Semiconductor Components Industries, LLC, 2002
August, 2002 – Rev. 2 1Publication Order Number:
NCP4423/D
NCP4423, NCP4424,
NCP4425
3 A Dual High-Speed
MOSFET Drivers
The NC P4423/4424/4425 are M OSFET drivers t hat are capable of
giving reliable service in demanding electrical environments.
Although primarily intended for driving power MOSFETs, these
drivers are well–suited for driving other loads (capacitive, resistive,
or inductive) which require a low impedance driver capable of high
peak currents and fast switching times. Applications such as heavily
loaded clock l ines, c oaxial cables, o r piezoelectric t ransducers c an all
be driven with the NCP4423/4424/4425. The only known limitation
on loading i s t hat the t otal p ower dissipated o f t he driver must be kept
within the maximum power dissipation limits of the package.
Features
High Peak Output Current (3 A)
Wide Operating Range (4.5 V to 18 V)
High Capacitive Load Drive Capability (1800 pF in 25 nsec)
Short Delay Times (40 nsec Typ)
Matched Rise/Fall Times
Low Supply Current
With Logic “1’’ Input (3.5 mA)
With Logic “0’’ Input (350 µA)
Low Output Impedance (3.5 Typ)
Latch–Up Protected: Will Withstand 1.5 A Reverse Current
Logic Input Will Withstand Negative Swing Up to 5 V
ESD Protected (4 kV)
OUTPUT
VDD
INPUT
GND
NONINVERTING
4.7 V
300 mV
INVERTING
EFFECTIVE
INPUT C = 20 pF
(EACH INPUT)
NCP4423 DUAL INVERTING
NCP4424 DUAL NONINVERTING
NCP4425 ONE INV., ONE NONINV
NOTES:
1. NCP4425 has one inverting and one noninverting driver.
2. Ground any unused driver input.
FUNCTIONAL BLOCK DIAGRAM
Device Package Shipping
ORDERING INFORMATION
NCP4423DWR2 SO–16 1000 Tape & Reel
MARKING
DIAGRAM
1
16 SO–16
DW SUFFIX
CASE 751G
NCP442x
YYWWXZ
1
16
NCP4424DWR2 SO–16 1000 Tape & Reel
NCP4425DWR2 SO–16 1000 Tape & Reel
PDIP–8
P SUFFIX
CASE 626
1
8
NCP442x
YYWWXZ
CO
1
8
NCP4423P PDIP–8 50 Units/Rail
NCP4424P PDIP–8 50 Units/Rail
NCP4425P PDIP–8 50 Units/Rail
x = Device Number (3, 4, or 5)
YY = Year
WW = Work Week
X = Assembly ID Code
Z = Subcontractor ID Code
CO = Country of Origin
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NCP4423, NCP4424, NCP4425
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2
PIN CONNECTIONS
116
15
14
13
12
11
10
9
2
3
4
5
6
7
8
(Top View)
NC
IN A
NC
NC
NC
NC
GND
GND
NC
IN B OUT B
OUT B
VDD
VDD
OUT A
OUT A
16–Pin SO Wide
NCP4423
NCP4424
NCP4425
4423
NC
NC
OUT B
OUT B
VDD
VDD
OUT A
OUT A
4424
NC
NC
OUT B
OUT B
VDD
VDD
OUT A
OUT A
4425
NC = NO CONNECTION
NOTE: Duplicate pins must both be connected for proper
operation.
