SDLS055A – DECEMBER 1972 – REVISED MAY 2007

(1) SN54S153, SN74153, and SN74S153 are obsolete.

PACKAGE OPTION ADDENDUM

www.ti.com 25-Sep-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

Op Temp (°C) Device Marking

7601101FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601101FA

JM38510/07902BEA OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125

JM38510/07902BFA OBSOLETE CFP W 16 TBD Call TI Call TI -55 to 125

JM38510/30902B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

JM38510/30902BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/

M38510/30902B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/

SN74153N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70

SN74LS153D ACTIVE SOIC D 16 40 Green (RoHS

SN74LS153DRE4 ACTIVE SOIC D 16 2500 Green (RoHS

PACKAGE OPTION ADDENDUM

www.ti.com 25-Sep-2013

Addendum-Page 2

SN74LS153J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70

SN74LS153N ACTIVE PDIP N 16 25 Pb-Free

SN74LS153NSRE4 ACTIVE SO NS 16 2000 Green (RoHS

SNJ54S153J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

PACKAGE OPTION ADDENDUM

www.ti.com 25-Sep-2013

Addendum-Page 3

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

NOTE: Qualified Version Definitions:

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service