○Product structure：Silicon monolithic integrated circuit ○This product is not designed with protection against radioactive rays.
1/23
Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･14･001 19.Aug.2015 Rev.004
1A Variable / Fixed Output
LDO Regulators
BDxxIC0WEFJ / BDxxIC0WHFV
●General Description
BDxxIC0W series devices are LDO regulators with an output current of 1.0A. The output accuracy is ±1% of the output
voltage. Both fixed and variable output voltage devices are available. The output voltage of the variable output voltage
device can be varied from 0.8 to 4.5V using external resistor s. Various fixed output voltage devices that do not use external
resistors are also available. These LDO regulators are available in two package types: HTSOP-J8 (4.90mm x 6.00mm x
1.00mm) and HVSOF6 (1.60mm x 3.00mm x 0.75mm), and can be used in a wide variety of digital appliances. These
devices have built in over current protection to protect the device when output is shorted, 0µA shutdown mode and thermal
shutdown circuit to protect the device during over load conditions. These L DO regulators are usable with ceramic capacitors
that enable a smaller layout and longer life.
●Features
+/-1% output voltage accuracy
Built-in Over Current Protection circuit (OCP)
Built-in Thermal Shut Down circuit (TSD)
Zero µA Shutdown mode
●Key Specifications
■ Input Power Supply Voltage range: 2.4V to 5.5V
■ Output Voltage range(Variable type): 0.8V to 4.5V
■ Output Voltage(Fixed type): 1.0V/1.2V/1.25V/1.5V
1.8V/2.5V/2.6V/3.0V/3.3V
(1.25V/2.6V:HVSOF6 only)
■ Output Current: 1.0A (Max.)
■ Shutdown Current: 0 µA (Typ.)
■ Operating Temperature Range: -25 to +85℃
●Typical Application Circuit
●Package (Typ.) (Typ.) (Max.)
HTSOP-J8 4.90mm x 6.00mm x 1.00mm
HVSOF6 1.60mm x 3.00mm x 0.75mm
HTSOP-J8
HVSOF6
R1
VO VCC
EN
GND FIN R2
FB
COUT
CIN
CIN,COUT : Ceramic Capacitor
Output voltage variable type
VO VCC
EN
GND FIN
VO_S COUT
CIN
CIN,COUT : Ceramic Capacitor
Output voltage fixed type
2/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Ordering Information
B D x x I C 0 W y y y - z z
Part
Number
Output
voltage
00:Variable
10:1.0V
12:1.2V
1C:1.25V
15:1.5V
18:1.8V
25:2.5V
26:2.6V
30:3.0V
33:3.3V
Input
voltage
range
:7V
Output
current
C0:1.0A
Shutdown
mode
“W”：included
Package
EFJ : HTSOP-J8
HFV : HVSOF6
Packaging and forming specifi cation
E2 : Emboss tape reel(HTSOP-J8)
GTR : Emboss tape reel(HVSOF6)
3/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Block Diagram
BD00IC0WEFJ / BD00IC0WHFV (Variable output voltage type)
●Pin Configuration and Pin Description
(HTSOP-J8)
Pin No. Pin name Pin Function
1 VO Output pin
2 FB Feedback pin
3 GND GND pin
4 N.C No Connect (Connect to GND or leave OPEN)
5 EN Enable pin
6 N.C No Connect (Connect to GND or leave OPEN)
7 N.C No Connect (Connect to GND or leave OPEN)
8 VCC Input pin
Reverse FIN Substrate (Connect to GND)
(HVSOF6)
Pin No. Pin name Pin Function
1 VO Output pin
2 FB Feedback pin
3 GND GND pin
4 EN Enable pin