18
7
6
5
2
3
4
8–Pin DIP
NCP4423
NCP4424
NCP4425
NCP4423, NCP4424, NCP4425
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3
ABSOLUTE MAXIMUM RATINGS
Rating Value Unit
Supply Voltage +22 V
Input Voltage, IN A or IN B (VDD + 0.3 V to GND – 5.0 V) –5 V
Maximum Chip Temperature +150 °C
Storage Temperature Range, Tstg –65 to +150 °C
Lead Temperature (Soldering, 10 sec) +300 °C
Package Thermal Resistance
SOIC, RθJA
PDIP, RθJA
PDIP, RθJC
155
–125
–45
°C/W
Operating Temperature Range –40 to +85 °C
Package Power Dissipation (TA 70°C)
SOIC
PDIP 470
730 mW
mc
ELECTRICAL CHARACTERISTICS (TA = +25°C with 4.5 V VDD 18 V, unless otherwise specified.)
Characteristic Symbol Test Conditions Min Typ Max Unit
Input
Logic 1 High Input Voltage VOH 2.4 V
Logic 0 Low Input Voltage VIL 0.8 V
Input Current IIN 0 V VIN VDD –1.0 1.0 µA
Output
High Output Voltage VOH VDD –0.025 V
Low Output Voltage VOL 0.025 V
Output Resistance, High ROH IOUT = 10 mA,
VDD = 18 V 2.8 5.0
Output Resistance, Low ROL IOUT = 10 mA,
VDD = 18 V 3.5 5.0
Peak Output Current IPK 3.0 A
Latch–Up Protection
Withstand Reverse Current IREV Duty Cycle 2%
t 300 µs1.5 A
Switching Time (Note 1)
Rise Time tRFigure 1, CL = 1800 pF 23 35 nsec
Fall Time tFFigure 1, CL = 1800 pF 25 35 nsec
Delay Time 1 tD1 Figure 1, CL = 1800 pF 33 75 nsec
Delay Time 2 tD2 Figure 1, CL = 1800 pF 38 75 nsec
Power Supply
Power Supply Current ISVIN = 3.0 V (Both Inputs)
VIN = 0 V (Both Inputs)
1.5
0.15 2.5
0.25 mA
1. Switching times guaranteed by design.
NCP4423, NCP4424, NCP4425
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4
ELECTRICAL CHARACTERISTICS (Over operating temperature range with 4.5 V VDD 18 V, unless otherwise specified.)
Characteristic Symbol Test Conditions Min Typ Max Unit
Input
Logic 1 High Input Voltage VIH 2.4 V
Logic 0 Low Input Voltage VIL 0.8 V
Input Current IIN 0 V VIN VDD –10 10 µA
Output
High Output Voltage VOH VDD –0.025 V
Low Output Voltage VOL 0.025 V
Output Resistance, High ROIOUT = 10 mA,
VDD = 18 V 3.7 8.0
Output Resistance, Low ROIOUT = 10 mA,
VDD = 18 V 4.3 8.0
Peak Output Current IPK 3.0 A
Latch–Up Protection
Withstand Reverse Current IREV Duty Cycle 2%
t 300 µsec 1.5 A
Switching Time (Note 1)
Rise Time tRFigure 1, CL = 1800 pF 28 60 nsec
Fall Time tFFigure 1, CL = 1800 pF 32 60 nsec
Delay Time 1 tD1 Figure 1, CL = 1800 pF 32 100 nsec
Delay Time 2 tD2 Figure 1, CL = 1800 pF 38 100 nsec
Power Supply
Power Supply Current ISVIN = 3.0 V (Both Inputs)
VIN = 0 V (Both Inputs)
