BAT54J / W / AW / CW / SW
June 1999 - Ed: 2A
SMALL SIGNAL SCHOTTKY DIODE
VERYSMALLCONDUCTION LOSSES
NEGLIGIBLESWITCHING LOSSES
LOW FORWARD VOLTAGEDROP
SURFACE MOUNTDEVICE
FEATURES AND BENEFITS
Schottky barrier diodes encapsulated either in
SOT-323 or SOD-323small SMDpackages.
Single and double diodes with differentpining are
available.
DESCRIPTION
K
A
A
NC
NC
K
Symbol Parameter Value Unit
VRRM Repetitivepeak reversevoltage 30 V
IFContinuousforwardcurrent 0.3 A
IFSM Surgenon repetitiveforward current tp=10mssinusoidal 1 A
Ptot Powerdissipation(note 1)
Tamb= 25°CSOD-323 230 mW
SOT-323
Tstg Maximum storagetemperaturerange - 65 to +150 °C
Tj Maximum operatingjunctiontemperature* 150 °C
TLMaximum temperaturefor solderingduring 10s 260 °C
Note 1: for double diodes, Ptotis the total dissipationof bothdiodes
ABSOLUTE RATINGS (limitingvalues)
BAT54W
A1 A1
A2
A2
KK
BAT54CW
A1
K2
A2
K1 A2
K1
K2
A1
BAT54SW
*:
dPtot
dTj
<1
Rth
(
j
−
a
)thermal runawayconditionfor a diode on its own heatsink
K1 K1
K2
K2
AA
BAT54AW
BAT54J
AK
86
SOT-323
SOD-323
1/5
Symbol Parameters Testsconditions Min. Typ. Max. Unit
VF* Forwardvoltagedrop Tj =25°CI
F
= 0.1 mA 240 mV
IF= 1 mA 320
IF= 10 mA 400
IF= 30 mA 500
IF= 100 mA 900
IR** Reverseleakagecurrent Tj =25°CV
R
=30V 1 µA
Tj =100°C 100
Pulse test : * tp =380 µs, δ<2%
** tp =5 ms, δ<2%
STATIC ELECTRICAL CHARACTERISTICS(perdiode)
Symbol Parameters Tests conditions Min. Typ. Max. Unit
C Junction
capacitance Tj=25
°
CV
R
= 1 V F = 1 MHz 10 pF
trr Reverserecovery
time IF=10mA I
R=10mA Tj=25°C
I
rr = 1 mA RL=100 Ω5ns
DYNAMIC CHARACTERISTICS (Tj= 25 °C)
Symbol Parameters Value Unit
Rth(j-a) Junctionto ambient(*) SOD-323 550 °C/W
SOT-323 °C/W
(*)Mountedon epoxy board,with recommendedpad layout.
THERMAL RESISTANCE
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
0.00E+0
2.00E-3
4.00E-3
6.00E-3
8.00E-3
1.00E-2
1.20E-2
1.40E-2
1.60E-2
1.80E-2
2.00E-2
VFM(V)
IFM(A)
Tj=100°C
Tj=50°CTj=25°C
Fig. 1-1: Forward voltage drop versus forward
current(typicalvalues,low level).
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
1E-3
1E-2
1E-1
5E-1
VFM(V)
IFM(A)
Tj=100°C
Tj=50°C
Tj=25°C
Fig. 1-2: Forward voltage drop versus forward
current(typicalvalues,high level).
BAT54J/ W / AW / CW / SW
2/5
0 5 10 15 20 25 30 35 40 45 50
300
350
400
450
500
550
600
S(Cu) (mm )
Rth(j-a) (°C/W)
P=0.2W
Fig. 6: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printedcircuit boardFR4,copperthickness:35µm.)
0 5 10 15 20 25 30
1E-2
1E-1
1E+0
1E+1
1E+2
VR(V)
IR(µA)
Tj=50°C
Tj=25°C
Tj=100°C
Fig. 2: Reverse leakage current versus reverse
voltageapplied (typicalvalues).
0 25 50 75 100 125 150
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
1E+4
Tj(°C)
IR(µA)
VR=30V
Fig. 3: Reverse leakage current versus junction
temperature.
12 5102030
1
2
5
10
VR(V)
C(pF)
F=1MHz
Tj=25°C
Fig. 4: Junction capacitance versus reverse
voltageapplied(typicalvalues).
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2
0.01
0.10
1.00
tp(s)
Zth(j-a)/Rth(j-a)
Single pulse
δ= 0.1
δ= 0.2
δ= 0.5
T
δ=tp/T tp
Fig. 5: Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
FR4with recommendedpad layout,e(Cu)=35µm)
BAT54J/ W / AW / CW / SW
3/5
PACKAGE MECHANICAL DATA
SOT-323
E
c
L
H
b
D
A
A1
e
θ
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.8 1.1 0.031 0.043
A1 0.0 0.1 0.0 0.004
b 0.25 0.4 0.010 0.016
c 0.1 0.26 0.004 0.010
D 1.8 2.0 2.2 0.071 0.079 0.086
E 1.15 1.25 1.35 0.045 0.049 0.053
e 0.65 0.026
H 1.8 2.1 2.4 0.071 0.083 0.094
L 0.1 0.2 0.3 0.004 0.008 0.012
θ030°030°
BAT54J/ W / AW / CW / SW
4/5
PACKAGE MECHANICAL DATA
SOD-323
H
b
D
E
A1
A
L
Q1
c
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 1.17 0.046
A1 0 0.1 0 0.004
b 0.25 0.44 0.01 0.017
c 0.1 0.25 0.004 0.01
D 1.52 1.8 0.06 0.071
E 1.11 1.45 0.044 0.057
H 2.3 2.7 0.09 0.106
L 0.1 0.46 0.004 0.02
Q1 0.1 0.41 0.004 0.016
Orderingtype Marking Package Weight Base qty Deliverymode
BAT54W D73 SOT-323 0.006g 3000 Tape& reel
BAT54AW D74 SOT-323 0.006g 3000 Tape& reel
BAT54CW D77 SOT-323 0.006g 3000 Tape& reel
BAT54SW D78 SOT-323 0.006g 3000 Tape& reel
BAT54J 86 SOD-323 0.005g 3000 Tape& reel
EpoxymeetsUL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use ofsuch informationnor forany infringementof patentsorother rightsof third parties which may resultfrom itsuse. Nolicenseis grantedby
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all informationpreviously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics. The ST logois a registeredtrademark of STMicroelectronics
1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia
Malta - Morocco -Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
BAT54J/ W / AW / CW / SW
5/5
