1
3
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
1
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▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
96
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
MULTILAYER CHIP BEAD INDUCTORS (BK ARRAY SERIES)
REFLOW
1
3
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
97
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
■PARTS NUMBER
●BK 2010
BK 20104W680-T RoHS 68 ±25％ 100 0.35 100
BK 20104W121-T RoHS 120 ±25％ 100 0.40 100
BK 20104W241-T RoHS 240 ±25％ 100 0.50 100
BK 20104S121-T RoHS 120 ±25％ 100 0.30 100
BK 20104S241-T RoHS 240 ±25％ 100 0.45 100
BK 20104S431-T RoHS 430 ±25％ 100 0.55 100
BK 20104S601-T RoHS 600 ±25％ 100 0.70 100
BK 20104M121-T RoHS 120 ±25％ 100 0.30 100
BK 20104M241-T RoHS 240 ±25％ 100 0.45 100
BK 20104M431-T RoHS 430 ±25％ 100 0.55 100
BK 20104M601-T RoHS 600 ±25％ 100 0.70 100
BK 20104M102-T RoHS 1000 ±25％ 100 0.80 100
BK 20104L050-T RoHS 5 ±25％ 100 0.10 100
BK 20104L100-T RoHS 10 ±25％ 100 0.15 100
BK 20104L220-T RoHS 22 ±25％ 100 0.20 100
BK 20104L330-T RoHS 33 ±25％ 100 0.30 100
BK 20104L470-T RoHS 47 ±25％ 100 0.40 100
BK 20104L680-T RoHS 68 ±25％ 100 0.50 100
BK 20104L121-T RoHS 120 ±25％ 100 0.70 100
BK 20104L181-T RoHS 180 ±25％ 100 0.90 100
●BK 3216
BK 32164W121-T RoHS 120 ±25％ 100 0.15 100
BK 32164W241-T RoHS 240 ±25％ 100 0.25 100
BK 32164W431-T RoHS 430 ±25％ 100 0.35 100
BK 32164W601-T RoHS 600 ±25％ 100 0.40 100
BK 32164S600-T RoHS 60 ±25％ 100 0.18 200
BK 32164S121-T RoHS 120 ±25％ 100 0.18 200
BK 32164S241-T RoHS 240 ±25％ 100 0.30 200
BK 32164S301-T RoHS 300 ±25％ 100 0.40 200
BK 32164S471-T RoHS 470 ±25％ 100 0.40 200
BK 32164S601-T RoHS 600 ±25％ 100 0.45 200
BK 32164S102-T RoHS 1000 ±25％ 100 0.68 100
BK 32164M121-T RoHS 120 ±25％ 100 0.20 150
BK 32164M241-T RoHS 240 ±25％ 100 0.35 150
BK 32164M301-T RoHS 300 ±25％ 100 0.45 150
BK 32164M471-T RoHS 470 ±25％ 100 0.50 150
BK 32164M601-T RoHS 600 ±25％ 100 0.60 100
BK 32164M102-T RoHS 1000 ±25％ 100 0.80 100
BK 32164L680-T RoHS 68 ±25％ 100 0.35 200
BK 32164L121-T RoHS 120 ±25％ 100 0.55 200
BK 32164L181-T RoHS 180 ±25％ 100 0.65 150
BK 32164L241-T RoHS 240 ±25％ 100 0.75 150
Rated current
［mA］（max.）
Parts number EHS Nominal impedance
［Ω］ Impedance tolerance Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
Rated current
［mA］（max.）
Parts number EHS Nominal impedance
［Ω］ Impedance tolerance Measuring frequency
［MHz］
DC Resistance
［Ω］（max.）
1
3
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
98
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
138
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mlci09_e-01
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
250
500
BK2010 4W241
BK2010 4W680
BK2010 4W121
500
400
300
200
100
BK2010 4S121
500
400
300
200
100
BK2010 4S241
250
500
BK2010 4M121
1000
800
600
400
200
BK2010 4S601
1000
2000
BK2010 4M102
BK2010 4L050
50
110 100 1000 10000
100
BK2010 4M601
1000
2000
BK2010 4M241
BK2010 4L100
50
110 100 1000 10000
100
1000
800
600
400
200
BK2010 4S431
BK2010 4M431
BK2010 4L220
100
110 100 1000 10000
200
■
BK2010
BK2010 4L330
250
110 100 1000 10000
500
BK2010 4L470
250
110 100 1000 10000
500
1
3
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