2.0
0.2 3.5
0.3 mA
1. Switching times guaranteed by design.
0.1 µF
CERAMIC
1 µF
WIMA
MKS–2
1 µF
WIMA
MKS–2
INPUT: 100 kHz,
square wave,
tRISE = tFALL
10 ns
INPUT
NCP4423
VDD = 16 V
OUTPUT
CL = 1800 pF
0.1 µF
CERAMIC
(1/2 NCP4425)
1
2
tD1
+5 V
INPUT
0 V
OUTPUT
0 V
90%
10%
10%
90%
10%
90% tFtR
tD2
tD1
+5 V
INPUT
0 V
OUTPUT
0 V
90%
10%
10%10%
90%
tF
tRtD2
90%
16 V
16 V
INPUT: 100 kHz,
square wave,
tRISE = tFALL
10 ns
INPUT
NCP4424
VDD = 16 V
OUTPUT
CL = 1800 pF
(1/2 NCP4425)
1
2
Figure 1. Inverting Driver Switching Time Figure 2. Noninverting Driver Switching Time
Test Circuit Test Circuit
NCP4423, NCP4424, NCP4425
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5
TYPICAL ELECTRICAL CHARACTERISTICS
20
0
100
80
60
40
CLOAD (pF)
20
0
100
80
60
40
1000 10000100
tFALL(nsec)
tRISE(nsec)
tFALL (nsec)
tRISE(nsec)
20
0
100
80
60
40
20
06 8 10 12 14 16
100
4
80
60
40
18
1000 10000100
VDD
20
06 8 10 12 14 16
CLOAD (pF)
Figure 3. Rise Time vs. Supply Voltage
5 V
100
4
80
60
40
32 CLOAD = 2200 pF
2 4 6 8 10 120
tD1
CLOAD = 2200 pF
VDD = 10 V
DELAY TIME (ns)
18 VDD
Figure 4. Fall Time vs. Supply Voltage
4700 pF
3300 pF
2200 pF
470 pF
10 V
15 V
tD2
TIME (ns)
tRISE
tFALL
tFALL
tRISE
30
28
26
24
22
20
18
4700 pF
3300 pF
2200 pF
470 pF
5 V
10 V
15 V
1500 pF
1000 pF
1500 pF 1000 pF
13 57 911
Figure 5. Rise Time vs. Capacitive Load Figure 6. Fall Time vs. Capacitive Load
Figure 7. Rise and Fall Times vs. Temperature Figure 8. Propagation Delay vs. Input Amplitude
TA (°C) INPUT (V)
–15 25 65 105–55 –35 5 45 85 125
NCP4423, NCP4424, NCP4425
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6
TYPICAL ELECTRICAL CHARACTERISTICS
4 6 8 1012141618
–55 –35 –15 5 25 45 65 85 105 125
45
20
30
40
35
25
50
45
20 4 6 8 101214
30
40
VDD
Figure 9. Propagation Delay Time vs. Supply
Voltage
35
25
16
CLOAD = 2200 pF
–55 –35 –15 5 25 45 65
TA (°C)
Figure 10. Delay Time vs. Temperature
0.01
468101214
0.1
16
VDD
Figure 11. Quiescent Current vs. Supply
Voltage
BOTH INPUTS = 1
1
I
TA (°C)
INPUTS = 1
QUIESCENT(mA)
VDD
10
2
14
12
VDD
50
18
tD2
tD2
85 105 125
CLOAD = 2200 pF
tD2
tD2
DELAY TIME (ns)
DELAY TIME (ns)
Figure 12. Quiescent Current vs. Temperature
INPUTS = 0
BOTH INPUTS = 0
18
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
IQUIESCENT (mA)
R
DS(ON)( )
4
6
8
4 6 8 1012141618
10
2
14
12
4
6
8
WORST CASE @ TJ = +150°C
TYP @ TA = +25°C
TA = +25°C
WORST CASE @ TJ = +150°C
TYP @ TA = +25°C
Figure 13. Output Resistance (Output High)
vs. Supply Voltage Figure 14. Output Resistance (Output Low)
vs. Supply Voltage
R
DS(ON)( )
NCP4423, NCP4424, NCP4425
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7
TYPICAL ELECTRICAL CHARACTERISTICS
ISUPPLY(mA)
ISUPPLY(mA)
20
10
10 100
40
60
50
30
1000
0
20
10
100 1000
40
60
I
CLOAD (pF)
Figure 15. Supply Current vs. Capacitive Load
50
30
10000
VDD = 18 V
634 kHz
SUPPLY (mA)
Figure 16. Supply Current vs. Frequency
70
20
100 1000
40
60
50
30
10000
80
90
70
20
0 100
40
60
50
30
1000
80
90
100 CLOAD (pF)
40
0
100
80
60
1000 10000 10 1000
FREQUENCY (kHz)
100
0
112.5 kHz
355 kHz
200 kHz
