SMW010AJ1 - TE Connectivity

Data Sheet

August 20 01

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

The SMC/SMW Dual-Outp ut Series Surface-M o unt Power

Modules use advanced, surface-mount technology and

deliver high-quality, compact, dc-dc conversion at an eco-

nomical price.

Applications

■Communication equipment

■Computer equipment

■Distributed power architectures

Options

■Negative remote on-off logic

■Synchronization

■Tight output voltage regulation

■Input voltage turn-on adjustment

is a registered trademark of Underwriters Laboratories, Inc.

†

CSA

is a registered trademark of Canadian Standards Associa-

tion.

‡

VDE

is a trademark of Verband Deutscher Elektrotechniker e.V.

§This product is intended for integration into end-use equipment.

All the required procedures for CE marking of end-use equip-

ment should be followed. (The CE mark is placed on selected

products.)

Features

■Low profile: 10 mm x 30.2 mm x 49.5 mm

(0.39 in. x 1.19 in. x 1.95 in.)

■Wide input voltage range: 18 Vdc to 36 Vdc and

36 Vdc to 75 Vdc

■Input-to-output isolation: 1500 V

■Operating case temperature range: –40 °C to

+105 °C

■Overcurrent protection, unlimited duration

■Remote on/off

■Output voltage adjustment: 90% to 105% of VO, nom

■Output overvoltage protection

■Undervoltage lockout

■

60950 Recognized,

CSA

† C22.2 No. 60950-00

Certified,

VDE

‡ 0805 (EN60950) Licensed

■CE mark meets 73/23/EEC and 93/68/EEC

directives§ (SMW only)

■Within FCC Class A radiated limits

Description

The SMC/SM W D ual-O u tput Se ries Surface-Mount

Po we r M odu les are l ow-profile, d c- dc converter s t h at

operate over an input voltage range of 18 Vdc to

36 Vdc or 36 Vdc to 75 Vdc and provide a precisely

regulated output. The output is isolated from the

input, allowing versatile polarity configurations and

grounding connections. The modules have a maxi-

mum power rating of 10 W and efficiencies up to

80%. Built-in filtering f or both input and output mini-

mizes the need for external filtering.

These modules are designed and manufactured to

be gull-winged surface-mounted power modules that

are reflowed with other surface-mount components in

a typical surface-mount fashion.

2Tyco Electronics Corp.

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-

lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess

of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended

periods can adversely affect device reliability.

* Maximum case temperature varies based on power dissipation. See derating curves, Figure 14, for details .

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions.

Table 1. Input Specifications

Fusing Considerations

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone

operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal

fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse.

The safety agencies require a normal-blo w fuse with a maximum rating of 5 A (see Safety Considerations section).

Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same

type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data for further information.

Parameter Device Symbol Min Typ Max Unit

Input Voltage:

Continuous

Transient (100 ms)

SMC

SMW

VI, trans

—

100

Vdc

Operating Case Temperature

(See Thermal Considerations section.) All TC–40 — 105* °C

Storage Temperature All Tstg –55 — 120 °C

I/O Isolation Voltage All — — — 1500 Vdc

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage SMC

SMW VI

VI18

36 24

48 36

75 Vdc

Vdc

Maximum Input Current

(VI = 0 to VI, max; IO = IO, max)SMC

SMW II, max

II, max —

——

—1.2

0.6 A

Inrush Transient All I2t——0.2

A2s

Input Reflected-ripple Current

(5 Hz to 20 MHz; 12 µH source imped-

ance; TA = 25 °C; see Figure 7.)

All II—5—mAp-p

Input Ripple Rejection (100 Hz—120 Hz) All — — 45 — dB

Tyco Electronics Corp. 3

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Electrical Specifications (continued)

Table 2. Output Specifications

Parameter Device Code

or Suffix Symbol Min Typ Max Unit

Output Voltage Set Point

(VI = VI, nom; IO = IO, max; TA = 25 °C) AJ

VO1, set

VO2, set

VO1, set

VO2, set

VO1, set

VO2, set

4.75

–4.75

11.40

–11.40

14.25

–14.25

5.0

–5.0

12.0

–12.0

15.0

–15.0

5.25

–5.25

12.60

–12.60

15.75

–15.75

Vdc

Output Voltage

(Over all line, load, and temperature

conditions until end of life; see Figure 9.)