99
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
139
1
2
mlci09_e-01
NOISE SUPPRESSION COMPONENTS
／
FERRITE BEAD INDUCTORS
■ ELECTRICAL CHARACTERISTICS
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
■
BK3216
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Type Thickness
mm（inch）
Standard Quantity ［pcs］
Paper Tape Embossed Tape
CK1608（0603） 0.8 （0.031） 4000 －
CK2125（0805） 0.85（0.033） 4000 －
1.25（0.049） － 2000
CKS2125（0805） 0.85（0.033） 4000 －
1.25（0.049） － 2000
CKP1608（0603） 0.8 （0.031） 4000 －
CKP2012（0805） 0.9 （0.035） － 3000
CKP2016（0806） 0.9 （0.035） － 3000
CKP2520（1008）
0.7 （0.028） － 3000
0.9 （0.035） － 3000
1.1 （0.043） － 2000
NM2012（0805） 0.9 （0.035） － 3000
NM2520（1008） 1.1 （0.043） － 2000
LK1005（0402） 0.5 （0.020） 10000 －
LK1608（0603） 0.8 （0.031） 4000 －
LK2125（0805） 0.85（0.033） 4000 －
1.25（0.049） － 2000
HK0402（01005） 0.2 （0.008） 20000 －
HK0603（0201） 0.3 （0.012） 15000 －
HK1005（0402） 0.5 （0.020） 10000 －
HK1608（0603） 0.8 （0.031） 4000 －
HK2125（0805） 0.85（0.033） － 4000
1.0 （0.039） － 3000
HKQ0402（01005） 0.2 （0.008） 20000 40000
HKQ0603W（0201） 0.3 （0.012） 15000 －
HKQ0603S（0201） 0.3 （0.012） 15000 －
HKQ0603U（0201） 0.3 （0.012） 15000 －
AQ105（0402） 0.5 （0.020） 10000 －
BK0402（01005） 0.2 （0.008） 20000 －
BK0603（0201） 0.3 （0.012） 15000 －
BK1005（0402） 0.5 （0.020） 10000 －
BKH1005（0402） 0.5 （0.020） 10000 －
BK1608（0603） 0.8 （0.031） 4000 －
BK2125（0805） 0.85（0.033） 4000 －
1.25（0.049） － 2000
BK2010（0804） 0.45（0.018） 4000 －
BK3216（1206） 0.8 （0.031） － 4000
BKP0603（0201） 0.3 （0.012） 15000 －
BKP1005（0402） 0.5 （0.020） 10000 －
BKP1608（0603） 0.8 （0.031） 4000 －
BKP2125（0805） 0.85（0.033） 4000 －
MCF0806(0302) 0.4 （0.016） － 10000
MCF1210(0504) 0.55（0.022） － 5000
MCF2010(0804) 0.45（0.018） － 4000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
②Taping material
●Card board carrier tape
CK 1608
CKP 1608
CK 2125
CKS 2125
LK 1005
LK 1608
LK 2125
HK 0402
HK 0603
HK 1005
HK 1608
HKQ 0402
HKQ 0603
AQ 105
BK 0402
BK 0603
BK 1005
BK 1608
BK 2125
BK 2010
BKP 0603
BKP 1005
BKP 1608
BKP 2125
BKH 1005
●Embossed Tape
CK 2125
CKS 2125
CKP 2012
CKP 2016
CKP 2520
NM 2012
NM 2520
LK 2125
HKQ 0402
HK 2125
BK 2125
BK 3216
MCF 0806
MCF 1210
MCF 2010
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
③Taping Dimensions
●Paper tape (0.315 inches wide)
Unit : mm（inch）
Type Thickness
mm（inch）
Chip cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ Ｔ
CK1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
CK2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
CKS2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
CKP1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
LK1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
LK1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
LK2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
HK0402（01005） 0.2 （0.008） 0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36max
（0.014max）
HK0603（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
HK1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
HK1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
HKQ0402（01005） 0.2 （0.008） 0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36max
（0.01max）