5 N.C No Connect (Connect to GND or leave OPEN)
6 VCC Input pin
Reverse FI N Substrate (Connect to GND)
Fig.1 Block Diagram
GND
EN
TSD
OCP
SOFT
START VO
VCC
FB
8
7
6
5
1
2
3
4
VO
FB
GND
N.C EN
N.C
N.C
VCC
6
5
4
1
2
3
Vo
FB
EN
N.C
Vcc
GND
4/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Block Diagram
BDxxIC0WEFJ / BDxxIC0WH F V (F ixed output voltage type)
●Pin Configuration and Pin Description
(HTSOP-J8)
Pin No. Pin name Pin Function
1 VO Output pin
2 VO_S Output voltage monitor pin
3 GND GND pin
4 N.C No Connect (Connect to GND or leave OPEN)
5 EN Enable pin
6 N.C No Connect (Connect to GND or leave OPEN)
7 N.C No Connect (Connect to GND or leave OPEN)
8 VCC Input pin
Reverse FIN Substrate (Connect to GND)
(HVSOF6)
Pin No. Pin name Pin Function
1 VO Output pin
2 VO_S Output voltage monitor pin
3 GND GND pin
4 EN Enable pin
5 N.C No Connect (Connect to GND or leave OPEN)
6 VCC Input pin
Reverse FI N Substrate (Connect to GND)
8
7
6
5
1
2
3
4
VO
VO_S
GND
N.C EN
N.C
N.C
VCC
6
5
4
1
2
3
VO
VO_S
GND EN
N.C
VCC
GND
EN
TSD
OCP
SOFT
START VO
VCC
VO_S
Fig.2 Block Diagram
5/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Ratings Unit
Power supply voltage VCC -0.3 to 7.0 *1 V
EN voltage VEN -0.3 to 7.0 V
Power dissipation HTSOP-J8 Pd 2.11
*2 W
HVSOF6 Pd 1.70
*3 W
Operating Temperature Range Topr -25 to +85 ℃
Storage Temperature Range Tstg -55 to +150 ℃
Junction Temperature Tjmax +150 ℃
*1 Not to exceed Pd
*2 Reduced by 16.9mW/℃ for each increase in Ta of 1℃ over 25℃. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)
*3 Reduced by 13.6mW/℃ for each increase in Ta of 1℃ over 25℃. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board,
single-layer(copper foil are :51%))
●Recommended Operatin g Ratings (Ta=25℃)
Parameter Symbol
Ratings Unit
Min. Max.
Input power supply voltage VCC 2.4 5.5 V
EN voltage VEN 0.0 5.5 V
Output voltage setting range VO 0.8 4.5 V
Output current IO 0.0 1.0 A
●Electrical Characteristics (Unless otherwise noted, Ta=25℃, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)
Parameter Symbol Limits Unit Conditions
Min. Typ. Max.
Circuit current at shutdown mode ISTB - 0 5 µA VEN=0V, OFF mode
Bias current ICC - 250 500 µA
Line regulation Reg.Ii -1 - 1 % VCC=( VO+0.6V )→5.5V
Load regulation Reg IO-1.5 - 1.5 % IO=0→1.0A
Minimum dropout voltage1 VCO1 - 0.10 0.15 V VCC=3.3V, IO=250mA
Minimum dropout voltage2 VCO2 - 0.20 0.30 V VCC=3.3V, IO=500mA
Minimum dropout voltage3 VCO3 - 0.30 0.45 V VCC=3.3V, IO=750mA
Minimum dropout voltage4 VCO4 - 0.40 0.60 V VCC=3.3V, IO=1.0A
Output reference voltage(variable type) VFB 0.792 0.800 0.808 V IO=0A
Output voltage(Fixed type) VO Vo×0.99 Vo Vo×1.01 V IO=0A
EN Low voltage VEN_Low 0 - 0.8 V
EN High voltage VEN_High 2.4 - 5.5 V
EN Bias current IEN 1 3 9 µA
6/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Typical Perfo rmance Curves
(Unless otherwise noted, Ta=25℃, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)
Fig.3
Transient Response(0→1.0A)
Co=1.0µF
VO
IO