VO1

VO2

VO1

VO2

VO1

VO2

4.5

–4.5

10.80

–10.80

13.50

–13.50

—

5.5

–5.5

13.20

–13.20

16.50

–16.50

Vdc

Output Regu la tion

(For line and load see ch aracteristi c

curves.)

All — ————

Output Ripple and Noise

(Across 2 x 0.47 µF ceramic capacitors;

see Figure 8.):

RMS

Peak-to-peak (5 Hz to 20 MHz)

BK, CL

—

120

150

mVrms

mVp-p

Output Curr ent

(At IO < IO, min, the modules may exceed

output ripple specifications, but operation is

guaranteed.)

IO1, IO2

0.1

0.06

0.05

—

1.0

0.42

0.33

Output Cur rent- limi t Ince pti on

(VO = 90% VO, set)AJ

IO1, IO2

—

4.0

2.5

Output Sh ort-circuit Cur rent

(VO = 0.25 V) AJ

IO1, IO2

—

6.0

3.5

Efficiency

(VI = VI, nom; IO = IO, max; TA = 25 °C; see

Figure 9.)

SMC010xx

SMW010AJ

SMW010BK

SMW010CL

TBD

—

Switching Frequency All — — 265 — kHz

4Tyco Electronics Corp.

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Electrical Specifications (continued)

Table 2. Output Specifications (continued )

Table 3. Isolation Specifications

Table 4. General Specifications

Parameter Device Code

or Suffix Symbol Min Typ Max Unit

Dynamic Response

(for duals: IO1 or IO2 = IO, max;

∆IO/∆t = 1A/10 µs; VI = VI, nom ; TA = 25 °C):

Load Change from IO = 50% to 75% of

IO, max:

Peak Deviation

Settling Time

(VO < 10% of peak deviation)

Load Change from IO = 50% to 25% of

IO, max:

Peak Deviation

Settling Time

(VO < 10% of peak deviation)

All

—

1.5

—

%VO, set

Parameter Min Typ Max Unit

Isolation Capacitance — 600 — pF

Isolation Resistance 10 — — MΩ

Parameter Min Typ Max Unit

Calculated MTBF (IO = 80% of IO, max; TC = 40 °C) 4,860,000 hours

Weight — — 30 (1.05) g (o z.)

Tyco Electronics Corp. 5

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Electrical Specifications (continued)

Table 5. Feature Specifications

Parameter Device Code

or Suffix Symbol Min Typ Max Unit

Remote On/Off Signal Interface (optional):

(VI = 0 V to VI, max; open collector or equivalent

compatible; signal referenced to VI(–) terminal.

See Figure 10 and Feature Descriptions.):

Positive Logic— If Device Code Suffix “1” Is

Not Specified:

Logic Low—Module Off

Logic High—Module On

Negative Logic— Dev ice Code Suffix “1”:

Logic Low—Module On

Logic High—Module Off

Module Specifications:

On/Off Current—Logic Low

On/Off Voltage:

Logic Low

Logic High (Ion/off = 0)

Open Collector Switch Specifications:

Leakage Current During Logic High

(Von/off = 10 V)

Output Low Voltage During Logic Low

(Ion/off = 1 mA)

All

Ion/off

Von/off

Ion/off

Von/off

—

–0.7

—

1.0

1.2

µA

Turn-on Delay and Rise Times

(At 80% of IO, max; TA = 25 °C):

Case 1: On/Off Input Is Set for Unit On and

then Input Power Is Applied (delay from

point at which VI = VI, min until VO = 10% of

VO, nom).

Case 2: Input Power Is Applied for at Least

One Second, and then the On/Off Input Is

Set to Turn the Module On (delay from point

at which on/off input is toggled until

VO= 10% of VO, nom).

Output Voltage Rise Time

(time for VO to rise from 10% of VO, nom to

90% of VO, nom)

Output Voltage Overshoot

(at 80% of IO, max; TA = 25 °C)

All

Tdelay

Trise

—

0.2

—

Output Voltage Set-point Adjust ment Range AJ

BK, CL —

—90

90 —

—110

100 %VO, nom

%VO, nom

Output Overvoltage Protection (clamp) AJ

VO1, clamp

VO2, clamp

VO1, clamp

VO2, clamp

VO1, clamp

VO2, clamp

5.6

–5.6

13.2

–13.2

16.6

–16.6

—

7.0

–7.0

18.0

–18.0

22.0

–22.0

Undervoltage Lockout SMC

SMW Vuvlo

Vuvlo 11

20 14

27 —

—V

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

6Tyco Electronics Corp.

