(1.27 mm) .050" TFC SERIES
Shrouded body for
blind mating
Surface Mount or
Through-hole
Alignment pin
option available
Choice
of eight
body
heights
(1.27 mm x 1.27 mm)
.050" x .050"
micro pitch
TFC–120–22–L–D–A
TFC–110–12–L–D–A
TFC–145–02–L–D–A
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
For complete specifications and
recommended PCB layouts
see www.samtec.com?TFC
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
3.1 A per pin
(2 pins powered)
Voltage Rating:
350 VAC mated with SFC
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Ye s
OPTION
NO. PINS
PER ROW
TFC 1LEAD
STYLE D
PLATING
OPTION
03, 04, 06, 08
(Lead Style –01 & –02 only)
05, 07, 10, 15, 20, 25,
30, 35, 40, 45, 50
(Standard sizes)
–RA
= Right-angle
(–01 only)
–A
= Alignment Pin
–LC
= Locking Clip
(Manual
Placement
required)
(not available
with –RA)
–K
= (6.75 mm) .266"
DIA Polyimide film
Pick & Place Pad
–P
= Plastic Pick &
Place Pad
( 5 positions min.)
–TR
= Tape & Reel
(–X2 only)
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(0.36) .014 TYP
(0.46) .018
DIA TYP
(1.27)
.050
TYP
(3.94)
.155
(1.91)
.075
(3.43)
.135
(5.72)
.225
(2.79)
.110
(1.27) .050 x No. of Positions + (3.18) .125
(1.27) .050 x No. of Positions + (0.64) .025
(1.27)
.050
02
01
ABA
(2.44)
.096
(1.14)
.045
(1.27)
.050 DIA
(1.91)
.075
(0.51)
.020
(1.27)
.050
–A OPTION
–RA OPTION
–X1
= Through-
hole
–X2
= Surface
Mount
–F
= Gold flash on post,
Matte Tin on tail
–L
= 15 µ" (0.38 µm) Gold on post,
Matte Tin on tail
SPECIFICATIONS
COST-EFFECTIVE RELIABLE HEADER
For complete scope
of recognitions see
www.samtec.com/quality
RECOGNITIONS
ALSO AVAILABLE
(MOQ Required)
• Other sizes
MATED
HEIGHTS
LEAD STYLE MATED
HEIGHT*
TFC SFC
– 01
–T1
(5.97) .235
– 11 (7.75) .305
– 21 (9.53) .375
– 31 (11.43) .450
– 02
–T2
(6.35) .250
– 12 (8.13) .320
– 22 (9.91) .390
– 32 (11.81) .465
*Processing conditions will
affect mated height.
FILE NO. E111594
Board Mates:
SFC
Cable Mates:
SFSD, SFSDT
PROCESSING
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (03-25)
(0.15 mm) .006" max (30-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
HIGH-SPEED CHANNEL PERFORMANCE
Rating based on Samtec reference
channel. For full SI performance data
visit Samtec.com or contact
SIG@samtec.com Gbps
8
SMT
LEAD
STYLE A B
–02 (5.72)
.225
(3.38)
.133
–12 (7.49)
.295
(3.30)
.130
–22 (9.27)
.365
–32 (11.18)
.440
TH
LEAD
STYLE A B
–01 (5.59)
.220
(3.38)
.133
–11 (7.37)
.290
(3.30)
.130
–21 (9.14)
.360
–31 (11.05)
.435
F-219 (Rev 23JAN19)
