Datashee
t
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
1/20
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･14･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
1ch Small Package
High Side Switch ICs
for USB Devices and Memory Cards
BD2220G-LB BD2221G-LB
General Description
This is the product guarantees long time support in
Industrial market.
BD2220G and BD2221G are low on-resistance
N-channel MOSFET high-side power switches,
optimized for Universal Serial Bus (USB) applications.
BD2220G and BD2221G are equipp ed with the function
of over-current detection, thermal shutdown,
under-voltage lockout and soft-start.
Features
■ Long time support a product for Industrial
applications.
■ Low On-Resistance (Typ. 160mΩ) N-channel
MOSFET Built-in
■ Over-Current Detection
(Output off-latch operation)
■ Thermal Shutdown
■ Open-Drain Fault Flag Output
■ Under-Voltage Lockout
■ Soft-Start Circuit
■ Control Input Logic
¾ Active-High : BD2220G
¾ Active-Low : BD2221G
■ Reverse Current Protection when
Power Switch Off
Applications
Industrial Equipment,
USB hub in consumer appliances, Car accessory, PC,
PC peripheral equipment, and so forth
Key Specifications
Input voltage range: 2.7V to 5.5V
ON resistance: 160mΩ(Typ.)
Over current threshold: 0.5A min., 1.0A max.
Standby current: 0.01μA (Typ.)
Operating temperature range: -40℃ to +85℃
Package W(Typ.) D (Typ.) H (Max.)
SSOP5 2.90mm x 2.80mm x 1.25mm
Typical Application Circuit
Lineup Over current detection Control input logic Package Orderable Part Number
Min. Typ. Max.
0.5A - 1.0A High SSOP5 Reel of 3000 BD2220G – LBTR
0.5A - 1.0A Low SSOP5 Reel of 3000 BD2221G – LBTR
SSOP5
10kΩ~
100kΩ
CL
CIN VIN
GND
EN
VOU
T
/
OC
5V (Typ. )
+
-
3.3V
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
OCD Dela
y
Counter SQ
R
Charge
pump TSD
UVL
O
/OC
EN
VIN VOUT
GN
D
Block Diagram
Pin Configurations
VIN
GND
EN
1
2
3 4
5
/OC
VOUT
VIN
GND
/EN
1
2
34
5
/OC
VOUT
Pin Description
Pin No. Symbol I/O Function
1 VIN - Switch input and the supply voltage for the IC.
2 GND - Ground.
3 EN, /EN I
Enable input.
EN: High level input turns on the switch. (BD2220G)
/EN: Low level input turns on the switch. (BD2221G)
4 /OC O
Over-current notification terminal.
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
5 VOUT O Switch output.
BD2220G
TOP VIEW BD2221G
TOP VIEW
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Ratings Unit
VIN supply voltage VIN -0.3 to 6.0 V
EN(/EN) input voltage VEN(/EN) -0.3 to 6.0 V
/OC voltage V/OC -0.3 to 6.0 V
/OC sink current I/OC 5 mA
VOUT voltage VOUT -0.3 to 6.0 V
Storage temperature TSTG -55 to 150 ℃
Power dissipation Pd 675 *1 mW
*1 Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1oC above 25oC.
Recommended Operation Range
Parameter Symbol Ratings Unit
Min. Typ. Max.
VIN operating voltage VIN 2.7 5.0 5.5 V
Operating temperature TOPR -40 - 85 ℃
Electrical Characteristics (VIN= 5V, Ta= 25℃, unless otherwise specified.)
DC Characteristics
Parameter Symbol Limits Unit Conditions
Min. Typ. Max.
Operating current IDD - 110 160 μA VEN = 5V (BD2220G)
V/EN = 0V (BD2221G)
VOUT = open
Standby current ISTB - 0.01 5 μA VEN = 0V (BD2220G)
V/EN = 5V (BD2221G)
VOUT = open
EN(/EN) input voltage VEN(/EN) 2.0 - - V High input
VEN(/EN) - - 0.8 V Low input
EN(/EN) input leakage IEN(/EN) -1.0 0.01 1.0 μA VEN(/EN) = 0V or 5V
On-resistance RON - 160 210 mΩ IOUT = 50mA
Switch leak current ILSW - - 1.0 μA VEN(/EN) = 0V, VOUT = 0V
Reverse leak current IREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Over-current threshold ITH 0.5 - 1.0 A
Short circuit output current ISC 0.35 - - A VOUT = 0V, RMS
/OC output low voltage V/OC - - 0.4 V I/OC = 0.5mA
UVLO threshold VTUVH 2.1 2.3 2.5 V VIN increasing
VTUVL 2.0 2.2 2.4 V VIN decreasing
AC Characteristics
Parameter Symbol Limits Unit Conditions
Min. Typ. Max.