HKQ0603W（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
HKQ0603S（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
HKQ0603U（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018mx）
AQ105（0402） 0.5 （0.020） 0.75±0.1
（0.030±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
BK0402（01005） 0.2 （0.008） 0.25±0.04
（0.010±0.002）
0.45±0.04
（0.018±0.002）
2.0±0.05
（0.079±0.002）
0.36max
（0.014max）
BK0603（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
BK1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
BK1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
BK2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
BK2010（0804） 0.45（0.018） 1.2±0.1
（0.047±0.004）
2.17±0.1
（0.085±0.004）
4.0±0.1
（0.157±0.004）
0.8max
（0.031max）
BKP0603（0201） 0.3 （0.012） 0.40±0.06
（0.016±0.002）
0.70±0.06
（0.028±0.002）
2.0±0.05
（0.079±0.002）
0.45max
（0.018max）
BKP1005（0402） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
BKP1608（0603） 0.8 （0.031） 1.0±0.2
（0.039±0.008）
1.8±0.2
（0.071±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
BKP2125（0805） 0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.1max
（0.043max）
BKH1005（0805） 0.5 （0.020） 0.65±0.1
（0.026±0.004）
1.15±0.1
（0.045±0.004）
2.0±0.05
（0.079±0.002）
0.8max
（0.031max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
●Embossed Tape (0.315 inches wide)
Type Thickness
mm（inch）
Chip cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ K T
CK2125（0805） 1.25（0.049） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
CKS2125（0805） 1.25（0.049） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
CKP2012（0805） 0.9 （0.035） 1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.3
（0.012）
CKP2016（0806） 0.9 （0.035） 1.8±0.1
（0.071±0.004）
2.2±0.1
（0.087±0.004）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.25
（0.01）
CKP2520（1008）
0.7 （0.028）
2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055）
0.3
（0.012）
0.9 （0.035） 1.4
（0.055）
1.1 （0.043） 1.7
（0.067）
NM2012（0805） 0.9 （0.035） 1.55±0.2
（0.061±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.3
（0.051）
0.3
（0.012）
NM2520（1008） 1.1 （0.043） 2.3±0.1
（0.091±0.004）
2.8±0.1
（0.110±0.004）
4.0±0.1
（0.157±0.004）
1.7
（0.067）
0.3
（0.012）
LK2125（0805） 1.25（0.049） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
HK2125（0805）
0.85（0.033） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
1.5
（0.059） 0.3
（0.012）
1.0 （0.039） 2.0
（0.079）
BK2125（0805） 1.25（0.049） 1.5±0.2
（0.059±0.008）
2.3±0.2
（0.091±0.008）
4.0±0.1
（0.157±0.004）
2.0
（0.079）
0.3
（0.012）
BK3216（1206） 0.8（0.031） 1.9±0.1
（0.075±0.004）
3.5±0.1
（0.138±0.004）
4.0±0.1
（0.157±0.004）
1.4
（0.055）
0.3
（0.012）
MCF0806(0302) 0.4 （0.016） 0.75±0.05
（0.030±0.002）
0.95±0.05
（0.037±0.002）
2.0±0.05
（0.079±0.002）
0.55
（0.022）
0.3
（0.012）
MCF1210(0504) 0.55（0.022） 1.15±0.05
（0.045±0.002）
1.40±0.05
（0.055±0.002）
4.0±0.1
（0.157±0.004）
0.65
（0.026）
0.3
（0.012）
MCF2010(0804) 0.45（0.018） 1.1±0.1
（0.043±0.004）
2.3±0.1
（0.091±0.004）
4.0±0.1
（0.157±0.004）
0.85
（0.033）
0.3
（0.012）
Unit : mm（inch）
●Embossed Tape (0.157 inches wide)
Type Thickness
mm（inch）
Chip cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ K T
HKQ0402(01005) 0.2 （0.008） 0.23 0.43 1.0±0.02 0.5max. 0.25max.
