1www.semtech.com
PROTECTION PRODUCTS
SM05 through SM36
TVS Diode Array
Description Features
Circuit Diagram Schematic & PIN Configuration
Revision 07/12/04
The SM series of transient voltage suppressors (TVS)
are designed to protect components which are
connected to data and transmission lines from voltage
surges caused by electrostatic discharge (ESD),
electrical fast transients (EFT), and lightning.
TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The dual-junction common-anode design
allows the user to protect one bidirectional data line or
two unidirectional lines. The low profile SOT23
package allows flexibility in the design of “crowded”
circuit boards.
The SM series will meet the surge requirements of IEC
61000-4-2 (Formerly IEC 801-2), Level 4, “Human
Body Model” for air and contact discharge.
Applications
Mechanical Characteristics
Cellular Handsets and Accessories
Portable Electronics
Industrial Controls
Set-Top Box
Servers, Notebook, and Desktop PC
300 watts peak pulse power (tp = 8/20µs)
Transient protection for data & power lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Protects one bidirectional line or two unidirectional
lines
Working Voltages: 5V, 12V, 15V, 24 and 36V
Low clamping voltage
Solid-state silicon avalanche technology
JEDEC SOT23 package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
Packaging : Tape and Reel per EIA 481
SOT23 (Top View)
22004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
SM05 through SM36
Absolute Maximum Rating
Electrical Characteristics
50MS
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V
MWR
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C
I
PP
,A1=
t
p
sµ02/8=
8.9V
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PP
t
p
sµ02/8=71A
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R
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kp
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521+ot55-C°
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GTS
051+ot55-C°
21MS
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21V
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R
V
MWR
C°52=T,V21=1Aµ
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C
I
PP
,A1=
t
p
sµ02/8=
91V
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PP
t
p
sµ02/8=21A
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V
R
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021Fp
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32004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SM05 through SM36
Electrical Characteristics (Continued)
51MS
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51V
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RB
I
t
Am1=7.61V
tnerruCegakaeLesreveRI
R
V
MWR
C°52=T,V51=1Aµ
egatloVgnipmalCV
C
I
PP
t,A1=
p
sµ02/8=42V
tnerruCesluPkaePI
PP
t
p
sµ02/8=01A
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j
2ot1niP
V
R
zHM1=f,V0=
57Fp
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3ot2dna3ot1niP
V
R
zHM1=f,V0=
001Fp
42MS
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MWR
42V
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RB
I
t
Am1=7.62V
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R
V
MWR
C°52=T,V42=1Aµ
egatloVgnipmalCV
C
I
PP
t,A1=
p
sµ02/8=34V
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PP
t
p
sµ02/8=5A
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j
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V
R
zHM1=f,V0=
05Fp
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V
R
zHM1=f,V0=
06Fp
63MS
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MWR
63V
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I
t
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R
V
MWR
C°52=T,V63=1Aµ
egatloVgnipmalCV
C
I
PP
t,A1=
p
sµ02/8=06V
tnerruCesluPkaePI
PP
t
p
sµ02/8=4A
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j
2ot1niP
V
R
zHM1=f,V0=
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R
zHM1=f,V0=
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42004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
SM05 through SM36
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% of Rated Power or IPP
Power Derating Curve
Pulse Waveform
0
10
20
30
40
50
60
70
80
90
100
110
0 5 10 15 20 25 30
Time (µs)
Percent of IPP
e-t
td = IPP/2
Waveform
Parameters:
tr = 8µs
td = 20µs
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15.748 2 2
25184 4 4
35.222166 8
403618 8 51
0.01
0.1
1
10
0.1 1 10 100 1000
Pulse Duration - tp (µs)
Peak Pulse Power - Ppk (kW)
IEC 61000-4-2 Discharge Parameters
ESD Pulse Waveform (Per IEC 61000-4-2)
52004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SM05 through SM36
Applications Information
Device Schematic & Pin Configuration
Device Connection Options
The SM series is designed to protect one bidirectional
or two unidirectional data or I/O lines operating at 5 to
36 volts. Connection options are as follows:
zz
zz
zBidirectional: Pin 1 is connected to the data line
and pin 2 is connected to ground (Since the device
is symmetrical, these connections may be re-
versed). The ground connection should be made
directly to a ground plane. The path length should
be kept as short as possible to minimize parasitic
inductance. Pin 3 is not connected.
zz
zz
zUnidirectional: Data lines are connected to pin 1
and pin 2. Pin 3 is connected to ground. For best
results, this pin should be connected directly to a
ground plane on the board. The path length should
be kept as short as possible to minimize parasitic
inductance.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):
zPlace the TVS near the input terminals or connec-
tors to restrict transient coupling.
zMinimize the path length between the TVS and the
protected line.
zMinimize all conductive loops including power and
ground loops.
zThe ESD transient return path to ground should be
kept as short as possible.
zNever run critical signals near board edges.
zUse ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
RS-232 Transceiver Protection Example
62004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
SM05 through SM36
Land Pattern - SOT23
Outline Drawing - SOT23
e
e1
D
E1 E
bxN
12
3
A1
A2
A3X
A
bbb C A B
B
C
SEATING PLANE
aaa C
1.401.20
N3 3
0-8°0°8°0° -
.055.047
bbb .008 0.20
aaa .004 0.10
INCHES
.114
L1
E
D
b
e
c
.012
.003
.082
A1
DIM
A
MIN
.000
.035
0.51
0.18
2.64
0.30
0.08
2.10
.022
-
.075
-
.093
.020
.007
.104
(0.55)
1.90 BSC
-
-
2.37
2.90
MILLIMETERS
MAX
0.10
1.12
MIN
DIMENSIONS
0.01
MAXNOM
-
-.004
.044
NOM
0.89
-
-
3.042.80.110 .120
e1 .037 0.95 BSC
L.015 .020 0.500.40.024 0.60
A2 .035 .037 0.950.88.040 1.02
E1 .051 1.30
SEE DETAIL A
SIDE VIEW
DATUMS AND TO BE DETERMINED AT DATUM PLANE
-A- -B-
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
OR GATE BURRS.
DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
3.
1.
-H-
H
DETAIL A
0.25
C
SEATING
PLANE
GAUGE
PLANE 0c
L
L1
REFERENCE IPC-SM-782A.
2.
E .037 0.95
Y
Y
G
ZC
E
X
E1
E1 .075 1.90
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
DIM
Y
Z
G
X
C
MILLIMETERSINCHES
(2.20)
.055
.141
.039
.031
(.087)
1.40
3.60
1.00
0.80
DIMENSIONS
72004 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SM05 through SM36
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Ordering Information
rebmuNtraPhsiniFdaeL repytQ
leeR eziSleeR
CT.50MSbPnS000,3hcnI7
CT.21MSbPnS000,3hcnI7
CT.51MSbPnS000,3hcnI7
CT.42MSbPnS000,3hcnI7
CT.63MSbPnS000,3hcnI7
TCT.50MSeerFbP000,3hcnI7
TCT.21MSeerFbP000,3hcnI7
TCT.51MSeerFbP000,3hcnI7
TCT.42MSeerFbP000,3hcnI7
TCT.63MSeerFbP000,3hcnI7
Marking Codes
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edoC
50MS50M
21MS21M
51MS51M
42MS42M
63MS63M