TQ1303-1308
Data Sheet
For additional information and latest specifications, see our website: www.triquint.com 6
Package Dimensions:
JEDEC DESIGNATION DESCRIPTION METRIC ENGLISH NOTE
A OVERALL HEIGHT 0.90 +/-.10 mm .035 +/-.004 in 1
A2 PACKAGE BODY HEIGHT 0.70 +/-.05mm .028 +/-. 002 i n 1
A3 PACKAGE BASE HEIGHT 0.20 +/-.05mm .008 +/-.002 in 1
r LEAD RADIUS 0.075 mm REF .003 in 1
b TERMINAL WIDTH 0.23 +/-.05 mm .009 +/-.002 in 1
D PACKAGE LENGTH 2.00 mm BSC .079 in 1
D2 EXOPSED PAD LENGTH 1.324 +/-0.1 mm .052 +/-.004 in 1
e TERM IN AL PI TC H 0.65 mm BSC .02 6 in 1
E PACK AGE WIDT H 2.00 mm BSC .079 in 1
E2 EXPOSED PAD WIDTH 0.624 +/-0.1 mm .025 +/-.004 in 1
E4 PAD END TO CENTERLINE 0.662 +/-0.1 mm .026 +/-.004 in 1
L TERMINAL LENGTH 0.355 +/-.14 mm .014 +/-.006 in 1
L2 TERMINAL PAST BODY LENGTH 0.063 m m REF .03 in 1
L3 TERMINAL PAST BODY W IDTH 0.063 m m REF .03 i n 1
1. Notes: PRIMARY DIMENSIONS ARE IN METRIC MILLIMETERS. THE ENGLISH EQUIVALENTS ARE CALCULATED AND SUBJECT TO
ROUNDING ERROR.
Additional Information
For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint:
Web: www.triquint.com Tel: (503) 615-9000
Email: info_wireless@tqs.com Fax: (503) 615-8900
For technical questions and additional information on specific applications:
Email: info_wireless@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this
infor mation, and all such inf ormation shall be entir ely at t he user's own ris k. Pri ces and s pecifi cations are subject to change without noti ce. No patent rights or licenses to any of
the ci rcuits described herei n are implied or granted t o any third party.
TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright © 1998 TriQuint Semiconductor, Inc. Al l rights reser ved.Revision A, Oc tober, 2001
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