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-01
④LEADER AND BLANK PORTION
⑤Reel Size
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
5±1.0mm
(0.197±0.039)
Less than 1.5mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
BK0402
－55～＋125℃
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
－55～＋85℃
BKP1005
BKP1608
BKP2125
MCF 0806
－40～＋85℃
MCF 1210
MCF 2010
CK1608
－40～＋85℃
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402/HKQ0402
－55～＋125℃
HK0603
HK1005
HK1608 －40～＋85℃
HK2125
HKQ0603W/HKQ0603S/HKQ0603U －55～＋125℃
AQ105
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
2. Storage Temperature Range
Specified Value
BK0402
－55～＋125℃
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
－55～＋85℃
BKP1005
BKP1608
BKP2125
MCF 0806
－40～＋85℃
MCF 1210
MCF 2010
CK1608
－40～＋85℃
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402/HKQ0402
－55～＋125℃
HK0603
HK1005
HK1608 －40～＋85℃
HK2125
HKQ0603W/HKQ0603S/HKQ0603U －55～＋125℃
AQ105
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
3. Rated Current
Specified Value
BK0402 240～540mA DC
BK0603 100～500mA DC
BK1005 120～1000mA DC
BKH1005 200mA DC
BK1608 150～1500mA DC
BK2125 200～1200mA DC
ARRAY BK2010 100mA DC
BK3216 100～200mA DC
BKP0603 1.0A DC
BKP1005 800～2000mA DC
BKP1608 1.0～3.0A DC
BKP2125 1.5～4.0A DC
MCF 0806 0.1～0.13A DC
MCF 1210 0.1A DC
MCF 2010 0.1A DC
CK1608 50～60mA DC
CK2125 60～500mA DC
CKS2125 110～280mA DC
CKP1608 0.35～0.9A DC
CKP2012 0.7～1.2A DC
CKP2016 0.9～1.6A DC
CKP2520 1.1～1.8A DC
NM2012 0.8～1.5A DC
NM2520 0.9～1.1A DC
LK1005 20～25mA DC
LK1608 1～150mA DC
LK2125 5～300mA DC
HK0402 160～380mA DC
HK0603 60～470mA DC
HK1005 110～300mA DC
HK1608 150～300mA DC
HK2125 300mA DC
HKQ0402 90～500mA DC
HKQ0603W 160～850mA DC
HKQ0603S 130～600mA DC
HKQ0603U 130～600mA DC
AQ105 280～710mA DC
Definition of rated current：
・In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20℃.
・In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within
40℃.
・In the LK, HK, HKQ, and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias,
or the value of current at which the temperature of the element is increased within 20℃.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
4. Impedance
Specified Value
BK0402 10～120Ω ±25%
BK0603 10～600Ω ±25%
BK1005 10～1800Ω ±25%
BKH1005 1500～1800Ω ±25%
BK1608 22～2500Ω ±25%
BK2125 15～2500Ω ±25%
ARRAY BK2010 5～1000Ω ±25%
BK3216 68～1000Ω ±25%
BKP0603 22～33Ω ±25%
BKP1005 10～220Ω ±25%
BKP1608 33～470Ω ±25%
BKP2125 33～330Ω ±25%
MCF 0806 12～90Ω ±5Ω(12Ω), ±20%(Other)
MCF 1210 90Ω ±25%
MCF 2010 90Ω ±25%
CK1608
－
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402/HKQ0402
HK0603
HK1005
HK1608
HK2125
HKQ0603W/HKQ0603S/HKQ0603U
AQ105
Test Methods and
Remarks
BK0402Series
Measuring frequency : 100±1MHz
Measuring equipment : E4991A（or its equivalent）
Measuring jig : 16196D（or its equivalent）
BK0603Series, BKP0603Series
Measuring frequency : 10±1MHz
Measuring equipment : 4291A（or its equivalent）
Measuring jig : 16193A（or its equivalent）
BK1005Series, BKP1005Series ,BKH1005Series
Measuring frequency : 100±1MHz
Measuring equipment : 4291A（or its equivalent）
Measuring jig : 16192A（or its equivalent）, 16193A（or its equivalent）
BK1608・2125Series, BKP1608・2125Series
Measuring frequency : 100±1MHz
Measuring equipment : 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig : 16092A（or its equivalent） or 16192A（or its equivalent）/HW
BK2010・3216Series,MCFSeries
Measuring frequency : 100±1MHz
Measuring equipment : 4291A（or its equivalent）, 4195A（or its equivalent）
Measuring jig : 16192A（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
5. Inductance
Specified Value
BK0402
