432703055641 - Ferroxcube - Product.Network

SMD Beads and Chokes Introduction

1.0 INTRODUCTION

To support designers and manufactu-

rers of electronic circuitry, FERROX-

CUBE manufactures a comprehensive

line of ferrite EMI-suppression products

for use on circuit boards, through-hole

as well as surface-mountable.

The demand for SMD-suppression

components is still growing. Therefore

FERROXCUBE has focused its effort

and expertise to develop new types and

sizes through a continuously optimized

design process to complete our SMD

selection:

• Low profiled SMD-bead for flat

designs

• SMD-Current Compensated

Chokes

• SMD-Wide Band Chokes

• Gapped SMD-bead for Power

inductor

Our recognized know-how and staff of

application engineers are the basis of

the technical support, which is entirely

at your disposal for your comments and

inquiries.

Well controlled manufacturing proces-

ses, automated production lines and

measuring equipment and a long expe-

rience in ferrites make FERROXCUBE a

flexible, capable and reliable partner,

able to advise and provide also custom-

designed products, either completely

new or similar to existing types.

FERROXCUBE offers smart solutions

to comply with the more and more

severe EMC norms and requirements:

our new SMD-components are suitable

to prevent generated interference and

to suppress incoming noise signals and

parasitic oscillations.

2.0 EMI INTERFERENCE

SUPPRESSION AND EMC

ELECTROMAGNETIC

COMPATIBILITY

With the ever increasing intensive use of

electronic equipment Electromagnetic

Compatibility (EMC) has become an

important issue. Since 1928 laws specify

limits of the level of interference caused

by equipment (EME; Electromagnetic

Emission) and also the sensitivity of

equipment to incoming interference

(EMS; Electromagnetic Susceptibility).

Limiting curves are defined by interna-

tional organizations and national agen-

cies such as CISPR, FCC in the USA, the

VDE in Germany and VCCI in Japan.

Since density of equipment increases,

laws will become more stringent in the

near future. EMC principles are explai-

ned in figure 1.

During the design phase, problems with

interference can be avoided to some

extent. Often additional suppression

components such as capacitors and

inductors will be necessary to meet the

required levels. Inductive components

are very effective in blocking interfering

signals, especially at high frequencies.

Capacitors are used as shunt impedance

(ZP) for the unwanted signal.

Unfortunately for high frequencies, most

capacitors do not have the low impedan-

ce one might except because of parasitic

inductance or resistance (Fig. 2).

Inductors (ZFXC) are used in series with

the load impedance (ZL). Most inducti-

ve interference suppression compo-

nents (choke, bead) are based upon a

ferrite core.

Figure 1. Principles of EMC

SMD Beads and Chokes Introduction

Ferrite inductors provide low impedan-

ce for the wanted signal, but high impe-

dance for the interfering, unwanted sig-

nal (noise).

The effectiveness of noise suppression

is found by comparing the situation

without and with ferrite inductor (see

figure 3.A measure for the suppressors

effectiveness is the insertion loss (atte-

nuation), which is defined as the ratio of

noise voltages (Ula / Ulb) across the

load impedance ZL without and with

inductor Zfxc:

Insertion loss is given by:

The parameter to characterize the

inductor performance, independent of a

circuit, is its impedance as a function of

frequency (Zfxc = f (Freq)).

Figure 2. Basic suppression circuits

Figure 3. Interference basic circuit with inductance

20 x log (Ula / Ulb) = 20 x log (1 + (Zfxc / ((Zi + (ZL)) in [dB]