Characteristic Curves

8-1790

Note: Output 2 has characteristics similar to output 1 when

IO1 = 0.5 A and IO2 varies.

Figure 1. SMx010AJ Typical Load Regulation of

Output1 with Fixed IO2 = 0.5 A at

TC = 25 °C

8-1791

Note: Output 2 has characteristics similar to output 1 when

IO2 = 0.1 A and IO1 varies.

Figure 2. SMx010AJ Typical Cross Regulation,

VO1 vs. IO2 with Fixed IO1 = 0.1 A at

TC = 25 °C

8-1792

Note: Output 2 has characterist ics similar to output 1 when

IO2 = 1.0 A and IO1 varies.

Figure 3. SM x01 0AJ Typ ica l Cross Regulation,

VO1 vs. IO2 with Fixed IO1 = 1.0 A at

TC = 25 °C

8-1793

Note: Output 2 has characterist ics similar to output 1 when

IO1 = (0.5 * IO, ma x) and IO2 varies.

Figure 4. SMx010BK, CL Load Regulation of

Output1 with Fixed IO2 = 0.5 * IO, max at

TC = 25 °C, Normalized VO1 vs. Normalized

Current IO1

0.1 0.2 0.3 0.4 0.5 0.6

4.90

5.05

OUTPUT CURRENT 1, I

(A)

5.00

5.10

1.0

0.0

4.95

0.7

5.15

0.8 0.9

= HIGH LINE

= LOW LINE

= NOM LINE

OUTPUT VOL TAGE 1, V

(V)

0.1 0.2 0.6 0.7 0.8 0.9

4.95

5.20

OUTPUT CURRENT 2, IO2 (A)

5.10

5.05

5.15

1.00.0

5.25

5.00

0.4 0.50.3

VI = LOW LINE

VI = NOM LINE

VI = HIGH LINE

OUTPUT V OLTAGE 1, VO1 (V)

0.1 0.2 0.3 0.5 0.6 0.7

4.75

4.90

OUTPUT CURRENT 2, IO2 (A)

4.85

4.95

1.00.0

4.80

0.8 0.9

5.00

0.4

OUTPUT V OLTAGE 1, VO1 (V)

VI = HIGH LINE

VI = NOM LINE

VI = LOW LINE

0.15 0.30 0.45 0.75 0.90

0.990

1.013

NORMALIZED OUTPUT CURRENT (IO1/IO1, max)

1.010

1.016

1.050.0

1.006

1.020

0.60

1.003

1.000

0.996

0.993 VI = HIGH LINE

IO = IO, max

IO = IO, min

VI = LOW LINE

VI = NOM LINE

NORMALIZED OUTPUT VOLTAGE 1 (VO1/VO1, set)

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Tyco Electronics Corp. 7

Characteristics Curves (continued)

8-1794

Note: Output 2 has characteristics similar to output 1 when

IO2 = IO, min and IO1 varies .

Figure 5. SMx010BK, CL Typical Cros s Regulation,

Normalized VO1 vs. Normalized IO2 with

Fixed IO1 = IO, min at TC = 25 °C

8-1795

Note: Output 2 has characteristics similar to output 1 when

IO2 = IO, max and IO1 varies.

Figure 6. SMx010BK, CL Typical Cros s Regulation,

Normalized VO1 vs. Normalized IO2 with

Fixed IO1 = IO, max at TC = 25 °C

Test Configurations

8-203

Note: Input reflected-ripple curre nt is measured with a simulated

source impedance of 12 µH. Capacitor Cs offsets possible

battery impedance. Current is measured at the input of the

module.

Figure 7. Input Reflected-Ripple Test Setup

8-808

Note: Use four 0.47 µF ceramic capacitors. Scope measurement

should be made using a BNC socket. Position the load

between 50 mm and 75 mm (2 in. and 3 in.) from the module.