Output rise time TON1 - 1 6 ms RL = 20Ω
Output turn-on time TON2 - 1.5 10 ms RL = 20Ω
Output fall time TOFF1 - 1 20 μs RL = 20Ω
Output turn-off time TOFF2 - 3 40 μs RL = 20Ω
/OC delay time T/OC 10 15 20 ms
4/20
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Measurement Circuit
VIN
GND
EN(/EN)
VOUT
/OC
VIN
VEN(/EN)
A
1µF
VIN
GND
EN(/EN)
VOUT
/OC
VIN
VEN(/EN)
A
1µF RL
A. Operating current B. EN,/EN Input voltage, Output rise/fall time
VIN
GND
EN(/EN)
VOUT
/OC
VIN
VEN(/EN)
A
1µF IOUT
10kΩ
VIN
GND
EN(/EN)
VOUT
/OC
VIN
VEN(/EN)
A
1µF
IOC
C. On-resistance, Over-current detection D. /OC Output low voltage
Figure 1. Measurement circuit
Timing Diagram
TON1 TOFF1
90%
10% 10%
TON2 TOFF2
50% 50%
90%
VEN
VOUT
TON1 TOFF1
90%
10%10%
TON2 TOFF2
50% 50%
90%
V/EN
VOUT
Figure 2. Output rise/fall time
(BD2220G) Figure 3. Output rise/fall time
(BD2221G)
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Typical Performance Curves
0
20
40
60
80
100
120
140
23456
SUPPLY V O LTAG E : VIN[V]
O P E RA TI NG CURRE NT : I [μA]
Ta=
2
5
°
C
Figure 4. Operating current
EN,/EN enable
0
20
40
60
80
100
120
140
-50050100
AMBIENT TEMPERATURE : T a[℃]
O P E RA TI NG CURRE NT : IDD[μA]
V
IN=5.
0V
Figure 5. Operating current
EN,/EN enable
0.0
0.2
0.4
0.6
0.8
1.0
23456
SUPPLY VOLTAGE : VIN[V]
STANDBY CURRENT : I STB[μA]
Ta=
2
5
°
C
Figure 6. Standby current
EN,/EN disable
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
AMBI ENT T EMPERAT URE : T a[ ℃]
S TANDB Y CURRE NT : I
DD[μA]
VIN=5.
0
V
Figure 7. Standby current
EN,/EN disable
6/20
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
0.0
0.5
1.0
1.5
2.0
23456
SUPPLY VOLTAGE : VIN[V]
ENABLE INPUT CURRENT : V EN[V]
Ta=
2
5
°
C
L
ow to
Hi
g
h
High to Low
Figure 8. EN,/EN input voltage
0.0
0.5
1.0
1.5
2.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
ENABLE INPUT CURRENT : V EN [V]
V
IN=5.
0V
Low to High
Hi
g
h
to
L
ow
Figure 9. EN,/EN input voltage
0
50
100
150
200
250
23456
SUPPLY VOLTAGE : VIN[V]
ON RESISTANCE : RON[mΩ]
T
a=
2
5
°
C
Figure 10. On-resistance
0
50
100
150
200
250
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
ON RESISTANCE : RON[mΩ]
V
IN=5.
0V
Figure 11. On-resistance
7/20
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
0.5
0.6
0.7
0.8
0.9
1.0
23456
SUPPLY VOLTAGE : VIN[V]
O V E RCURRE NT THRES HOLD : ITH[A]
Ta=
2
5
°
C
Figure 12. Over-current threshold
0.5
0.6
0.7
0.8
0.9
1.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
OV ERCURRENT T HRESHOLD : ITH[A]
VIN=5.
0
V
Figure 13. Over-current threshold
0
20
40
60
80
100
23456
SUPPLY VOLTAGE : VIN[V]
/OC OUTPUT LOW VOLTAGE : V/OC[mV]
Ta=
2
5
°
C
Figure 14. /OC output low voltage
0
20
40
60
80
100
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
/OC OUTPUT LOW VOLTAGE : V/OC[mV]
VIN=5.
0
V
Figure 15. /OC output low voltage
8/20
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
2.0
2.1
2.2
2.3
2.4
2.5
-50 0 50 100
AMBI ENT T EMPERATURE : T a[℃
UVLO THRESHOLD : VTUVH, V TUVL[V]
V
IN=5.
0V
V
TUVH
V
TUVL
Figure 16. UVLO threshold
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VIN[V]
RISE TIME : TON1[ms]
T
a=
2
5
°
C
Figure 18. Output rise time
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
RISE T IME : TON1[ms]
V
IN=5.
