Data Sheet
June 26, 2009
HW006/010/012 Series Power Modules; dc-dc C onverters
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Document No: ADS02-006EPS ver.1.4
PDF Name: fds03-0031.pdf
Applications
n
Distributed Power Architectures
n
Wireless Networks
n
Access and Optical Network Equipment
n
Enterprise Networks
n
Latest generation IC’s (DSP, FPGA, ASIC) and Micropro-
cessor-powered applications.
Options
n
Remote On/Off negative logic
n
Surface-mount package (–S Suffix)
n
Basic Insulation (–B Suffix)
Features
n
Compatible with RoHS EU Directive 200295/EC (-Z Ver-
sions)
n
Compatible in RoHS EU Directive 200295/EC with lead
solder exemption (non -Z versions)
n
Delivers up to 12A output current
n
High efficiency: 90% at 3.3V full load (VIN = 48V)
n
Small size and low profile:
47.2 mm x 29.5 mm x 8.50 mm
(1.86 in x 1.16 in x 0.335 in)
n
Low output ripple and noise
n
Exceptional thermal performance
n
High reliability: MTBF > 4.5M hours at 25 °C
n
Remote On/Off positive logic (primary referenced)
n
Constant switching frequency (285 KHz typical)
n
Output overvoltage and overcurrent protection
n
Overtemperature protection
n
Input undervoltage lockout
n
Adjustable output voltage (± 10%)
n
Surface mount or through-hole package
n
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and is approved for
Basic Insulation rating per IEC60950 3rd (-B version only)
n
UL* 60950 Recognized, CSA† C22.2 No. 60950-00 Certi-
fied, and VDE‡ 0805 (IEC60950, 3rd edition) Licensed
n
CE mark meets 73/23/EEC and 93/68/EEC directives§
n
ISO** 9001 and ISO14001 certified manu facturing facili-
ties
RoHS Compliant
Description
The HW series power modules are isolated dc-dc converters that can deliver up to 12A of output current and provide a precisely
regulated output voltage over a wide range of input voltages (VI = 36 V to 75 Vdc for HW modules). The modules achieve full load
efficiency of 90% at 3.3 V output voltage. The open frame modules, available in both surface-mount and through-hole packaging,
enable designers to develop cost- and space-efficient solutions. Standard features include remote On/Off, output voltage adjust-
ment, overvoltage, overcurrent and overtemperature protection.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.)
** ISO is a registered trademark of the Internation Organization of Standards
Lineage Power 2
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress
ratings only, functional operati on of the device is not implied at these or any other conditions in excess of those given in the
operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the
device reliabiltiy.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of application s , ranging from simple stand-alone operation to an integrated
part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a
maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush
energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s
data sheet for further information.
Parameter Device Symbol Min Max Unit
Input Voltage:Continuous
Transient (100ms) HW
HW VI
VI, trans –0.3
—80
100 Vdc
Vdc
Operating Ambient Temperature
(See Thermal Considerations section) All TA –40 85 °C
Storage Temperature All Tstg –55 125 °C
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage HW VIN 36 48 75 Vdc
Maximum Input Current
(VI = 0 V to 75 V; IO = IO, max) HW II, max 1.6 Adc
Inrush Transient All I2t1A
2s
Input Reflected Ripple Current, peak-peak
(5 Hz to 20 MHz, 12 µH source impedance
See Test configuration section)
All II 3 mAp-p
Input Ripple Rejection (120 Hz) All 50 dB
Lineage Power 3
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set Point
(VI = 48 Vdc; IO = IO, min to IO, max, TA = 25 °C) HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
Vo, set
Vo, set
Vo, set
Vo, set
Vo, set
Vo, set
1.17
1.46
1.75
2.46
3.25
4.92
1.2
1.5
1.8
2.5
3.3
5.0
1.23
1.54
1.85
2.54
3.35
5.08
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Output Voltage
(Over all operating input voltage, resistive load, and
temperature conditions at steady state until end of life.)
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
VO
VO
VO
VO
VO
VO
1.15
1.44
1.73
2.42
3.2
4.85
—
—
—
—
—
—
1.25
1.56
1.87
2.57
3.4
5.15
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Output Regulation:
Line (VI = VI, min to VI, max)
Load (IO = IO, min to IO, max)
Temperature (TA = TA, min to TA , max)
All
All
All
—
—
—
—
—
—
—
—
0.2
0.1
10
—
%, VO, set
mV
%, VO, set
Output Ripple and Noise
Measured across 10µF Tantalum, 1µF
Ceramic, VI = VI, nom TA = 25 °C, IO = IO, max See test
Configuration section
RMS (5 Hz to 20 MHz bandwidth)
Peak-to-peak (5 Hz to 20 MHz bandwidth) All
All —
—8
40 20
75 mVrms
mVp-p
External Load Capacitance HW006A6A1
All others CO, max
CO, max 0
0—
—470
1000µF
µF
Output Current
(At Io < Io,min, the output ripple may exceed the
maximum specifications. All modules shall operate at no
load without damage and without exceeding 1 10% of VO,
set.)
HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
IO
IO
IO
IO
IO
IO
0.15
0.15
0.15
0.05
0.05
0.05
—
—
—
—
—
—
12
12
12
10
10
6.6
Adc
Adc
Adc
Adc
Adc
Adc
Output Current-limit Inception
(VO = 90% of VO, set) HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
IO, lim
IO, lim
IO, lim
IO, lim
IO, lim
IO, lim
—
—
—
—
—
—
18
18
18
12
12
8
—
—
—
—
—
—
Adc
Adc
Adc
Adc
Adc
Adc
Output Short-circuit Current (Average)
VO = 0.25 V HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
IO, s/c
IO, s/c
IO, s/c
IO, s/c
IO, s/c
IO, s/c
—
—
—
—
—
—
20
20
20
17
17
13
—
—
—
—
—
—
Adc
Adc
Adc
Adc
Adc
Adc
Efficiency
(VI = VIN, nom; IO = IO, max), TA = 25 °C HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
h
h
h
h
h
h
—
—
—
—
—
—
82
83
85
89
90
91
—
—
—
—
—
—
%
%
%
%
%
%
Switching Frequency All fSW — 285 — kHz
Efficiency
(VI = VIN, nom; IO = IO, max), TA = 25 °C HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
h
h
h
h
h
h
—
—
—
—
—
—
82
83
85
89
90
91
—
—
—
—
—
—
%
%
%
%
%
%
Lineage Power 4
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Electrical Specifications (continued)
Isolation Specifications
General Specifications
Parameter Device Symbol Min Typ Max Unit
Dynamic Load Response
(di/dt = 0.1 A/ µs, VI = VI, nom, TA = 25 °C)
Load change from IO = 50% to 75% of IO, max,
Peak Deviation
Settling Time (VO < 10% of peak deviation)
Load Change from IO = 50% to 25% of IO, max,
Peak Deviation
Setting Time (VO < 10% peak deviation)
All
All
All
All
—
—
—
—
—
—
—
—
200
0.2
200
0.2
—
—
—
—
mV
msec
mV
msec
Parameter Symbol Min Typ Max Unit
Isolation Capacitance Ciso — 1000 — PF
Isolation Resistance Riso 10 — — MΩ
Isolation Voltage Viso — — 1500 Vdc
Parameter Min Typ Max Unit
Calculated MTBF (IO = 80% of IO, max TA = 25 °C)
RIN (Reliability Infomation Notebook) Method 4,537,000 Hours
Weight — 13 (0.46) — g (oz.)
Lineage Power 5
Data Sheet
June 26, 2009 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal interface
(VI = VI, min to VI, max; Open collector or compatible, signal
referenced to VI (-) terminal
Negative Logic: Device code with suffix "1"
Logic Low—Module On / Logic High—Module Off
Positive Logic: If device code suffix "1" is not specified
Logic Low—Module Off / Logic High—Module On
Module Specifications:
On/Off Current—Logic Low
On/Off Voltage:
Logic Low
Logic High
Open Collector Specifications:
Leakage Current during Logic High
(Von/off = 15 V)
Output Low Voltage during Logic Low
(Ion/Off – 1 mA)
All
All
All
All
All
Ion/off
Von/off
Von/off
Ion/off
Von/off
—
–0.7
—
—
—
—
—
—
—
—
1.0
1.2
15
50
1.2
mA
V
V
µA
V
Turn-On Delay and Rise Times
(IO = 80% of IO, max, VIN = 48 Vdc, TA = 25 °C)
Case 1: On/Off input is set to Logic high and then input power
is applied (delay from instant at which VI = VI, min until VO =
10% of VO, set)
Case 2: Input power is applied for at least one second and
then the On/Off input is set to logic high (delay from instant at
which Von/off = 0.9 V until VO = 10% of VO, set)
Output voltage Rise time (time for VO to rise from 10% of VO,
set to 90% of VO, set)
All
All
All
Tdelay
Tdelay
Trise
—
—
—
25
25
0.9
—
—
—
msec
msec
msec
Output voltage overshoot
(IO = 80% of IO, max, VI = 48 Vdc TA = 25 °C) All — — 5 %VO, set
Output voltage adjustment (see Feature Description section)
Output voltage set-point adjustment range (TRIM) ALL 90 — 110 %VO, set
Output Overvoltage Protection (clamp) HW012A0P1
HW012A0M1
HW012A0Y1
HW010A0G1
HW010A0F1
HW006A6A1
VO, ovsd
VO, ovsd
VO, ovsd
VO, ovsd
VO, ovsd
VO, ovsd
—
—
—
—
—
—
2.0
2.3
2.3
3.1
4.0
6.1
2.8
3.2
3.2
3.7
4.6
7.0
V
V
V
V
V
V
Overtemperaute Protection (IO = IO, max)
See Figure 44 All TQ203 — 125 — °C
Input Undervoltage Lockout
Turn-on Threshold
Turn-off Threshold All
All —
25 32
27 36
—V
V
Lineage Power 6
Data Sheet
June 26, 2009 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Characteristic Curves
The following figures provide typical characteristics curves for the HW012A0P1 (VO = 1.2 V) module at room temperature (TA
= 25 °C).