Figure 8. Peak-to-Peak Output Noise Measurement

Test Setup

1.020

1.003

0.996

1.010

1.016

1.023

1.000

1.007

1.013

0.15 0.45 0.60 0.75 0.90 1.050.0 0.30

NORMALIZED OUTPUT CURRENT 2 (I

max

)

= NOM LINE

= LOW LINE

= HIGH LINE

= I

min

= I

max

NORMALIZED

OUTPUT VOLTAGE 1 (V

set

)

1.000

0.966

0.953

0.980

0.993

1.006

0.960

0.973

0.987

0.15 0.45 0.60 0.75 0.90 1.050.0 0.30

NORMALIZED OUTPUT CURRENT 2 (IO2/IO2, max)

NORMALIZED

OUTPUT VOLTAGE 1 (VO1/VO1, set)

VI = LOW LINE

VI = NOM LINE

VI = HIGH LINE

IO = IO, max

IO = IO, min

TO OSCILLOSCOPE

12 µH

CS 220 µF

IMPEDANCE < 0.1 Ω

@ 20 ˚C, 100 kHz

VI (+)

VI (-)

BATTERY 33 µF

CURRENT

PROBE

LTEST

VO1(+

)

VO2(+

)

0.47 µF

SCOPE

COPPER STRIP

SCOPE

COM

RLOAD1

RLOAD2

0.47 µF

88 Tyco Electronics Corp.

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Test Configurations (c on tinued )

8-863a

Note: All measurements are taken at the module terminals. When

socketing, place Kelvin connections at module terminals to

avoid measurement errors due to socket contact resistance.

Figure 9. Output Voltage and Efficiency

Measurement Test Setup

Design Considerations

Input Source Impedance

The power module should be connected to a low

ac-impedance input source. Highly inductive source

impedances can affect the stability of the power mod-

ule. If the source inductance exceeds 4 µH, a 33 µF

electrolyti c capacitor (ESR < 0.7 Ω at 1 00 kHz)

mounted close to the power module helps ensure

stability of the unit.

Solder Recommendations

Large surface-mount components typically require a

thicker stencil than smaller components to ensure a

reliable solder joint. The SMC/SMW-Series Surface-

Mount Power Modules have been evaluated for solder

joint reliability and shock and vibration requirements

using 170,000 cubic mils (2.8 mm3) of solder. This vol-

ume can be obtained by printing solder 12 mils thick on

the copper pads on overprinting the copper pads

13 mils (0.33 mm) around the pad area with 8 mils of

printed solder. Although this volume is recommended,

tests have been conducted using lower volumes with

successful results. Contact technical support for further

assistance.

Safety Considerations

SMC Modules

For safety-agency approval of the system in which the

power module is used, the power module must be

installed in compliance with the spacing and separation

requir eme nts of the end-u se sa fety agency stan dard,

i.e.,

60950,

CSA

C22.2 No. 60950-00, and

VDE

0805 (EN60950).

For the converter output to be considered meeting the

requir eme nts of safety ex tra-l ow voltage (SELV), the

input must meet SELV requirements.

The power module has e xtr a-low v oltage (ELV) outputs

when all inputs are ELV.

The input to these units is to be provided with a maxi-

mum 5 A normal-blow fuse in the ungrounded lead.

SMW Modules

For safety-agency approval of the system in which the

power module is used, the power module must be

installed in compliance with the spacing and separation

requir eme nts of the end-u se sa fety agency stan dard,

i.e.,

60950,

CSA

C22.2 No. 60950-00, and

VDE

0805 (EN60950).

If the input source is non-SELV (ELV or a hazardous

voltage greater than 60 Vdc and less than or equal to

75 Vdc), for the module's output to be considered

meeting the requirements of safety e xtra-low voltage

(SELV), all of the following must be true:

■The input source is to be provided with reinforced

insulation from any other hazardous voltages, includ-

ing the ac mains.

■One VI pin and one VO pin are to be grounded, or

both the input and output pins are to be kept floating.

■The input pins of the module are not operator acces-

sible.

■Another SELV reliability test is conducted on the

whole system, as required by the saf ety agencies, on

the combination of supply source and the subject

module to verify that under a single fault, hazardous

voltages do not appear at the module's output.

Note: Do not ground either of the input pins of the

module without grounding one of the output

pins. This may allow a non-SELV voltage to

appear between the output pins and ground.

VI(+)

IIIO

SUPPLY

CONTACT

RESISTANCE

CONTACT AND

DISTRIBUTION LOSSES

LOAD

VI(-)

VO1

VO2

COM

LOAD

ηVOJ COM

–[]

IOJ

J1=

∑

VI+() VI–()–[]

---------------------------------------------------x100 %

Tyco Electronics Corp. 9

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Safety Considerations (continued)

SMW Modules (continued)

The power module has e xtr a-low v oltage (ELV) outputs

when all inputs are ELV.

The input to these units is to be provided with a maxi-

mum 5 A normal-blow fuse in the ungrounded lead.

