This is information on a product in full production.
January 2017 DocID025635 Rev 8 1/21
SPWF01SA
SPWF01SC
Serial-to-Wi-Fi b/g/n intelligent modules
Datasheet - production data
Features
2.4 GHz IEEE 802.11 b/g/n transceiver
STM32 ARM Cortex-M3, with 64 KB RAM and
512 KB Flash memory
– 1 MB extended Flash available on
SPWF01Sx.1y
Integrated TCP/IP protocol stack
– 8 simultaneous TCP or UDP clients and 1
socket server
– 1 TLS/SSL socket client supporting up to
TLS 1.2, including common encryption
algorithms: AES (128, 256), hash (MD5,
SHA-1, SHA-256) and public key
algorithms (RSA, ECC)
– Web server supporting dynamic web pages
– RESTful API to get and post web content
WEP/WPA/WPA2 personal security
System modes: Station, IBSS, and miniAP
(supporting up to 5 stations)
miniAP easily provisioned (SSID, PWD)
Fast Wi-Fi reassociation after reset
Firmware update via UART and Over The Air
(FOTA); extended Flash on board with
SPWF01Sx.1y
TX power
– 18.3 dBm @ 1 Mbps DSSS
– 13.7 dBm @ 54 Mbps OFDM
RX sensitivity
– -96.0 dBm @ 1 Mbps DSSS
– -74.5 dBm @ 54 Mbps OFDM
16 configurable GPIOs available
UART interface to host system
Advanced low-power modes
– Standby with RTC: 43 µA
– Sleep connected (DTIM=1): 15 mA
– RX traffic: 105 mA typical
– TX traffic: 243 mA typical @ 10 dBm
Simple AT command set host interface through
UART
Small form factor: 26.92 x 15.24 x 2.35 mm
Single voltage supply (3.3 V typical)
Multiple antenna options:
– Integrated antenna (SPWF01SA.xy
versions)
– Integrated u.fl connector (SPWF01SC.xy
versions)
Industrial temperature range: -40 °C to 85 °C
FCC/CE/IC/SRRC certified
RoHS compliant
Surface mount PCB module
Applications
Smart appliances
Industrial control and data acquisition
Home automation and security systems
Wireless sensors
Cable replacement
Medical equipment
Machine-to-machine communication
www.st.com
Contents SPWF01SA, SPWF01SC
2/21 DocID025635 Rev 8
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 General electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Digital interface specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5 Pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 Module reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7 Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.1 RF compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.2 FCC and IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.2.1 Modular approval, FCC and IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.2.2 Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.3 CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.4 SRRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
8.1 Module shield package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
10 Traceability information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
DocID025635 Rev 8 3/21
SPWF01SA, SPWF01SC Description
21
1 Description
The SPWF01SA and the SPWF01SC intelligent Wi-Fi modules represent a plug-and-play
and standalone 802.11 b/g/n solution for easy integration of wireless Internet connectivity
features into existing or new products.
Configured around a single-chip 802.11 transceiver with integrated PA and comprehensive
power management subsystem, and an STM32 microcontroller with an extensive GPIO
suite, the modules also incorporate timing clocks and voltage regulators. Two different
options exist based on the integrated Flash memory. The SPWF01Sx.1y orderable parts
integrate 1.5 MB of Flash, while the SPWF01Sx.2y orderable parts integrate 512 KB of
Flash.
The module is available either configured with an embedded micro 2.45 GHz highly-efficient
ISM band antenna (SPWF01SA), or with an u.fl connector for external antenna connection
(SPWF01SC).
With low power consumption and ultra-compact (2.7 x 1.5 cm) footprint, the modules are
ideal for fixed and mobile wireless applications, as well as challenging battery-operated
applications.
The SPWF01Sx parts are released with an integrated full featured TCP/IP protocol stack
with added web server and additional application service capabilities, such as REST API for
accessing files on servers in the cloud and support for dynamic web pages with CGI/SSI
functions to easily interact with the module and the host processor over the air.