SMD Beads and Chokes Material Characteristics

Symbol Conditions Value / grade Unit

3S1 4S2

µ≤10 KHz 0.1 mT 25ºC 4000 ± 20% 850 ± 20% -

B 10 KHz 250 A / m 25ºC ~350 ~270 mT

10 KHz 250 A / m 100ºC ~180 ~180 mT

|Z| 1 MHz 25ºC ≥30 - Ω

10 MHz 25ºC ≥60 - Ω

30 MHz - ≥50 Ω

300 MHz - ≥90 Ω

ρDC 25ºC ~1~105Ωm

Tc ≥125 ≥125 ºC

DENSITY ~4900 ~5000 Kg/m3

3.0 MATERIAL CHARACTERISTICS

• 3S1 and 4S2

• 3S4 and 4B1

Table 1. 3S1 and 4S2 characteristics

Table 2. 3S4 and 4B1 characteristics

Symbol Conditions Value / grade Unit

3S4 4B1

µ≤10 KHz 0.1 mT 25ºC 1700 ± 20% 250 ± 20% -

B 10 KHz 250 A / m 25ºC ~320 ~310 mT

10 KHz 250 A / m 100ºC ~170 ~260 mT

tan δ/ µi 1 MHz 0.1 mT 25ºC - ≤90 106-

3 MHz 0.1 mT 25ºC - ≤300 106-

|Z| 3 MHz ≥25 - Ω

30 MHz ≥60 - Ω

100 MHz ≥80 - Ω

300 MHz ≥90 - Ω

ρDC 25ºC ~10^3 ~105Ωm

Tc ≥110 ≥250 ºC

DENSITY ~4800 ~4600 Kg/m3

SMD Beads and Chokes Material Characteristics

Symbol Conditions Value / grade Unit

3C96 4S3

µ≤10 KHz 0.1 mT 25ºC 2000 ± 20% 250 ± 20% -

B 10 KHz 250 A / m 25ºC ~500 ~310 mT

10 KHz 250 A / m 100ºC ~440 ~260 mT

tan δ/ ºi 1 MHz 0.1 mT 25ºC - ≤90 106-

3 MHz 0.1 mT 25ºC - ≤300 106-

|Z| 30 MHz - ≥10 Ω

50 MHz - ≥40 Ω

200 MHz - ≥200 Ω

500 MHz - ≥250 Ω

ρDC 25ºC ~5~105Ωm

Tc ≥240 ≥250 ºC

DENSITY ~4800 ~4600 Kg/m3

• 3C96 and 4S3

• 3S5 and 4S60

Table 3. 3C96 and 4S3 characteristics

Table 4. 3S5 and 4S60 characteristics

Symbol Conditions Value / grade Unit

3S5 4S60

µ≤10 KHz 0.1 mT 25ºC 3800 ± 20% 2000 ± 20% -

B 10 KHz 250 A / m 25ºC ~545 ~260 mT

10 KHz 250 A / m 100ºC ~435 ~85 mT

Q factor 0.1 MHz - 25ºC - 40 -

|Z| 1 MHz ≥20 - Ω

10 MHz ≥40 - Ω

ρDC 25ºC ~10 ~105Ωm

Tc ≥255 ≥100 ºC

DENSITY ~4800 4700 - 5100 Kg/m3

SMD Beads General, Product and Type Specification

4.0 CHIP BEADS FOR

INTERFERENCE SUPPRESSION

Ferroxcube ferrite beads are well

known to suppress unwanted interfe-

rence.They are supplied as:

• Suppression bead for shifting on a

wire

• Bead-on-wire for through-hole

mounting on a PCB

In response to market demands for

smaller lighter and more integrated

electronic devices FERROXCUBE

added a series of SMD-type chip beads

to the bead families. The ferrite chip

bead EMI-suppressor provide a power-

ful means of EMI / RFI attenuation for

electronic equipment. Four compact

sizes are standardized and available in

suppression material grades 3S1, 4S2,

4S3, 3S5 and 4S60 according to impe-

dance/frequency requirements at each

application.

4.1 PRODUCT APPLICATION

Chip beads have the sample application

area as beads-on-wire, but in addition

they offer the full advantages of SMD

technology like economical mounting,

high packing density of components,

reliable soldering etc. Applications for

these components can be found in e.g.:

• Office automation equipment

• Electronic data processing equipment

• Telecommunication

• Automotive

• Consumer electronic products

(audio / video)

• Domestic appliances

4.2.2 SHAPE AND DIMENSIONS

4.2 PRODUCT SPECIFICATION

4.2.1 GENERAL SPECIFICATION

Chip beads are available in four stan-

dard sizes and five suppression material

grades. A chip bead is made of a ferrite

tube with a rectangular cross section

and a fead through flat tinned copper

wire, which is bending around the edges

and forms the terminals of the compo-

nent. This design offers many superior

mechanical and electrical features.

FEATURES:

• Low magnetic leak inductance due to

magnetic closed circuit

• Resistant to mechanical shocks and

pressure

• Excellent solder ability (reflow solde-

ring, flow soldering, iron soldering)

• Terminals are highly resistant to pull

forces

• Low tolerances of mechanical dimen-

sions enable automatic mounting

APPLICATIONS:

• EMI-suppression

• Decoupling

• Damping parasitic oscillations

APPLICABLE MATERIALS:

• 3S5 for frequencies up to 30 MHz

• 3S1 for frequencies up to 100 MHz

• 4S60 for frequencies up to 300 MHz

• 4S2 for frequencies up to 1000 MHz

• 4S3 for frequencies up to 1200 MHz

TYPE DESCRIPTION:

e.g. BDS3/1.8/5.3-3S1-Z

(1)(2) (3) (4) (5) (6)

(1) Product type

(BDS = Bead for Surface mounting)

(2) Width (in mm)

(3) Height (in mm)

(4) Length (in mm)

(5) Material grade (e.g. 3S1)

(6) -Z lead-free version*

*Note: Not lead-free old version avai-

lable depending on stock.All new codes

are leadfree (not -Z included on type

description)

ORDERING CODE (12 NC):

e.g. 433003036301

The first 11 digits of the 12NC are suffi-

cient to order the desired chip bead.The

type description is additional information.

Figure 4. Chip bead dimensions (in millimeters)

BDS3/1.8/5.3 BDS3/3/4.6

BDS3/3/8.9 BDS4.6/3/8.9

SMD Beads General, Product and Type Specification

4.2.3 ELECTRICAL

CHARACTERISTICS

IMPEDANCE [Ω] AT FREQUENCY [MHz] Mass

TYPE 1 3 10 25 30 100 300 700 (g)

BDS3/1.8/5.3-3S1 - - 28 33 - 25 - - ~0.15

BDS3/1.8/5.3-4S2 - - - 25 - 38 45 - ~0.3

BDS3/3/4.6-3S1 - 25 45 35 - - - - ~0.15

BDS3/3/4.6-4S2 - - - 30 - 50 55 - ~0.3

BDS3/3/4.6-3S5 15 - 35 - 30 - - - ~0.15

BDS3/3/4.6-4S60 - - 25 - 35 38 - - ~0.3

BDS3/3/4.6-4S3 - - - - 47 66 70 ~0.3

BDS3/3/8.9-3S1 - 55 80 55 - - - - ~0.5

BDS3/3/8.9-4S2 - - - 65 - 100 110 - ~0.5

BDS4.6/3/8.9-4S2 - - - 65 - 100 110 - ~0.5

Maximum Vdc DC resistance Isat* Imax (A)

