(5 V tolerant)
ILIF HVDD = 3.0V
CVDD = 1.65V
LVDD = 1.65V
HVOH = 5.5V
-10 - 10 µA
*1: TYP is the measured value when transferring data with the USB-HDD connected as the USB host. MAX is the value
estimated from this value.
*2: Stationary current with Ta = 25°C and both terminals in input mode.
7. Electrical Characteristics
20 EPSON S1R72V27 Data Sheet (Rev. 1.00)
Current consumption measurements for individual power management states using Seiko
Epson operating conditions (Ta = 25°C)
Item Condition TYP Units
CPU_Cut CPU bus operation *1
Power supply power HVDD = 3.3V
CVDD = 3.3V
LVDD = 1.8V
4.2 uW
SLEEP CPU bus operation *1
Power supply power HVDD = 3.3V
CVDD = 3.3V
LVDD = 1.8V
8.8 uW
ACTIVE
(when operating as USB device)
(USB CPU-I/F)
*2
Power supply power HVDD = 3.3V
CVDD = 3.3V
LVDD = 1.8V
98 mW
ACTIVE (when operating as USB
host)
(USB CPU-I/F)
*3
Power supply power HVDD = 3.3V
CVDD = 3.3V
LVDD = 1.8V
118 mW
*1: Excluding current consumption due to DP pull-up resistance inside S1R72V27 (approx. 200 µA).
*2: When transferring data connected to a PC as a USB device (actual transfer rate 13.5 MB/s).
*3: When transferring data with the USB-HDD connected as the USB host (actual transfer rate 13 MB/s).
7. Electrical Characteristics
S1R72V27 Data Sheet (Rev. 1.00) EPSON 21
7.3.2 Input Characteristics
Item Symbol Condition MIN TYP MAX Units
Input characteristics
(LVCMOS)
Terminal
names:
TESTEN, ATPGEN, BURNIN
H level input voltage VIH1 LVDD = 1.95V 1.27 - - V
L level input voltage VIL1 LVDD = 1.65V - - 0.57 V
Input characteristics
(LVCMOS)
Terminal
names: CA[8:1], CD[15:0], XRD, XWRL, XWRH, XBEL, XDACK, CLKIN
H level input voltage VIH2 CVDD=3.6V 2.2 - - V
L level input voltage VIL2 CVDD=3.0 - - 0.8 V
H level input voltage VIH3 CVDD=1.95V 1.27 - - V
L level input voltage VIL3 CVDD=1.65V - - 0.57 V
Schmitt input characteristics
(USB FS)
Terminal
names:
DP, DM
H level trigger voltage VT+ (USB) HVDD = 3.6V 1.1 - 1.8 V
L level trigger voltage VT- (USB) HVDD = 3.0V 1.0 - 1.5 V
Hysteresis voltage ΔV (USB) HVDD= 3.0V 0.1 - - V
Input characteristics
(USB FS differential)
Terminal
names:
DP, DM pair
HVDD = 3.0V
Differential input
voltage - - 0.2 V
Differential input
sensitivity
VDS (USB)
0.8V to 2.5V
Input characteristics (VBUS) Terminal
names:
VBUS
H level trigger voltage VT+(VBUS) HVDD = 3.6V 1.86 - 2.85 V
L level trigger voltage VT- (VBUS) HVDD = 3.0V 1.48 - 2.23 V
Hysteresis voltage ΔV (VBUS) HVDD= 3.0V 0.31 - 0.64 V
Input characteristics
(Schmitt)
Terminal
names:
VBUSFLG
H level trigger voltage VT1+ HVDD = 3.6V 1.4 - 2.7 V
L level trigger voltage VT1- HVDD = 3.0V 0.6 - 1.8 V
Hysteresis voltage ΔV HVDD= 3.0V 0.3 - - V
Input characteristics
(Schmitt)
Terminal
names:
XCS, XRESET
H level trigger voltage VT1+ CVDD=3.6V 1.4 - 2.7 V
L level trigger voltage VT1- CVDD=3.0V 0.6 - 1.8 V
Hysteresis voltage ΔV1 CVDD=3.0V 0.3 - - V
H level trigger voltage VT2+ CVDD=1.95V 0.6 - 1.4 V
L level trigger voltage VT2- CVDD=1.65V 0.3 - 1.1 V