Fig.4
Transient Response(1.0→0A)
Co=1.0µF
VO
IO
VO
IO
Fig.5
Input sequence1
Co=1.0µF
VCC
VO
Fig.6
OFF sequence 1
Co=1.0µF
VCC
VO
VOVO
IOIO
VEN VEN
7/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Fig.10
Ta-VO (IO=0A)
Fig.7
Input sequence2
Co=1.0µF
VCC
VO
Fig.8
OFF sequence 2
Co=1.0µF
VCC
VO
VEN VEN
VO[V]
Ta[℃] Ta[℃]
Fig.9
Ta-VFB
VFB
[
V
]
8/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Fig.11
Ta-ICC
Ta[℃]
ICC[µA]
Fig.12
Ta-ISTB (VEN=0V)
Ta[℃]
ISTB[µA]
Fig.14
Ta-IEN
Ta[℃]
IEN[µA]
VCC[V]
ISTB[µA]
Fig.13
VCC-ISTB (VEN=0V)
9/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Fig.15
IO-VO (VO=1.2V)
IO[A]
VO[V]
Fig.16
IO-VO (VO=1.5V)
IO[A]
VO[V]
Fig.17
IO-VO (VO=1.8V)
IO[A]
VO[V]
Fig.18
IO-VO (VO=2.5V)
IO[A]
VO[V]
10/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Fig.19
IO-VO (VO=3.3V)
IO[A]
VO[V]
Fig.20
VCC-VO (IO=0A)
VCC[V]
VO[V]
Fig.21
TSD (IO=0A)
Ta[℃]
VO[V]
Fig.22
OCP
(VCC=5V, VO=3.3V)
IO[A]
VO[V]
11/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Fig.23
OCP
(VCC=5V, VO=2.5V)
IO[A]
VO[V]
Fig.24
OCP
(VCC=5V, VO=1.8V)
IO[A]
VO[V]
Fig.25
OCP
(VCC=5V, VO=1.5 V)
IO[A]
VO[V]
Fig.26
OCP
(VCC=5V, VO=1.2 V)
IO[A]
VO[V]
12/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Fig.27
OCP
(VCC=3.3V, VO=2.5V)
IO[A]
VO[V]
Fig.28
OCP
(VCC=3.3V, VO=1.8V)
IO[A]
VO[V]
Fig.29
OCP
(VCC=3.3V, VO=1.5 V)
IO[A]
VO[V]
Fig.30
OCP
(VCC=3.3V, VO=1.2 V)
IO[A]
VO[V]
13/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Fig.34
Minimum dropout Voltage 1
(VCC=3.3V, IO=1.0A)
Fig.32
IO-ICC
Fig.33
PSRR(IO=0A)
Fig.31
ESR-IO characteristics
(Co=2.2µF)
I
O[A] I
O[A]
Vdrop[V]
Ta[℃]
14/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Fig.36
Minimum dropout Voltage3
(VCC=3.3V)
Fig.37
Minimum dropout Voltage4
(
VCC=5.0V
)
Fig.35
Minimum dropout Voltage2
(VCC=2.4V)
I
O[A] I
O[A]
I
O[A]
15/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Power Dissipation
◎HTSOP-J8
◎HVSOF6
Measurement condition: mounted on a ROHM
board,
Substrate size: 70mm × 70mm × 1.6mm
(Substrate with thermal via)
・Solder the thermal pad to Ground
① IC only
θj-a=249.5℃/W
② 1-layer（copper foil are :0 mm×0mm）
θj-a=153.2℃/W
③ 2-layer（copper foil are :1 5mm×15mm）
θj-a=113.6℃/W
④ 2-layer（copper foil are :7 0mm×70mm）
θj-a=59.2℃/W
⑤ 4-layer（copper foil are :7 0mm×70mm）
θj-a=33.3℃/W
Power Dissipation :Pd [W]
0 25 50 75 100 125 150
0
2.0
3.0
4.0
①0.50W
周囲温度:Ta [℃]
1.0
①0.50W
②0.82W
③1.10W
④2.11W
⑤3.76W
Ambient Temperature :Ta [℃]
Measurement condition: mounted on a ROHM
board,
Substrate size: 70mm × 70mm × 1.6mm
(Substrate with thermal via)
・Solder the thermal pad to Ground
① single-layer(copper foil are :2%)
θj-a=147.1℃/W
② single-layer(copper foil are :18%)
θj-a=89.3℃/W
③single-layer(copper foil are :51%)
θj-a=73.5℃/W
0.0
1.0
2.0
3.0
4.0
0 25 50 75 100 125 150
Ambient Temperature: Ta [℃]
Power Dissipation: Pd [W]
③1.7W
②1.4W
①0.85W
16/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed
temperature limits and thermal design should allow sufficient margin beyond these limits.