20
120
40
0
100
80
60
20
120
Figure 17. Supply Current vs. Capacitive Load Figure 18. Supply Current vs. Frequency
VDD = 12 V
2 MHz
634 kHz
355 kHz
VDD = 18 V 3300 pF
1000 pF
10,000 pF
100 pF
VDD = 12 V 3300 pF
1000 pF
10,000 pF 100 pF
VDD = 6 V
2 MHz
355 kHz
VDD = 6 V
10,000 pF
ISUPPLY(mA)
ISUPPLY(mA)
CLOAD (pF) FREQUENCY (kHz)
10
0
1.125 MHz
10
0
4700 pF
2200 pF
1000 pF
100 pF
1.125 MHz
634 kHz
355 kHz
112.5 kHz
20 kHz
63.4 kHz
200 kHz
20 kHz
63.4 kHz
35.5 kHz
20 kHz
112.5 kHz
100 pF
ISUPPLY(mA)
FREQUENCY (kHz)
Figure 19. Supply Current vs. Capacitive Load Figure 20. Supply Current vs. Frequency
NCP4423, NCP4424, NCP4425
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8
TYPICAL ELECTRICAL CHARACTERISTICS
VIN
Figure 21. NCP4423 Crossover Energy
AMBIENT TEMPERATURE (°C)
Figure 22. Thermal Derating Curves
16 Pin SOIC
1400
1200
1000
800
600
400
200
0
A sec
MAX. POWER (mA)
0 20 40 60 80 100 120 14
0
0 2 4 6 81012141618
–8
8
6
4
2
–9
8
6
4
2
–10
10
10
10
NOTE: The values on this graph represent the loss seen by both drivers
in a package during one complete cycle. For a single driver, divide the
stated values by 2. For a single transition of a single driver, divide the
stated value by 4.
Static–sensitive device. Unused devices must be stored in conductive
material. Protect devices from static discharge and static fields.
Stresses above those listed under Absolute Maximum Ratings (See
page 2 ) may cause permanent damage to the device. These are stress
ratings only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to Absolute Maximum Rating
Conditions for extended periods may affect device reliability.
NCP4423, NCP4424, NCP4425
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9
PACKAGE DIMENSIONS
PDIP–8
P SUFFIX
CASE 626–05
ISSUE K
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
58
F
NOTE 2 –A–
–B–
–T–
SEATING
PLANE
H
J
GDK
N
C
L
M
M
A
M
0.13 (0.005) B M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.40 10.16 0.370 0.400
B6.10 6.60 0.240 0.260
C3.94 4.45 0.155 0.175
D0.38 0.51 0.015 0.020
F1.02 1.78 0.040 0.070
G2.54 BSC 0.100 BSC
H0.76 1.27 0.030 0.050
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L7.62 BSC 0.300 BSC
M--- 10 --- 10
N0.76 1.01 0.030 0.040

SO–16
DW SUFFIX
CASE 751G–03
ISSUE B
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B S
T
16 9
81
hX 45
M
B
M
0.25
H8X
E
B
A
eT
A1
A
L
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM MIN MAX
MILLIMETERS
A2.35 2.65
A1 0.10 0.25
B0.35 0.49
C0.23 0.32
D10.15 10.45
E7.40 7.60
e1.27 BSC
H10.05 10.55
h0.25 0.75
L0.50 0.90
0 7
NCP4423, NCP4424, NCP4425
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10
Notes
NCP4423, NCP4424, NCP4425
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11
Notes
NCP4423, NCP4424, NCP4425
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12
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changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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NCP4423/D
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