For secure end-to-end communication with the cloud, an SSL/TLS stack is embedded in
every module with no licensing charge. See application note AN4683 for details.
The SW package also includes an AT command layer interface for user-friendly access to
the stack functionalities via the UART serial port. For details, see user manual UM1695.
It is always possible to upgrade the module firmware via UART and Over The Air (FOTA).
Out of the 1 MB extended Flash available on the SPWF01Sx.1y module, 512 KB of the
Flash is dedicated to FW upgrade and the other 512 KB is dedicated to host proprietary
files, organized in a file system image, accessible through the integrated web server.
FOTA is also possible with the SPWF01Sx.2y module, temporarily storing the FW in the
external host Flash memory, if it exists.
ST may update the FW provided with the modules at any time. ST recommends that users
regularly check for documentation and the current FW version available at
www.st.com/wifimodules.
Description SPWF01SA, SPWF01SC
4/21 DocID025635 Rev 8
Figure 1. Block diagram
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DocID025635 Rev 8 5/21
SPWF01SA, SPWF01SC General electrical specifications
21
2 General electrical specifications
Table 1. Absolute maximum ratings
Parameter Test condition/comment Min. Typ. Max. Unit
Voltage supply
-
-0.3
-
4.0 V
Vin for 5 V tolerant pins -0.3 5.5 V
Vin for all other pins -0.3 2.8 V
Storage temperature range -55 105 °C
Table 2. Operating conditions and input power specifications(1)
1. Typical results are at room temperature only.
Parameter Test condition/comment Min. Typ. Max. Unit
Operating temperature range Industrial -40 85 °C
3.3 V
supply
Input supply voltage 3.3 V supply input 3.1 3.3 3.6 V
Standby Both the STM32 and the radio
are in standby power states 43 A
Sleep
The STM32 is in stop power
state and the radio is in sleep
power state
15 mA
Low power state The STM32 is active and the
radio is in sleep power state 26 mA
TX
802.11b
TX power = 0 dBm 236 mA
TX power = 10 dBm 250 mA
TX power = 18 dBm 344 mA
802.11g
TX power = 0 dBm 210 mA
TX power = 10 dBm 243 mA
TX power = 18 dBm 338 mA
RX
802.11b 105 mA
802.11g 105 mA
Digital interface specifications SPWF01SA, SPWF01SC
6/21 DocID025635 Rev 8
3 Digital interface specifications
Table 3. Digital interface specifications, I/O pins
Parameter Test condition/comment Min. Typ. Max. Unit
Inputs
VIH 1.6
-
2.8 V
VIL 0.9 V
Outputs
VOH IOH = 4 mA 2.1 2.5 V
VOL IOL = 4 mA 0.4 V
DocID025635 Rev 8 7/21
SPWF01SA, SPWF01SC RF characteristics
21
4 RF characteristics
Table 4. RF characteristics
Parameter Test condition/comment Min. Typ. Max. Unit
11b, 1 Mbps -96 dBm
RX sensitivity(1)
11b, 2 Mbps -93 dBm
11b, 5.5 Mbps -91 dBm
11b, 11 Mbps -87 dBm
11g, 9 Mbps -89.5 dBm
11g, 18 Mbps -86 dBm
11g, 36 Mbps -80 dBm
11g, 54 Mbps -74.5 dBm
11n, MCS1, 13 Mbps -86.5 dBm
11n, MCS3, 26 Mbps -81.5 dBm
11n, MCS5, 52 Mbps -74 dBm
11n, MCS7, 65 Mbps -71 dBm
Channel-to-channel
de-sensitivity CH1 to 14 11g, 54 Mbps, 10%PER 1 dB
Maximum input signal CH7 11g, 54 Mbps -20 dBm
Adjacent channel rejection
11Mbps 38 dBc
9 Mbps 20 dBc
54 Mbps 4 dBc
MCS1 24 dBc
MCS7 3 dBc
TX output power (1)