－
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608 4.7～10.0μH： ±20%
CK2125 0.1～10.0μH： ±20%
CKS2125 1.0～10.0μH： ±20%
CKP1608 0.33～2.2μH： ±20%
CKP2012 0.47～4.7μH： ±20%
CKP2016 0.47～4.7μH： ±20%
CKP2520 0.47～4.7μH： ±20%
NM2012 0.82～1.0μH： ±20%
NM2520 1.0～2.2μH： ±20%
LK1005 Inductance 0.12～2.2μH： ±10%, Q 0.12～2.2μH： ±30%
LK1608 Inductance 0.047～33.0μH： ±20% 0.10～12.0μH： ±10%
Q 0.12～2.2μH： ±30%
LK2125 Inductance 0.047～33.0μH： ±20% 0.10～12.0μH： ±10%
Q 0.12～2.2μH： ±30%
HK0402 1.0～6.2nH： ±0.3nH 6.8～12nH： ±5%
HK0603 1.0～6.2nH： ±0.3nH 6.8～100nH： ±5%
HK1005 1.0～6.2nH： ±0.3nH 6.8～270nH： ±5%
HK1608 1.0～5.6nH： ±0.3nH 6.8～470nH： ±5%
HK2125 1.5～5.6nH： ±0.3nH 6.8～470nH： ±5%
HKQ0402 0.5～5.6nH： ±0.3nH 6.2～27nH： ±5%
HKQ0603W 0.6～3.9nH： ±0.3nH 4.3～22nH： ±5%
HKQ0603S 0.6～6.2nH： ±0.3nH 6.8～22nH： ±5%
HKQ0603U 0.6～6.2nH： ±0.3nH 6.8～22nH： ±5%
AQ105 1.0～6.2nH： ±0.3nH 6.8～15nH： ±5%
Test Methods and
Remarks
CKSeries
Measuring frequency : 2～4MHz（CK1608）
Measuring frequency : 2～25MHz（CK2125）
Measuring frequency : 2～1MHz（CKS2125）
LKSeries
Measuring frequency : 10～25MHz（LK1005）
Measuring frequency : 1～50MHz（LK1608）
Measuring frequency : 0.4～50MHz（LK2125）
CKP、NMSeries
Measuring frequency : 1MHz（CKP2012・CKP2016・CKP2520・NM2012・NM2520）
Measuring equipment /jig :・4194A＋16085B＋16092A（or its equivalent）
・4195A＋41951＋16092A（or its equivalent）
・4294A＋16192A（or its equivalent）
・4291＋1693A（or its equivalent）/LK1005
・4285A＋42841A＋42842C＋42851－61100（CKP2012・CKP2016・CKP2520・NM2012・NM2520）
Measuring current :・1mA rms（0.047～4.7μH）
・0.1mA rms（5.6～33μH）
HK、HKQ、AQ Series
Measuring frequency : 100MHz（HK0402・HKQ0402・HK0603・HK1005・AQ105）
Measuring frequency : 50/100MHz（HK1608・HK2125）
Measuring frequency : 500MHz（HKQ0402・HKQ0603S・HKQ0603U）
Measuring frequency : 300/500MHz（HKQ0603W）
Measuring equipment /jig :・4291A＋16197A（or its equivalent）/HK060・AQ105
・4291A＋16193A（or its equivalent）/HK1005
・E4991A＋16197A（or its equivalent）/HKQ0603S・HKQ0603・HKQ0603W
・4291A＋16092A ＋ in-house made jig（or its equivalent）/HK1608・HK2125
・E4991A＋16196D（or its equivalent）/HK0402・HKQ0402
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
6. Q
Specified Value
BK0402
－
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608 20 min.
CK2125 15～20 min.
CKS2125
－
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 10～20 min.
LK1608 10～35 min.
LK2125 15～50 min.
HK0402 3 min.
HK0603 4～5 min.
HK1005 8 min.
HK1608 8～12 min.
HK2125 10～18 min.
HKQ0402 3～8 min.
HKQ0603W 14～15 min.
HKQ0603S 10～13 min.
HKQ0603U 10～13 min.
AQ105 8 min.
Test Methods and
Remarks
CKSeries
Measuring frequency : 2～4MHz（CK1608）
Measuring frequency : 2～25MHz（CK2125）
LKSeries
Measuring frequency : 10～25MHz（LK1005）
Measuring frequency : 1～50MHz（LK1608）
Measuring frequency : 0.4～50MHz（LK2125）
Measuring equipment /jig :・4194A＋16085B＋16092A（or its equivalent）
・4195A＋41951＋16092A（or its equivalent）
・4294A＋16192A（or its equivalent）
・4291A＋16193A（or its equivalent）/LK1005
Measuring current ・1mA rms（0.047～4.7μH）
・0.1mA rms（5.6～33μH）
HK、HKQ、AQ Series
Measuring frequency : 100MHz（HK0402・HKQ0402・HK0603・HK1005・AQ105）
Measuring frequency : 50/100MHz（HK1608・HK2125）
Measuring frequency : 500MHz（HKQ0402・HKQ0603S・HKQ0603U）
Measuring frequency : 300/500MHz（HKQ0603W）
Measuring equipment /jig :・4291A＋16197A（or its equivalent）/HK0603・AQ105
・4291A＋16193A（or its equivalent）/HK1005
・E499A＋16197A（or its equivalent）/HKQ0603S・HKQ0603U・HKQ0603W
・4291A＋16092A ＋ in-house made jig（or its equivalent）/HK1608, HK2125
・E4991A＋16196D（or its equivalent）HK0402・HKQ0402
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
7. DC Resistance
Specified Value
BK0402 0.10～0.53Ω max.