Hysteresis voltage ΔV2 CVDD=1.65V 0.2 - - V
Input characteristics Terminal
names: VBUSFLG
Pull-up resistor RPLU2H VI=VSS 50 100 240 k
Input characteristics Terminal
names:
VBUS
Pull-down resistor RPLD3L VI=5.0V 110 125 150 k
Input characteristics Terminal
names:
ATPGEN, BURNIN
Pull-down resistor RPLD1L VI=LVDD 24 60 150 k
Input characteristics Terminal
names:
TESTEN
Pull-down resistor RPLD2L VI=LVDD 48 120 300 k
7. Electrical Characteristics
22 EPSON S1R72V27 Data Sheet (Rev. 1.00)
7.3.3 Output Characteristics
Item Symbol Condition MIN TYP MAX Units
Output characteristics Terminal names: CD[15:0], XDREQ, XINT
H level output
voltage
VOH1 CVDD = 3.0V
IOH = -2mA CVDD-0.4 - - V
L level output
voltage
VOL1 CVDD = 3.0V
IOL = 2mA - - VSS+0.4 V
H level output
voltage
VOH2 CVDD = 1.65V
IOH = -1mA CVDD-0.4 - - V
L level output
voltage
VOL2 CVDD = 1.65V
IOL = 1mA - - VSS+0.4 V
L level output
voltage
VOL2(2) CVDD = 1.65V
IOL = 0.8mA - - VSS+0.3 V
Output characteristics Terminal names:VBUSEN
H level output
voltage
VOH4 HVDD = 3.0V
IOH = -2mA HVDD-0.4 - - V
L level output
voltage
VOL4 HVDD = 3.0V
IOL = 2mA - - VSS+0.4 V
Output characteristics
(USB FS)
Terminal names: DP, DM
H level output
voltage
VOH(USB) HVDD=3.0V 2.8 - - V
L level output
voltage
VOL(USB) HVDD=3.6V - - 0.3 V
Output characteristics
(USB HS)
Terminal names: DP, DM
H level output
voltage
VHSOH
(USB)
HVDD = 3.0V 360 - - mV
L level output
voltage
VHSOL
(USB) HVDD = 3.6V - - 10.0 mV
Output characteristics Terminal names: CD[15:0], XINT
OFF-STATE
leakage current
IOZ CVDD = 3.6V
CVOH = CVDD
VOL = VSS
-5 - 5 µA
7. Electrical Characteristics
S1R72V27 Data Sheet (Rev. 1.00) EPSON 23
7.3.4 Terminal Capacitance
Item Symbol Condition MIN TYP MAX Units
Terminal capacitance Terminal name: All input terminals
Input terminal
capacitance
CI f = 10MHz
HVDD = CVDD = LVDD = VSS - - 8 pF
Terminal capacitance Terminal name: All output terminals
Output terminal
capacitance
CO f = 10MHz
HVDD = CVDD = LVDD = VSS - - 8 pF
Terminal capacitance Terminal name: All input/output terminals (except DP, DM)
Input/output
terminal
capacitance 1
CIO1 f = 10MHz
HVDD = CVDD = LVDD = VSS - - 8 pF
Terminal capacitance Terminal names: DP, DM
Input/output
terminal
capacitance 2
CIO2 f = 10MHz
HVDD = CVDD = LVDD = VSS - - 11 pF
7. Electrical Characteristics
24 EPSON S1R72V27 Data Sheet (Rev. 1.00)
7.4 AC Characteristics
7.4.1 Reset Timing
XRESET
tRESET
Code Description min typ max Units
tRESET Reset pulse width 40 - - ns
7.4.2 Clock Timing
<Internal oscillator>
XI
tCYC
tCYCL tCYCH
Code Description min typ max Units
tCYC Clock cycle (ClkFreq=0b00) 11.9988 12 12.0012 MHz
tCYC Clock cycle (ClkFreq=0b01) 23.9976 24 24.0024 MHz
tCYCH
tCYCL Clock duty 45 -55 %
7. Electrical Characteristics
S1R72V27 Data Sheet (Rev. 1.00) EPSON 25
<External input>
CLKIN
tCYI
tCYIL tCYIH
Code Description min typ max Units
tCYI Clock cycle (ClkFreq=0b00) 11.9988 12 12.0012 MHz
tCYI Clock cycle (ClkFreq=0b01) 23.9976 24 24.0024 MHz
tCYIH
tCYIL Clock duty 45 -55 %
