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Micrel, Inc.
SY89832U
Ordering Information(1)
Part Number Package Type Operating Range Package Marking Lead Finish
SY89832UMG QFN-16 Industrial 832U with Pb-Free bar line indicator NiPdAu
Pb-Free
SY89832UMG TR(2) QFN-16 Industrial 832U with Pb-Free bar line indicator NiPdAu
Pb-Free
Notes:
1. Contact f act ory for die avail abi lit y. Dice are guaranteed at TA = 25°C, DC Electricals only.
2. Tape and Reel.
Truth Table
IN /IN EN Q /Q
0 1 1 0 1
1 0 1 1 0
X X 0 0
(3)
1
(3)
Note:
3. On next negative trans iti on of the input signal (I N).
Pin Configuration
16-Pin QFN
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SY89832U
Pin Description
Pin Number Pin Name Pin Function
15, 16
1, 2
3, 4
5, 6
Q0, /Q0
Q1, /Q1
Q2, /Q2
Q3, /Q3
LVDS Differential (Outputs): Normally terminated with 100Ω across the pair (Q, /Q). See LVDS
Outputs section for more details.Unused outputs should be terminated with a 100Ω resist or across
each pair.
8 EN
The single-ended, TTL/CMOS-compatible input funct ion s as a synchrono us outp ut enabl e. T he
synchronous enable ensures that enable/disable will only occur when the outputs are in a logic LOW
state. Note that thi s input is int ernal ly connec ted to a 25kΩ pull-up resistor and will default to logic
HIGH state (enabled) if left open.
9, 12 /IN, IN
Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs accept AC-
or DC-Coupled differential signs as small as 100mV. Each pin of a pair internally terminates to a VT
pin through 50Ω. Note that these inputs will default to an intermediate state if left open. See Input
Interface Applications section for more details.
10 VREF-AC
Reference Voltage: These outputs bias to VCC–1.4V. They are used when AC coupling the inputs
(IN, /IN). For AC-Coupled applications, connect VREF-AC to VT pin and bypass with 0.01μF low
ESR capacitor to VCC. See Input Interface Applications section for more details.
Maximum sink/source current is ±1.5mA. Due to the limited drive capability, each VREF-A C pin is
only intended to drive its respective VT pin.
11 VT Input Termination Center-Tap: Each side of the differential input pair terminates to a VT pin. The
VT pins provide a center-tap to a termination network for maximum interface flexibility. See Input
Interface Applications section for more details.
13 GND
Ground. GND pins and exposed pad must be connected to the most negative potential of the device
ground.
7, 14 VCC
Positive Power Supply: Bypass with 0.1μF//0.01μF low ESR capacitors and place as close to each
VCC pin as possible.
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SY89832U
Absolute Maximum Ratings(4)
Supply Voltage (VCC) .................................... −0.5V to +4.0V
Input Voltage (VIN). ................................. −0.5V to VCC +0.3V
LVDS Output Current (IOUT) ....................................... ±10mA
Input Current
Source or Sink Current on (IN, /IN) .................... ±50mA
VREF-AC Current
Source or Sink Current on (IVT) ............................. ±2mA
Lead Temperature (soldering, 20s) ............................ 260°C
Storage Temperature (TS) ......................... −65°C to +150°C
Operating Ratings(5)
Suppl y Voltage Range (VIN) ................. +2.375V to +2.675V
Ambient Temperature (TA) .......................... –40°C to +85°C
Package Thermal Resistance(6)
QFN
(θJA) Still-Air ....................................................... 60°C/W
(ΨJB) ................................................................... 32°C/W
DC Electrical Characteristics(7)
TA = -40°C to +85°C, unless otherwise noted.
Symbol Parameter Condition Min. Typ. Max. Units
VCC Power Supply 2.375 2.5 2.625 V
ICC Power Supply Current No load, maximum VCC. 75 100 mA
RIN Input Resistance (IN-to-VT) 45 50 55 Ω
RDIFF_IN Differential Input Resistance
(IN-to-/IN) 90 100 110 Ω
VIH Input HIGH Voltage (IN, /IN) 0.1 VCC+0.3 V
VIL Input LO W Voltage (IN, /IN) −0.3 VIH-0.1 V
VIN Input Voltage Swing (IN, /IN) See Figure 4. 0.1 VCC V
VDIFF_IN Differential Input Voltage Swing
|IN – /IN| See Figure 5. 0.2 V
|IIN| Input Current (IN, /IN) Note 8 45 mA
VREF-AC Output Reference Voltage VCC − 1.525 VCC − 1.425 VCC − 1.325 V
Notes:
4. Permanent device dam age may occur if absolute maximum ratings are exceeded. This is a stress rating only and funct i onal operation is not implied
at conditions other than thos e detailed in the operati onal sections of this data sheet. Exposure to absol ute maximum rating c onditions for ex tended
periods may affect device reliabi l i ty.
5. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
6. Package t hermal resist ance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. ψJB and θJA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
7. The ci rcuit is designed to meet the DC specifications shown in the above table after therm al equili bri um has been establis hed.
8. Due to the internal term i nation the input current depends on t he applied voltages at IN, /IN and VT inputs. Do not apply a combination of voltages
that causes the input current to exceed the maximum limit!
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SY89832U
LVDS Outputs DC Electrical Characteristics(7)
VCC = 2.5V ±5%, RL = 100Ω across the outputs; TA = –40°C to +85°C.
