LP38855T-0.8/NOPB - Texas Instruments

VEN

BIAS

GND

OUT VOUT

VIN

VBIAS

CIN

10 PF Ceramic

COUT

10 PF

Ceramic

CBIAS

1 PF

GND GND

LP38855-x.x

LP38855

www.ti.com

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

1.5A Fast-Response High-Accuracy LDO Linear Regulator with Enable

Check for Samples: LP38855

1FEATURES DESCRIPTION

The LP38855 is a high-current, fast-response

2• Standard VOUT Values of 0.8V and 1.2V regulator which can maintain output voltage

• Wide VBIAS Supply Operating Range of 3.0V to regulation with an extremely low input to output

5.5V voltage drop. Fabricated on a CMOS process, the

• Stable with 10 µF Ceramic Capacitors device operates from two input voltages: VBIAS

provides power for the internal bias and control

• Dropout Voltage of 130 mV (Typical) at 1.5A circuits, as well as drive for the gate of the N-MOS

Load Current power transistor, while VIN supplies power to the load.

• Precision Output Voltage Across All Line and The use of an external bias rail allows the part to

Load Conditions: operate from ultra low VIN voltages. Unlike bipolar

regulators, the CMOS architecture consumes

– ±1.0% for TJ= 25°C extremely low quiescent current at any output load

– ±2.0% for 0°C ≤TJ≤+125°C current. The use of an N-MOS power transistor

– ±3.0% for -40°C ≤TJ≤+125°C results in wide bandwidth, yet minimum external

• Over-Temperature and Over-Current capacitance is required to maintain loop stability.

Protection The fast transient response of this device makes it

• Available in 5 Lead TO-220 and DDPAK/TO-263 suitable for use in powering DSP, Microcontroller

Packages Core voltages and Switch Mode Power Supply post

regulators. The LP38855 is available in TO-220 and

• Custom VOUT Values between 0.8V and 1.2V DDPAK/TO-263 5-Lead packages.

are Available Dropout Voltage: 130 mV (typical) at 1.5A load

• -40°C to +125°C Operating Temperature Range current.

APPLICATIONS Low Ground Pin Current: 10 mA (typical) at 1.5A

load current.

• ASIC Power Supplies In:

– Desktops, Notebooks, and Graphics Cards, Shutdown Current: 1 µA (typical) IIN(GND) when EN

pin is low.

Servers

– Gaming Set Top Boxes, Printers and Precision Output Voltage: ±1.0% for TJ= 25°C and

Copiers ±2.0% for 0°C ≤TJ≤+125°C, across all line and load

conditions

• Server Core and I/O Supplies

• DSP and FPGA Power Supplies

• SMPS Post-Regulator

Typical Application Circuit

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TAB

GND

BIAS

OUT

GND

EN 1

LP38855S-x.x

TAB

GND

BIAS

OUT

GND

EN 1

LP38855T-x.x

LP38855

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

www.ti.com

Connection Diagrams

Top View Top View

Figure 1. DDPAK/TO-263 Package Figure 2. TO-220 Package

See Package Number KTT0005B See Package Number NDH0005D

PIN DESCRIPTIONS

TO-220–5 and DDPAK/TO-263–5 Packages

Pin # Pin Symbol Pin Description

1 EN The device Enable pin.

2 IN The unregulated input voltage pin

3 GND Ground

4 OUT The regulated output voltage pin

5 BIAS The supply for the internal control and reference circuitry

The TAB is a thermal connection that is physically attached to the backside of the

TAB TAB die, and is used as a thermal heat-sink connection. See the Application Information

section for details

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings(1)(2)

Storage Temperature Range −65°C to +150°C

Lead Temperature Soldering, 5 seconds 260°C

ESD Rating Human Body Model(3) ±2 kV

Power Dissipation(4) Internally Limited

VIN Supply Voltage (Survival) −0.3V to +6.0V

VBIAS Supply Voltage (Survival) −0.3V to +6.0V

VEN Voltage (Survival) −0.3V to +6.0V

VOUT Voltage (Survival) −0.3V to +6.0V

IOUT Current (Survival) Internally Limited

Junction Temperature −40°C to +150°C

(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical

Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-

A114. The HBM rating for device pin 1 (EN) is ±1.5 kV.