tCYI Clock cycle (ClkFreq=0b11) 47.9952 48 48.0048 MHz
7. Electrical Characteristics
26 EPSON S1R72V27 Data Sheet (Rev. 1.00)
7.4.3 CPU/DMA I/F Access Timing
7.4.3.1 Specifications for CVDD = 1.65 V to 3.6 V
XDREQ(O)
XDACK(I)
XCSI
XRDI
CDOValid
tcas
CAI
XWRH/LI
XWR
CDI
Code
tcas
tccs
min
6
6
typ
-
-
max
-
-
unit
ns
ns
tcch
tcah
6
6
-
-
-
-
ns
ns
trbd 1 - - ns
trdf - - 33 ns
trdh 2 - - ns
trbh - - 6 ns
twds
twdh
-
6
-
-
10
-
ns
ns
tdrn - - 35 ns
tdaa
tdng
6
Nn *16.6
-
-
-
-
ns
ns
tcah
tccs tcch
trbd
trdf
trdh
trbh
twds twdh
tdrn
tdaa tdan
Write
Read
tras
tras 35 - - ns
twas
35 - - nstwas
trng
twng
twcy
trcy
trcy 55 - - ns
trng 20 - - ns
55 - - nstwcy
20 - - nstwng
XBEH/L(I) twbs twbh
twbs
twbh
6
6
-
-
-
-
ns
nsWrite byte enable hold time
(CL=30pF)
Item
Address setup time
Address hold time
XCS setup time
XCS hold time
Read data output start time
Read data confirmation time
Read data hold time
Read data output delay time
Write data delay acknowledge time
Write data hold time (after strobe negation)
XDREQ negate delay time
XDACK setup time
XDREQ minimum negate time
Read strobe assert time
Write strobe assert time
Read cycle
Read strobe negate time
Write cycle
Write strobe negate time
Write byte enable setup time
tccn
tccn 15 - - nsXCS negate time (Only when CPUIF mode is set*)
*Nn is determined by the DMA_EdgeMode.NegControl[3:0] setting. Nn = (NegControl + 3)
tdng
tdan 6 - - nsXDACK hold time
7. Electrical Characteristics
S1R72V27 Data Sheet (Rev. 1.00) EPSON 27
7.4.3.2 Specifications when limited to CVDD = 3.0 V to 3.6 V
(relaxed specifications)
XDREQ(O)
XDACK(I)
XCSI
XRDI
CDOValid
tcas
CAI
XWRH/LI
XWR
CDI
Code
tcas
tccs
min
6
6
typ
-
-
max
-
-
unit
ns
ns
tcch
tcah
6
6
-
-
-
-
ns
ns
trbd 1 - - ns
trdf - - 30 ns
trdh 2 - - ns
trbh - - 6 ns
twds
twdh
-
6
-
-
10
-
ns
ns
tdrn - - 30 ns
tdaa
tdng
6
Nn *16.6
-
-
-
-
ns
ns
tcah
tccs tcch
trbd
trdf
trdh
trbh
twds twdh
tdrn
tdaa tdan
Write
Read
tras
tras 33 - - ns
twas
33 - - nstwas
trng
twng
twcy
trcy
trcy 55 - - ns
trng 20 - - ns
55 - - nstwcy
20 - - nstwng
XBEH/L(I) twbs twbh
twbs
twbh
6
6
-
-
-
-
ns
nsWrite byte enable hold time
(CL=30pF)
Item
Address setup time
Address hold time
XCS setup time
XCS hold time
Read data output start time
Read data confirmation time
Read data hold time
Read data output delay time
Write data delay acknowledge time
Write data hold time (after strobe negation)
XDREQ negate delay time
XDACK setup time
XDREQ minimum negate time
Read strobe assert time
Write strobe assert time
Read cycle
Read strobe negate time
Write cycle
Write strobe negate time
Write byte enable setup time
tccn
tccn 15 - - nsXCS negate time (Only when CPU IF mode is set*)
*Nn is determined by the DMA_EdgeMode.NegControl[3:0] setting. Nn = (NegControl + 3)
tdng
tdan 6 - - nsXDACK hold time
7. Electrical Characteristics
28 EPSON S1R72V27 Data Sheet (Rev. 1.00)
7.4.4 USB I/F Timing
Complies with the USB 2.0 standard (Universal Serial Bus Specification Revision 2.0
Released on April 27, 2000).
