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POWER MOS 7® IGBTs
THUNDERBOLT® & FAST IGBTs
Insulated Gate Bipolar Transistors (IGBTs)
The IGBT (Insulated Gate Bipolar Transistor) is the combination
of a MOSFET and a Bipolar Transistor in a single chip and as
such combines the best attributes of each type of transistor... The
Bipolar Transistor attributes portion allows operation at high
on-state current densities with a low on-state voltage drop and the
MOSFET structure attributes allows for ease of gate control. The
IGBT advantage in current density over MOSFETs facilitates higher
output power at equal chip size, provides for smaller and lower
cost components, and allows for smaller more compact and higher
power density designs. The die size for the IGBT is often 1 or 2 die
sizes smaller than a MOSFET at equal current solution which means
lower cost than MOSFETs.
The characteristics of the IGBT are determined by the technology
used (materials, process, design). IGBTs can generally be classified
into two basic technologies PT (Punch Through) and NPT (Non-
Punch Through).
There are 3 APT Product Families of IGBTs:
PT 1) Power MOS 7® PT IGBT Family… These devices are
available in 300, 600, 900, and 1200 volt for operation up
to 200 kHz hard switching.
NPT 2) Thunderbolt® NPT IGBT Family… 600 volt only, these
devices are capable of operation 100 kHz Max in
hard switching applications.
3) Fast NPT IGBT Family… 600 and 1200 volt devices,
designed for operation 50 kHz Max in hard switching
applications.
For soft switching topologies these maximum operating frequencies
will be higher.
IGBT products offered by APT utilize offers both NPT and PT
technologies to cover the widest range of applications and design
requirements. They IGBTs can be used as a cost effective alternative
to MOSFETs in many applications with high efficiency, improved
power density, and lower cost.
Our latest generation of 300, 600, 900, and 1200 volt PT-
Type IGBTs utilizing our advanced proprietary POWER MOS 7®
Technology. The 300V parts are designed to replace 200-300V
MOSFETs in PDP and alternative energy inverters. The 600 volt
IGBTs are designed to replace 500V/600V MOSFETs, the 900 volt
IGBTs to replace 800 volt MOSFETs, and the 1200 volt IGBTs are
designed to replace 1000V/1200V MOSFETs in switch mode power
supply (SMPS), power factor correction (PFC), and other high-power
applications. For all IGBT’s, the gate-drive voltage requirement is
similar to a MOSFET. This allows larger die size power MOSFETs, or
multiple MOSFETs in parallel to be replaced with just one POWER
MOS 7® IGBT.
Features and Benefits of POWER MOS 7® Technology IGBTs
Metal Gate… these IGBTs utilize a proprietary planar stripe metal
gate design providing internal chip gate resistance one to two orders
of magnitude lower than comparable industry standard polysilicon
gate devices. This enables very uniform and fast switching across the
entire chip with uniform heat distribution. The metal gate minimizes
chip gate resistance variation from batch to batch providing the user
with more consistent switching performance. In addition, the low
chip gate resistance allows the designer maximum range of switching
speed and increases the immunity to dv/dt induced turn-on.
Higher Threshold Voltage and Reduced “Miller Capacitance”…
this provides for increased noise and spurious turn-on immunity and
eliminates the need for a negative gate voltage supply for turn-off.
This eliminates the need for an auxiliary power supply and simplifies
the use of gate driver ICs.
Low On-State Voltage… conduction losses are dramatically lower,
especially at high temperatures and high currents. Conduction
losses at operating currents and temperatures are ~1/8 that of a
conventional MOSFET and ~1/3 that of a superjunction MOSFET.
Low Gate Charge… this reduces gate drive power losses and
enables fast switching.
Low Thermal Resistance… this maximizes power dissipation
capabilities or lowers junction temperature for improved
reliability.
Short Tail Current Ideal for Soft Switching…
Combis… POWER MOS 7® IGBTs are available co-packaged
with a fast-recovery, antiparallel diode optimized for low reverse
recovery charge, further enhancing performance in power switching
applications. Co-packaging the POWER MOS 7® IGBTs with these
rectifiers reduces EMI, switching losses, and conduction losses, while
reducing component count and cost.
Low Switching Energies… this enables very low switching losses.
In combination with the low conduction losses and the low
thermal resistance, new levels of high frequency capability for a
given current are achieved. Data sheets now include a graph of
frequency vs. current for an IGBT Combi. This graph comprehends
both conduction and switching losses and allows the designer to
properly select the best device for the application.
SiC Combi’s.. Power MOS 7® IGBTs are now available co-packaged
with SiC schottky diodes for the ultimate in performance. Switching
energies are up to 50% lower for the SiC/IGBT combi than those
parts using conventional Si diodes.
In many applications these IGBTs can be used in moderate to high
frequency SMPS applications. Also, the NPT technology has some
added benefits over the PT type IGBTs.
Features and Benefits of NPT IGBTs
Ruggedness… NPT Technology is more rugged due to the wider
base and lower gain of the PNP bipolar transistor. APT NPT IGBTs
are short circuit, avalanche energy, and RBSOA rated while PT
POWER MOS 7® IGBTs with higher switching frequency capability
are RBSOA rated.
Paralleling… This is easier with NPT technology due to the positive
temperature coefficient of VCE(ON) similar to a MOSFET. PT POWER
MOS 7® IGBTs from APT have a slightly negative temperature
coefficient and can be paralleled but may require added precautions,
such as careful thermal matching or VCE(ON) sorting.
High Temperature Operation…
NPT - The turn-off speed and switching losses remain relatively
constant over the entire operating temperature range.
PT - The turn-off speed and switching losses increase with
temperature, but are extremely low due to the short tail current.
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