
SPE-11-8-136/F/SS | page 11 of 12
5. Recommended Reflow Soldering Profile
AP.10H can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC
J-STD-020C, the temperature profile suggested is as follows:
The graphic shows temperature profile for component assembly process in reflow ovens
Soldering Iron condition: Soldering iron temperature 270°C±10°C.
Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering
iron temperature over 270°C±10°C or 3 seconds, it will make cause component surface peeling or damage.
Phase Profile Features Pb-Free Assembly (SnAgCu)
PREHEAT Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(ts) from (Tsmin to Tsmax)
150°C
200°C
60-120 seconds
RAMP-UP Avg. Ramp-up Rate (Tsmax to TP) 3°C/second(max)
REFLOW Temperature(TL)
Total Time above TL (tL)
217°C
30-100 seconds
PEAK Temperature (TP)
Time (tp)
260°C
2-5 seconds
RAMP-DOWN Rate 3°C/second(max)
Time from 25°C to Peak Temperature 8 minutes max.
Composition of solder paste 96.5Sn/3Ag/0.5Cu
Solder Paste Model SHENMAO PF606-P26
Temperature
Time
Time 25°C to Peak
Tsmin
Tsmax
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
25
Tp
TL
-5°C
tL
Tc
ts
Preheat Area
tP