BAL-2690D3U 50 nominal input / conjugate match balun to STLC2690 Datasheet - production data Description The BAL-2690D3U is a balun designed to transform single ended signals to differential signals in Bluetooth applications. The BAL-2690D3U has been customized for the STLC2690 Bluetooth transceiver with 0.8 dB insertion losses in the bandwidth (2400 MHz - 2500 MHz) and with a specific requirement for the SCC22 parameter. The BAL-2690D3U has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. )OLS&KLSSDFNDJH EXPSV Figure 1. Top view Features Top View * 50 nominal input / 30+j25 output differential impedance GND A1 A1 A2 A2 * Low insertion loss BAL - ZC C * Low amplitude imbalance SE * Low phase imbalance * Small footprint: BAL-2690D3U < 1 mm B1 B1 B2 B2 BAL + Bump Name Description Benefits * Very low profile (<700 m) A1 A2 BAL- RF balanced ouput GND Ground B1 BAL+ RF balanced ouput B2 SE RF input * High RF performances * RF BOM and area reduction Figure 2. Application schematic Applications WLAN PA + SP3T Balun transformer for applications such as: * Bluetooth STLC2690 * Mobile phone 2.4G Antenna Band Pass Filter BT Balun BT RFIC TM: IPAD is a trademark of STMicroelectronics September 2015 This is information on a product in full production. DocID16056 Rev 3 1/9 www.st.com 9 Characteristics 1 BAL-2690D3U Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN VESD TOP Typ. Max. Input power RFIN 20 ESD ratings MIL STD883G (HBM: C = 100 pF, R = 1.5 k, air discharge) 2000 ESD ratings machine model, (MM: C = 200 pF, R = 25 , L = 500 nH) 500 ESD ratings charged device model (JESD22-C101D) 500 Operating temperature -40 dBm V +125 C Table 2. Electrical characteristics - RF performance (Tamb = 25 C) Value Symbol Parameter Min. ZOUT ZIN Nominal input impedance Frequency range (bandwidth) IL Insertion loss in bandwidth Ripple RL Ma x. 30 + j25 Nominal differential output impedance F Typ. Unit 50 2402 2441 0.8 Ripple in bandwidth 248 MHz 0 1.1 dB 0.6 dB Return loss in bandwidth 14 imb Phase imbalance -10 10 Aimb Amplitude imbalance -1 1 dB Common mode rejection ratio (SSC12) 20 RCMRR SCC22 2/9 Magnitude for common mode harmonic rejection coefficient at 2fo Phase for common mode harmonic rejection coefficient at 2fo From 4804 MHz to 4960 MHz, 25 is considered as reference for CM DocID16056 Rev 3 dB dB 0.7 1 dB -45 0 BAL-2690D3U 1.1 Characteristics Measurements Figure 3. Insertion loss (Tamb = 25 C) dB - 0.9 Figure 4. Return loss (Tamb = 25 C) m2 -10 dB m1 - 1.0 -15 Ripple in band 0.02 dB typ. - 1.1 -20 - 1.2 -25 - 1.3 F(Hz) - 1.4 2.2E9 2.4E9 2.3E9 2.5E9 2.6E9 2.7E9 2.2E9 Figure 5. Amplitude imbalance (Tamb = 25 C) dB 1.0 F(Hz) -30 2.4E9 2.6E9 2.5E9 2.7E9 Figure 6. Phase imbalance (Tamb = 25 C) 10 0.5 5 0.0 0.0 -0.5 -5 F(Hz) -1.0 2.2E9 2.3E9 2.3E9 2.4E9 2.5E9 2.6E9 F(Hz) -10 2.2E9 2.7E9 Figure 7. Scc22 magnitude at 2f0 (Tamb = 25 C) 2.3E9 2.4E9 2.5E9 2.6E9 2.7E9 Figure 8. Scc22 phase 2f0 (Tamb = 25 C) 0 1.0 - 10 0.9 - 20 - 30 0.8 - 40 F(Hz) 0.7 4.6E9 4.7E9 4.8E9 4.9E9 5.0E9 5.1E9 5.2E9 F(Hz) - 50 4.6E9 DocID16056 Rev 3 4.7E9 4.8E9 4.9E9 5.0E9 5.1E9 5.2E9 3/9 Package information 2 BAL-2690D3U Package information * Epoxy meets UL94, V0 * Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 2.1 Flip-Chip package information Figure 9. Flip-Chip package outline 7RSYLHZ ' VLGHYLHZ %RWWRPYLHZ $ $ $ $ ' FFF & ( & ( 6( % % E ' I( I' $ Table 3. Flip-Chip package mechanical data Parameter Description Min. Typ. Max. Unit A Bump height + substrate thickness 0.570 0.630 0.690 mm A1 Bump height 0.155 0.205 0.255 mm A2 Substrate thickness 0.400 b Bump diameter 0.215 0.255 0.295 mm D Y dimension of the die 0.860 0.910 0.960 mm D1 Y pitch E X dimension of the die E1 X pitch 0.474 SE 0.860 0.910 mm 0.960 mm 0.474 mm 0.237 mm fD Distance from bump to edge of die on Y axis 0.213 mm fE Distance from bump to edge of die on X axis 0.213 mm ccc 0.05 $ 4/9 mm 0.025 DocID16056 Rev 3 mm mm BAL-2690D3U Package information Figure 10. Footprint PP # PP PP " Figure 11. Footprint - 3 mils stencil -non solder mask defined Figure 12. Footprint - 3 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG Figure 13. Footprint - 5 mils stencil -non solder mask defined Figure 14. Footprint - 5 mils stencil - solder mask defined &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP 6ROGHUPDVNRSHQLQJ PUHFRPPHQGHG PPLQLPXP PPD[LPXP &RSSHUSDGGLDPHWHU PUHFRPPHQGHG PPLQLPXP 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG 6ROGHUVWHQFLORSHQLQJ PUHFRPPHQGHG GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP DocID16056 Rev 3 5/9 Package information BAL-2690D3U Figure 15. Recommend land pattern (used for balun characterization) 35 m 76 m 18 m L1 L2 540 m No GND under the die in L1 GND under the die in L2 18 m 76 m 35um L3 L4 Figure 16. Example of transceiver application board land pattern Figure 17. Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year, ww = week) x x z y ww 6/9 DocID16056 Rev 3 BAL-2690D3U Package information Figure 18. Flip Chip tape and reel specifications 2.0 0.05 4.0 0.1 O 1.50 0.10 1.75 0.1 Dot identifying pin A1 location 1.0 0.05 x x z y ww x x z y ww x x z y ww 3.5 0.05 1.0 0.05 8.0 0.3 0.20 0.015 2.0 0.05 0.73 0.05 All dimensions in mm Note: User direction of unreeling More information is available in the STMicroelectronics Application note: AN2348 Flip-Chip: "Package description and recommendations for use" DocID16056 Rev 3 7/9 Ordering information 3 BAL-2690D3U Ordering information Table 4. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode BAL-2690D3U RP Flip-Chip 1.02 mg 5000 Tape and reel Revision history Table 5. Document revision history 8/9 Date Revision Changes 25-Jan-2010 1 First issue. 08-Feb-2010 2 Updated Table 1 and Figure 16. 21-Sep-2015 3 Updated Figure 9 and Figure 9. Added Figure 11, Figure 12, Figure 13, Figure 14 and Table 3. DocID16056 Rev 3 BAL-2690D3U IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2015 STMicroelectronics - All rights reserved DocID16056 Rev 3 9/9