BAT54JW
Document number: DS30157 Rev. 11 - 2 1 of 3
www.diodes.com July 2008
© Diodes Incorporated
BAT54J
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAY
Features
• Low Forward Voltage Drop
• Fast Switching
• Ultra-Small Surface Mount Package
• PN Junction Guard Ring for Transient and ESD Protection
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Orientation: See Diagram
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.006 grams (approximate)
C
1
A
2
A
1
C
2
(Jumper
connection
between
middle pins)
Top View Device Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 30 V
Forward Continuous Current (Note 1) IF 200 mA
Repetitive Peak Forward Current (Note 1) IFRM 300 mA
Forward Surge Current (Note 1) @ t < 1.0s IFSM 600 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) PD 200 mW
Thermal Resistance, Junction to Ambient Air (Note 1) RθJA 625 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +125 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) V(BR)R 30 ⎯ ⎯ V IR = 100μA
Forward Voltage
VF ⎯ ⎯
240
320
400
500
1000
mV
IF = 0.1mA
IF = 1mA
IF = 10mA
IF = 30mA
IF = 100mA
Reverse Leakage Current (Note 2) IR ⎯ ⎯ 2.0 μA VR = 25V
Total Capacitance CT ⎯ ⎯ 10 pF VR = 1.0V, f = 1.0MHz
Reverse Recovery Time trr ⎯ ⎯ 5.0 ns IF = 10mA through IR = 10mA
to IR = 1.0mA, RL = 100Ω
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our webs ite at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.