Feature Descriptions

Overcurrent Protection

To provide protection in a fault (output overload) condi-

tion, the unit is equipped with internal current-limiting

circuitry and can endure current limiting for an unlim-

ited duration. At the point of current-limit inception, the

unit shifts from voltage control to current control. If the

output voltage is pulled very low during a severe fault,

the current -limit circuit can exhibit either foldback or

tailout charact eristics (output-current decrease or

increase). The unit operates normally once the output

current is brought back into its specified range.

Remote On/Off

Two remote on/off options are available. Positive logic

(if device code suffix “1” is not specified) remote on/off

turns the module on during a logic-high voltage on the

remote ON/OFF pin, and off during a logic low. Nega-

tive logic, de vice code suffix “1,” remote on/off turns the

module off during a logic high and on during a logic low

or when the remote ON/OFF pin is shorted to the VI(–)

pin.

To turn the power module on and off, the user must

supply a s witch to control the voltage between the

on/off terminal and the VI(–) terminal (Von/off). The

switch may be an open collector or equivalent (see

Figure 10). A logic low is Von/off = –0.7 V to 1.2 V. The

maximum Ion/off during a logic low is 1 mA. The switch

should maintain a logic-low voltage while sinking 1 mA.

During a logic high, the maximum Von/off generated by

the power module is 10 V. The maximum allowable

leakage cu rren t of the switch at Von/off = 10 V is 50 µA.

The module has internal capacitance to reduce noise

at the ON/OFF pin. Additional capacitance is not gen-

erally needed and may degrade the start-up character-

istics of the module.

If not using the remote on/off feature, perform one of

the following:

For negative logic, short the ON/OFF pin to VI(–).

For positive logic, leave the ON/OFF pin open (float-

ing).

8-758a

Figure 10. Remote On/Off Implemen tat ion

Output Voltage Adjustment

Output voltage set point adjustment allows the user to

increase or decrease the output voltage set point of a

module. This is accomplished by connecting an exter-

nal resistor between the TRIM pin and either the VO(+)

or VO(–) pins. With an external resistor between the

TRIM and VO(+) pins (Radj-down), the output voltage set

point (VO, adj) decreases (see Figure 11). The following

equation determines the required external resistor

v alue to obtain an output voltage change from VO, nom to

VO, adj:

where Radj-down is the resistance value connected

between TRIM and VO(+), and G, H, and L are defined

in the table below.

8-715j

Figure 11. Circuit Configuration to Decrease

Output Voltage

Ion/off

Von/off

REMOTE

ON/OFF

VI(+)

VI(-)

Radj-down VO adj,L

–()

VO nom,VO adj,

–()

--------------------------------------- H

–Ω=

VI(+)

VI(-)

VO1(+)

VO2(-)

TRIM

Radj-down

RLOAD1

COM RLOAD2

1010 Tyco Electronics Corp.

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Feature Descriptions (continued)

Output Voltage Adjustment (continued)

With an external resistor connected between the TRIM

and VO(–) pins (Radj-up), the output voltage set point

(VO, adj) increases (see Figure 12). The following equa-

tion determines the required external resistor value to

obtain an output voltage from VO, nom to VO, adj:

where Radj-up is the resistance value connected

between TRIM and VO(–), and the values of G, H, K,

and L are shown in the following table.

Although the AJ output can be trimmed up, with mis-

matched loads, the output voltage on the lightly loaded

output will increase. The output voltage between the

COM pin and both the VO1(+) and VO2(–) pins must be

kept lower than the minimum overvoltage protection

voltage found in the Feature Specifications table. The

BK and CL modules can only be trimmed down.

8-715k

Figure 12. Circuit Configur ation to Increa se Output

Voltage

The SMC/SMW-Series Surface-Mount Power Modules

have a fixed current-limit set point. Therefore, as the

output voltage is adjusted down, the available output

power is reduced. In addition, the minimum output cur-

rent is a function of the output voltage. As the output

v oltage is adjusted down, the minimum required output

current can increase (i.e., minimum power is constant).

As the output voltage is adjusted up, the output power

should be held constant (max imum loa d curr ent

decreases).

Output Overvoltage Protection

The output overvoltage clamp consists of control cir-

cuitry, independent of the primary regulation loop, that

monitors the voltage on the output terminals. This con-

trol loop has a higher voltage set point than the primary

loop (see Feature Specifications table). In a fault condi-

tion, the overvoltage clamp ensures that the output

voltage does not exceed VO, clamp, max. This provides a

redundant voltage-control that reduces the risk of out-

put overvoltage.