TYPE Volts ( mΩ) mA 25º 125º

BDS3/1.8/5.3-3S1 60 < 0.6 ~300 10 8.5

BDS3/1.8/5.3-4S2 60 < 0.6 ~500 10 8.5

BDS3/3/4.6-3S1 60 < 0.6 ~300 10 8.5

BDS3/3/4.6-4S2 60 < 0.6 ~1000 10 8.5

BDS3/3/4.6-3S5 60 < 0.6 ~1500 10 8.5

BDS3/3/4.6-4S60 60 < 0.6 ~500 10 8.5

BDS3/3/4.6-4S3 60 < 0.6 ~500 10 8.5

BDS3/3/8.9-3S1 80 < 1.0 ~300 10 8.5

BDS3/3/8.9-4S2 80 < 1.0 ~1000 10 8.5

BDS4.6/3/8.9-4S2 80 < 1.0 ~1000 10 8.5

Table 5. Chip bead Z characteristics*

Table 6. Chip bead electrical characteristics*

*Note: Typical impedance values measured at

25ºC with Agilent-4191A impedance analyzer.

|Z|min is -20% typical specified.

*Note: Isat is defined with DC bias value at

which Z specification decreases around 50%.

SMD Beads and Chokes General, Product and Type Specification

4.2.4 PACKAGING AND

ORDERING CODES

The chip beads are delivered taped and

reeled, ready for use in automatic

mounting machines. The packaging is

according to IEC 286-A and EIA 481-A

TYPE PACKING QUANTITY ORDERING CODE RoHS

[PCS / REEL] [12 NC] complaint

BDS3/1.8/5.3-3S1-Z 3000 43300305573_ yes

BDS3/1.8/5.3-4S2-Z 3000 43300305566_ yes

BDS3/3/4.6-3S5 3000 43300307237_ yes

BDS3/3/4.6-4S60 3000 43300307238- yes

BDS3/3/4.6-4S3 3000 43300307239_ yes

BDS3/3/4.6-3S1-CZ 3000 43300305561_ yes

BDS3/3/4.6-4S2-Z 3000 43300305550_ yes

BDS3/3/8.9-3S1-CZ 2800 43300305564_ yes

BDS3/3/8.9-4S2-Z 2800 43300305547_ yes

BDS4.6/3/8.9-4S2-Z 2400 43300305551_ yes

BDS3/1.8/5.3-3S1 3000 43300303685_ no*

BDS3/1.8/5.3-4S2 3000 43300303682_ no*

BDS3/3/4.6-4S2 3000 43300303629_ no*

BDS3/3/8.9-4S2 2800 43300303630_ no*

BDS4.6/3/8.9-4S2 2400 43300303652_ no* Table 7. Chip bead packaging quantities and orde-

ring code

* Check disponibility. Upon request

SMD Beads and Chokes General, Product and Type Specification

SIZE DIMENSIONS (mm)

BDS3/1.8/5.3 BDS3/3/4.6 BDS3/3/8.9 BDS4.6/3/8.9

A0 3.25 ± 0.1 3.45 ± 0.1 3.45 ± 0.1 3.25 ± 0.1

B0 5.85 ± 0.1 5.1 ± 0.1 9.4 ± 0.1 9.4 ± 0.1

K0 2.0 ± 0.1 3.1 ± 0.1 3.1 ± 0.1 3.1 ± 0.1

T 0.3 ± 0.05 0.25 ± 0.05 0.35 ± 0.1 0.3 ± 0.05

W 12.0 ± 0.3 12.0 ± 0.3 16.0 ± 0.3 16.0 ± 0.3

E 1.75 ± 0.1 1.75 ± 0.1 1.75 ± 0.3 1.75 ± 0.1

F 5.5 ± 0.05 5.5 ± 0.05 7.5 ± 0.1 7.5 ± 0.05

D0 1.5 + 0.1 1.5 + 0.1 1.5 ± 0.1 1.5 + 0.1

D1 > 1.5 > 1.5 1.5 + 0.1 > 1.5

P0 4.0 ± 0.1 4.0 ± 0.1 4.0 ± 0.1 4.0 ± 0.1

P1 8.0 ± 0.1 8.0 ± 0.1 8.0 ± 0.1 8.0 ± 0.1

P2 2.0 ± 0.1 2.0 ± 0.05 2.0 ± 0.1 2.0 ± 0.1

Table 8. Physical dimensions of blister tape (in

millimeters)

Figure 6.Tape leader and trailer*

Note*: trailer contains 75 empty compartments

minimum (secured with tape)

Leader: length of leader is 500 mm minimum and

covered with covertape

4.2.5 BLISTER TAPE

AND REEL DIMENSIONS

Figure 5. Blister tape

SMD Beads and Chokes General, Product and Type Specification

SIZE DIMENSIONS (mm)

A N W1 W2

12 330 100 ± 0.5 12.4 ≤16.4

16 330 100 ± 0.5 16.4 ≤20.4

Table 9. Physical dimensions of reel (in millime-

ters)

SHAPE Reflow soldering Wave soldering

ABCDABCDE

BDS3/3/8.9 7.0 10.8 1.9 3.3 6.0 12.2 3.1 3.0 2.5

BDS3/3/4.6 2.8 6.4 1.8 3.3 2.0 6.4 2.2 3.0 0.8

BD4.6/3/8.9 7.0 10.8 1.9 3.3 6.0 12.2 3.1 3.0 2.5

BDS3/1.8/5.3 2.8 7.2 2.2 3.3 2.0 7.2 2.6 3.0 0.8

Table 10. Dimensions of solder lands (in millime-

ters)

For recommended temperature/time profiles see

8.0 soldering curves

Figure 8a. Solder lands reflow soldering Figure 8b. Solder lands wave soldering

Figure 7. Reel dimensions (in millimeters)