8. Connection Examples
S1R72V27 Data Sheet (Rev. 1.00) EPSON 29
8. Connection Examples
8.1 CPU I/F Connection Example
CA[8:1]
XBEL
DATA[15:0]
XCS
XRD
XWRH/XBEH
XWRL/XWR
XDREQ *1
XDACK *2
XINT
Address[8:1]
DATA[15:0]
XCS
XRD
XWRH
XWRL
XDREQ
XDACK
XINT
CA[8:1]
XBEL
DATA[15:0]
XCS
XRD
XWRH/XBEH
XWRL/XWR
XDREQ *1
XDACK *2
XINT
Address[8:1]
DATA[15:0]
XCS
XRD
XBEH
XWR
XDREQ
XDACK
XINT
XBEL
16-bit CPU (XWRH/XWRL) connection example
*1: Open when DMA is not used
*2: Set to inactive level when DMA is not used
16-bit CPU (XBEH/XBEL) connection example
*1: Open when DMA is not used
*2: Set to inactive level when DMA is not used
8. Connection Examples
30 EPSON S1R72V27 Data Sheet (Rev. 1.00)
8.2 USB I/F Connection Example
Refer to the separately provided S1R72V Series USB 2.0 Hi-Speed PCB Design Guidelines.
9. Product Codes
S1R72V27 Data Sheet (Rev. 1.00) EPSON 31
9. Product Codes
Table 9-1 Product codes
Product code Product type
S1R72V27B05**** PFBGA5UX60 package
S1R72V27B08**** PFBGA8UX81 package
S1R72V27F14**** QFP14-80 package
10. External Dimension Diagrams
32 EPSON S1R72V27 Data Sheet (Rev. 1.00)
10. External Dimension Diagrams
Refer to the PFBGA5UX60, PFBGA8UX81 and QFP14-80 package drawings at the end of this document.
Revision History
Revision History
Revision details
Date
Rev. Page
(old issue) Type Details
11/20/2007 1.0 All New Newly established
A1Corner 1
A
BottomView
A1Corner
TopView
S
SD
E
A
e
b
X
Y
10.23
0.25
0.25
0.26 0.5 0.36
0.08
0.1
D
E
Symbol
A
Min
5
5
Nom Max
1.2
D
E
A
A1
e
SD
φ
e
P‑TFBGA‑060‑0505‑0.50(PFBGA5U‑60)
2900‑0002‑01(Rev.1.1)
SE
2 3 4 5 6 7 8
B
C
D
E
F
G
H
Index
A1Corner 321 4 8765 9
H
A
C
D
E
F
G
B
J
BottomView
Index
A1Corner
TopView
Z
ZD
E
A
e
b
x
y
10.3
0.8
0.8
0.38 0.8 0.48
0.08
0.1
D
E
Symbol
A
Min
8
8
Nom Max
1.2
D
E
A
e
eA1
ZD
ZE
2900‑0002‑01(Rev.1.1)
P‑TFBGA‑081‑0808‑0.80(PFBGA8U‑81)
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Document Code: 411338400
First Issue December 2007
Mouser Electronics
Authorized Distributor
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