(4) Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to

ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

Product Folder Links: LP38855

LP38855

www.ti.com

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

Operating Ratings(1)

VIN Supply Voltage (VOUT + VDO) to VBIAS

VBIAS Supply Voltage 3.0V to 5.5V

VEN Enable Input Voltage 0.0V to VBIAS

IOUT 0 mA to 1.5A

Junction Temperature Range(2) −40°C to +125°C

(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical

Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.

(2) Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to

ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

Electrical Characteristics

Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF, CBIAS = 1µF, VEN = VBIAS.

Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C

to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent

the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only.

Symbol Parameter Conditions Min Typ Max Units

VOUT(NOM) + 1V ≤VIN ≤VBIAS,-1.0 +1.0

3.0V ≤VBIAS ≤5.5V, 0

-3.0 +3.0

10 mA ≤IOUT ≤1.5A

VOUT Output Voltage Tolerance %

VOUT(NOM) + 1V ≤VIN ≤VBIAS,

3.0V ≤VBIAS ≤5.5V, -2.0 0 +2.0

10 mA ≤IOUT ≤1.5A,

0°C ≤TJ≤125°C

ΔVOUT/ΔVIN Line Regulation, VIN(1) VOUT(NOM) + 1V ≤VIN ≤VBIAS - 0.04 - %/V

ΔVOUT/ΔVBIAS Line Regulation, VBIAS(1) 3.0V ≤VBIAS ≤5.5V - 0.10 - %/V

ΔVOUT/ΔIOUT Output Voltage Load Regulation(2) 10 mA ≤IOUT ≤1.5A - 0.2 - %/A

165

VDO Dropout Voltage, VIN −VOUT(3) IOUT = 1.5A - 130 mV

180

LP38855-0.8 8.5

- 7.0

10 mA ≤IOUT ≤1.5A 9.0 mA

Ground Pin Current Drawn from VIN LP38855-1.2 12

IGND(IN) - 11

Supply 10 mA ≤IOUT ≤1.5A 15

VEN ≤0.5V - 1.0 µA

300

3.8

10 mA ≤IOUT ≤1.5A - 3.0 mA

4.5

Ground Pin Current Drawn from

IGND(BIAS) VBIAS Supply 170

VEN ≤0.5V - 100 µA

200

VBIAS rising until device is 2.20 2.70

UVLO Under-Voltage Lock-Out Threshold 2.45 V

functional 2.00 2.90

VBIAS falling from UVLO threshold 60 300

UVLO(HYS) Under-Voltage Lock-Out Hysteresis 150 mV

until device is non-functional 50 350

VIN = VOUT(NOM) + 1V,

ISC Output Short-Circuit Current - 4.5 - A

VBIAS = 3.0V, VOUT = 0.0V

(1) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.

(2) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from no load

to full load.

(3) Dropout voltage is defined the as input to output voltage differential (VIN - VOUT) where the input voltage is low enough to cause the

output voltage to drop 2% from the nominal value.

Product Folder Links: LP38855

LP38855

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

www.ti.com

Electrical Characteristics (continued)

Unless otherwise specified: VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF, CBIAS = 1µF, VEN = VBIAS.

Limits in standard type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C

to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent

the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only.

Symbol Parameter Conditions Min Typ Max Units

ENABLE Pin

VEN = VBIAS - 0.01 -

IEN ENABLE pin Current µA

-19 -40

VEN = 0.0V, VBIAS = 5.5V -30

-13 -51

1.00 1.50

VEN(ON) Enable Voltage Threshold VEN rising until Output = ON 1.25 V

0.90 1.55

VEN falling from VEN(ON) until 50 150

VEN(HYS) Enable Voltage Hysteresis 100 mV

Output = OFF 30 200

tOFF Turn-OFF Delay Time RLOAD × COUT << tOFF - 20 - µs

tON Turn-ON Delay Time RLOAD × COUT << tON - 15 -

AC Parameters

VIN = VOUT +1V, f = 120 Hz - 80 -

PSRR Ripple Rejection for VIN Input dB

(VIN) Voltage VIN = VOUT + 1V, f = 1 kHz - 65 -

VBIAS = VOUT + 3V, f = 120 Hz - 58 -

PSRR Ripple Rejection for VBIAS Voltage dB

(VBIAS)VBIAS = VOUT + 3V, f = 1 kHz - 58 -

Output Noise Density f = 120 Hz - 1 - µV/√Hz

enBW = 10 Hz −100 kHz - 150 -

Output Noise Voltage µVRMS

BW = 300 Hz −300 kHz - 90 -

Thermal Parameters

TSD Thermal Shutdown Junction - 160 -

Temperature °C

TSD(HYS) Thermal Shutdown Hysteresis - 10 -

TO-220-5 - 60 -

Thermal Resistance, Junction to

θJA Ambient(4) DDPAK/TO-263-5 - 60 - °C/W

TO-220-5 - 3 -

Thermal Resistance, Junction to

θJC Case(4) DDPAK/TO-263-5 - 3 -

(4) Device power dissipation must be de-rated based on device power dissipation (TD), ambient temperature (TA), and package junction to

ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not

exceed the maximum operating rating. See the Application Information section for details.