Symbol Parameter Condition Min. Typ. Max. Units
VOUT Output Voltage Swing See Figure 4. 250 325 mV
VDIFF_OUT Differential Output Voltage Swing See Fi gure 5. 500 650 mV
VOCM Output Common Mode Voltage 1.125 1.275 V
∆ VOCM Change in Common Mode Voltage −50 50 mV
LVTTL/CMOS DC Electrical Characteristics(7)
VCC = 2.5V ±5%, TA = –40°C to +85°C.
Symbol Parameter Condition Min. Typ. Max. Units
VIH Input HIGH Voltage 2.0 VCC V
VIL Input LO W Voltage 0 0.8 V
IIH Input HIGH Current −125 30 µA
IIL Input LO W Current −300 µA
AC Electrical Characteristics(9)
VCC = 2.5V ±5% or 3.3V ±10%, RL = 100Ω across the outputs; TA = –40°C to +85°C unless otherwise stated.
Symbol Parameter Condition Min. Typ. Max. Units
fMAX Maximum Frequency VOUT ≥ 200mV 2.0 2.5 GHz
tpd Propagation Delay IN-to-Q
VIN < 400mV 370 470 570 ps
VIN ≥ 400mV 300 410 500 ps
tSKEW Within-Device Skew Note 10 5 20 ps
Part-to-Part Skew Note 11 200 ps
tS Set-Up Time EN to IN, /IN Note 12 300 ps
tH Hold Time EN to IN, /IN Note 12 500 ps
tJITTER Additive Phase Jitter
Carrier = 622M Hz
Integration Range: 12kHz – 20MHz 81 fs
Carrier = 250M Hz
Integration Range: 12kHz – 20MHz 195 fs
tr, tf Output Rise/Fall Times
(20% to 80%) At full output swing. 70 150 200 ps
Notes:
9. High-frequency AC parameters are guaranteed by design and characteri zat i on.
10. Within device skew is measured between two different out puts under ident ic al input trans iti ons.
11. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and no skew at the edges at the respective
inputs.
12. Set-up and hold times apply to synchronous appl ic ations t hat int end to enable/di sable before the next clock cycle. For asynchronous applications,
set-up and hold times do not apply.
September 10, 2014 5 Revision 3.0
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SY89832U
Input Stage
Figure 1. Simplified Differential Input Buffer
LVDS Outputs
LVDS specifies a small swing of 325mV typical, on a
nominal 1.2V common-mode above ground. The common-mode voltage has tight limits to permit large
variations in ground noise between an LVDS driver and
receiver.
Figure 2. LVDS Differential Measu rement
Figure 3. LVDS Common Mode Measurement
Single-Ended and Differential Swings
Figure 4. Single-Ended Sw ing
Figure 5. Differential Swing
September 10, 2014 10 Revision 3.0
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SY89832U
Input Interface Applications
Figure 6. DC-Coupled CML
Input Interface
Figure 7. AC-Coupled CML
Input Interface
Figure 8. DC-Coupled LVPECL
Input Interface
(*Bypass with 0.01µF to GND)
Figure 9. AC-Coupled LVPECL
Input Interface
Figure 10. LVDS Input Interface
Figure 11. AC-Coupled LVDS
Input Interface
September 10, 2014 11 Revision 3.0
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Micr
e
Sept
e
Pa
c
Note:
13.
P
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l, Inc.
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mber 10, 2
0
c
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16-Pin 3m
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Land Pa
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× 3mm QF
N
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N
(MM)
u
rrent informatio
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tcghelp@mi
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rel.com or (
4
c
rel.com.
SY89832
U
Revision 3.
0
4
08) 955-169
0
U
0
0
Micrel, Inc.
SY89832U
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-100 0 WEB http://www.micrel.com
Micrel, Inc. is a leading
global manufacturer of IC solutions for the worldwide high-
perform ance linear and po wer, LAN, and tim ing & communications
markets. The Company’s products include advanced mixed
-signal, analog & power semiconductors; high-
performance communication, clock
m
anagement, MEMs-based clock oscillators & crystal-less clock generators, Ethernet switches, and physical layer transceiver ICs.
Company
customers include leading manufacturers of enterprise, consumer, industrial, mobile, telecommunications, automotive, an
d computer products.
Corporation headquarters and state
-of-the-
art wafer fabrication facilities are located in San Jose, CA, with regional sales and support offices and
advanced technol ogy design centers s ituated throughout the Americas, Europe, and Asia
.
Additionally, the Company maintains an extensive network
of distribut ors and reps worldwide.
Micrel makes no representations or warranties with respect to the accuracy or completeness of the inf
ormation furnished in this data
sheet. This
information is
not intended as a warranty and Micrel does not assume responsibility for its use.
Micrel reserves the right to change circuitry,
specifications and descriptions at any time without notice.
No license, whether express, implied, arising by estoppel or othe
rwise, to any intellectual
property rights
is granted by this document. E
xcept as provided in Micrel’s terms and conditions of sale f or such products, Micrel assumes no liability
whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties
relating to fitness for a partic ular purpose, merchant abi lit y, or inf ri ngem ent of any patent, copyright
, or other intellectual property right.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical
i
mplant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expec ted to result in a s
ignificant injury to the user. A
Purchaser’s use or s al e of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees t o fully
indemnify Mic rel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
September 10, 2014 13 Revision 3.0
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