Input Voltage Turn-On Adjustment

(Optional)

The input voltage at which the unit turns on can be

adjusted upward to add additional hysteresis between

the points at which the modules turn on and turn off.

This f eature can be useful when the power system has

high impedance between the source voltage and the

power unit causing the input to drop as the supply is

turned on. Please consult the factory for application

guidelines and/or a description of how to use this fea-

ture.

Synchronization (Optional)

With external circuitry, the unit is capable of synchroni-

zation from an independent time base with a switching

rate of 256 kHz. Other frequencies may be available;

please consult the factory for application guidelines

and/or a description of the external circuit needed to

use this feature.

Thermal Considerations

The power module operates in a variety of thermal

environments; however, sufficient cooling should be

provided to help ensure reliable operation of the unit.

Heat-dissipating components inside the unit are ther-

mally coupled to the case. Heat is removed by conduc-

tion, convection, and radiation to the surrounding

environment. Proper cooling can be verified by mea-

suring the case temperature. The case temperature

(TC) should be measured at th e position indicated in

Figure 13.

GHKL

SMx010AJ 10000 2050 7.5 2.49

SMx010BK 45300 2050 —2.49

SMx010CL 45300 2050 —2.49

Radj-up GL

VO adj,L

–()

–[]

-----------------------------------------H

–





Ω=

VI(+)

VI(-)

VO1(+)

VO2(-)

TRIM

Radj-up

RLOAD1

COM RLOAD2

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Tyco Electronics Corp. 11

Thermal Considerations (continued)

8-1363d

Note: Dimensions are in millimeters and (inches). Pin locations are

for reference only.

Figure 13. SMC and SMW Case Temperature

Measurement Location

Note that the view in Figure 13 is of the surface of the

module. The temperature at this location should not

exceed the maximum case temperature indicated on

the derating curves. The output power of the module

should not exceed the rated power for the module as

listed in the Ordering Information table.

Heat Transfer Characte ristics

Increasing airflow over the module enhances the heat

transfer via convection. Figure 14 shows the maximum

power that can be dissipated by the module without

ex ceeding the maximum case temperature versus local

ambient temperature (TA) for natural convection

through 3.0 ms–1 (600 ft./min.) .

Systems in which these power modules are used typi-

cally gene rate natu ral convection airflow rates of

0.25 ms–1 (50 ft./min.) due to other heat-dissipating

components in the system. Therefore, the natural con-

vection condition represents airflow rates of approxi-

mately 0.25 ms–1 (50 ft./min.). Use of Figure 14 is

shown in the following example.

Example

What is the minimum airflow necessary for an

SMW010AJ operating at VI = 48 V, an output current of

±1 A, and a maximum ambient temperature of 84 °C?

Solution:

Given: VI = 4 8 V, IO = ±1 A (IO, max), TA = 84 °C

Determine PD (Figure 16): PD = 2.50 W

Determine airflow (Figure 14): v = 1 ms–1

(200 ft./min.)

8-1375b

Figure 14. SMC010/SMW010 Forced Convection

Power Derating; Either Orientation

8-1813

Figure 15. SMC010AJ, BK, CL Typical Power

Dissipation vs. Normalized Output

Current at TC = 25 °C

25 (0.98)

(0.59)

50 60 70 80 90 100 11040 45 55 65 75 85 95 105

3.5

1.5

1.0

0.5

2.0

2.5

3.0

MAX AMBIENT TEMPERATURE, T A (˚C)

MAXIMUM CASE TEMPERATURE

2.0 ms -1 (400 ft./min.)

3.0 ms -1 (600 ft./min.)

1.0 ms -1 (200 ft./min.)

NATURAL CONVECTION

POWER DISSIPATION, PD (W)

0.2 0.6 0.7 0.8 0.9

0.0

2.5

NORMALIZED OUTPUT CURRENT ,

IO1 = IO2 [(IO1 + IO2)/(IO1, max + IO2, max)]

1.5

1.0

2.0

3.5

1.00.1

3.0

0.5

0.4 0.50.3

VI = 36 V

VI = 24 V

VI = 18 V

POWER DISSIPATION, P D (W)

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

12 Tyco Electronics Corp.

Thermal Considerations (continued)

Heat Transfer Characteristics (continued)

8-1817

Figure 16. SMW010AJ, BK, CL Typical Powe r

Dissipation vs. Normalized Output

Current at TC = 25 °C

Module Derating

The derating curves in Figure 14 were derived by mea-

surements obtained in an experimental apparatus

shown in Figure 17. Note that the module and the

printed-wiring board (PWB) that it is mounted on are

both vertically oriented. The passage has a rectangular

cross section.