11b, 1 Mbps
@ 11b spectral mask
18.3 dBm
11b, 11 Mbps 18.3 dBm
11g, 9 Mbps @ 11g spectral mask 18.3 dBm
11g, 54 Mbps EVM = -27 dB, 4.5% 13.7 dBm
11n, MCS1 @ 11n spectral mask 18.3 dBm
11n, MCS7 EVM = -27 dB 13.5 dBm
On-board antenna gain Average -1.2 dBi
External antenna gain SG901-1066 average
including cable loss 2.8 dBi
1. Output power and sensitivities are measured with a 50 Ω connection at the antenna port.
Pinout description SPWF01SA, SPWF01SC
8/21 DocID025635 Rev 8
5 Pinout description
Table 5. Pinout description
Signal name Type Pin number Main function Alternate
functions(1) Notes
GPIO - general purpose input/output
GPIO[0] I/O 16
General purpose
input/output
Restore to factory
settings(2)
Input pull down and
5V tolerant
GPIO[1] I/O 17 General purpose
input/output PWM Input pull down and
5V tolerant
GPIO[2] I/O 19 General purpose
input/output
Floating and 5V
tolerant
GPIO[3] I/O 1 General purpose
input/output
Input pull down and
5V tolerant
GPIO[6] I/O 22
General purpose
input/output
Wake Up/Sleep
Inhibit(3)
Input pull down and
5V tolerant
GPIO[4] I/O 18 General purpose
input/output
GPIO[5] I/O 20 General purpose
input/output
GPIO[7] I/O 13
General purpose
input/output
STA/Mini AP
switch (4)
GPIO[8] I/O 4 General purpose
input/output ADC
GPIO[9] I/O 7 General purpose
input/output
GPIO[11] I/O 11
GPIO[12] I/O 12 General purpose
input/output
GPIO[15] I/O 21 General purpose
input/output DAC
Monitoring purpose with no alternate function
GPIO[10] I/O 5 Drives LED, Blinks
while running
GPIO[13] I/O 15 Drives LED, Wi-Fi
link up
GPIO[14] I/O 14 LED drive, Power
up
DocID025635 Rev 8 9/21
SPWF01SA, SPWF01SC Pinout description
21
Note: Pin 26 to Pin 30 are reserved and they can be left floating in the final design.
UART pins
RXD1 I 8 UART1 Receive
data input 5V tolerant
TXD1 O 6 UART1 Transmit
data output 5V Tolerant
CTS1_DN I 9 UART1 Clear to
send input Active low, 5V tolerant
RTS1_DP O 10 UART1 Request to
send output Active low, 5V tolerant
Reset
RESETn I 3 Reset input
Active low for 5 ms
with pull up to
2.5VDC. Not 5V
tolerant
Supply pins and paddle
3.3 V 24 Voltage supply Decouple with 10 F
capacitor
Ground 23 Ground
Ground Paddle 25 Ground
Add plenty of ground
vias for thermal
dissipation and ground
return
Boot loader
BOOT0 I 2 Boot loader (5)
1. The activation of ALT function depends upon the firmware version or upon the variable configuration.
2. To perform the factory reset of the variables, pin GPIO0 must be high during powerup.
3. GPIO function running when low power mode variable is enabled.
4. Introduced with the release 3.0 of AT Full stack. To enable the STAToMiniAP switch the GPIO[7] needs to be put low
together with the HW reset.
5. To enable the firmware download, pin BOOT0 needs to be high during power up. RESETn need to be pulled low at least 5
ms to initiate the firmware download sequence.
Table 5. Pinout description (continued)
Signal name Type Pin number Main function Alternate
functions(1) Notes
Pinout description SPWF01SA, SPWF01SC
10/21 DocID025635 Rev 8
Application guidelines
As a general rule, when signals between the I/O pins of the external host processor and the
module are to be connected (e.g. from 2.5 V to 3.3 V), a level translator should be used to
match the voltage of the I/O pins.
Please refer to the data brief for the STEVAL-IDW001V1 evaluation board on st.com, which
includes a schematic diagram illustrating the use of the level translator.