0V
Figure 19. Output rise time
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
UVLO HYSTERESIS VOL TAGE:VHSY[V]
VIN=5.
0
V
Figure 17. UVLO hysteresis voltage
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VIN[V]
TURN ON TIME : T ON2[ms]
T
a=
2
5
°
C
Figure 20. Output turn-on time
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta [℃]
TURN ON TIME : TON2[ms]
VIN=5.
0
V
Figure 21. Output turn-on time
0.0
1.0
2.0
3.0
4.0
5.0
23456
SUPPLY VOLTAGE : VIN[V]
FALL T I ME : TOFF1[μs]
T
a=
2
5
°
C
Figure 22. Output fall time
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
FALL T I ME : TOFF1[μs]
V
IN=5.
0V
Figure 23. Output fall time
10/20
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Typical Performance Curves - continued
0.0
1.0
2.0
3.0
4.0
5.0
6.0
23456
SUPPLY VOLTAGE : VIN[V]
TURN OFF TIME : TOFF2[μs]
Ta=
2
5
°
C
Figure 24. Output turn-off time
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
TURN OFF T IME : T OFF2[μs]
VIN=5.
0
V
Figure 25. Output turn-off time
10
12
14
16
18
20
23456
SUPPLY VOLTAGE : VIN[V]
/OC DDLAY TIME : T/OC[ms]
Ta=
2
5
°
C
Figure 26. /OC delay time
10
12
14
16
18
20
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
/OC DDLAY TIME : T/OC[ms]
VIN=5.
0
V
Figure 27. /OC delay time
11/20
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Typical Waveforms
TIME(1ms/div.)
Figure 28. Output rise characteristic
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.) VIN=5V
RL=20Ω
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VIN=5V
RL=20Ω
TIME(2us/div.)
Figure 29. Output fall characteristic
TIME (1ms/div.)
Figure 30. Inrush current response
CL=47uF
CL=100uF
CL=220uF
(5V/div.)
VEN
IOUT
(0.2A/div.)
V/OC
(5V/div.)
VIN=5V
RL=20Ω
TIME (2ms/div.)
Figure 31. Over-current response
ramped load
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.) VIN=5V
1A/10ms
12/20
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21.Feb.2014 Rev.002
Typical Waveforms - continued
TIME (10ms/div.)
Figure 32. Over-current response
r
am
p
ed load
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VIN=5V
1A/50ms
TIME (5ms/div.)
Figure 33. Over-current response
enable to short-circuit
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
VIN=5V
TIME (5ms/div.)
Figure 34. Over-current response
1Ω load connected at EN
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(1A/div.)
VIN=5V
RL=1Ω
TIME (10ms/div.)
Figure 35. UVLO response
an increasing VIN
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.) RL=20Ω
13/20
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TSZ22111･15･001 TSZ02201-0E3E0H300380-1-2
21.Feb.2014 Rev.002
Typical Wave Forms - continued
Typical Application Circuit
Application Information
When excessive current flo ws due to output s hort-circuit or so, ringi ng occurs because of inductance between power source
line to IC, and may cause bad influences on IC operations. In order to avoid this case, connect a bypass capacitor across
IN terminal and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by a resistance value of 10kΩ to 100kΩ.
Set up value which satisfies the application of either CL.
This application circuit does n ot guara ntee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
RL=20Ω
TIME (10ms/div.)
Figure 36. UVLO response in
a decreasing VIN
Controlle
r
10kΩ to
100kΩ
CL
CIN VIN
GND
EN(/EN)
VOUT
/OC
5V (Typ.)
+
-
14/20
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21.Feb.2014 Rev.002
Functional Description
1. Switch Operation
VIN terminal and VOUT terminal are connected to the drain and the source of s witch MOSFET respectively. And the VIN
terminal is used also as power source input to internal control circuit.
When the switch is turned ON from EN,/EN control in put, the switch is bidirectional. VIN terminal and VOUT terminal are
connected by a 160mΩ (Typical) switch., Therefore, when the potential of VOUT terminal is higher than that of VIN
terminal, current flows from VOUT terminal to VIN terminal. On the other hand, when the switch is turned OFF, it is
possible to prevent current from flowing reversely from VOUT to VIN since a parasitic diode between the drain and the
source of switch MOSFET is not present,
2. Thermal Shutdown Circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 170°C (typ.) in the condition of over current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 150°C (typ.), power
switch is turned on and fault flag (/OC) is cancelled. Unless the increasing of the chip’s temperature is removed or the
output of power switch is turned off, this operation repeats.
Note: The thermal shutdown circuit operates when the switch is on (EN,/EN signal is active).