1. Ambient temperature Ta can be no higher than 85℃.
2. Chip junction temperature (T j) can be no higher than 150℃.
Chip junction temperature can be determined as follows:
Calculation based on ambient temperature (Ta)
Tj=Ta+θj-a×P
＜Reference values＞
θj-a：HTSOP-J8 153.2℃/W
113.6℃/W
59.2℃/W
33.3℃/W
1-layer substrate (copper foil density 0mm×0mm)
2-layer substrate (copper foil density 15mm×15mm)
2-layer substrate (copper foil density 70mm×70mm)
4-layer substrate (copper foil density 70mm×70mm)
Substrate size: 70mm×70mm×1.6mm (substrate with thermal via)
Most of the heat loss that occurs in the BDxxIC0W series is generated from the output Pch FET. Power loss is determined by
the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage as well as the output current
conditions in relation to the he at dissipation characteristics of the VCC an d VO in the desig n. Bearing in m ind that heat dis sipation
may vary substantially depending on the substrate employed (due to the power package incorporated in the BDxxIC0W
series )make certain to factor conditions such as substrate size into the thermal design.
Power consumption [W] = Input voltage (VCC) - Output voltage (VO) ×IO(Ave)
Example) When VCC=3.3V, VO=2.5V, IO(Ave) = 0.1A
Power consumption [W] = 3.3V - 2.5V ×0.1A
=0.08[W]
17/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Input-to-Output Capacitor
It is recommended that a capacitor (over 1uF) is placed near pins bet ween the input pin and GND as well as the output pin
and GND. A capacitor, between input pin and GND, is valid when the po wer supply imped ance is high or trace is long. Also,
as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulat ion
will be and the capacitor will make improvements of characteristics depending on the load. However, please check the
actual functionality of this part by mounti ng it on a boar d for the actu al appl i cation. Cer amic capacitors usuall y have different,
thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use.
For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application.
●Equivalent Series Resistance ESR (Output Capacitor)
To prevent oscillations, please attach a capacitor between
VO and GND. Capacitors usually have ESR (Equivalent
Series Resistance). Operation will be stable in the ESR-IO
range shown to the right. This reference data condition is
1.0uF Ceramic capacitor and resistor are connected to
output in series. Ceramic, tantalum and electrolytic
Capacitors have different ESR values, so please ensure
that you are using a capacitor that operates in the stable
operating region shown on the right. Finally, please
evaluate in the actual application.