4.2.6 RECOMMENDED

SOLDER LANDS

SMD Beads and Chokes Impedance Curves

Figure 9. Z graph BDS3/1.8/5.3-3S1 and

BDS3/1.8/5.3-4S2

Figure 10. Z graph BDS3/3/4.6 in 3S1, 4S2, 3S5,

4S60 and 4S3 materials

Figure 11. Z graph BDS3/3/8.9-3S1 and

BDS3/3/8.9-4S2

Z (ohms)Z (ohms)

Z (ohms)

4.2.7 TYPICAL

IMPEDANCE CURVES

BDS3/1.8/5.3

SMD Beads and Chokes Impedance Curves

Figure 12. Impedance vs. frequency for

BDS3/1.8/5.3-3S1 under DC-premagnetization

Figure 13. Impedance vs. frequency for

BDS3/1.8/5.3-4S2 under DC-premagnetization

Figure 14. Impedance vs. frequency for

BDS3/3/4.6-3S1 under DC-premagnetization

Z (ohms)Z (ohms)

Z (ohms)

SMD Beads Impedance Curves

Figure 15. Impedance vs. frequency for

BDS3/3/4.6-4S2 under DC-premagnetization

Figure 16. Impedance vs. frequency for

BDS3/3/4.6-4S60 under DC-premagnetization

Figure 17. Impedance vs. frequency for

BDS3/3/4.6-3S5 under DC-premagnetization

Z (ohms)Z (ohms)

Z (ohms)

BDS3/3/4.6-4S60

BDS3/3/4.6-3S5

SMD Beads Impedance Curves

Figure 18. Impedance vs. frequency for

BDS3/3/4.6-4S3 under DC-premagnetization

Figure 19. Impedance vs. frequency for

BDS3/3/8.9-3S1 under DC-premagnetization

Figure 20. Impedance vs. frequency for

BDS3/3/8.9-4S2 under DC-premagnetization

Z (ohms)

BDS3/3/4.6-4S3

SMD Beads Impedance Curves

Figure 21. Impedance vs. frequency for

BDS4.6/3/8.9-4S2 under DC-premagnetization

Z (ohms)

SMD Beads Damping Curves

Figure 22.Attenuation vs. frequency for

BDS3/1.8/5.3-3S1 under DC-premagnetization

Figure 23.Attenuation vs. frequency for

BDS3/1.8/5.3-4S2 under DC-premagnetization

Figure 24.Attenuation vs. frequency for

BDS3/3/4.6-3S1 under DC-premagnetization

IL (dB)IL (dB)

IL (dB)

4.2.7 TYPICAL

DAMPING CURVES

SMD Beads Damping Curves

Figure 25.Attenuation vs. frequency for

BDS3/3/4.6-4S2 under DC-premagnetization

Figure 26.Attenuation vs. frequency for

BDS3/3/4.6-4S60 under DC-premagnetization

Figure 27.Attenuation vs. frequency for

BDS3/3/4.6-3S5 under DC-premagnetization

IL (dB)IL (dB)

IL (dB)

SMD Beads Damping Curves

Figure 28.Attenuation vs. frequency for

BDS3/3/4.6-4S3 under DC-premagnetization

Figure 29.Attenuation vs. frequency for

BDS3/3/8.9-3S1 under DC-premagnetization

Figure 30.Attenuation vs. frequency for

BDS3/3/8.9-4S2 under DC-premagnetization

IL (dB)IL (dB)

IL (dB)

SMD Beads Damping Curves

Fig 31.Attenuation vs. frequency for

BDS4.6/3/8.9-4S2 under DC-premagnetization

IL (dB)

SMD Common Mode Chokes General, Product and Type Specification

5.0 OPERATING PRINCIPLE OF

SMD COMMON MODE CHOKES

Interference propagating via supply or

signal lines can be suppressed by placing

a high impedance in series. This can be

provided by a ferrite inductor. However,

saturation by the supply current can be

a problem. Remedies are a low

permeability material or a gapped /

open magnetic circuit.

The disadvantage is the large number of

turns required to achieve the required

inductance, leading to high copper los-

ses. With standard suppression

methods in a signal path, the wanted sig-

nal is often suppressed along with the

interference, and in many modern appli-

cations (EDP for instance) this leads to

unacceptable loss of signal. This can be

overcome with current compensation,

based on the fact that supply or signal

currents in both lines are opposite and

have equal magnitude.

In Ferroxcube new interference-sup-

pression beads, a pair of conductors

within a single soft-ferrite block are

connected along their lengths by an air

gap. Common-mode signals - interfe-

rence signals passing in the same direc-

tion along the input and output chan-

nels of a device (an IC for instance) -

serve to reinforce the magnetic flux

around both conductor, and are there-

fore attenuated. In contrast, the wanted

signal passing along the input and out-

put channel serves to cancel the flux

around the conductors and therefore

passes unattenuated.

5.1 PRODUCT APPLICATION

These common mode chokes are avai-

lable in 4 sizes in 4S2 material with 2

different winding configurations. In

combination with appropriate tracks on

the PCB the products can also serve as:

• Multi-Turn Choke

• Transformer

The main application areas for the SMD

common mode choke can be found in

e.g.:

• Electronic data processing

• Telecommunication

• Consumer electronics

• Domestic appliances

5.2 PRODUCT SPECIFICATON

5.2.1 GENERAL SPECIFICATION

FEATURES:

• Resistant to mechanical shocks and

pressure

• High resistivity material

• Low tolerances of mechanical dimen-

sions enable automatic mounting

• Flat sides to improve handling by

automatic placement machines

• Low leakage inductance

• Suitable for different functions,

depending on PCB connections

APPLICATIONS:

• EMI suppression

• Supply line filtering

• Data line filtering

TYPE DESCRIPTION:

e.g. CMS2-5.6/3/4.8-4S2-Z

(1) (2)(3)(4)(5) (6) (7)

(1) Product type (CMS=Common

Mode Surface mountable choke)

(2) Number of strips

(3) Width nominal (in mm)

(4) Height maximum including wire (in

mm)

(5) Length nominal including wire (in

mm)

(6) Material grade

(7) -Z lead-free version*

*Note: Not lead-free old version avai-

lable depending on stock.All new codes

are leadfree (not -Z included on type

description).