Figure 1. Input Voltage and Current Characteristics.
Figure 2. Converter Efficiency vs. Output Current.
Figure 3. Output Ripple Voltage (IO = IO, max).
Figure 4. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
Figure 5. Transient Resp onse to Step Increase in
Load from 50% to 75% of Full Load
(VI = 48 Vdc).
Figure 6. Start-up from Remote On/Off (IO = IO, max).
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
25 30 35 40 45 50 55 60 65 70 7
5
I
O
= 12A
I
O
= 6A
I
O
= 0.15A
INPUT VOLTAGE, V
I
(V)
INPUT CURRENT, I
I
(A)
70
72
74
76
78
80
82
84
86
02468101
2
V
I
= 36V
V
I
= 48V
V
I
= 75V
OUTPUT CURRENT, I
O
(A)
EFFICIENCY, (%)
TIME, t (1 µs/div)
OUTPUT V OLTAG
E,
V
O
(V) (10 mV/div)
TIME, t (200 µs/div)
OUTPUT V OLTAG
E,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div)
TIME, t (200 µs/div)
OUTPUT V OLTAG
E,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
TIME, t (10 ms/div)
REMOTE ON/OFF,
V
ON/OFF
(V) (5 V/div) OUTPUT V OLTAGE,
V
O
(V) (1 V/div)
Lineage Power 7
Data Sheet
June 26, 2009 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Characteristic Curves
The following figures provide typical characteristics curves for the HW012A0M1 (VO = 1.5 V) module at room temperature (TA =
25 °C)
Figure 7. Input Voltage and Current Characteristics.
Figure 8. Converter Efficiency vs. Output Current.
Figure 9. Output Ripple Voltage (IO = IO, max).
Figure 10. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
Figure 1 1. Transient Response to St ep Incre ase in Load
from 50% to 75% of Full Load
(VI = 48 Vdc).
Figure 12. Start-up from Remote On/Off (IO = IO, max).
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
25 30 35 40 45 50 55 60 65 70 75
INPUT VOLTAGE, VI (V)
INPUT CURRENT, II (A)
IO = 12A
IO = 6A
IO = 0.15A
70
72
74
76
78
80
82
84
86
88
90
024681012
OUTPUT CURRENT, IO (A)
EFFICIENCY, (%)
VI = 36V
VI = 48V
VI = 75V
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (10 mV/div)
TIME, t (200 ms/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div) OUTPUT V OLTAGE,
V
O
(V) (100 mV/div)
TIME, t (200 ms/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div) OUTPUT V OLTAGE,
V
O
(V) (100 mV/div)
TIME, t (10 ms/div)
REMOTE ON/OFF,
V
ON/OFF
(V) (5 V/div) OUTPUT V OLTAGE,
V
O
(V) (0.5 V/div)
Lineage Power 8
Data Sheet
June 26, 2009 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Characteristic Curves
The following figures provide typical characteristics curves for the HW012A0Y1 (VO = 1.8 V) module at room temperature (TA
= 25 °C)
Figure 13. Input Voltage and Current Characteristics.
Figure 14. Converter Efficiency vs. Output Current.
Figure 15. Output Ripple Voltage (IO = IO, max).
Figure 16. Transient Respon se to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
Figure 17. Transient Response to Step Increase in
Load from 50% to 75% of Full Load
(VI = 48 Vdc).
Figure 18. Start-up from Remote On/Off (IO = IO, max).
0
0.2
0.4
0.6
0.8
1
1.2
25 30 35 40 45 50 55 60 65 70 7
5
I
O
= 12A
I
O
= 6A
I
O
= 0.15A
INPUT VOLTAGE, V
I
(V)
INPUT CURRENT, I
I
(A)
70
72
74
76
78
80
82
84
86
88
90
02468101
2
V
I
= 36V
V
I
= 48V
V
I
= 75V
OUTPUT CURRENT, I
O
(A)
EFFICIENCY, (%)
TIME, t (1 µs/div)
OUTPUT V OLTAG
E,
V
O
(V) (10 mV/div)
TIME, t (200 ms/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div) OUTPUT V OLTAGE,
V
O
(V) (100 mV/div)
TIME, t (200 ms/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div) OUTPUT V OLTAGE,
V
O
(V) (100 mV/div)
TIME, t (10 ms/div)
REMOTE ON/OFF,
V
ON/OFF
(V) (5 V/div) OUTPUT V OLTAGE,
V
O
(V) (1 V/div)
Lineage Power 9
Data Sheet
June 26, 2009 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Characteristic Curves
The following figures provide typical characteristics curves for the HW010A0G1 (VO = 2.5 V) module at room temperature (TA =
25 °C)
Figure 19. Input Voltage and Current Characteristics.
Figure 20. Converter Efficiency vs. Output Current.
Figure 21. Output Ripple Voltage (IO = IO, max).
Figure 22. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
Figure 23. T ra nsient R esponse to S tep In crease in Load
from 50% to 75% of Full Load
(VI = 48 Vdc).
Figure 24. Start-up from Remote On/Off (IO = IO, max).
