ESD Suppressor
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
Z
2
A
3
E
4
G
5
2
6
A
7
5
8
0
9
A
10
X
11
Product Code
ESD Suppressor
Size
Code
2
3
Size (inches)
1005 (0402)
1608 (0603)
Packaging Methods
Code
X
V
Packaging
Punched Carrier Taping
2mmPitch (EZAEG2A)
Punched Carrier Taping
4mmPitch (EZAEG3A)
Rated Voltage
Code
A
Rated Voltage
15 V
Design Specification
Code
A
Design Specification
Standard
Peak Voltage
Code
50
Peak Voltage
500 V
a
b
t
W
L
Protective coating
Alumina substrate Gap electrode
Electrode
(Between)
ESD absorbent material Electrode (Outer)
ESD Suppressor
Type: EZAEG
EZAEG2A, 3A
■Features
● ESD protection of high-speed data lines
● Low capacitance
(0.1 pF : 1608 size, 0.05 pF : 1005 size)
● Good ESD suppression characteristics
● Good ESD withstanding
■Explanation of Part Numbers
■Dimensions in mm (not to scale)■Construction
■Recommended Applications
● High-Speed Data Lines
(HDMI, Serial ATA, USB, IEEE1394)
● Antenna Circuitry (Cellular Phones)
■Circuit Configuration
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWa b t
EZAEG2A
(0402) 1.00 ±0.10 0.50 ±0.05 0.20 ±0.10 0.25 ±0.10 0.38 ±0.05 0.6
EZAEG3A
(0603) 1.60 ±0.15 0.80 ±0.15 0.30 ±0.20 0.30 ±0.20 0.50 ±0.10 2.2
Jun. 2006
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
ESD Suppressor
FE
W
P1P2P0
T
A
B
Tape running directionChip component
Sprocket hole Compartment
fD0
-30
-25
-20
-15
-10
-5
0
5
110100 1000 10000
Frequency(MHz)
Attenuation (dB)
-50
0
50
100
150
200
250
300
350
400
-20 0 20 40 60 80 100 120 140 160 180 200
Times (nSecs)
Volts (V)
HDMI Controller
HDMI
Rx/Tx
Antenna
Ga/As-SW
or
ASM
fC
fA
fB
W
T
(1) Capacitance = The capacitance value shall be measured under the conditions specifi ed below.
Frequency : 1 MHz±10 %, Voltage : 1 Vrms±0.2 Vrms, Temperature : 25 °C±2 °C
(2) Peak Voltage = The peak voltage value shall be measured under the following conditions. ESD test conditions : IEC61000-4-2, 8 kV contact discharge
(3) Clamping Voltage = The clamping voltage value shall be measured at 30 ns after initiation of pulse and measured under the conditions specifi ed below.
ESD test conditions : IEC61000-4-2, 8 kV contact discharge
■Ratings
Type
(inches) Capacitance(1) Peak Voltage(2) Clamping
Voltage(3) Rated Voltage
Category Temperature Range
(Operating Temperature Range)
EZAEG2A (0402) 0.05±0.05 pF 500 V max.
(350 V typ.) 100 V max. 15 V max. –55 to +125 °C
EZAEG3A (0603) 0.1±0.1 pF
■Frequency Characteristics ■ESD Suppression Voltage Waveform
■Typical Circuits Requiring Protection
● HDMI circuit ● Antenna circuit
● Taping Reel● Punched Carrier Taping
■Packaging Methods (Taping)
● Standard Quantity
Type Kind of Taping Pitch (P1)Quantity
EZAEG2A Punched Carrier Taping 2 mm 10000 pcs./reel
EZAEG3A 4 mm 5000 pcs./reel
Dimensions
(mm)
Type A B W F E
2A 0.70±0.05 1.20±0.05
8.00±0.20 3.50±0.05 1.75±0.10
3A 1.10±0.10 1.90±0.10
Dimensions
(mm)
Type P1P2P0fD0T
2A 2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10 0.60±0.05
3A 4.00±0.10 0.70±0.05
–0
Dimensions
(mm)
Type fAfBfC
2A 180.0 +0 60 min. 13.0±1.0
3A –3.0
Dimensions
(mm)
Type W T
2A 9.0±1.0 11.4 ±1.0
3A
Jun. 2006
ESD Suppressor
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
ESD Suppressor
c
a
b
Preheating
Peak
Heating
Temperature
Time
Type
(inches)
Dimensions (mm)
abc
EZAEG2A
(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
EZAEG3A
(0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
In case of fl ow soldering, the land width must be small er than the ESD Suppressor width to properly control the
sol der amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of ESD Suppressor. In
case of refl ow soldering, solder amount can be adjusted, there fore the land width should be set to 1.0 to 1.3 times
ESD Suppressor width (W).
■Recommended Land Pattern
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMC Components
shown on page ER3 of this catalog.
1. If a large electric surge (especially, one which is larger than an ESD) is expected to be applied, be sure to test and
confi rm proper ESD Suppressor functionality when mounted on your board. When the applied load is more than the
allowable rated power under normal load conditions, it may impair performance and/or the reliability of the ESD
Suppressor. Never exceed the rated power. If the product will be used under these special conditions, be sure to contact
a Panasonic representative fi rst.
2. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
3. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
4. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
5. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of im mer sion.
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Jun. 2006
– ER3 –
Safety Precautions
(Common precautions for EMC Components)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general electronic
equipment (e.g. AV equipment, home electric appliances, offi ce equipment, information and communication
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
5. In an environment where these products cause dew condensation
6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be de formed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Apr. 2006