ORDERING CODE (12 NC):

e.g. 433003055761

The first 11 digits of the 12 NC are suf-

ficient to order the desired SMD com-

mond mode choke. SMD common

mode chokes are delivered taped and

reeled, ready for use on automatic

mounting machines.

Figure 32. SMD Common Mode Choke

SMD Common Mode Chokes General, Product and Type Specification

Figure 33. SMD common mode chokes dimensions (in millimeters)

Table 11. SMD common mode chokes electrical

characteristics*

*Note: Typical impedance values measured at

25ºC with Agilent-4191A impedance analyzer.

|Z|min is -20% typical specified.

TYPE Remark IMPEDANCE [Ω] Mass

AT FREQUENCY [MHz]

30 100 300 (g)

CMS2-5.6/3/4.8-4S2 - 23 35 50 ~0.3

CMS2-5.6/3/8.9-3S4 - 45 65 - ~0.3

CMS2-5.6/3/8.9-4S2 - 38 60 85 ~0.3

CMS4-11/3/4.8-4S2 Inner channel 13 23 42

Outer channel 13 23 42

CMS4-11/3/8.9-4S2 Inner channel 23 45 82

Outer channel 27 58 97

~0.6

5.2.3 ELECTRICAL CHARACTERISTICS

5.2.2 SHAPE AND DIMENSIONS

a-CMS2-5.6/3/8.9 a-CMS2-5.6/3/4.8

a-CMS4-11/3/8.9 b-CMS4-11/3/4.8

SMD Common Mode Chokes General, Product and Type Specification

5.2.5 BLISTER TAPE

AND REEL DIMENSIONS

Table 12. SMD Common mode Choke electrical

characteristics

Table 13. SMD common mode chokes packaging

quantities and ordering code

* Check disponibility. Upon request.

Table 14. Physical dimensions of blister tape (in milli-

meters)*

*Note: Figure 5 for reference detailed dimensions.

TYPE Maximum Vdc DC resistance Imax (A)

Volts (mΩ) 25º 125º

CMS2-5.6/3/4.8-4S2 60 < 0.6 10 8.5

CMS2-5.6/3/8.9-3S4 60 < 0.6 10 8.5

CMS2-5.6/3/8.9-4S2 60 < 0.6 10 8.5

CMS4-11/3/4.8-4S2 60 < 0.6 10 8.5

CMS4-11/3/8.9-4S2 60 < 0.6 10 8.5

TYPE PACKING QUANTITY ORDERING CODE RoHS

[PCS / REEL] [12 NC]

CMS2-5.6/3/8.9-4S2-Z 2500 43300305576_ yes

CMS2-5.6/3/8.9-3S4-Z 2500 43300305575_ yes

CMS2-5.6/3/4.8-4S2-Z 2500 43300305574_ yes

CMS4-11/3/4.8-4S2-Z 2500 43300305565_ yes

CMS4-11/3/8.9-4S2-Z 2500 43300305577- yes

CMS2-5.6/3/8.9-4S2 2500 43300304630_ no*

CMS2-5.6/3/8.9-3S4 2500 43300305575_ no*

SIZE DIMMENSIONS (mm)

CMS2-5.6/3/4.8 CMS2-5.6/3/8.9 CMS4-11/3/4.8 CMS4-11/3/8.9

A0 5.26 5.99 5.23 10.13

B0 6.07 9.09 11.18 11.56

K0 3.18 3.18 4.5 4.5

T 0.3 0.33 0.34 0.36

W 12.0 16.0 24.0 24.0

E 1.75 1.75 1.75 1.75

F 5.5 7.5 11.75 11.5

D0 1.5 1.5 1.5 1.5

D1 > 1.5 > 1.5 > 1.5 > 1.5

P0 4.0 4.0 4.0 4.0

P1 8.0 8.0 8.0 16.0

P2 2.0 2.0 2.0 2.0

5.2.4 PACKAGING

AND ORDERING CODES

The SMD Common mode chokes are delive-

red taped and reeled, ready for use in auto-

matic mounting machines. The packaging is

according to IEC 286-A and EIA 481-A

SMD Common Mode Chokes General, Product and Type Specification

Table 15. Physical dimensions of reel (in millime-

ters)*

Figure 34a. Solder lands for reflow soldering of

CMS2-5.6/3/4.8

Figure 34a. Figure 34b.

Figure 35a. Figure 35b.

Figure 36a. Figure 36b.

Figure 35a. Solder lands for reflow soldering of

CMS2-5.6/3/8.9

Figure 35b. Solder lands for wave soldering of

CMS2-5.6/3/8.9

Figure 36a. Solder lands for reflow soldering of

CMS4-11/3/4.8

Figure 36b. Solder lands for wave soldering of

CMS4-11/3/4.8

Figure 34b. Solder lands for wave soldering of

CMS2-5.6/3/4.8

SIZE DIMENSIONS (mm)

A N W1 W2

12 330 100 ± 0.5 12.4 ≤16.4

16 330 100 ± 0.5 16.4 ≤20.4

24 330 100 ± 0.5 16.4 ≤28.4

*Note: Figure 7 for reference detailed dimensions.