0
0.2
0.4
0.6
0.8
1
1.2
25 30 35 40 45 50 55 60 65 70 75
IO = 10A
IO = 5A
IO = 0.05A
INPUT VOLTAGE, VI (V)
INPUT CURRENT, I
I
(A)
70
75
80
85
90
95
012345678910
VI = 36V
VI = 48V
VI = 75V
OUTPUT CURRENT, IO (A)
EFFICIENCY, (%)
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (10 mV/div)
TIME, t (100 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (100 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
TIME, t (100 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (100 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
TIME, t (5 ms/div)
OUTPUT V OLTAGE,
V
O
(V) (500 mV/div)
REMOTE ON/OFF,
V
ON/OFF
(V) (5 V/div)
Lineage Power 10
Data Sheet
June 26, 2009 36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Characteristic Curves
The following figures provide typical characteristics curves for the HW010A0F1 (VO = 3.3 V) module at room temperature (TA
= 25 °C)
Figure 25. Input Voltage and Current Characteristics.
Figure 26. Converter Efficiency vs. Output Current.
Figure 27. Output Ripple Voltage (IO = IO, max).
Figure 28. Transient Respon se to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
Figure 29. Transient Response to Step Increase in
Load from 50% to 75% of Full Load
(VI = 48 Vdc).
Figure 30. Start-up from Remote On/Off (IO = IO, max).
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
25 30 35 40 45 50 55 60 65 70 7
5
I
O
= 10A
I
O
= 5A
I
O
= 0.05A
INPUT VOLTAGE, V
I
(V)
INPUT CURRENT, I
I
(A)
70
75
80
85
90
95
01234567891
0
VI = 36V
VI = 48V
VI = 75V
OUTPUT CURRENT, IO (A)
EFFICIENCY, (%)
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (20 mV/div)
TIME, t (100 µs/div)
OUTPUT V OLTAG
E,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
TIME, t (100 µs/div)
OUTPUT V OLTAG
E,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (5 A/div)
TIME, t (5 ms/div)
REMOTE ON/OFF,
V
ON/OFF
(V) (5 V/div) OUTPUT V OLTAGE,
V
O
(V) (1 V/div)
Lineage Power 11
Data Sheet
June 26, 2009
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Characteristic Curves
The following figures provide typical characteristics curves for the HW006A6A1 (VO = 5.0 V) module at room temperature (TA =
25 °C)
Figure 31. Input Voltage and Current Characteristics.
Figure 32. Converter Efficiency vs. Output Current.
Figure 33. Output Ripple Voltage (IO = IO, max).
Figure 34. Transient Response to Step Decrease in
Load from 50% to 25% of Full Load
(VI = 48 Vdc).
Figure 35. T ra nsient R esponse to S tep In crease in Load
from 50% to 75% of Full Load
(VI = 48 Vdc).
Figure 36. Start-up from Remote On/Off (IO = IO, max).
0
0.2
0.4
0.6
0.8
1
1.2
1.4
25 30 35 40 45 50 55 60 65 70 75
IO = 6.6A
IO = 3.3A
IO = 0.05A
INPUT VOLTAGE, VI (V)
INPUT CURRENT, II (A)
70
75
80
85
90
95
01234567
V
I
= 36V
V
I
= 48V
V
I
= 75V
OUTPUT CURRENT, I
O
(A)
EFFICIENCY, (%)
TIME, t (1 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (10m V/div)
TIME, t (100 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div)
TIME, t (100 µs/div)
OUTPUT V OLTAGE,
V
O
(V) (200 mV/div)
OUTPUT CURRENT,
I
O
(A) (2 A/div)
TIME, t (5 ms/div)
REMOTE ON/OFF,
V
ON/OFF
(V) (5 V/div) OUTPUT V OLTAGE,
V
O
(V) (2 V/div)
Lineage Power 12
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Test Configurations
Note: Measure input reflected ripple current with a simulated source
inductance (LTEST) of 12µH. Capacitor CS offsets possible
battery impedance. Measure current as shown above.
Figure 37. Input Reflected Ripple Current Test Setup.
Note: Scope measurements should be made using a BNC socket,
with a 10 µF tantalum capacitor and a 1 µF ceramic capcitor.
Position the load between 51 mm and 76 mm (2 in and 3 in)
from the module
Figure 38. Peak-to-Peak Output Ripple Measurement
Test Setup.
Note: All voltage measurements to be taken at the module termi-
nals, as shown above. If sockets are used then Kelvin con-
nections are required at the module terminals to avoid
measurement errors due to socket contact resistance.
Figure 39. Output Voltage and Efficiency Test Setup.
Safety Considerations
For safety-agency approval of the system in which the power
module is used, the power module must be installed in com-
pliance with the spacing and separation requirements of the
end-use safety agency standard, i.e., UL60950, CSA C22.2
No. 60950-00, and
VDE 0805:2001-12 (IEC60950, 3rd Ed).
These converters have been evaluated to the spacing
requirements for Basic Insulation, per the above safety stan-
dards.
For Basic Insulation models ("–B" Suffix), 1500 Vdc is
applied from VI to VO to 100% of outgoing production.
For end products connected to –48 Vdc, or –60 Vdc nomianl
DC MAINS (i.e. central office dc battery plant), no further
fault testing is required.