BK0603 0.065～1.50Ω max.
BK1005 0.03～0.80Ω max.
BKH1005 1.50～2.00Ω max.
BK1608 0.05～1.10Ω max.
BK2125 0.05～0.75Ω max.
ARRAY BK2010 0.10～0.90Ω max.
BK3216 0.15～0.80Ω max.
BKP0603 0.065～0.070Ω max.
BKP1005 0.030～0.20Ω max.
BKP1608 0.025～0.18Ω max.
BKP2125 0.020～0.075Ω max.
MCF 0806 2.5～6.5Ω max.
MCF 1210 4.5Ω max.
MCF 2010 4.5Ω max.
CK1608 0.45～0.85Ω（±30%）
CK2125 0.16～0.65Ω max.
CKS2125 0.09～0.40Ω typ.
0.12～0.52Ω max.
CKP1608 0.15～0.35Ω max.
CKP2012 0.10～0.28Ω max.
CKP2016 0.08～0.20Ω max.
CKP2520 0.05～0.16Ω max.
NM2012 0.10～0.19Ω max.
NM2520 0.13～0.22Ω max.
LK1005 0.41～1.16Ω max.
LK1608 0.2～2.2Ω max.
LK2125 0.1～1.1Ω max.
HK0402 0.18～0.99Ω max.
HK0603 0.11～3.74Ω max.
HK1005 0.08～4.8Ω max.
HK1608 0.05～2.6Ω max.
HK2125 0.10～1.5Ω max.
HKQ0402 0.08～2.24Ω max.
HKQ0603W 0.07～1.6Ω max.
HKQ0603S 0.06～1.29Ω max.
HKQ0603U 0.06～1.29Ω max.
AQ105 0.07～0.45Ω max.
Test Methods and
Remarks Measuring equipment：VOAC-7412（made by Iwasaki Tsushinki） VOAC-7512（made by Iwasaki Tsushinki）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
8. Self Resonance Frequency（SRF）
Specified Value
BK0402
－
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608 17～25MHz min.
CK2125 24～235MHz min.
CKS2125
－
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 40～180MHz min.
LK1608 9～260MHz min.
LK2125 13～320MHz min.
HK0402 29000～10000MHz min.
HK0603 900～10000MHz min.
HK1005 400～10000MHz min.
HK1608 300～10000MHz min.
HK2125 200～4000MHz min.
HKQ0402 1700～10000MHz min.
HKQ0603W 2500～10000MHz min.
HKQ0603S 1900～10000MHz min.
HKQ0603U 1900～10000MHz min.
AQ105 2300～10000MHz min.
Test Methods and
Remarks
LKSeries :
Measuring equipment : 4195A（or its equivalent）
Measuring jig : 41951＋16092A（or its equivalent）
HK、HKQ、AQSeries :
Measuring equipment : 8719C（or its equivalent）・8753D（or its equivalent）/HK2125
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
9. Temperature Characteristic
Specified Value
BK0402
－
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
Inductance change：Within ±10％
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and
Remarks
HK、HKQ、AQSeries：
Temperature range : －30～＋85℃
Reference temperature : ＋20℃
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
10. Resistance to Flexure of Substrate
Specified Value
BK0402
No mechanical damage.
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and
Remarks
Warp : 2mm（BK Series without 0402size,、BKP、BKH、CK、CKS、CKP、NM、LK、HK、HKQ0603S、HKQ0603U、AQ Series、
MCF1210）
: 1mm（BK0402、HK0402、HKQ0402、HKQ0603W Series、MCF Series without 1210 size,）
Testing board : glass epoxy-resin substrate
Thickness : 0.8mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
11. Solderability
Specified Value
BK0402
At least 75％ of terminal electrode is covered by new solder.
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608
At least 75％ of terminal electrode is covered by new solder.