5.2.6 RECOMMENDED SOLDER LANDS

SMD Common Mode Chokes Impedance Curves

Figure 37. Z graph CMS2-5.6/3/4.8-4S2

(1 and 2 turns)

Figure 38. Z graph CMS2-5.6/3/4.8-3S4

(1 and 2 turns)

Figure 39. Z graph CMS2-5.6/3/8.9-3S4

(1 and 2 turns)

Z (ohms)Z (ohms)Z (ohms)

5.2.7 TYPICAL

IMPEDANCE CURVES

CMS2-5.6/3/4.8-4S2

CMS2-5.6/3/8.9-3S4

SMD Common Mode Chokes Impedance Curves

Figure 40. Z graph CMS4-11/3/4.8-4S2

Figure 41. Z graph CMS4-11/3/8.9-4S2

Z (ohms)Z (ohms)

CMS4-11/3/8.9-4S2

SMD Wide Band Chokes General, Product and Type Specification

6.0 OPERATING PRINCIPLE OF

SMD WIDE BAND CHOKES

SMD wide-band chokes are an alternati-

ve to a SMD bead when more impedan-

ce or damping is required.The design of

this product is based on our well-known

range of through-hole wide-band cho-

kes. In these products the conductor

wire is wound through holes in a multi-

hole ferrite core, thus separating them

physically and reducing coil capacitance.

The result is a high impedance over a

wide frequency range, a welcome featu-

re for many interference problems.

The present SMD design preserves the

excellent properties and reliability of

the original wide-band chokes by kee-

ping the number of electrical interfaces

to an absolute minimum.

6.1 PRODUCT APPLICATION

SMD wide-band chokes are available in

3S4 and 4B1material with different win-

ding configurations offering Z values

according for each needed.

As SMD beads and common mode cho-

kes, the SMD wide-bands chokes are

used in main electronics appliances:

• Electronic data processing

• Telecommunication

• Consumer electronics

• Domestic appliances

6.2 PRODUCT SPECIFICATON

6.2.1 GENERAL SPECIFICATION

FEATURES:

• Low leakage inductance due to closed

magnetic circuit

• Small mechanical tolerances enable

automatic mounting

• Flat sides to improve handling by auto-

matic placement machines

• Reliability of simple design

• Single wire construction without

extra electrical interfaces

• Resistant to mechanical shocks and

pressure

• Resistant to thermal mismatch becau-

se of flexible wire connections

APPLICATIONS:

• EMI suppression

• Damping of parasitic oscillations

APPLICABLE MATERIALS:

• 3S4 covers medium frequencies up to

300 MHz

• 4B1 covers higher frequencies up to

1000 MHz

TYPE DESCRIPTION:

e.g.WBS2.5-5/4.8/10-4B1-Z

(1) (2) (3)(4) (5)(6) (7)

(1) Product type (WBS=Wide Band

choke for Surface mounting)

(2) Number of turns

(3) Width nominal (in mm)

(4) Height maximum including wire (in

mm)

(5) Length nominal including wire (in

mm)

(6) Material grade

(7) Lead-free version*

*Note: Not lead-free old version avai-

lable depending on stock.All new codes

are leadfree (not -Z included on prime

name)

ORDERING CODE (12 NC):

e.g. 433003041991

The first 11 digits of the 12 NC are suf-

ficient to order the desired SMD wide

band choke. SMD wide band chokes are

delivered taped and reeled, ready for

use on automatic mounting machines.

Figure 42. SMD wide-band chokes

SMD Wide Band Chokes General, Product and Type Description

6.2.2 SHAPE AND DIMENSIONS

Figure 43. SMD wide-band chokes dimensions (in

millimeters)

SMD Wide Band Chokes General, Product and Type Description

The SMD wide-band chokes are delivered

taped and reeled, ready for use in auto-

matic mounting machines. The packaging

is according to IEC 286-A and EIA 481-A

6.2.4 PACKAGING

AND ORDERING CODES

TYPE IMPEDANCE [Ω] AT FREQUENCY [MHz] Mass

10 25 50 100 300 (g)

WBS1.5-5/4.8/10-3S4 230 - 400 430 - ~0.9

WBS1.5-5/4.8/10-4B1 - 275 - 500 350 ~0.9

WBS2.5-5/4.8/10-3S4 300 - 625 600 - ~0.9

WBS2.5-5/4.8/10-4B1 - 485 - 850 350 ~0.9

Table 16. SMD wide-band chokes electrical cha-

racteristics.

Table 17. SMD wide-band chokes electrical cha-

racteristics

Table 18. SMD wide-band chokes packaging and

ordering codes.

TYPE Maximum Vdc DC resistance Imax (A)

Volts (mΩ) 25º 125º

WBS1.5-5/4.8/10-3S4 60 < 7.5 5 4.2

WBS1.5-5/4.8/10-4B1 60 < 7.5 5 4.2

WBS2.5-5/4.8/10-3S4 60 < 9 5 4.2

WBS2.5-5/4.8/10-4B1 60 < 9 5 4.2

TYPE PACKING QUANTITY ORDERING CODE

[PCS / REEL] [12 NC]

WBS1.5-5/4.8/10-4B1 1650 43300304177_

WBS1.5-5/4.8/10-3S4 1650 43300304176_

WBS1.5-5/10-3S4-Z 1650 43300306901_

WBS2.5-5/4.8/10-4B1 1650 43300304168_

WBS2.5-5/10-4B1-Z 1650 43300306900_

WBS2.5-5/4.8/10-3S4 1650 43300304166-

WBS2.5-5/10-3S4-Z 1650 43300304199_

WBSM2.5-5/4.8/10-4B1 1680 43300304195_

6.2.3 ELECTRICAL CHARACTERISTICS

SMD Wide Band Chokes General, Product and Type Description

6.2.5 BLISTER TAPE

AND REEL DIMENSIONS

6.2.6 RECOMMENDED

SOLDER LANDS

SIZE DIMENSIONS (mm)