Note:–60 V dc nominal bettery plants are not available in the
U.S. or Canada.
For all input voltages, other than DC MAINS, where the input
voltage is less than 60 Vdc, if the input meets all of the
requirements for SELV, then:
n
The output may be considered SELV. Output voltages will
remain withing SELV limits even with internally-generated
non-SELV voltages. Single component failure and fault
tests were performed in the power converters.
n
One pole of the input and one pole of the output are to be
grounded, or both circuits are to be kept floating, to main-
tain the output voltage to ground voltage within ELV or
SELV limits.
For all input sources, other than DC MAINS, where the input
voltage is between 60 and 75 Vdc (Classified as TNV-2 in
Europe), the following must be adhered to, if the converter’s
output is to be evaluated for SELV:
n
The input source is to be provided with reinforced insula-
tion from any hazardous voltage, including the AC mains.
n
One VI pin and one VO pin are to be reliably earthed, or
both the input and output pins are to be kept floating.
n
Another SELV reliability test is conducted on the whole
system, as required by the safety agencies, on the combi-
nation of supply source and the subject module to verify
that under a single fault, hazardous voltages do not
appear at the module’s output.
The power module has ELV (extra-low voltage) outputs
when all inputs are ELV.
All flammable materials used in the manu facturing of these
modules are rated 94V-0, and UL60950A.2 for reduced
thicknesses. The input to these units is to be provided with a
maximum 5A time-delay in the unearthed lead.
TO OSCILLOSCOPE
12 µH
C
S
220 µF
ESR < 0.1 Ω
@ 20 ˚C, 100 kHz
V
I
(+)
V
I
(-)
BATTERY 33 µF
CURRENT
PROBE
L
TEST
ESR < 0.7 Ω
@ 100 kHz
V
O
(+)
V
O
(–)
1.0 µF RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10 µF
V
I
(+)
I
I
I
O
SUPPLY
CONTACT
RESISTANCE
CONTACT AND
DISTRIBUTION LOSSES
LOAD
V
I
(–)
V
O
(+)
V
O
(–)
ηVO(+) VO(-)
–[]IO
×
VI(+) VI(-)
–[]II
×
------------------------------------------------
⎝⎠
⎛⎞
100×=
Lineage Power 13
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance source. A highly inductive source impedance
can affect the stability of the power module. For the test con-
figuration in Figure 37, a 33µF electrolytic capacitor
(ESR<0.7W at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Feature Descriptions
Remote On/Off
Two remote On/Off options are available. Positive logic
remote On/Off turns the module on during a logic-high volt-
age on the remote ON/OFF pin, and off during a logic low.
Negative logic remote On/Off, device code suffix "1", turns
the module off during logic-high voltage and on during a logic
low.
To turn the power module on and off, the user must supply a
switch to contro l th e vo ltage between the
ON/OFF pin and the VI(–) terminal. The switch may be an
open collector or equivalent (see Figure 40). A logic low is
Von/off = –0.7 V to 1.2 V. The maximum Ion/off during a logic
low is 1 mA. The switch should maintain a logic-low voltage
while sinking 1 mA. During a logic high, the maximum Von/off
generated by the power module is 15 V. The maximum allow-
able leakage current of the switch at Von/off = 15 V is 50 µA.
If not using the remote on/off feature, do one of the following:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VI(–).
Figure 40. Remote On/Off Implement ation.
Output Voltage Set-Point Adjustment (Trim)
Output voltage trim allows the user to increase or decrease
the output voltage set point of a module. This is accom-
plished by connecting an external resistor between the TRIM
pin and either the VO(+) or VO(–) pins. The trim resistor
should be positioned close to the module. If not using the trim
feature, leave the TRIM pin open.
With an external resistor Trim-down between the TRIM and
VO(–) pins, the output voltage set point VO, set decreases
(see Figure 41). The following equation determines the
required external-resistor value to trim-down the output volt-
age from VO, set to VO:
Rtrim-down is the external resistor in kW
D% is the % change in output voltage
A & B are defined in Table 1 for various models
Table 1
For example, to trim-down the output voltge of 2.5 V module
(HW010A0G) by 8% to 2.3 V, Rtrim-down is calculated as fol-
lows:
D% = 8
A = 1690
B = 73.1
VO(+)
VO(–)
VI(–)
+
–
Ion/off
ON/OFF
VI(+)
LOAD
Von/off
Output Voltage
(V) AB
1.2 1089 62.0
1.5 1089 104
1.8 1089 104
2.5 1690 73.1
3.3 1690 73.1
5.0 1690 73.1
Rtrim-down A
Δ%
---------B–
⎩⎭
⎨⎬
⎧⎫
kΩ=
Rtrim-down 1690
8
------------73.1–
⎩⎭
⎨⎬
⎧⎫
kΩ=
Rtrim down–138.15kΩ=
Lineage Power 14
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Feature Descriptions (continued)
Output Voltage Set-Point Adjustment
(Trim) (continued)
Figure 41. Circuit Configuration to Decrease Output
Voltage.
