Document No. 70-0326-04 │www.psemi.com
Page 1 of 11
©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Product Description
The PE42430 is a HaRP™-enhanced reflective SP3T RF
switch developed on the UltraCMOS® process
technology. This tiny general purpose switch is ideal for
WLAN and bluetooth applications in the 2.4 - 2.5 GHz
bands as well as general broadband switching
applications. It is comprised of three RF ports and has
low insertion loss and high isolation. An on-chip CMOS
decode logic facilitates a three-pin CMOS control
interface. Unlike competitive solutions, there is no need
for blocking capacitors when using the PE42430.
Peregrine’s HaRP™ technology enhancements deliver
high linearity and exceptional harmonics performance.
It is an innovative feature of the UltraCMOS® process,
providing performance superior to GaAs with the
economy and integration of conventional CMOS.
Product Specification
UltraCMOS® SP3T Reflective
RF Switch 100 – 3000 MHz
PE42430
Features
HaRP™-enhanced UltraCMOS® device
Low insertion loss
Typical 0.45 dB @ 1 GHz
Typical 0.55 dB @ 2.5 GHz
IIP3: Typical +66 dBm
P0.1dB Compression: Typical +30 dBm
Excellent ESD tolerance of 4500V HBM
and 250V MM on all ports
No external VDD required. VDD is derived
from switch control inputs
Package type: 8-lead 1.5 x 1.5 mm DFN
Figure 1. Functional Diagram Figure 2. Package Type
8-lead 1.5 x 1.5 mm DFN
RF1
CMOS
Control/Driver
and ESD
V1 V2
ESD
ESD ESD
RF3
RFC
RF2
ESD
V3
71-0086-01
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Product Specification
PE42430
Page 2 of 11
©2010-2012 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
Table 1. Electrical Specifications1: Nominal @ 25°C, V1, V2 or V3 = 3V/5V (ZS = ZL = 50 Ω)
Notes: 1. Specifications under min and max nominal conditions
2. Please refer to Maximum Input Power (50 Ω ) in Table 4
3. Switching time is measured while the part is powered on and one of the control pins is switching state
4. Turn on time is defined as the time it takes the part to go from an unpowered state to 90% RF voltage. Max power
can only be applied after the part is turned on
5. Video feedthrough is measured by terminating all ports and measuring peak transients while switching logic state
Electrical Parameter Path Condition Min Typ Max Unit
Operating Frequency 100 3000 MHz
Insertion Loss
RFC-RFX
100 to 1000 MHz 0.45 0.56 dB
1000 to 3000 MHz 0.65 0.9 dB
2400 to 2500 MHz 0.55 0.8 dB
Isolation
RFX-RFX
100 to 1000 MHz 35 40 dB
1000 to 3000 MHz 23 28 dB
2400 to 2500 MHz 25 30 dB
Isolation 100 to 1000 MHz 34 40 dB
1000 to 3000 MHz 23 28 dB
2400 to 2500 MHz 25 30 dB
Return Loss (Active Port)
RFX
100 to 1000 MHz 22 dB
1000 to 3000 MHz 16 dB
2400 to 2500 MHz 18 dB
Return Loss (Common Port)
RFC
100 to 1000 MHz 22 dB
1000 to 3000 MHz 16 dB
2400 to 2500 MHz 18 dB
Input 0.1 dB compression 2 RFC-RFX 100 to 3000 MHz 30 dBm
IIP3 RFC-RFX 100 to 3000 MHz 66 dBm
IIP2 RFC-RFX 100 to 3000 MHz 100 dBm
Switching Time 3 50% CTRL to 90% or 10% of final value 500 nS
Video Feedthrough 5 10 mV
RFC-RFX
Turn on Time 4 50% CTRL to 90% or 10% of RF 1.5 2.0 µS
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Product Specification
PE42430
Page 3 of 11
Document No. 70-0326-04 │www.psemi.com ©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Table 3. Electrical Specifications: Min/Max Performance @ -40 to +85°C, V1, V2 or V3 = 3.0V to 5.5V
(ZS = ZL = 50 Ω)
Electrical Parameter Path Condition Min Typ Max Unit
Operating Frequency 100 3000 MHz
Insertion Loss
RFC-RFX
100 to 1000 MHz 0.45 0.65 dB
1000 to 3000 MHz 0.65 0.95 dB
2400 to 2500 MHz 0.55 0.85 dB
Isolation
RFX-RFX
100 to 1000 MHz 35 40 dB
1000 to 3000 MHz 23 28 dB
2400 to 2500 MHz 25 30 dB
Isolation
RFC-RFX
100 to 1000 MHz 34 40 dB
1000 to 3000 MHz 23 28 dB
2400 to 2500 MHz 25 30 dB
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Product Specification
PE42430
Page 4 of 11
©2010-2012 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
Pin # Pin Name Description
1 RFC1 RF Common
2 N/C No Connect
3 V1 Switch Control Input, CMOS logic level
4 RF11 RF I/O
5 RF21 RF I/O
6 V2 Switch Control Input, CMOS Logic Level
7 V3 Switch Control Input, CMOS Logic Level
8 RF31 RF I/O
Paddle GND
Exposed Ground Paddle. Ground for
Proper Device Operation
Table 3. Pin Descriptions
Table 5. Absolute Maximum Ratings
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be
restricted to the limits in the Operating Ranges
table.
