LITE-ON TECHNOLOGY CORPORATION
P roper t y o f Li t e -On On l y
Features
* Designed for ease in circuit board assembly.
* Black case enhance contrast ratio.
* Solid state light source.
* Reliable and rugged.
Package Dimensions
Part No. Source
Lens Color
LTL-4232NH63P Green Transparent Green
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. The holder color is black.
4. The holder raw material is nylon.
5. The LED lamp is LTL-4232N.
Part No. : LTL-4232NH63P Page : 1 of 9
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LITE-ON TECHNOLOGY CORPORATION
P ro p er t y o f Li t e -On On l y
Absolute Maximum Ratings at T
a
=25℃
℃℃
℃
Parameter Maximum Rating Unit
Power Dissipation 100 mW
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width) 120 mA
Continuous Forward Current 30 mA
Derating Linear From 50℃ 0.4 mA/℃
Operating Temperature Range -55℃ to + 100℃
Storage Temperature Range -55℃ to + 100℃
Lead Soldering Temperature
[1.6mm(.063") From Body] 260℃ for 5 Seconds
Part No. : LTL-4232NH63P Page : 2 of 9
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LITE-ON TECHNOLOGY CORPORATION
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Electrical Optical Characteristics at T
a
=25℃
℃℃
℃
Parameter Symbol
Part No.
LTL- Min.
Typ.
Max.
Unit
Test Condition
Luminous Intensity I
V
4232NH63P
12.6
40 mcd
I
F
= 10mA
Note 1,4
Viewing Angle 2θ
1/2
4232NH63P
45 deg Note 2 (Fig.6)
Peak Emission Wavelength λp 4232NH63P
565
nm Measurement
@Peak (Fig.1)
Dominant Wavelength λd 4232NH63P
569
nm Note 3
Spectral Line Half-Width Δλ 4232NH63P
30 nm
Forward Voltage V
F
4232NH63P
2.1
2.6
V I
F
= 20mA
Reverse Current I
R
4232NH63P
100
μA
V
R
= 5V, Note 5
Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2. θ
1/2
is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. Iv needs ±15% additionary for guaranteed limits.
5. Reverse Voltage (V
R
) condition is applied for IR test only. The device is not designed for reverse operation
Part No. : LTL-4232NH63P Page : 3 of 9
BNS-OD-C131/A4
LITE-ON TECHNOLOGY CORPORATION
P ro p er t y o f Li t e -On On l y
Typical Electrical / Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
Part No. : LTL-4232NH63P Page : 4 of 9
BNS-OD-C131/A4
LITE-ON TECHNOLOGY CORPORATION
P ro p er t y o f Li t e -On On l y
Packing Spec
500, 200 or 100 pcs per packing bag
10 packing bags per inner carton
total 5,000 pcs per inner carton
8 Inner cartons per outer carton
total 40,000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
Part No. : LTL-4232NH63P Page : 5 of 9
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LITE-ON TECHNOLOGY CORPORATION
P ro p er t y o f Li t e -On On l y
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3 mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens/Holder to the soldering point.
Dipping the lens/Holder into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron Wave soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED/Holder or
catastrophic failure of the CBI. IR(Hot air) re-
flow is not suitable process for through hole type LED lamp
production. Max. temperature of wave soldering is not mean that Holder’s HDT/Melting temperature.
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6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A Circuit model B
LED
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
All devices, equipment, and machinery must be properly grounded
Work tables, storage racks, etc. should be properly grounded
Use ion blower to neutralize the static charge which might have built up on surface of the
LEDs plastic lens as a result of friction between LEDs during storage and handing
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LITE-ON TECHNOLOGY CORPORATION
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Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DSL?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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BNS-OD-C131/A4
LITE-ON TECHNOLOGY CORPORATION
P ro p er t y o f Li t e -On On l y
8. Reliability Test
Classification
Test Item Test Condition Reference Standard
Operation Life Ta= Under Room Temperature As
Per Data Sheet Maximum Rating
Test Time= 1000HRS
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
High Temperature
High Humidity
Storage
Ta= 65±5
°C
RH= 90 ～ 95%
Test Time= 240HRS
MIL-STD-202F: 103B(1980)
JIS C 7021 : B-11(1982)
High Temperature
Storage Ta= 105±5
°C
Test Time= 1000HRS MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Endurance
Test
Low Temperature
Storage Ta= -55±5
°C
Test Time=1000HRS JIS C 7021:B-12 (1982)
Temperature
Cycling
105
°C
～ 25
°C
～ -55
°C
～ 25
°C
30mins 5mins 30mins 5mins
10 Cycles
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021: A-4(1982)
Thermal
Shock
105 ± 5
°C
～ -55
°C
± 5
°C
10mins 10mins
10 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Solder
Resistance T.sol = 260
°C
Max.
Dwell Time= 5secs Max.
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021: A-1(1982)
Environmental
Test
Solderability T. sol = 230 ± 5
°C
Dwell Time= 5 ± 1secs
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
JIS C 7021: A-2(1982)
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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