3. Over Current Detection (OCD)
The Over Current Detection circuit limits current (ISC) and outputs a fault flag (/OC) when current flowing in each
MOSFET exceeds a specified value. There are three types of response against over current. The over current detectio n
circuit works when the switch is on (EN,/EN signal is active).
3-1. When the switch is turned ON while the output is in shortcircuit status
When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status
immediately.
3-2. When the output shortcircuits while the switch is on
When the output short-circuits or high-current load is connected while the switch is on, very large c urrent flows until
the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out.
3-3. When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the detection valu e, current limitation is carried out.
4. Under Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typical). If the VIN drops below
2.2V(Typical) while the switch is still ON, then UVLO will shut off the power switch. UVLO has a hysteresis of
100mV(Typical).
Note: Under voltage lockout circuit works when the switch is on (EN,/EN signal is active).
5. Fault Flag (/OC) Output
Fault flag output is an NMOS open drain output. At detection of over current and/or thermal shutdown, the output level is
low.
Over current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at
switch on, hot plug from being informed to outside.
T/OC T
/
OC
ONOFFON
Output current
Sw itc h status
VEN
FLAG Output
Figure 37. Over-current shutdown operation (reset at toggle of EN）(BD2220G)
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21.Feb.2014 Rev.002
Sw itch status
VIN
T/OC T
/
OC
ON OFF ON
Outp ut c ur r en t
VTUVH
V
TUVL
FLAG Output
VEN
Figure 38. Over-current shutdown operation (reset at UVLO operation) (BD2220G)
Power Dissipation
(SSOP5 package)
Figure 39. Power dissipation curve (Pd-Ta curve)
I/O Equivalence Circuit
Symbol Pin No. Equivalence circ uit Symbol Pin No. Equivalence circuit
EN
(/EN) 3 EN
(/EN) /OC 4
/OC
VOUT 5 VOUT - - -
0
100
200
300
400
500
600
700
0 25 50 75 100 125 150
AMBIENT TEMPERATURE : Ta [℃]
POWER DISSIPATION : Pd [mW]
85
675mW * 70mm x 70mm x 1.6mm Glass Epo x y Board
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21.Feb.2014 Rev.002
Operational Notes
(1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit bet ween pins. T herefore, it is important to consider circuit protection measures, such as
adding a fuse, in case the IC is operated over the absolute maximum ratings.
(2) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals
(4) Power supply lines
Design the PCB layout pattern to provide low im pedance ground an d supply lines. Separate the ground and s upply lines
of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature
and aging on the capacitance value when using electrolytic capacitors.
(5) Ground voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
(6) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. T he IC ma y be damaged if it is mounted in a wrong orientation
or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
(7) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
(8) Testing on application boards
When testing the IC on a n ap plication board, connecting a capacitor directl y to a l ow-impedance output pin may sub ject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
(9) Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor Transistor (NPN)
N N N P+ P
+
P
P substrate
GND
Parasitic element
Pin A
N
N P+ P+
P
P substrate
GND
Parasitic element
Pin B C B
E
N
GND
Pin A
Pin B
Other adjacent elements
E
B C
GND Parasitic
element
Figure 40. Example of monolithic IC structure
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21.Feb.2014 Rev.002
(10) GND wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large curre nts. Also ensur e that the GND traces of exter nal com pon ents do not caus e variatio ns on th e
GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
(11) External capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nomi nal capacitance due to DC bias and others.
(12) Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is desig ned to turn off the IC when the internal temperature
of the IC reaches a specified value. Do not continue to o perate the IC after this func tion is activated. Do not use the IC in
conditions where this function will always be activated.
(13) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).
Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja
Power dissipation : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib
Tjmax : Maximum junction te mperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
.
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21.Feb.2014 Rev.002
Ordering Information
B D 2 2 2 x G - L B T R
Part Numbe
r
Package
G : SSOP5 Product class
LB for Industrial applications
Packaging and forming specific ation
TR: Embossed tape and reel
Marking Diagram
Part Number Part Number Marking
BD2220G DX
BD2221G DY
Part Number Marking
LOT Number
SSOP5 (TOP VIEW)
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21.Feb.2014 Rev.002
Physical Dimension Tape and Reel Information
Package Name SSOP5
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21.Feb.2014 Rev.002
Revision History
Date Revision Changes
13.Mar.2013 001 New Release
21.Feb.2014 002
Delete sentence “and log life cycle” in General Description and Futures (page 1).
Change “Industrial Application s” to “Industrial Equipment” in Applications (page 1).
Applied new style (“title”, “Ordering Information” and “Physical Dimension Tape and Reel
Information”).
Datasheet
Datasheet
Notice - SS Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - SS Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