Symbol Parameter/Conditions Min Max Units
TST Storage temperature range -55 +150 °C
PIN Maximum Input Power (50 Ω) 30 dBm
VESD ESD Voltage HBM1 All Pins 4500 V
VESD ESD Voltage MM2, All Pins 250 V
Notes: 1. HBM ESD Voltage (MIL_STD 883 Method 3015.7)
2. MM ESD Voltage (MM, JEDEC JESD22-A115-A )
Figure 3. Pin Configuration (Top View)
Note 1: RF pins 1, 4, 5 and 8 must be at 0 VDC. The RF pins do not require
DC blocking capacitors for proper operation if the 0 VDC requirement
is met
9
DGND
RF2
V2
V3
RF3
RFC
N/C
V1
RF1
5
6
7
8
1
2
3
4
Exposed
Ground
Paddle
Pin 1 Indicator
Table 4. Operating Ranges
Parameter Symbol Min Typ Max Units
IDD Power Supply Current IDD 130 230 µA
VCTRL Control Voltage High VIH 3 5.5 V
VCTRL Control Voltage Low VIL 0 0.6 V
Operating temperature range TOP -40 +85 °C
Maximum Input Power (50 Ω)
CW @ +85°C
CW @ +25°C
Pin
+27
+30
dBm
dBm
Logo updated under non-rev change. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com
Product Specification
PE42430
Page 5 of 11
Document No. 70-0326-04 │www.psemi.com ©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS®
devices are immune to latch-up.
Table 6. Truth Table
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the
PE42430 in the 8-lead 1.5 x 1.5 mm DFN package
is MSL1.
Switching Frequency
The PE42430 has a maximum 25 kHz switching
rate.
Path V1 V2
RFC - RF1 1 0
RFC - RF2 0 1
RFC - RF3 0 0
V3
0
0
1
Note: Any state other than shown in Table 6 are undefined states
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS® device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Logo updated under non-rev change. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com
Product Specification
PE42430
Page 6 of 11
©2010-2012 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
Figure 4. Insertion Loss vs Temperature
(RFX-RFC) Figure 5. Insertion Loss vs VDD
(RFX-RFC)
Figure 6. Insertion Loss RFX
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Product Specification
PE42430
Page 7 of 11
Document No. 70-0326-04 │www.psemi.com ©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Figure 7. RFX-RFX Isolation vs Temperature Figure 8. RFX-RFX Isolation vs VDD
Figure 9. RFC-RFX Isolation vs Temperature Figure 10. RFC-RFX Isolation vs VDD
Logo updated under non-rev change. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com
Product Specification
PE42430
Page 8 of 11
©2010-2012 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
Figure 13. Active Port Return Loss vs
Temperature (RFX) Figure 14. Active Port Return Loss vs VDD
(RFX)
Figure 11. RFC Port Return Loss vs
Temperature Figure 12. RFC Port Return Loss vs VDD
Logo updated under non-rev change. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com
Product Specification
PE42430
Page 9 of 11
Document No. 70-0326-04 │www.psemi.com ©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Evaluation Kit Information
The SP3T Switch Evaluation Kit facilitates custom-
er evaluation of the PE42430 SP3T switch. The
RF common port is connected through a 50 Ω
transmission line to J2. Ports 1, 2 and 3 are con-
nected through 50 Ω transmission lines to J3, J5
and J4 respectively. J1 provides digital inputs V1,
V2 and V3 to the device.