8-1126d

Note: Dimensions are in millimeters and (inches).

Figure 17. Experimental Test Setup

Surface-Mount Power Module Solder

Reflow Recommendation

The SMC/SMW-Series surface-mount power modules

are construct ed with SMT (surface-mount technol ogy)

components and assembly guidelines. Such large

mass/low thermal resistance devices heat up slower

than typical SMT components. It is recommended that

the customer review data sheets in order to customize

the solder reflow profile for application board assembly.

It is recommended that a reflow profile must be charac-

terized for the module on the application board assem-

bly. The solder paste type, component, and board

thermal sensitivity must b e considered in order to form

the desired fused solder fillet. The power module leads

are plated with tin (Sn) solder to prevent corrosion and

ensure good solderability. Typically, the eutectic solder

melt s at 183 °C , wets the land, and subsequently wicks

the device lead. Sufficient time must be allocated to

fuse the plating on the lead and ensure a reliable sol-

der joint.

There are several types of SMT reflow technologies

currently used in th e industry. These surface-mount

power modules can be adequately soldered using nat-

ural convection, IR (radiant infrared), convection/IR, or

forced convection technologies. The surface-mount

power module solder reflow profile is established by

accurately measuring the module gull-wing lead sur-

face temperature.

0.2 0.4 0.6 0.8 1.0

0.0

2.5

1.5

1.0

2.0

0.0

3.0

0.5

NORMALIZED OUTPUT CURRENT ,

IO1 = IO2 [(IO1 + IO2)/(IO1, max + IO2, max)]

VI = 36 V

VI = 48 V

VI = 60 V

POWER DISSIPATION, P D

(W)

VI = 75 V

AIR VELOCITY

AND AMBIENT

TEMPERATURE

MEASURED

BELOW THE

MODULE AIRFLOW

13 (0.5)

FACING PWB

MODULE

76 (3.0)

PWB

Tyco Electronics Corp. 13

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Surface-Mount Power Module Solder Reflow Recommendation (continued)

The maximum oven temperature and conveyor speed should prevent the lead temperature from exceeding the

maximum thermal profile limits as shown in Figure 18. The lead temperature during a typical reflow profile is shown

in Figure 19. Failure to observe these maximum lead temperatures and duration may result in permanent damage

to the power module.

Relative temperatures of the module gull-wing leads vary according to many factors, including surrounding compo-

nents, internal paths, and connecting paths. Typically, pin 1 is a good choice for a conservative measurement since

it is usually connected to heavy paths for current conduction which also tend to heat the lead faster. These vari-

ables make it difficult to compare various types of surface-mount modules; however, based upon a sampling, the

unit has been found to be more robust during temperature profiles compared with other SMT modules available in

the industry at the time of this publication.

8-2275

Figure 18. Maximum Thermal Pr ofile Limits

8-2274

Figure 19. Typical Reflow Soldering Profile

4 ˚C/s MAX

90 s MAX

6 MINUTES MAX

230 ˚C MAX

183 ˚C

150 ˚C

120 ˚C

TIME (s)

GULL-WING LEAD

TEMPERATURE (˚

(PEAK)

2:30 5:00 7:30 10:00

MELTING POINT

(60/40 SOLDER)

250

200

150

100

TIME (min.)

GULL-WING LEAD

TEMPERATURE (˚

14 Tyco Electronics Corp.

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Packaging Information

Vacuum Formed Trays

The SMC/SMW -Series surface-mount power modules are delivered in plastic vacuum formed tra ys (see Figure 20)

that allow automated placement of the modules via a surface-mount pick and place machine.

8-2263

Note: Dimensions are in millimeters and (inches).

Figure 20. Vacuum Formed Tray

Specifications:

■Material: PVC (ESD protected)

■Capacity: 24 pieces/tray

■Weight: 90 g (3.2 oz.)