With an external resistor Rtrim-up, connected between the
TRIM and VO(+) pins, the output voltage set point VO, set
increases (see Fiugre 42). The following equation deter-
mines the required external-resistor value to trim-up the out-
put voltage from VO, set to VO:
Rtrim-up is th e external resistor in kW
D% is the % change in output voltage
A, B and C are defined in Table 2
Table 2
For example, to trim-up the output voltage of 1.5 V module
(HW012A0M) by 8% to 1.62 V, Rtrim-up is calcualted is as
follows:
D% = 8
A = 19.8
B = 1089
C = 104
Figure 42. Circuit Configuration to Increase
Output Voltage.
The amount of power delivered by the module is defined as
the voltage at the output terminals multiplied by the output
current. When using trim, the output voltage of the module
can be increased, which at the same output current would
increase the power output of the module. Care should be
taken to ensure that the maximum output power of the mod-
ule remains at or below the maximum rated power (maxi-
mum rated power = VO, set x IO, max).
Overcurrent Protection
To provide pr otection in an output over load fault condition,
the module is equipped with internal current-limiting circuitry,
and can endure current limiting for an unlimited duration. At
the instance of current-limit inception, the module enters a
"hiccup" mode of operation, whereby it shuts down and auto-
matically attempts to restart. While the fault condition exists,
the module will remain in this mode until the fault is cleared.
The unit operates normally once the output current is
reduced back into its specified range.
Output Overvoltage Protection
The output overvoltage protection clamp consists of control
circuitry, independent of the primary regulation loop, that
monitors the voltage on the outp ut terminals. T his control
loop has a higher voltage set point than the primary loop
(See the overvoltage clamp values in the Feature S pecifica-
tions Table). In a fault condition, the overvoltage clamp
ensures that the output voltage does not exceed VO, ovsd,
max. This provides a redundant voltage-control that reduces
the risk of output overvoltage.
Output Voltage
(V) ABC
1.2 15.9 1089 62.0
1.5 19.8 1089 104
1.8 23.8 1089 104
2.5 34.5 1690 73.1
3.3 45.5 1690 73.1
5.0 69.0 1690 73.1
VI(+)
VI(–)
ON/OFF
VO(+)
VO(–)
TRIM
Rtrim-down
RLOAD
Rtrim-up A100 Δ%+()B–
Δ%
------------------------------------------- C–
⎩⎭
⎨⎬
⎧⎫
kΩ=
Rtrim-up 19.8 100 8+()1089–
8
----------------------------------------------------104–
⎩⎭
⎨⎬
⎧⎫
kΩ=
Rtrim-up 27.175kΩ=
VI(+)
VI(–)
ON/OFF
VO(+)
VO(–)
TRIM
Rtrim-up
RLOA
D
Lineage Power 15
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Feature Descriptions (continued)
Overtemperature Protection
To provide protection under certain fault conditios, the unit is
equipped with a thermal shutdown circuit. The unit will shu-
down if the overtemperature threshold is exceeded, but the
thermal shut down is not intended as a guarantee that the
unit will survive temp eratures beyond its rating. The module
will automatically restart after it cools down.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operatio n is disabled. The module will begin to
operate at an input voltage above the unde rvoltage locko ut
turn-on threshold.
Lineage Power 16
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Thermal Considerations
The power modules operate in a variety of ther mal environ-
ments; however, sufficient cooling should be provided to help
ensure reliable operation of the unit. Heat is removed by con-
duction, convection, and radiation to the surrounding environ-
ment. Proper cooling can be verified by measuring drain pin
Q203 at the position indicated in Figure 43.
The temperature at Q203 drain pins should not exceed 115
°C. The output power of the module should not exceed the
rated power for the module
(VO, set x IO, max).
Although the maximum operating ambient temperature of the
power modules is 85 °C, you can limit this temperature to a
lower value for extremely high relia bility.
Figure 43. HW 6.6A-12A-Series Temperature
Measurement Location (Top View).
Heat Transfer via Convection
Increasing airflow over the module enhances the heat trans-
fer via convection. Figures 44—48 show the maximum cur-
rent that can be delivered by various modules versus local
ambient temperature (TA) for natural convection through 2 m/
s (400 ft./min.).
Systems in which these power modules may be used typi-
cally generate natural convection airflow rates of 0.3 ms–1
(60 ft./min.) due to other heat-dissipating components in the
system. Therefore, the natural convection condition repre-
sents airflow rates of up to 0.3 ms–1 (60 ft./min.). Use of Fig-
ure 44 is shown in the following example.
Example
What is the minimum airflow necessary for a HW010A0F1
operating at VIN = 48 V, an output current of 10 A, and a
maximum ambient temperature of 75 °C.
Solution
Given: VIN = 48V
IO = 12 A
TA = 75 °C
Determine airflow (v) (Use Figure 44.):
v = 0.5 m/s (100 ft./min.)
Figure 44. Derating Curves for HW010A0F1
(VO = 3.3 V) in Transverse Orientation
(VI = 48 Vdc).
Figure 45. Derating Curves for HW006A6A1
(VO = 5.0 V) in Transverse Orientation
(VI = 48 Vdc).
