ESD Suppressor ESD Suppressor Type: EZAEG EZAEG2A, 3A Features Recommended Applications ESD protection of high-speed data lines Low capacitance (0.1 pF : 1608 size, 0.05 pF : 1005 size) Good ESD suppression characteristics Good ESD withstanding High-Speed Data Lines (HDMI, Serial ATA, USB, IEEE1394) Antenna Circuitry (Cellular Phones) Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E Z A E G 2 A 5 0 A X Product Code ESD Suppressor Size Code Size (inches) 2 1005 (0402) 3 1608 (0603) Rated Voltage Code Rated Voltage A 15 V Peak Voltage Code Peak Voltage 50 500 V Design Specification Code Design Specification A Standard Code X V Construction Packaging Methods Packaging Punched Carrier Taping 2 mm Pitch (EZAEG2A) Punched Carrier Taping 4 mm Pitch (EZAEG3A) Dimensions in mm (not to scale) Protective coating L Alumina substrate a Gap electrode W t Electrode (Between) b Type (inches) ESD absorbent material Electrode (Outer) Dimensions (mm) L W a b t Mass (Weight) [g/1000 pcs.] EZAEG2A 1.00 0.10 0.50 0.05 0.20 0.10 0.25 0.10 0.38 0.05 (0402) 0.6 EZAEG3A 1.60 0.15 0.80 0.15 0.30 0.20 0.30 0.20 0.50 0.10 (0603) 2.2 Circuit Configuration Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jun. 2006 ESD Suppressor Ratings Type (inches) EZAEG2A (0402) Capacitance (1) Peak Voltage (2) Clamping Voltage (3) Rated Voltage Category Temperature Range (Operating Temperature Range) 0.050.05 pF EZAEG3A (0603) 0.10.1 pF 500 V max. (350 V typ.) 100 V max. 15 V max. -55 to +125 C (1) Capacitance = The capacitance value shall be measured under the conditions specified below. Frequency : 1 MHz10 %, Voltage : 1 Vrms0.2 Vrms, Temperature : 25 C2 C (2) Peak Voltage = The peak voltage value shall be measured under the following conditions. ESD test conditions : IEC61000-4-2, 8 kV contact discharge (3) Clamping Voltage = The clamping voltage value shall be measured at 30 ns after initiation of pulse and measured under the conditions specified below. ESD test conditions : IEC61000-4-2, 8 kV contact discharge ESD Suppression Voltage Waveform 5 400 0 350 300 -5 Volts (V) Attenuation (dB) Frequency Characteristics -10 -15 -20 250 200 150 100 50 -25 -30 0 1 10 100 1000 Frequency(MHz) -50 -20 0 10000 Typical Circuits Requiring Protection HDMI circuit 20 40 60 80 100 120 140 160 180 200 Times (nSecs) Antenna circuit Antenna HDMI Controller Ga/As-SW or ASM HDMI Rx/Tx Packaging Methods (Taping) Standard Quantity Type EZAEG2A EZAEG3A Kind of Taping Punched Carrier Taping Punched Carrier Taping Pitch (P1) 2 mm 4 mm Quantity 10000 pcs./reel 5000 pcs./reel Taping Reel T Sprocket hole fD0 Compartment E fC B F W fB A T Chip component P1 P2 P0 Tape running direction fA Dimensions (mm) Type A B W F E 2A 0.70 0.05 1.20 0.05 0.20 0.05 8.00 3.50 1.75 0.10 3A 1.10 0.10 1.90 0.10 Dimensions (mm) Type 2A 3A Dimensions (mm) fD 0 Type P1 P2 P0 T 2A 2.00 0.10 0.60 0.05 0.05 0.10 +0.10 2.00 4.00 1.50 -0 3A 4.00 0.10 0.70 0.05 Dimensions (mm) Type 2A 3A W fA 180.0 +0 -3.0 W 9.0 1.0 fB fC 60 min. 13.0 1.0 T 11.41.0 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jun. 2006 ESD Suppressor Recommended Land Pattern In case of flow soldering, the land width must be smaller than the ESD Suppressor width to properly control the solder amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of ESD Suppressor. In case of reflow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times ESD Suppressor width (W). c ESD Suppressor a Type (inches) EZAEG2A (0402) EZAEG3A (0603) a Dimensions (mm) b c 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 b Recommended Soldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 C to 160 C Above 200 C 235 5 C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 150 C to 180 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak max. 260 C max. 10 s Time Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to EMC Components shown on page ER3 of this catalog. 1. If a large electric surge (especially, one which is larger than an ESD) is expected to be applied, be sure to test and confirm proper ESD Suppressor functionality when mounted on your board. When the applied load is more than the allowable rated power under normal load conditions, it may impair performance and/or the reliability of the ESD Suppressor. Never exceed the rated power. If the product will be used under these special conditions, be sure to contact a Panasonic representative first. 2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance and/or reliability. 3. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 C max.). 4. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 5. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jun. 2006 Safety Precautions (Common precautions for EMC Components) * When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. * Do not use the products beyond the specifications described in this catalog. * This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. * Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use * These products are designed and manufactured for general and stan dard use in general electronic equipment (e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment) * These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 5. In an environment where these products cause dew condensation 6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials * These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. * Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . * Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. * Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Apr. 2006 - ER3 -