Product Folder Links: LP38855

LP38855

www.ti.com

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

Typical Performance Characteristics

Unless otherwise specified: TJ= 25°C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS =

1 µF Ceramic, VEN = VBIAS.

VBIAS Ground Pin Current (IGND(BIAS)) VBIAS Ground Pin Current (IGND(BIAS))

vs VBIAS vs Temperature

Figure 3. Figure 4.

VIN Ground Pin Current (IGND(IN))

vs Temperature Load Regulation vs Temperature

Figure 5. Figure 6.

Dropout Voltage (VDO) Output Current Limit (ISC)

vs Temperature vs Temperature

Figure 7. Figure 8.

Product Folder Links: LP38855

LP38855

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

www.ti.com

Typical Performance Characteristics (continued)

Unless otherwise specified: TJ= 25°C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS =

1 µF Ceramic, VEN = VBIAS.

VOUT vs Temperature UVLO Thresholds vs Temperature

Figure 9. Figure 10.

Enable Thresholds (VEN) Enable Pull-Down Current (IEN)

vs Temperature vs Temperature

Figure 11. Figure 12.

Enable Pull-Up Resistor (rEN)

vs Temperature VIN Line Transient Response

Figure 13. Figure 14.

Product Folder Links: LP38855

LP38855

www.ti.com

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

Typical Performance Characteristics (continued)

Unless otherwise specified: TJ= 25°C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS =

1 µF Ceramic, VEN = VBIAS.

VIN Line Transient Response VBIAS Line Transient Response

Figure 15. Figure 16.

VBIAS Line Transient Response Load Transient Response, COUT = 10 μF Ceramic

Figure 17. Figure 18.

Load Transient Respose, COUT = 10 μF Ceramic Load Transient Response, COUT = 100 μF Ceramic

Figure 19. Figure 20.

Product Folder Links: LP38855

LP38855

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

www.ti.com

Typical Performance Characteristics (continued)

Unless otherwise specified: TJ= 25°C, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT = 10 mA, CIN = COUT = 10 µF Ceramic, CBIAS =

1 µF Ceramic, VEN = VBIAS.

Load Transient Response, COUT = 100 μF Ceramic Load Transient Response, COUT = 100 μF Tantalum

Figure 21. Figure 22.

Load Transient Response, COUT = 100 μF Tantalum VBIAS PSRR

Figure 23. Figure 24.

VIN PSRR Output Noise

Figure 25. Figure 26.

Product Folder Links: LP38855

LP38855-x.x

GND

OUT

BIAS

Under-Voltage

Lock-Out

Thermal

Shut Down

1.2V

Enable

VREF

0.6V

ILIMIT

rEN

LP38855

www.ti.com

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

Block Diagram

APPLICATION INFORMATION

EXTERNAL CAPACITORS

To assure regulator stability, capacitors are required on the input, output and bias pins as shown in the Typical

Application Circuit.

Output Capacitor

A minimum output capacitance of 10 µF, ceramic, is required for stability. The amount of output capacitance can

be increased without limit. The output capacitor must be located less than 1 cm from the output pin of the IC and

returned to the device ground pin with a clean analog ground.

Only high quality ceramic types such as X5R or X7R should be used, as the Z5U and Y5F types do not provide

sufficient capacitance over temperature.

Tantalum capacitors will also provide stable operation across the entire operating temperature range. However,

the effects of ESR may provide variations in the output voltage during fast load transients. Using the minimum

recommended 10 µF ceramic capacitor at the output will allow unlimited capacitance, Tantalum and/or

Aluminum, to be added in parallel.

Input Capacitor

The input capacitor must be at least 10 µF, but can be increased without limit. It's purpose is to provide a low

source impedance for the regulator input. A ceramic capacitor, X5R or X7R, is recommended.

Tantalum capacitors may also be used at the input pin. There is no specific ESR limitation on the input capacitor

(the lower, the better).