216 (8.50)

(0.75)

213 (8.37)

212 (8.33)

184 (7.25)

137 (5.40)

90 (3.55)

43 (1.70)

12 (0.48)

4 (0.16)

0.00

1 1 1 1 1 1

848116547 3 (0.11)

(0.51)

381 (15.00)

165 (6.50)

378 (14.89)

0.00

1 1 1 1 1 1

45 (1.78)

105 (4.14)

225 (8.86)

285 (11.22)

345 (13.58)

Tyco Electronics Corp. 15

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Outline Diagram

Dimensions are in millimeters and (inches). See next page for pin descriptions.

Tolerances: x.x ± 0.5 mm (0.020 in.); x.xx ± 0.4 mm (0.015 in.).

Top View

Side Views

Bottom View

8-1507

PATENTS PENDING

SMW010A

DC-DC Power Module

IN:DC 36-75V, 0.34A

49.5 (1.95)

29.47

(1.16)

Nominal

OUT:DC 5V, 2A

1.8

(0.07)

0.30 ± 0.1

(0.012 ± 0.004)

0.25

(0.010)

9.7

(0.38)

2.0

(0.08)

NO-SLIDE MECHANICAL

RETAINING PINS,

2 PLACES

1.75

(0.069)

38.51 (1.52)

33.50 (1.32)

13.49 (0.53)

35.3

(1.39)

2.5

(0.10)

3.51 (0.138)

43.48 (1.71)

12.07

(0.475)

47.78

(1.881)

1.27

(0.050)

DIA

8.48 (0.33)

16 Tyco Electronics Corp.

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Recommended Hole Patter n

Component-side footprint. Dimensions are in millimeters and (inches).

Tolerances: x.x ± 0.5 mm (0.020 in.); x.xx ± 0.4 mm (0.015 in.).

CAUTION: Care must be taken to ensure the board in the periphery of the footprint is flat.

8-1507

* The recommended solder paste volume is 2.8 cubic mm (170,000 cubic mils/pin). See Design Considerations section.

†N/C may be used for internal module connections and should not be connected by the customer.

Pin Function Pin Function

O1(+) 12 VI(+)

2COM11V

I(–)

O2(–)10 N/C

†

4 TRIM 9 SYNC (optional)

5N/C

†8ON/OFF

6N/C

†7 TURN-ON ADJUSTMENT (optional)

3.02

(0.119)

30.0 (1.18)

3.3

(0.13)

1.6

(0.063)

SLOT

4.1

(0.16)

5.0

(0.197)

2.8

(0.11)

FOOTPRINT

PERIPHERY

13.11

(0.516)

36.8

(1.45)

31.2

(1.23)

1.6 (0.063) DIA PILOT HOLE,

REQUIRED FOR GUIDE PIN,

1 PLACE

PIN 1 PAD

43 (1.693)

(0.39)

35 (1.38)

40 (1.57)

Tyco Electronics Corp. 17

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Ordering Information

Table 6. Device Codes

* SMC codes are available upon request only. Contact the f actory for minimum order size and availability.

Optional features may be ordered using the device code suffix es shown below. The feature suffixes are listed

numerically in descending order. Please contact your Tyco Electronics’ Account Manager or Field Application Engi-

neer for pricing and availability.

Table 7. Device Options

Input Voltage Output Voltages Output Power Device Code Comcode

24 V 5 V, –5 V 10 W SMC010AJ* TBD

24 V 12 V, –12 V 10 W SMC010BK* TBD

24 V 15 V, –15 V 10 W SMC010CL* TBD

48 V 5 V, –5 V 10 W SMW010AJ 108611047

48 V 12 V, –12 V 10 W SMW010BK 108729781

48 V 15 V, –15 V 10 W SMW010CL 108560954

Option Device Code Suffix

Negative logic remote on/off 1

18 Tyco Electronics Corp.

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Notes

Tyco Electronics Corp. 19

Data Sheet

August 2001 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Notes

Data Sheet

August 2001

18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W

SMC/SMW Dual-Output Series Surface-Mount Power Modules:

Printed on

Recycled Paper

Tyco Electroni cs Power Systems, Inc.

3000 Skyline Drive, Mesquite, TX 75149, USA

+1-800-526-7819 FAX: + 1-888-315-5182

(Outs ide U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900

http://power.tycoeleectronics.com

Tyco Electronics Corportation reserves the right to make changes to the pro duct(s) or inf ormation cont ai ned her ein without noti ce. No liability is assumed as a result of their use or application.

No rights under any patent accompany the sale of any such product(s) or information.

Printed in U.S.A.

August 2001

FDS01-079EPS (Replaces DS00-002EPS)