The HOST processor should control the RESETn pin of the module in order to recover from
unexpected behavior using the HW reset.
DocID025635 Rev 8 11/21
SPWF01SA, SPWF01SC Module reflow
21
6 Module reflow
The SPWF01SA and SPWF01SC are surface mount modules with a 6-layer PCB. The
recommended final assembly reflow profiles are indicated below.
The soldering phase must be executed with care: in order to prevent an undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on the IPC/JEDEC J-
STD-020C, July 2004 recommendations.
Table 6. Soldering values
Profile feature PB-free assembly
Average ramp-up rate (TSMAX to TP) 3 °C/sec max
Preheat:
– Temperature min. (Ts min.)
– Temperature max. (Ts max.)
–Time (T
s min. to Ts max) (ts)
150 °C
200 °C
60-100 sec
Critical zone:
Temperature TL
Time TL
217 °C
60-70 sec
Peak temperature (TP)240 + 0 °C
Time within 5 °C of actual peak temperature (TP) 10-20 sec
Ramp-down rate 6 °C/sec
Time from 25 °C to peak temperature 8 minutes max.
Module reflow SPWF01SA, SPWF01SC
12/21 DocID025635 Rev 8
Figure 2. Soldering profile
AM17477v1
DocID025635 Rev 8 13/21
SPWF01SA, SPWF01SC Regulatory compliance
21
7 Regulatory compliance
7.1 RF compliance
The RF certifications obtained are described in Table 7.
Note: The SG901-1066 from Sagrad Inc. is the only approved antenna using the u.fl connector
version.
7.2 FCC and IC
This module has been tested and complies with the FCC part 15 and IC RSS-210
regulations. These limits are designed to provide reasonable protection against harmful
interference in approved installations. This equipment generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions:
1. The device must not cause harmful interference.
and
2. The device must accept any interference received, including interference that may
cause undesired operation.
Modifications or changes to this equipment not expressly approved by the party responsible
for compliance may render void the user's authority to operate this equipment.
7.2.1 Modular approval, FCC and IC
FCC ID: VRA-SG9011203
IC: 7420A-SG9011203
In accordance with FCC part 15, the modules SPWF01SA and SPWF01SC are listed above
as a modular transmitter device.
Table 7. RF certification summary
Comment
FCC ID VRA-SG9011203 On board antenna and external SG901-1066 with connector version
IC ID 7420A-SG9011203 On board antenna and external SG901-1066 with connector version
ETSI Compliant Approved with on board antenna and connector version
Regulatory compliance SPWF01SA, SPWF01SC
14/21 DocID025635 Rev 8
7.2.2 Labeling instructions
When integrating the SPWF01SA and SPWF01SC into the final product, it must be ensured
that the FCC labeling requirements specified below are satisfied. Based on the Public
Notice from FCC, the product into which the ST transmitter module is installed must display
a label referring to the enclosed module. The label should use wording like the following:
Contains Transmitter Module
FCC ID: VRA-SG9011203
IC: 7420A-SG9011203
Any similar wording that expresses the same meaning may also be used.
7.3 CE
This module complies with the following European EMI/EMC and safety directives and
standards:
– ETSI EN 300 238 v1.9.1:2015
– EN 301 489-1 V1.9.2:2011 + EN 301 489-17 V2.2.1:2009
– EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013
– EN 62479:2010
Figure 3. CE certified
7.4 SRRC
The SPWF01Sx.21 module complies with Chinese SRRC certification.
– SRRC CMIIT ID: 2015DJ6514
DocID025635 Rev 8 15/21
SPWF01SA, SPWF01SC Package information
21
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
8.1 Module shield package information
Figure 4. Top view of the module shield
Figure 5. Bottom view of the module
CE Logo
Shield
Board Design Reference
FCC and IC IDs
Model Series Name
Data Matrix
Package information SPWF01SA, SPWF01SC
16/21 DocID025635 Rev 8
Figure 6. Wi-Fi module dimensions
Note: An antenna area of 217 x 520 mils must be free of any ground metalization or traces under
the unit. The area extending away from the antenna should be free from metal on the PCB
and housing to meet expected performance levels. Pin 25 is the required paddle ground and
is not shown in this diagram.
