
Preliminar
data sheet TLE 5224 G2
Semiconductor Group Page 03.02.97
3
Maximum Ratings for Tj = – 40°C to 150°C
Parameter Symbol Values Unit
Supply voltage
V
S- 0.3 ... + 60 V
Supply voltage operational range
V
S+ 4.8 ... + 45 V
Continuous drain source voltage (OUT1, OUT2)
V
DS 45 V
Input voltage IN1, IN2, ENA
V
IN - 0.3 ... + 6 V
Status output voltage
V
ST - 0.3 ... + 32 V
Operating temperature range
Storage temperature range
T
j
T
stg
- 40 ... + 150
- 55 ... + 150 °C
Output current per channel
I
D(lim) self limited A
Status output current
I
ST - 5 ... + 5 mA
Inductive load switch-off energy dissipation,
single pulse Tj= 150°C
E
AS 400 mJ
Thermal resistance junction - case1
junction - ambient
R
thJC
R
thJA
12
75 K/W
Pin Definitions and Functions
Pin Configuration(top view)
Pin Symbol Function
1 IN1 Control input channel 1
2 ST2 Status output channel 2
3 OUT2 Power output channel 2
4 N.C. Not connected, cooling
5,6,7,8 GND Ground, cooling
9,10 N.C. Not connected, cooling
11 ENA Enable input for both channels
12 VSSupply voltage
13,14,15,16 N.C. Not connected, cooling
17,18,19,20 GND Ground, cooling
21 N.C. Not connected, cooling
22 OUT1 Power output channel 1
23 ST1 Status output channel 1
24 IN2 Control input channel 2
1 Case = Pin 5 to 8 and 17 to 20.
Additionally the pins not connected (N.C.) have to be connected to the ground plane used as
thermal heatsink to achieve the best thermal resistance.