Figure 46. Derating Curves for HW010A0G1
(VO = 2.5 V) in Transverse Orientation
(VI = 48 Vdc).
Q203
Attach thermocouple
to drain lead.
AIRFLOW
0
2
4
6
8
10
12
20 30 40 50 60 70 80 9
0
Ambient Temperature T
A
(˚C)
Output Current I
O
(A)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
NATURAL CONVECTION
0
1
2
3
4
5
6
7
8
20 30 40 50 60 70 80 9
0
AMBIENT TEMPERATURE, T
A
(˚C)
OUTPUT CURRENT, I
O
(A)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
NATURAL CONVECTION
0
1
2
3
4
5
6
7
8
9
10
11
20 30 40 50 60 70 80 9
0
AMBIENT TEMPERATURE, T
A
(˚C)
OUTPUT CURRENT, I
O
(A)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
NATURAL CONVECTION
Lineage Power 17
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Thermal Considerations (continued)
Figure 47. Derating Curves for HW012A0Y1
(VO = 1.8 V) in Transverse Orientation
(VI = 48 Vdc).
Figure 48. Derating Curves for HW012A0P1
(VO = 1.2 V) in Transverse Orientation
(VI = 48 Vdc).
Layout Considerations
Copper paths must not be routed beneath the power module.
For additional layout guide lines, refer to the FLTR100V10 or
FLTR100V20 data sheet.
EMC Considerations
For assistance with designing for EMC compliance, please
refer to the FLTR100V10 data sheet
(FDS01-043EPS)
Lineage Power 18
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compli-
ant finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please co nsult with your
Lineage Power representative for more details.
Surface Mount Information
Pick and Place Area
Although the module weight is minimized by using open-
frame construction, the modules have a relatively large mass
compared to conventional surface-mount components. To
optimize the pick-and-place process, automated vacuum
equipment variables such as
nozzle size, tip style, vacuum pressure, and placement
speed should be considered. Surface-mount versions of this
family have a flat surface which serves as a
pick-and-place location for automated vacuum equipment.
The module’s pick-and-place location is identified in Figure
49.
Figure 49. Pick and Place Location.
Z Plane Height
The 'Z' plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, they have a relatively
large mass when compared with conventional SMT compo-
nents. Variables such as nozzle size, tip style, vacuum pres-
sure and placement speed should be considered to optimize
this process.
The minimum recommended no zzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component spacing,
is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
For further information ple ase contact your local Lineage
Power Technical Sales Representative.
Reflow Soldering Information
The HW006 family of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT) soldering.
These power modules are large mass, low thermal resis-
tance devices and typically heat up slower than other SMT
components. It is recommended that the customer review
data sheets in o r de r t o customize the solder reflow profile for
each application board assembly.
The following instructions must be observed when SMT sol-
dering these units. Failure to observe these instructions may
result in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
The surface mountable modules in the HW006 family use our
newest SMT tech no l og y cal l e d "C o l umn Pin" (CP) conne c-
tors. Figure 50 shows the new CP connector before and after
reflow soldering onto the end-board assemb ly.
Figure 50. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an integral
solder ball attached, which is composed of tin/lead (Sn/Pb)
solder. The CP connector design is able to compensate for
large amounts of co-planarity and still ensure a reliable SMT
solder joint.
Typically, the eutectic so lder melts at 183oC, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power module s can be re liably sol-
dered using natural forced convection, IR (radiant infrared),
or a combination of convection/IR. For reliable soldering the
solder reflow profile should be established by accurately
measuring the modules CP connector temperatures.
X
21mm
(0.84in)
14mm
(0.57in)
HW006 Board
Insulator
Solder Ball
End assembly PCB
Lineage Power 19
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Figure 51. Recomme nded Reflow profile.
Figure 52. Time Limit curve above 2050C.
Lead Free Soldering
The -Z version SMT modules of the HW/HC series ar e lead-
free (Pb-free) and RoHS compliant and are compatible in a
Pb-free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/
Reflow Sensitivity Classification for Nonhermetic Solid S tate
Surface Mount Devices) for both Pb-free solder profiles and
MSL classification procedures. This standard provides a rec-
ommended forced-air-convecti on reflow profile based on the
volume and thickness of the package (table 4-2). The sug-
gested Pb-free solder paste is Sn/Ag/Cu (SAC). The recom-
mended linear reflow profile using Sn/Ag/Cu solder is shown
in Figure. 53.
MSL Rating
The HW series SMT modules have a MSL rating of 1.
Storage and Handling
The recommende d storage environment and handling proce-
dures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed pack-
ages should not be broken until time of use. Once the origi-
nal package is broken, the floor li fe of the product at
conditions of < 30°C and 60% relative humidity varies accord-
ing to the MSL rating (see J-STD-033A). The shelf life for dry
packed SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following conditions: <
40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Solderi ng and
Cleaning Application Note (AP01-056EPS).
Figure 53. Recommend ed linear reflow profile us in g Sn/
Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These require-
ments state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the ope n frame power module
is C00 (per J specification).