DocID025635 Rev 8 17/21
SPWF01SA, SPWF01SC Package information
21
Figure 7. Wi-Fi module footprint
PCB design requires a detailed review of the center exposed pad. This pad requires good
thermal conductivity. Soldering coverage should be maximized and checked via x-ray for
proper design. There is a trade-off between providing enough soldering for conductivity and
applying too much, which allows the module to “float” on the paddle creating reliability
issues. ST recommends two approaches, a large center via that allows excess solder to
flow down into the host PCB with smaller vias around it, or many smaller vias with just
enough space for the viscosity of the chosen solder/flux to allow some solder to flow into the
smaller vias.
Either of these approaches must result in 60% or more full contact solder coverage on the
paddle after reflow. ST strongly encourages PCB layout teams to work with their EMS
providers to ensure vias and solder paste designs that will result in satisfactory
performance.
Ordering information SPWF01SA, SPWF01SC
18/21 DocID025635 Rev 8
9 Ordering information
Note: Refer to the user manual for a complete list of features and commands available in the Wi-Fi
full stack.
Table 8. Ordering information
Order codes Description
SPWF01SA.11 Wi-Fi module with integrated antenna, 1.5 MB of Flash and Wi-Fi full stack
SPWF01SC.11 Wi-Fi module with integrated u.fl connector, 1.5 MB of Flash and Wi-Fi full stack
SPWF01SA.21 Wi-Fi module with integrated antenna, 512 KB of Flash and Wi-Fi full stack
SPWF01SC.21 Wi-Fi module with integrated u.fl connector 512 KB of Flash and Wi-Fi full stack
DocID025635 Rev 8 19/21
SPWF01SA, SPWF01SC Traceability information
21
10 Traceability information
Each module is univocally identified by the serial number stored in a 2D data matrix laser
marked on the bottom side of the module itself.
The serial number has the following format:
Each module bulk is identified by a bulk ID.
BULK ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
Table 9. Traceability information letter meaning
Letter (s) Meaning
WW Week
YY Year
D Product ID family
FF Production panel coordinate identification
NNN Progressive serial number
Revision history SPWF01SA, SPWF01SC
20/21 DocID025635 Rev 8
11 Revision history
Table 10. Document revision history
Date Revision Changes
05-Dec-2013 1 Initial release.
22-Jan-2014 2 Figure 3 has been modified.
16-Apr-2014 3 Updated with references to modules with reduced Flash
memory.
18-Sep-2014 4 Modified: Figure 1 and Table 3
20-May-2015 5 Modified: Features and Applications
11-Nov-2015 6 Update picture in first page.
16-Mar-2016 7
– Added information regarding SRRC certification in
Features and Section 7: Regulatory compliance.
– Updated module photo on the coverpage and
Figure 1: Block diagram.
– Added information on upgrading the module firmware
in the Features and Description sections.
– Updated the text of Application guidelines on page 9.
– Changed title of Section 8 to Package information.
– Updated image and caption of Figure 6 and Figure 7.
– Minor text changes throughout the document.
18-Jan-2017 8
– Updated Section : Features on page 1 [added
“(supporting up to 5 stations)”].
– Updated Section 7.3: CE on page 14 (replaced “ETSI
EN 300 328 V1.8.1:2012” by “ETSI EN 300 238
v1.9.1:2015”).
– Added Section 10: Traceability information on
page 19.
– Minor modifications throughout document.
–Important note regarding a prior release of this
datasheet: The module photo on the coverpage was
replaced, and modifications to Figure 6 and Figure 7
were implemented for revision 5, released on 20-May-
2015. These changes were erroneously omitted from
the change history for that revision. Please note that
these changes were effective from revision 5, and
have remained unchanged in all subsequent revisions
up to the date of this revision.
DocID025635 Rev 8 21/21
SPWF01SA, SPWF01SC
21
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