On the back of the board, a through line connects
SMA connectors J6 and J7. This transmission line
can be used to estimate the PCB loss over the
environmental conditions.
This four layer board is composed of Rogers 4350
on the top and bottom and FR4 on the inner layers
with a total thickness of 0.062”. All transmission
lines have 21.5 mil width and 7.25 mil gap.
Use jumpers on header J1 to short the control pins
to ground for logic low. VDD is supplied to the part
through at least one of the control pins via Pins 1,
3 or 5 (V3, V2, V1) on header J1.
Figure 16. Evaluation Kit Schematics
Figure 15. Evaluation Board Layouts
101-0604
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Product Specification
PE42430
Page 10 of 11
©2010-2012 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0326-04 │ UltraCMOS® RFIC Solutions
Figure 17. Mechanical Specifications
Symbol Common
Dimensions (mm) Dimensions (in)
Min Nom Max Min Nom Max
A 0.45 0.50 0.55 0.018 0.020 0.022
A3 0.127 ref 0.005 ref
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.15 0.20 0.25 0.006 0.008 0.010
D 1.45 1.50 1.55 0.058 0.060 0.062
D2 1.15 1.20 1.25 0.046 0.048 0.050
E 1.45 1.50 1.55 0.058 0.060 0.062
E2 0.65 0.70 0.75 0.026 0.028 0.030
e 0.40 BSC
L 0.125 0.175 0.225 0.005 0.007 0.009
K 0.200 - - 0.008 - -
0.016 BSC
Figure 18. Marking Specifications
PZZ
YWW
MarkingSpec
Symbol
Package
Marking Definition
P A-Z Part# code
ZZ 00-99 Last two digits of lot code
Y 0-9 Last digit of year, starƟng from 2011
(1 for 2011,2 for 2012 etc)
WW 01-53 Work week
17-0154
Logo updated under non-rev change. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com
Product Specification
PE42430
Page 11 of 11
Document No. 70-0326-04 │www.psemi.com ©2010-2012 Peregrine Semiconductor Corp. All rights reserved.
Figure 19. Tape and Reel Drawing
Drawing not drawn to scale
Pocket hole diameter 0.6 ± 0.05 mm
Bumped die are oriented active side down
Maximum cavity angle 5o
Advance Information:
The product is in a formative or design stage. The datasheet contains design target
specifications for product development. Specifications and features may change in any manner without notice.
Preliminary Specification:
The datasheet contains preliminary data. Additional data may be added at a later
date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best
possible product.
Product Specification:
The datasheet contains final data. In the event Peregrine decides to
change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Custome r
Notification Form).
The informatio n in this datasheet i s believed to b e reliable. Ho wever, Peregrin e assume s no liability for the us e
of this inf o r m ati o n. U s e s hal l b e ent i rel y at th e u se r’ s o w n ri sk.
No patent rights or licenses to any circuits descri bed in this datasheet are i mplied or granted to any third party.
Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant,
or in other applications intended to support or sustain life, or in any application in which the failure of the
Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no
liability for damages, including consequential or incidental damages, arising out of the use of its products in
such applications.
The Peregrine name, logo, UltraCMOS and UTSi are regist ered trademarks and HaRP, MultiSwitch and DuNE
are trademarks of Peregrine Semiconductor Corp.
Sales Contact and Information
For sales and contact information please visit www.psemi.com.
Table 7. Ordering Information
Order Code Description Package Shipping Method
PE42430MLAB-Z PE42430 SP3T RF Switch Green 8LD 1.5x1.5 DFN 3000 units T/R
EK42430-01 PE42430 Evaluation board Evaluation Kit 1/Box
Logo updated under non-rev change. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com
