1NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
V-Chip Memory Back-Up Capacitors NEXC Series
NIC P/N
Capacitance
Value (F)
Discharge
Working
Voltage
(VDC)
Holding
Voltage
(VDC min.)
Max. Current
@ 30 minutes
(mA)
Max. ESR
@ 1KHz
(Ω)
NEXC104Z3.5V10.5X5.5TRF 0.1 3.5 - 0.090 50
NEXC224Z3.5V10.5X5.5TRF 0.22 3.5 - 0.200 25
NEXC474Z3.5V10.5X8.5TRF 0.47 3.5 - 0.420 25
NEXC473Z5.5V10.5X5.5TRF 0.047 5.5 4.2 0.071 50
NEXC104Z5.5V10.5X5.5TRF 0.1 5.5 4.2 0.150 25
NEXC224Z5.5V10.5X8.5TRF 0.22 5,5 4.2 0.330 25
NEXC474Z5.5V16X9.5TRF 0.47 5.5 4.2 0.710 13
NEXC105Z5.5V21X10.5TRF 1.0 5.5 4.2 1.500 7
Rated Voltage Range 3.5 & 5.5VDC
Rated Capacitance Range 0.047F ~ 1.0F (47,000µF ~ 1,000,000µF)
Operating Temp. Range -25°C ~ +70°C
Capacitance Tolerance +80%/-20% (Z)
Load Life Test
+70°C 1,000 hours
∆ Capacitance Change Less than ±30% of initial measured value
Maximum ESR Less than 200% of the specied maximum value
Current at 30 minutes Less than 200% of the specied maximum value
Temperature Cycling
(5 cycles, -25 ~ +70°C
∆ Capacitance Change Within +80%/-20% of specied value
Maximum ESR Less than specied maximum value
Current at 30 minutes Less than specied maximum value
Humidity Resistance
(240 hours @ 40°C/90% RH)
∆ Capacitance Change Less than ±20% of initial measured value
Maximum ESR Less than 120% of the specied maximum value
Current at 30 minutes Less than 120% of the specied maximum value
Case Size Dφ ± 0.5 L max. A/B ±0.2 I W P
10.5 x 5.5 10.5 5.5 10.8 3.6 ±0.5 1.2 5.0
10.5 x 8.5 10.5 8.5 10.8 3.6 ±0.5 1.2 5.0
16 x 9.5 16.0 9.5 16.3 6.8 ±1.0 1.2 5.0
21 x 10.5 21.0 10.5 21.6 7.0 ±1.0 1.4 10.0
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS DEVICES
• SURFACE MOUNTABLE V-CHIP STYLE
• LEAD-FREE FINISH
CASE DIMENSIONS (mm)
STANDARD VALUES AND SPECIFICATIONS
CHARACTERISTICS
+ -
0.3mm max.
Dφw
P
B
A
I
L
I
I
*For high temperature +85°C,
high temperature reow parts
see the NEXCW series
PRECAUTIONS
WASHING is NOT RECOMMENDED. Additional guidelines and precautions
can be found at https://www.niccomp.com/resource/les/aluminum/AlumApplInfoCautions.pdf
If in doubt or uncertainty, please review your specic application - process details with NIC’s technical
support personnel: tpmg@niccomp.com
SUPER CAPACITOR
APPLICATIONS GUIDE
2NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
Case
Diameter R S T
10.5 5.0 4.6 2.5
16.0 5.0 10.0 2.5
21.0 10.0 10.5 3.5
LAND PATTERN DIMENSIONS (mm)
T
R
SS
COMPONENT OUTLINE
STANDARD RECOMMENDED REFLOW PROFILE
Peak Temperature
(235°C for 10 sec.)
50
100
150
200
250
Time
Temperature - Deg. C
Pre-heat
160°C 120 sec. max.
25
0
Cool Down
Time above 200°C
30 sec. max.
V-Chip Memory Back-Up Capacitors NEXC Series
1. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.
2. 2x reow process maximum. Capacitor should be allowed to return to room temperature before second reow process.
3NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
V-Chip Memory Back-Up Capacitors NEXC Series
CARRIER TAPE DIMENSIONS (mm)
Case Size A B D E F G P P1T1T2W Quantity/Reel
10.5 x 5.5 11.4 13.0 1.55 1.75 11.5 - 4.0 16.0 0.4 6.0 24.0 1,000
10.5 x 8.5 11.4 13.0 1.55 1.75 11.5 - 4.0 16.0 0.4 8.4 24.0 500
16 x 9.5 18.0 20.0 1.55 1.75 14.2 28.4 4.0 24.0 0.5 10.0 32.0 200
21 x 10.5 23.0 25.0 1.55 1.75 20.2 40.4 4.0 32.0 0.5 12.0 44.0 150
Case Size A ± 2.0 B ± 1.0 C ± 0.5 D ± 0.8 E ± 0.5 W t
10.5 x 5.5 380 80.0 13.0 21.0 2.0 25.5 3.0
10.5 x 8.5 380 100.0 13.0 21.0 2.0 25.5 2.8
16 x 9.5 330 100.0 13.0 21.0 2.0 33.5 2.8
21 x 10.5 370 100.0 13.0 21.0 2.0 45.5 2.8
AB
CE
W
t
W
+
1.5∅ +0.1/- 1.75 ±
A
B
E
F
D
P1
PT1
T2
-
Feeding
REEL DIMENSIONS (mm)