www.ERNI.com/contact/ Catalog E XXXXXX 10/01 Edition 1
General
ERNI has designed the LPV Pin Header series in accordance
with the IEC 60603-13 (DIN 41651) standard for signal trans-
mission between PC boards and interfaces.
SMT Pin Headers are designed for fully automatic SMT assem-
bly and are characterized by the following featur es: black insu-
lation body for easy visual recognition and high temperatur e
resistant thermoplastic for all standar d SMT reflow soldering
processes. The pin headers ar e developed with pre-assembled
pick-and-place covers that provide a firm vacuum grip and the
tray packaging is designed for fully automated assembly.
For signal transmission, use the female IDC connectors from
the LPV series.
LPV
SMT Pin Header
2.54 mm Pitch For IDC Systems
Technical Features
• Pitch: 2.54 mm x 2.54 mm
• Standard vertical and right angle pin header with
interlocking clip
• Pin Number
Standard: 10 - 64
• Material
Insulator: PA46
Contact: Cu-Alloy
• Plating
Mating area: Au over Ni
Termination: Sn
• Closed design
• Optional center or side polarization
• Temperature range: -55/125°C
• Maximum SMT reflow solder temperature: 10s bei 260°C
• Current rating: 1A
• Insulation resistance: >105 Ω
• Voltage rate: 1000 Veff