0
50
100
150
200
250
300
REFL OW TIME (S)
Preheat zone
max 4
o
Cs
-1
Soak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Cooling
zone
1-4
o
Cs
-1
T
lim
above
205
o
C
200
205
210
215
220
225
230
235
240
0
10
20
30
40
50 60
TIME (S)
Per J-STD-02 0 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating
Zone
Peak Temp
* Min. Time
A bove 235°C
*Time Above
217°C
Cooling
Zone
Lineage Power 20
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Outline Diagram for Surface-Mount Module
Dimensions are in millime ters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
29.5
(1.16)
2.54
(0.100)
min stand-off
height
0.5
(.020)
max
compliance
VO+VO-TRIM
26.16
(1.030)
5.00
(0.197)
VI+VI-
35.00
(1.375)
8.50
(0.335)
MAX
47.2
(1.86)
T
op View
S
ide View
B
ottom View
0.06 x 0.0
6
chamffe
r
On/Off
3.6
(0.14)
1.7
(0.07)
40.00
(1.575)
Lineage Power 21
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Outline Diagram for Through-Hole Module
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
Lineage Power 22
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
Recommended Pad Layout for Surface-Mount Module
and Recommended Hole Layout for Through-Hole Module
Component-side footprint.
Dimensions are in millimeters and (inches), unless oth erwise noted.
2
9.46 (1.160)
2
7.84 (1.096)
1.68 (0.066)
0 (0)
0 (0)
32.56 (1.282)
20.73 (0.816)
0 (0)
0 (0)
3.63 (0.143
)
8.64 (0.340
)
38.63 (1.52
1)
43.64 (1.71
8)
47.24 (1.86
0)
NOTES:
1. FOR CGA SURFACE MOUNT PIN
USE THE FOLLOWING PAD
0.022" DIA VIA
0.032" DIA SOLDER MASK OPENING
4 PLACES FOR OUTPUT PINS
2 PLACES FOR INPUT PINS
0.025" SPACING VIA TO PAD
0.015" MIN SOLDER MASK WALL
0.105" PASTE MASK OPENING
0.110" SOLDER MASK OPENING
KEEP-OUT AREA:
Besides trace to ON/OFF pin,
do not route other traces on the
PWB top layer closest to the
power module in this keep-out are
a.
Document No: ADS02-006EPS ver.1.4
PDF Name: fds03-0031.pdf
Data Sheet
June 26, 200936-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
HW006/010/012 Series Power Modules; dc-dc Converters
World Wide He adquar ters
Lin e age P o w er Corp ora tio n
3000 Sky l i ne Dri ve, Mesquite, TX 75149, USA
+1-800-526-7819
(Outsid e U.S.A .: +1-972-284-2626)
www.li nea gepower.com
e -m a il: techsupport1@l ine agepower.com
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Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Ta ble 1. Device Codes
Optional features can be ordered using the suffixes shown below . The suffixes follow the last letter of the Product Code and are
placed in descending alphanumerical order.
Table 2. Device Options
Input Voltage Output
Voltage Output
Current Efficiency Connector Type Device Code Comcodes
36 – 75 Vdc 1.2 V 12 A 82 Through-Hole HW012A0P1 108965591
36 – 75 Vdc 1.5 V 12 A 83 Through-Hole HW012A0M1 108968389
36 – 75 Vdc 1.8 V 12 A 85 Through-Hole HW012A0Y1 108968405
36 – 75 Vdc 2.5 V 10 A 89 Through-Hole HW010A0G1 108968421
36 – 75 Vdc 3.3 V 10 A 90 Through-Hole HW010A0F1 108965625
36 – 75 Vdc 3.3 V 10 A 90 Through-Hole HW010A0F1Z CC109107141
36 – 75 Vdc 5.0 V 6 A 91 Through-Hole HW006A6A1 108968363
36 – 75 Vdc 5.0 V 6 A 91 Through-Hole HW006A6A1Z CC109107133
36 – 75 Vdc 1.2 V 12 A 82 SMT HW012A0P1-S 108965617
36 – 75 Vdc 1.2 V 12 A 82 SMT HW012A0P1-SZ 109100360
36 – 75 Vdc 1.5 V 12 A 83 SMT HW012A0M1-S 108968371
36 – 75 Vdc 1.5 V 12 A 83 SMT HW012A0M1-SZ CC109101805
36 – 75 Vdc 1.8 V 12 A 85 SMT HW012A0Y1-S 108968397
36 – 75 Vdc 1.8 V 12 A 85 SMT HW012A0Y1-SZ 109100377
36 – 75 Vdc 2.5 V 10 A 89 SMT HW010A0G1-S 108968413
36 – 75 Vdc 3.3 V 10 A 90 SMT HW010A0F1-S 108967985
36 – 75 Vdc 3.3 V 10 A 90 SMT HW010A0F1-SZ 108995214
36 – 75 Vdc 5.0 V 6 A 91 SMT HW006A6A1-S 108968355
36 – 75 Vdc 5.0 V 6 A 91 SMT HW006A6A-S CC109142155
36 – 75 Vdc 5.0 V 6 A 91 SMT HW006A6A1-SZ 109100352
Option Suffix
Negative remote on/off logic 1
Approved for Basic Insulation –B
Surface mount interconnections –S
RoHS Compliant -Z