DC Bias Voltage [V]
Ceramic capacitor capacity – DC bias characteristics
(Characteristics example)
0.01
0.10
1.00
10.00
00.2 0.4 0.6 0.8 1
Io [A]
ESR [Ω]
Safety area
ESR – IO characteristics
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
01 234
Rated Voltage ：10V
B1 characteristics
Rated Voltage ：4V
X6S characteristics
Capacitance Change [%]
Rated Voltage:10V
F characteristics
Rated Voltage ：6.3V
B characteristics
B characteristics
Rated Voltage ：10V
COUT=1uF
18/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Evaluation Boa r d Circuit
●Evaluation Board Parts List
Designation Value Part No. Company Designation Value Part No. Company
R1 16kΩ MCR01PZPZF1602 ROHM C4 ‐ ‐ ‐
R2 7.5kΩ MCR01PZPZF7501 ROHM C5 1µF CM105B105K10A KYOCERA
R3 ‐ ‐ ‐ C6 ‐ ‐ ‐
R4 ‐ ‐ ‐ C7 ‐ ‐ ‐
R5 ‐ ‐ ‐ C8 ‐ ‐ ‐
R6 ‐ ‐ ‐ C9 ‐ ‐ ‐
C1 1µF CM105B105K16A KYOCERA C10 ‐ ‐ ‐
C2 ‐ ‐ U1 ‐ BD00IC0WEFJ ROHM
C3 ‐ ‐ U2 ‐ ‐ ‐
●Board Layout
PCB layout considerations:
・Input capacitor CIN connected to VCC (Vin) should be placed as close to VCC(VIN) pin as possible.
Output capacitor COUT also should be placed as close to IC pin as possible. In case the part is connected to inner layer
GND plane, please use sever al through holes.
・FB pin has comparatively high impedance and can be affected by noise, so stray capacitance should be as small as
possible. Please take care of this during layout.
・Please make GND pattern wide enough to handle thermal dissipation.
・For output voltage setting
Output voltage can be set by FB pin voltage (0.800V typ.) and external resistance R1, R2.
(The use of resistors with R1+R2=1k to 90k is recommended)
N.C
GND
FB N.C
N.C.
VO
2
VO
C7
3
4
7
5
U1
8
C1
C2
C3
R1
R2
C6
C5
1 VCC
6
EN
GND
SW1
EN
FIN
VO
EN GND
(
VCC VIN )
CIN
R1 R2
COUT
VO = VFB× R1+R2
R2
19/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●I/O Equivalent Circuits (Variable type：BD00IC0WEFJ)
8pin(VCC) / 1pin(VO) 2pin(FB) 5pin(EN)
●I/O Equivalent Circuits (Fixed type：BDxxIC0WEFJ)
●I/O Equivalent Circuits (Variable type：BD00IC0WHFV)
6pin(VCC) / 1pin(VO) 2pin(FB) 4pin(EN)
●I/O Equivalent Circuits (Fixed type：BDxxIC0WHFV)
2pin(FB)
8pin(VCC)
1pn(VO)
5pin(EN) 520kΩ
480kΩ
8pin(VCC) / 1pin(VO) 2pin(VO_S) 5pin(EN)
8pin(VCC)
1pin(VO)
2pin(VO_S) 5pin(EN) 520kΩ
480kΩ
6pin(VCC) / 1pin(VO) 2pin(VO_S) 4pin(EN)
6pin(VCC)
1pin(VO)
2pin(VO_S) 4pin(EN) 520kΩ
480kΩ
2pin(FB)
6pin(VCC)
1pn(VO)
4pin(EN) 520kΩ
480kΩ
20/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Operational Notes
(1) Absolute maximum ratings
An excess in the absolute m aximum ratings, such as s upply voltage, temperature rang e of operatin g conditions, etc., can
break down the device, thus making it impossible to i dentify the damage mode, such as a short circuit or an open circuit.
If there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as
fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage the IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
(3) Power supply lines
Design the PCB layout pattern to provide low impedanc e GND and supp ly lines. To obtain a low noise ground and suppl y
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and GND terminal. When using electrolytic capacitors in
a circuit, note that capacitance values are reduced at low temperatures and over time.
(4) GND voltage
The potential of the GND pin must be minim um potential under all operating conditio ns.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
(6) Off-leakage at high temperature.
Off-leakage at high temperature may increase because of manufacturing variations.