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
LK1608
LK2125
HK0402
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and
Remarks
Solder temperature : 230±5℃
Duration ：4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
12. Resistance to Soldering
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change：Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806 Appearance：No significant abnormality
Impedance change：Within ±20％
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Remaining terminal electrode：70％ min
Inductance change
R10～4R7： Within ±10％
6R8～100： Within ±15％
CKS2125 ： Within ±20％
CKP2012、CKP2016、CKP2520、NM2012、NM2520： Within ±30％
CK2125
CKS2125
CKP1608
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change： Within ±15％
LK1608 No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change
47N～4R7： Within ±10％
5R6～330： Within ±15％
LK2125
HK0402
No mechanical damage.
Remaining terminal electrode：70％ min.
Inductance change： Within ±5％
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and
Remarks
Solder temperature ：260±5℃
Duration ：10±0.5 sec.
Preheating temperature ：150 to 180℃
Preheating time ：3 min.
Flux ：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery ：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
13. Thermal Shock
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change： Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806 Appearance：No significant abnormality
Impedance change： Within ±20％
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Inductance change：Within ±20％ Q change：Within ±30％
Inductance change：Within ±20％ （CKS2125）
CK2125
CKS2125
CKP1608
No mechanical damage.
Inductance change： Within ±30％
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
LK1608
LK2125
HK0402
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and
Remarks
Conditions for 1 cycle
Step temperature（℃） time（min.）
1 Minimum operating temperature ＋0/－3 30±3
2 Room temperature 2～3
3 Maximum operating temperature ＋3/－0 30±3
4 Room temperature 2～3
Number of cycles：5
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
14. Damp Heat（ Steady state）
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change： Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806 Appearance：No significant abnormality
Impedance change： Wihin ±20％
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
CK2125
CKS2125 Inductance change： Within ±20％
CKP1608
No mechanical damage.
Inductance change： Within ±30％
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
LK1608
LK2125 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
HK0402
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and
Remarks
BK、BKP、BKH Series、MCF Series：
Temperature ：40±2℃
Humidity ：90 to 95％RH
Duration ：500＋24/－0 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQSeries：
Temperature ：40±2℃（ LK、CK、CKS、CKP、NM Series）
：60±2℃（ HK、HKQ、AQ Series）
Humidity ：90 to 95％RH
Duration ：500±12 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
15. Loading under Damp Heat
Specified Value
BK0402
Appearance：No significant abnormality
Impedance change： Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
CK2125
CKS2125 No mechanical damage.
Inductance change： Within ±20％
CKP1608
No mechanical damage.
Inductance change： Within ±30％
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
LK1608
No mechanical damage.
Inductance change： 0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ±15％
Q change： Within ±30％
LK2125 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
HK0402
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and
Remarks
BK、BKP、BKH Series：
Temperature ：40±2℃
Humidity ：90 to 95％RH
Applied current ：Rated current
Duration ：500＋24/－0 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
LK、CK、CKS、CKP、NK、HK、HKQ、AQ Series：
Temperature ：40±2℃（ LK、CK、CKS、CKP、NM Series）
：60±2℃（ HK、HKQ、AQ Series）
Humidity ：90 to 95％RH
Applied current ：Rated current
Duration ：500±12 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-01
16. Loading at High Temperature
Specified Value
BK0402
Appearance：No significant abnormality。
Impedance change： Within ±30％
BK0603
BK1005
BKH1005
BK1608
BK2125
ARRAY BK2010
BK3216
BKP0603
BKP1005
BKP1608
BKP2125
MCF 0806 Appearance：No significant abnormality
Impedance change： Within ±20％
MCF 1210
MCF 2010
CK1608 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
CK2125
CKS2125 No mechanical damage.
Inductance change： Within ±20％
CKP1608
No mechanical damage.
Inductance change： Within ±30％
CKP2012
CKP2016
CKP2520
NM2012
NM2520
LK1005 No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±30％
LK1608
No mechanical damage.
Inductance change： 0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ±15％
Q change： Within ±30％
LK2125 No mechanical damage.
Inductance change： Within ±20％ Q change： Within ±30％
HK0402
No mechanical damage.