WBS1.5-5/4.8/10 WBS2.5-5/4.8/10

A0 5.51 5.51

B0 11 11

K0 5.03 5.03

T 0.36 0.36

W24 24

E 1.75 1.75

F 11.5 11.5

D0 1.5 1.5

D1 ≥1.5 ≥1.5

P0 4.0 4.0

P1 8.0 8.0

P2 2.0 2.0

SIZE DIMENSIONS (mm)

A N W1 W2

24 330 100 ± 0.5 24.4 ≤28.4

Table 19. Physical dimensions of blister tape (in

millimeters)*

Table 20. Physical dimensions of reel (in millime-

ters)*

Figure 44. Recommended solder lands for SMD

wide-band chokes WBS1.5-5/4.8/10 and WBS2.5-

5/4.8/10

*Note: Figure 5 for reference detailed dimen-

sions.

*Note: Figure 7 for reference detailed dimen-

sions.

SMD Wide Band Chokes Impedance Curves

Figure 45. Z graph WBS1.5-5/4.8/10-3S4 and

WBC1.5-5/4.8/10-4B1

Figure 46 Z graph WBS2.5-5/4.8/10-3S4 and

WBC2.5-5/4.8/10-4B1

Z (ohms)

6.2.7 TYPICAL

IMPEDANCE CURVES

SMD Wide Band Chokes Impedance Curves

Figure 47. Impedance vs. frequency for WBS1.5-

5/4.8/10-3S4 under DC-premagnetization

Figure 48. Impedance vs. frequency for WBS1.5-

5/4.8/10-4S2 under DC-premagnetization

Figure 49. Impedance vs. frequency for WBS2.5-

5/4.8/10-3S4 under DC-premagnetization

Z (ohms)

Z (ohms)Z (ohms)

SMD Wide Band Chokes Impedance Curves

Figure 50. Impedance vs. frequency for WBS2.5-

5/4.8/10-4S2 under DC-premagnetization

Z (ohms)

SMD Wide Band Chokes Damping Curves

Figure 51.Attenuation vs. frequency for WBS1.5-

5/4.8/10-3S4 under DC-premagnetization

Figure 52.Attenuation vs. frequency for WBS1.5-

5/4.8/10-4S2 under DC_premagnetization

Figure 53.Attenuation vs. frequency for WBS2.5-

5/4.8/10-3S4 under DC_premagnetization

IL (dB)IL (dB)IL (dB)

6.2.8 TYPICAL

DAMPING CURVES

SMD Wide Band Chokes Damping Curves

Figure 54.Attenuation vs. frequency for

WBS2.5-5/4.8/10-4S2

under DC¬_premagnetization

IL (dB)

Gapped SMD Beads General, Product and Type Specification

7.0 GAPPED SMD BEADS FOR

POWER INDUCTORS

Traditional power supply architectures

for PC´s are facing problems with the

latest generation of integrated circuits.

Lower voltages and higher currents lead

to increasing losses in supply lines and

sensivity to interference. On top of this,

fast microprocessors introduce high fre-

quency transients which are difficult to

regulate with a voltage regulator modu-

le (VRM) form a distant main supply.

7.1 PRODUCT APPLICATION

The fundamental solution utilizes and

intermediate voltage and distributed

point of load (POL) converters. These

are small dc/dc converters, placed close

to the load on the PCB.

Ferroxcube now introduces gapped

SMD beads, perfectly suitable for the

POL concept. They are small inductors

typically meant to serve as output induc-

tor in buck / boost stage and feature the

state of the art power material 3C96.

Depending on relative ripple current,

switching frequencies up to 1 MHz are

possible to realize compact geometries.

Saturation rated current goes up to 20 A

and the dc resistance is less than 1 m|.

These gapped beads are available in 2

sizes (1812 and 3512), packed in tape

on reel, and they are SMD mountable.

Furthermore, they are lead-free and

fully comply with the RoHS regulations

on hazardous substances.

Our lowest loss general power mate-

rial, 3C96 is an excellent choice to use

in high-frequency output inductors.

With a small ripple only, it can work at

much higher switching frequency then it

would as transformer material, preser-

ving its highest higher saturation over

real high-frequency transformer mate-

rials.

7.2 PRODUCT SPECIFICATON

7.2.1 GENERAL SPECIFICATION

FEATURES:

• Very suitable for POL converter con-

cept

• High switching frequency, up to 1 MHz

• High current rating, up to 20 A

• Low dc resistance, less than 1 mΩ

• Small size (1812 and 3512

• SMD mountable

• Lead-free / RoHs compliant

7.2.2 SHAPE AND DIMENSIONS

APPLICATIONS:

• Output inductor dc/dc converters

• EMI suppression with high current

TYPE DESCRIPTION:

e.g. BDS3/3/4.6-3C96-A75

(1)(2) (3) (4) (5) (6)

(1) Product type (BDS = Bead for

Surface mounting)

(2) Width (in mm)

(3) Height (in mm)

(4) Length (in mm)

(5) Material grade

(6) AL inductor value

ORDERING CODE (12 NC):

e.g. 433003072431

The first 11 digits of the 12 NC are suf-

ficient to order the desired SMD wide

band choke. SMD wide band chokes are

delivered taped and reeled, ready for

use on automatic mounting machines.