Design should consider the typical & worst cases shown below.
(7) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted togeth er.
(8) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(9) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(10) Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circu it or use the IC in an environme nt where the operation of this circuit
is assumed.
TSD ON Temperature[℃] (typ.) Hysteresis Temperature [℃] (typ.)
BDxxIC0W series 175 15
Ta-Ileak
0
0.1
0.2
0.3
0.4
0.5
25 50 75 100 125 150
Temperature (℃)
Ileak (mA)
typ
worst
21/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
(11)Testing on application boards
When testing the IC on an applicati on board, connecting a c apacitor to a pin with low impeda nce subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
(12) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction oper ates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
(13) Ground Wiring Pattern.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern of any external components, either.
Resistor Transistor (NPN)
N N N P+ P
+
P
P substrate
GND
Parasitic element
Pin A
N
N
P+ P+
P
P substrate
GND
Parasitic element
Pin B C B
E
N
GND
Pin A
P
aras
iti
c
element
Pin B
Other adjacent elements
E
B C
GND
P
aras
iti
c
element
22/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Physical Dimension Tape and Reel Information
●Marking Diagram
xx Product Name
00 BD00IC0WEFJ
10 BD10IC0WEFJ
12 BD12IC0WEFJ
15 BD15IC0WEFJ
18 BD18IC0WEFJ
25 BD25IC0WEFJ
30 BD30IC0WEFJ
33 BD33IC0WEFJ
xx Product Name
B0 BD00IC0WHFV
BT BD10IC0WHFV
BU BD12IC0WHFV
BS BD1CIC0WHFV
BV BD15IC0WHFV
BW BD18IC0WHFV
BX BD25IC0WHFV
BR BD26IC0WHFV
BY BD30IC0WHFV
BZ BD33IC0WHFV
(Unit : mm)
HTSOP-J8
0.08 S
0.08
M
S
1.0MAX
0.85±0.05
1.27
0.08±0.08
0.42 +0.05
-
0.04
1.05±0.2
0.65±0.15
4
°
+
6
°
−
4
°
0.17 +0.05
-
0.03
234
568
(MAX 5.25 include BURR)
7
1
0.545
(3.2)
4.9±0.1
6.0±0.2
(2.4)
3.9±0.1
1PIN MARK
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
HVSOF6
0.1 S
S
(1.2)
(1.4)
(1.5)
(0.45)
(0.15)
0.145±0.05
0.22±0.05
0.75Max.
0.5
321
456
3.0±0.1
2.6±0.1
1.6±0.1
(MAX 1.8 include BURR)
(MAX 2.8 include BURR)
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
HTSOP-J8(TOP VIEW)
xxIC0W
Part Number Marking
LOT Number
1PIN MARK
HVSOF6(TOP VIEW)
xx
Part Number Marking
LOT Numbe
r
1PIN MARK
23/23
BDxxIC0WEFJ / BDxxIC0WHFV Datasheet
TSZ02201-GAG0A600030-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111･15･001 19.Aug.2015 Rev.004
●Revision History
Date Revision Changes
6.Jul.2012 001 New Release.
21.Dec.2012 002 The descriptio n was modified.
24.Sep.2014 003 The po wer diss ipation data was added.
19.Aug.2015 004 P5 modify A bsolute Maximum Ratings (Po wer supply voltage and EN voltage)
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Pro ducts.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissip ation (Pd) depe nding o n Ambient temper ature (Ta). When us ed in se aled area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specifi ed range described in the product specification.
9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant conditio n from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. W hen a highly active hal ogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any d amages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are expos ed to sea winds or corrosive gases, includin g Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are expos ed to direct sunshine or condensatio n
[d] the Products are expos ed to high Electrostatic
2. Even under ROHM recommended storage c ondition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required b efore using Products of
which storage time is exceeding the recommended storage time perio d.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly us ing an authorized industr y waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under an y intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