Inductance change： Within ±10％ Q change： Within ±20％
HK0603
HK1005
HK1608
HK2125
HKQ0402
HKQ0603W
HKQ0603S
HKQ0603U
AQ105
Test Methods and
Remarks
BK、BKH、BKP Series、MCF Series：
Temperature : 125±3℃（BK、BKH Series）
: 85±3℃（BKP、MCF Series）
Applied current ：Rated current
Duration ：500＋24/－0 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
（See Note 1）
LK、CK、CKS、CKP、NM、HK、HKQ、AQ Series：
Temperature : 85±2℃（LK、CK、CKS、CKP、NM Series）
: 85±2℃（HK1608，2125）
: 85±2℃（HK1005, AQ105 operating temperature range－55～＋85℃）
: 125±2℃（HK0402, HKQ0402, HK0603, HK1005, HKQ0603S, HKQ0603U, HKQ0603W, AQ105
operating temperature range－55～＋125℃）
Applied current ：Rated current
Duration ：500±12 hrs
Recovery ：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
Precautions
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
Technical
considerations
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Recommended land dimensions for wave-soldering （Unit：mm）
Type 1608 2125 3216
Size L 1.6 2.0 3.2
W 0.8 1.25 1.6
A 0.8～10 1.0～1.4 1.8～2.5
B 0.5～0.8 0.8～1.5 0.8～1.7
C 0.6～0.8 0.9～1.2 1.2～1.6
Recommended land dimensions for reflow-soldering （Unit：mm）
Type 0402 0603 1005 105 1608 2012
Size L 0.4 0.6 1.0 1.0 1.6 2.0
W 0.2 0.3 0.5 0.6 0.8 1.25
A 0.15～0.25 0.20～0.30 0.45～0.55 0.50～0.55 0.8～1.0 0.8～1.2
B 0.10～0.20 0.20～0.30 0.40～0.50 0.30～0.40 0.6～0.8 0.8～1.2
C 0.15～0.30 0.25～0.40 0.45～0.55 0.60～0.70 0.6～0.8 0.9～1.6
Type 2125 2016 2520 3216
Size L 2.0 2.0 2.5 3.2
W 1.25 1.6 2.0 1.6
A 0.8～1.2 0.8～1.2 1.0～1.4 1.8～2.5
B 0.8～1.2 0.8～1.2 0.6～1.0 0.6～1.5
C 0.9～1.6 1.2～2.0 1.8～2.2 1.2～2.0
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when
designing land-patterns.
Recommended land dimension for Reflow-soldering
Type 3216 2010 1210 0806
Size L 3.2 2.0 1.25 0.85
W 1.6 1.0 1.0 0.65
a 0.7～0.9 0.5～0.6 0.45～0.55 0.25～0.35
b 0.8～1.0 0.5～0.6 0.7～0.8 0.25～0.35
c 0.4～0.5 0.2～0.3 0.25～0.35 0.25～0.35
d 0.8 0.5 0.55 0.5
（Unit：mm）
（（2） Examples of good and bad solder application
Item Not recommended Recommended
Mixed mounting of SMD and
leaded components
Component placement close to
the chassis
Hand-soldering of leaded
components near mounted
components
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item Nt recommended Recommended
Deflection of the board
Position the
component at a right
angle to the direction
of the mechanical
stresses that are
anticipated.
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
3. Considerations for automatic placement
Precautions
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
Technical
considerations
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item Improper method Proper method
Single-sided mounting
Double-sided mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
［Recommended conditions］
Figure 0805 case sizes as examples
a 0.3mm min
b 100～120μm
c Area with no adhesive
Amount of adhesives
After inductors are bonded
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
Technical
considerations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference
between the components and cleaning process should not be greater than 100℃.
Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the
soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal
shock.
Recommended conditions for soldering
［Reflow soldering］
Temperature profile
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of the inductor, as shown
below:
2. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to
recommended times as possible.
［Wave soldering］
Temperature profile
※Ceramic chip components should be preheated to within 100 to 130℃ of the
soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder should not be greater than 100 to 130℃.
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the inductors designated as for reflow soldering only.
［Hand soldering］
Temperature profile
（※⊿ＴT190℃（ 3216Type max）, ⊿Ｔ≦130℃（ 3225 Type ming）
※It is recommended to use 20W soldering iron and the tip is 1φ or less.
※The soldering iron should not directly touch the components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable soldering condition, therefore
these profiles are not always recommended.
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-01
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
Technical
considerations
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the
cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output Below 20W/ℓ
Ultrasonic frequency Below 40kHz
Ultrasonic washing period 5 min. or less
6. Post cleaning processes
Precautions
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat
may lead to inductor damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature Below 40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions inductor electrode solderability decreases as
time passes, so inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
Technical
considerations
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within
6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