Figure 55. Gapped SMD beads

Figure 56. Gapped SMD chip beads dimensions (in millimeters)

7.2.3 ELECTRICAL

CHARACTERISTICS

Gapped SMD Beads General, Product and Type Specification

*Note: Isat is defined as the saturation

rated current

Table 21. Gapped SMD beads electrical characte-

ristics

Figure 57. Saturation Curves gapped SMD beads

Table 22. Chip bead electrical characteristics*

TYPE AL Mass

nH / t^2 (g)

BDS3/3/4.6-3C96-A50 50 +- 20% ~0.15

BDS3/3/4.6-3C96-A75 75 +- 20% ~0.15

BDS4.6/3/8.9-A100 100 +- 20% ~0.15

BDS4.6/3/8.9-A150 150 +- 20% ~0.15

TYPE Maximum Vdc DC resistance Isat* Imax (A)

Volts (mΩ) mA 25º 125º

BDS3/3/4.6-3C96-A50 60 < 0.6 20 20 17

BDS3/3/4.6-3C96-A75 60 < 0.6 15 20 17

BDS4.6/3/8.9-A100 60 < 1.0 20 20 17

BDS4.6/3/8.9-A150 60 < 1.0 20 20 17

Gapped SMD Beads General, Product and Type Specification

7.2.4 PACKAGING

AND ORDERING CODES

7.2.5 BLISTER TAPE

AND REEL DIMMENSIONS

The Capped SMD beads are delivered

taped and reeled, ready for use in auto-

matic mounting machines.The packaging

is according to IEC 286-A and EIA 481-A

TYPE PACKING QUANTITY ORDERING CODE

[PCS / REEL] [12 NC]

BDS3/3/4.6-3C96-A50 3000 43300307234_

BDS3/3/4.6-3C96-A75 3000 43300307235_

BDS4.6/3/8.9-A100 2400 43300307243_

BDS4.6/3/8.9-A150 2400 43300307244_ Table 23. Gapped SMD beads packaging quanti-

ties and ordering code

Table 24. Physical dimensions of blister tape (in

millimeters)

Table 24. Physical dimensions of reel

(in millimeters)

*Note: Figure 5 for reference detailed dimensions.

*Note: Figure 7 for reference detailed dimensions.

SIZE DIMENSIONS (mm)

BDS3/3/4.6 BDS4.6/3/8.9

A0 3.45 ± 0.1 3.25 ± 0.1

B0 5.1 ± 0.1 9.4 ± 0.1

K0 3.1 ± 0.1 3.1 ± 0.1

T 0.25 ± 0.05 0.3 ± 0.05

W 12.0 ± 0.3 16.0 ± 0.3

E 1.75 ± 0.1 1.75 ± 0.1

F 5.5 ± 0.05 7.5 ± 0.05

D0 1.5 + 0.1 1.5 + 0.1

D1 > 1.5 > 1.5

P0 4.0 ± 0.1 4.0 ± 0.1

P1 8.0 ± 0.1 8.0 ± 0.1

P2 2.0 ± 0.05 2.0 ± 0.1

SIZE DIMENSIONS (mm)

ANW

1W2

12 3.30 100 ± 0.5 12.4 ≤16.4

16 2.30 100 ± 0.5 16.4 ≤20.4

Gapped SMD Beads General, Product and Type Specification

7.2.6 RECOMMENDED

SOLDER LANDS

SHAPE Reflow soldering Wave soldering

ABCDAB CDE

BDS3/3/4.6 2.8 6.4 1.8 3.3 2.0 6.4 2.2 3.0 0.8

BDS4.6/3/8.9 7.0 10.8 1.9 3.3 6.0 12.2 3.1 3.0 2.5

Figure 58a. Solder lands reflow soldering Figure 58b. Solder lands wave soldering

Table 26. Dimensions (mm) of solder lands

SMD Beads and Chokes Soldering

8.0 SOLDERING CURVES

Our surface mountable beads, common

mode and wide-band chokes can be pla-

ced and soldered onto any normal prin-

ted circuit board or hybrid circuits.

Suitable methods include those where

the device is immersed in solder, wave

soldering, reflow methods where the

solder and device are heated together,

and in vapor phase soldering.

The robust construction of these SMD

components enables them to be totally

immersed in a solder bath at 255º up to

10 seconds for lead parts and up to 30

seconds at 260º for lead-free products

without damage. This facilitates the

mounting of leaded discrete components

on the components side of a board after

surface mountable beads or chokes have

been attached to the side to be solde-

red, thus making a 'mixed print' board.

Typical temperature / time curves for

different soldering methods are shown

in next figures 59, 60, 61 for leaded pro-

ducts and 62 for lead-free parts. They

show a preheating stage, followed by

the soldering process at which the SMD

components are fully subjected to the

soldering temperature, and then finally

cooling. Beads, common mode and

wide-band chokes are able to withstand

both the rapid rise in temperature,

prior to soldering and the high tempe-

rature of the soldering process

Figure 59. Reflow soldering curve

Figure 60.Wave soldering

Figure 61.Vapor phase soldering

SMD Beads and Chokes Soldering

Figure 62. Reflow soldering profile for lead-free types according to JEDEC STD.

SMD Beads and Chokes Maximun Current

Figure 64. RDC in function of temperature for

SMD beads, common mode and wide band chokes

RDC (mohms)

9.0 MAXIMUM CURRENT

LIMITS IN FUNCTION

OF TEMPERATURE

Next graphs shows maximum current

that could be applied to Ferroxcube

SMD parts and Rdc correspondat tem-

perature variability:

Figure 63. Imax. in function of temperature for

SMD beads, common mode and wide band chokes.

Imax (A)