SFH 3600
1Version 1.5 | 2018-08-08
Produktdatenblatt | Version 1.1
www.osram-os.com
SFH 3600
MIDLED®
Silicon NPN Phototransistor in MIDLED package
Applications
—Gesture Recognition
—Industrial Automation (Machine Controls, Light
Barriers, Vision Controls)
—Remote Control, Proximity, Ambient Light Sens-
ing
Features:
—Package: clear silicone
—Qualications: The product qualication test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Qualication for Automotive Grade Discrete Semiconductors.
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—Toplooker
—Narrow half angle (± 20°)
—Spectral range of sensitivity: (typ) 500 ... 1100 nm
—Low prole component (1,6 mm)
—Emitter in same package (SFH 46xx) available
Ordering Information
Type Photocurrent Ordering Code
VCE = 5 V;
λ
= 950 nm; Ee = 0.1 mW/cm²
IPCE
SFH 3600-Z 100 ... 500 µA Q65110A1573
SFH 3600-2/3 100 ... 320 µA Q65110A2665
SFH 3600-3/4-Z 160 ... 500 µA Q65110A2666
Only one bin within one packing unit (variation less than 2:1)
SFH 3600
2Version 1.5 | 2018-08-08
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating temperature Top min.
max.
-40 °C
100 °C
Storage temperature Tstg min.
max.
-40 °C
100 °C
Collector-emitter voltage VCE max. 35 V
Collector current ICmax. 15 mA
Collector surge current
τ ≤ 10 µs
ICS max. 75 mA
Emitter-collector voltage VEC max. 7 V
Total power dissipation Ptot max. 130 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
SFH 3600
3Version 1.5 | 2018-08-08
Characteristics
TA = 25 °C
Parameter Symbol Values
Wavelength of max sensitivity
λ
S max typ. 990 nm
Spectral range of sensitivity
λ
10% typ. 500 ... 1100
nm
Chip dimensions L x W typ. 0.35 x 0.35
mm x mm
Radiant sensitive area A typ. 0.04 mm²
Half angle
φ
typ. 20 °
Dark current
VCE = 20 V; E = 0
ICE0 typ.
max.
1 nA
50 nA
Rise time
IC = 1 mA; VCC = 5 V; RL = 1 kΩ
trtyp. 45 µs
Fall time
IC = 1 mA; VCC = 5 V; RL = 1 kΩ
tftyp. 45 µs
Collector-emitter saturation voltage 1)
IC = IPCE,min X 0.3; Ee = 0.1 mW/cm²
VCEsat typ. 150 mV
Capacitance
VCE = 5 V; f = 1 MHz; E = 0
CCE typ. 1.3 pF
Thermal resistance junction ambient real 2) RthJA max. 340 K / W
Thermal resistance junction solder point real RthJS max. 180 K / W
Grouping
TA = 25 °C
Group Photocurrent Photocurrent
VCE = 5 V;
λ
= 950 nm; Ee = 0.1 mW/cm² VCE = 5 V;
λ
= 950 nm; Ee = 0.1 mW/cm²
min. max.
IPCE IPCE
2 100 µA 200 µA
3 160 µA 320 µA
4 250 µA 500 µA
SFH 3600
4Version 1.5 | 2018-08-08
400
0
20
40
S
rel
80
60
%
100
λ
OHF02405
500 600 700 800 900 nm 1100
10
30
50
70
Relative Spectral Sensitivity 3), 4)
Srel = f (
λ
), axial direction
OHF02432
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
Directional Characteristics 3), 4)
Srel = f (
φ
)
SFH 3600
8Version 1.5 | 2018-08-08
Pad 1: collector The package is casted with silicone. Mechanical stress at the surface of the unit should be avoided.
Recommended Solder Pad 5)
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
SFH 3600
9Version 1.5 | 2018-08-08
Prole Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the specied peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulllment for the whole T-range
Taping 5)
SFH 3600
10 Version 1.5 | 2018-08-08
Tape and Reel 6)
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel dimensions [mm]
A W Nmin W1W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 2000
SFH 3600
11 Version 1.5 | 2018-08-08
Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 5)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
SFH 3600
12 Version 1.5 | 2018-08-08
Transportation Packing and Materials 5)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of transportation box in mm
Width Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
SFH 3600
13 Version 1.5 | 2018-08-08
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specied in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding eect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal lled materials including silver.
Metal lled materials can be aected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
SFH 3600
14 Version 1.5 | 2018-08-08
Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please nd the latest version in the OSRAM OS Webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales oce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-specic request between OSRAM OS and Buyer and/or Customer.
SFH 3600
15 Version 1.5 | 2018-08-08
Glossary
1) IPCEmin: IPCEmin is the min. photocurrent of the specied group.
2) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each
3) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reect statistical gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
4) Testing temperature: TA = 25°C
5) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specied with ±0.1 and
dimensions are specied in mm.
6) Tape and Reel: All dimensions and tolerances are specied acc. IEC 60286-3 and specied in mm.
SFH 3600
16 Version 1.5 | 2018-08-08
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