Aluminum electrolytic capacitors can be used, but are not recommended as their ESR increases very quickly at

cold temperatures. They are not recommended for any application where the ambient temperature falls below

0°C.

Product Folder Links: LP38855

LP38855

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

www.ti.com

Bias Capacitor

The capacitor on the bias pin must be at least 1 µF. It can be any good quality capacitor (ceramic is

recommended).

INPUT VOLTAGE

The input voltage (VIN) is the high current external voltage rail that will be regulated down to a lower voltage,

which is applied to the load. The input voltage must be at least VOUT + VDO, and no higher than whatever value is

used for VBIAS.

BIAS VOLTAGE

The bias voltage (VBIAS) is a low current external voltage rail required to bias the control circuitry and provide

gate drive for the N-FET pass transistor. The bias voltage must be in the range of 3.0V to 5.5V to ensure proper

operation of the device.

UNDER VOLTAGE LOCKOUT

The bias voltage is monitored by a circuit which prevents the device from functioning when the bias voltage is

below the Under-Voltage Lock-Out (UVLO) threshold of approximately 2.45V.

As the bias voltage rises above the UVLO threshold the device control circuitry become active. There is

approximately 150 mV of hysteresis built into the UVLO threshold to provide noise immunity.

When the bias voltage is between the UVLO threshold and the Minimum Operating Rating value of 3.0V the

device will be functional, but the operating parameters will not be within the specified limits.

SUPPLY SEQUENCING

There is no requirement for the order that VIN or VBIAS are applied or removed. However, the output voltage

cannot be ensured until both VIN and VBIAS are within the range of specified operating values.

If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be

diode clamped to ground. A Schottky diode is recommend for this diode clamp.

REVERSE VOLTAGE

A reverse voltage condition will exist when the voltage at the output pin is higher than the voltage at the input pin.

Typically this will happen when VIN is abruptly taken low and COUT continues to hold a sufficient charge such that

the input to output voltage becomes reversed.

The NMOS pass element, by design, contains no body diode. This means that, as long as the gate of the pass

element is not driven, there will not be any reverse current flow through the pass element during a reverse

voltage event. The gate of the pass element is not driven when VBIAS is below the UVLO threshold, or the EN pin

is held low.

When VBIAS is above the UVLO threshold, and the EN pin is above the VEN(ON) threshold, the control circuitry is

active and will attempt to regulate the output voltage. Since the input voltage is less than the output voltage the

control circuit will drive the gate of the pass element to the full VBIAS potential when the output voltage begins to

fall. In this condition, reverse current will flow from the output pin to the input pin, limited only by the RDS(ON) of

the pass element and the output to input voltage differential. Discharging an output capacitor up to 1000 μF in

this manner will not damage the device as the current will decay rapidly. However, continuous reverse current

should be avoided.

Product Folder Links: LP38855

'TJ

TJA

'TJ = TJ(MAX) - TA(MAX)

LP38855

www.ti.com

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

ENABLE OPERATION

The Enable pin (EN) provides a mechanism to enable, or disable, the regulator output stage. The Enable pin has

an internal pull-up, through a typical 180 kΩresistor, to VBIAS.

If the Enable pin is actively driven, pulling the Enable pin above the VEN threshold of 1.25V (typical) will turn the

regulator output on, while pulling the Enable pin below the VEN threshold will turn the regulator output off. There

is approximately 100 mV of hysteresis built into the Enable threshold provide noise immunity.

If the Enable function is not needed this pin should be left open, or connected directly to VBIAS. If the Enable pin

is left open, stray capacitance on this pin must be minimized, otherwise the output turn-on will be delayed while

the stray capacitance is charged through the internal resistance (rEN).

POWER DISSIPATION AND HEAT-SINKING

A heat-sink may be required depending on the maximum power dissipation and maximum ambient temperature

of the application. Under all possible conditions, the junction temperature must be within the range specified

under operating conditions.

The total power dissipation of the device is the sum of three different points of dissipation in the device.

The first part is the power that is dissipated in the NMOS pass element, and can be determined with the formula:

PD(PASS) = (VIN - VOUT) × IOUT (1)

The second part is the power that is dissipated in the bias and control circuitry, and can be determined with the

formula:

PD(BIAS) = VBIAS × IGND(BIAS)

where

• IGND(BIAS) is the portion of the operating ground current of the device that is related to VBIAS (2)

The third part is the power that is dissipated in portions of the output stage circuitry, and can be determined with

the formula:

PD(IN) = VIN × IGND(IN)

where

• IGND(IN) is the portion of the operating ground current of the device that is related to VIN (3)

The total power dissipation is then:

PD= PD(PASS) + PD(BIAS) + PD(IN) (4)

The maximum allowable junction temperature rise (ΔTJ) depends on the maximum anticipated ambient

temperature (TA(MAX)) for the application, and the maximum allowable operating junction temperature (TJ(MAX)):

(5)

The maximum allowable value for junction to ambient Thermal Resistance, θJA, can be calculated using the

formula:

(6)

Heat-Sinking the TO-220 Package

The TO-220 package has a θJA rating of 60°C/W, and a θJC rating of 3°C/W. These ratings are for the package

only, no additional heat-sinking, and with no airflow.

The thermal resistance of a TO-220 package can be reduced by attaching it to a heat-sink or a copper plane on

a PC board. If a copper plane is to be used, the values of θJA will be same as shown in next section for

DDPAK/TO-263 package.

Product Folder Links: LP38855

THA d TJA - (TCH + TJC)

LP38855

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

www.ti.com

The heat-sink to be used in the application should have a heat-sink to ambient thermal resistance, θHA:

where

•θJA is the required total thermal resistance from the junction to the ambient air

•θCH is the thermal resistance from the case to the surface of the heat sink

•θJC is the thermal resistance from the junction to the surface of the case (7)

For this equation, θJC is about 3°C/W for a TO-220 package. The value for θCH depends on method of

attachment, insulator, etc. θCH varies between 1.5°C/W to 2.5°C/W. Consult the heat-sink manufacturer

datasheet for details and recommendations.

Heat-Sinking the DDPAK/TO-263 Package

The DDPAK/TO-263 package has a θJA rating of 60°C/W, and a θJC rating of 3°C/W. These ratings are for the

package only, no additional heat-sinking, and with no airflow.

The DDPAK/TO-263 package uses the copper plane on the PCB as a heat-sink. The tab of this package is

soldered to the copper plane for heat-sinking. The graph below shows a curve for the θJA of TO-263 package for

different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area

for heat-sinking.

Figure 27. θJA vs Copper (1 Ounce) Area for the DDPAK/TO-263 package

As shown in Figure 27, increasing the copper area beyond 1 square inch produces very little improvement. The

minimum value for θJA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.

Figure 28 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient

temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C.

Figure 28. Maximum Power Dissipation vs Ambient Temperature for DDPAK/TO-263 Package

Product Folder Links: LP38855

LP38855

www.ti.com

SNVS461D –OCTOBER 2006–REVISED APRIL 2013

REVISION HISTORY

Changes from Revision C (April 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 12

Product Folder Links: LP38855

PACKAGE OPTION ADDENDUM

www.ti.com 23-Dec-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP38855S-0.8/NOPB ACTIVE DDPAK/

TO-263 KTT 5 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP38855S

-0.8

LP38855S-1.2 NRND DDPAK/

TO-263 KTT 5 45 TBD Call TI Call TI -40 to 125 LP38855S

-1.2

LP38855S-1.2/NOPB ACTIVE DDPAK/

TO-263 KTT 5 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP38855S

-1.2

LP38855SX-1.2/NOPB ACTIVE DDPAK/

TO-263 KTT 5 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LP38855S

-1.2

LP38855T-0.8/NOPB ACTIVE TO-220 NDH 5 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP38855T

-0.8

LP38855T-1.2/NOPB ACTIVE TO-220 NDH 5 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP38855T

-1.2

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

PACKAGE OPTION ADDENDUM

www.ti.com 23-Dec-2015

Addendum-Page 2

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP38855SX-1.2/NOPB DDPAK/

TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2015

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LP38855SX-1.2/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2015

Pack Materials-Page 2

MECHANICAL DATA

NDH0005D

www.ti.com

MECHANICAL DATA

KTT0005B

www.ti.com

BOTTOM SIDE OF PACKAGE

TS5B (Rev D)

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

LP38855S-0.8 LP38855S-0.8/NOPB LP38855S-1.2 LP38855S-1.2/NOPB LP38855SX-0.8 LP38855SX-0.8/NOPB

LP38855SX-1.2 LP38855SX-1.2/NOPB LP38855T-0.8 LP38855T-0.8/NOPB LP38855T-1.2 LP38855T-1.2/NOPB