IP4264CZ8-10-TTL - NXP - Product.Network

1. Product profile

1.1 General description

The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel

RC low-p ass filter arrays. They are designed to provide filtering of undesired RF signals in

the 800 MHz-to-3 000 MHz frequen cy band. They incor porate diodes to pr ovide protection

to downstream components from ElectroStatic Discharge (ESD) voltages up to 25 kV

contact and higher than 25 kVair discharge, far exceeding IEC 61000-4-2, level 4.

The devices support ESD protection of the USB data pins of a Universal Subscriber

Identity Module (USIM) interface, as well as the digital standard SIM interface

ESD protection and ElectroMagnetic Interface (EMI) filtering.

The devices are fabricated using monolithic silicon technology. They integrate three

resistors and eight high-level ESD protection diodes in a 0.4 mm pitch Quad Flat-pack

No-leads (QFN) plastic package with a height of only 0.5 mm. These features make all

three devices ideal for use in applications requiring component miniaturization, such as

mobile phone handsets, cordless telephones and personal digit al devices.

Similar products are available in Wafer Level Chip-Size Package (WLCSP).

IP4365CX11/P (0.4 mm pitch, 11-ball WLCSP11) is designed for USIM interfaces.

IP4364CX8 (0.4 mm pitch, 8-ball WLCSP8) and

IP4064CX8 (0.5 mm pitch, 8-ball WLCSP8) are designed for SIM interfaces.

1.2 Features and benefits

Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen

and antimony (Dark Green compliant)

3-channel SIM card interface integrated RC-filter array and SIM voltage

ESD protection

2 USIM (USB 1.1) compliant ESD protection diodes with 20 pF channel capacitance

Integrated 100 /100 /47  series channel resistors

Total channel capacitance of 10 pF (IP4264CZ8-10-TTL), 20 pF (IP4264CZ8-20-TTL)

or 40 pF (IP4264CZ8-40-TTL)

Downstream ESD protection up to 25 kV (contact) according to IEC 61000-4-2

Micropak (QFN compatible) plastic package with 0.4 mm pitch

1.3 Applications

SIM interfaces in for example, cellular phone and Personal Communication

System (PCS) mobile handsets

IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card p assive filter array with ESD protection

Rev. 2 — 12 October 2011 Product data sheet

Product data sheet Rev. 2 — 12 October 2011 2 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

2. Pinning information

3. Ordering information

4. Marking

Table 1. Pinning

Pin Description Simplified outline Graphic symbol

1 and 8 filter channel 1

2 and 7 filter channel 2

3 and 6 filter channel 3

4 and 5 ESD protection

GND ground

Transparent

top view

018aaa015

100 Ω

47 Ω

100 Ω

Table 2. Ordering information

Type number Package

Name Description Version

IP4264CZ8-10-TTL HUSON8 plastic thermal enhanced extremely thin small outline package;

no leads; 8 terminals; body 1.35 1.7 0.55 mm SOT1166-1

IP4264CZ8-20-TTL

IP4264CZ8-40-TTL

Table 3. Marking codes

Type number Marking code

IP4264CZ8-10-TTL N1

IP4264CZ8-20-TTL N2

IP4264CZ8-40-TTL N4

Product data sheet Rev. 2 — 12 October 2011 3 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

5. Limiting values

[1] All devices are qualified using 1000 contact discharges of 8 kV (IP4264CZ8-10-TTL and

IP4264CZ8-20-TTL) or 25 kV (IP4264CZ8-40-TTL) using the IEC 61000-4-2 model, far exceeding the

specified IEC 61000-4-2, level 4 (8 kV contact discharge).

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

IP4264CZ8-10-TTL

VESD electrostatic discharge

voltage pins 1, 2 and 3 to ground [1]

contact discharge 10 +10 kV

air discharge 15 +15 kV

pins 6, 7 and 8 to ground [1]

contact discharge 8+8kV

air discharge 15 +15 kV

pins 5 and 6 to ground [1]

contact discharge 15 +15 kV

air discharge 15 +15 kV

IP4264CZ8-20-TTL

VESD electrostatic discharge

voltage all pins to ground [1]

contact discharge 15 +15 kV

air discharge 15 +15 kV

IP4264CZ8-40-TTL

VESD electrostatic discharge

voltage all pins to ground [1]

contact discharge 25 +25 kV

air discharge 25 +25 kV

IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL

VESD electrostatic discharge

voltage IEC 61000-4-2, level 4;

all pins to ground

contact discharge 8+8kV

air discharge 15 +15 kV

VIinput voltage at I/O pins 0.5 +5.5 V

Pch channel power

dissipation Tamb =70C-60mW

Ptot total power dissipation Tamb =70C-180mW

Tstg storage temperature 55 +150 C

Treflow(peak) peak reflow

temperature tp10 s - 260 C

Tamb ambient temperature 30 +85 C

Product data sheet Rev. 2 — 12 October 2011 4 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

6. Characteristics

[1] Guaranteed by design.

[2] Total line capacitance including diode capacitance, per channel.

[3] Pins 4 and 5 to ground.

Table 5. Channel resistance

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Rs(ch) channel series

resistance R1, R3 85 100 115 

R2 40 47 54 

Table 6. Channel characteristics

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

IRM reverse leakage

current VI=3V - - 50 nA

VBR breakdown voltage Itest =1mA 6 - 10 V

IP4264CZ8-10-TTL

Cch channel capacitance f = 1 MHz [1][2]

Vbias(DC) = 0 V 8 10 12 pF

Vbias(DC) =2.5V 4 6 8 pF

Cddiode capacitance f = 1 MHz [1][3]

Vbias(DC) = 0 V 8 10 12 pF

Vbias(DC) =2.5V 4 6 8 pF

IP4264CZ8-20-TTL

Cch channel capacitance f = 1 MHz [1][2]

Vbias(DC) = 0 V - 17 20 pF

Vbias(DC) =2.5V - 11 15 pF

IP4264CZ8-40-TTL

Cch channel capacitance f = 1 MHz [1][2]

Vbias(DC) = 0 V - 35 40 pF

Vbias(DC) = 2.5 V - 23 28 pF

IP4264CZ8-20-TTL and IP4264CZ8-40-TTL

Cddiode capacitance f = 1 MHz [3]

Vbias(DC) =0V 12 16 20 pF

Vbias(DC) =2.5V 8 11 14 pF

Product data sheet Rev. 2 — 12 October 2011 5 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

7. Application information

7.1 Insertion loss

The devices are designed as EMI/Radio Frequency Interference (RFI) filters for SIM card

interfaces. The setup for measuring return loss is shown in Figure 1.

The insertion loss in a 50  system for all three channels of

IP4264CZ8-10-TTL (Cch = 10 pF) is shown in Figure 2. The same measurements for

IP4264CZ8-20-TTL (C ch = 20 pF) are shown in Figure 3. The insertion loss for

IP4264CZ8-40-TTL (C ch = 10 pF) is shown in Figure 4.

Cch =10pF

(1) Pin 2 to 7

(2) Pin 1 to 8

(3) Pin 3 to 6

Fig 1. Frequency response setup Fig 2. IP4264CZ8-10-TTL: Frequency response

curves

018aaa016

50 Ω

Vgen

50 Ω

DUT OUTIN

TEST BOARD

018aaa145

–20

–30

–10

S21

(dB)

–40

f (MHz)

10–1 104

103

110

(1)

(2)

(3)

Product data sheet Rev. 2 — 12 October 2011 6 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

Cch =20pF

(1) Pin 2 to 7

(2) Pin 1 to 8

(3) Pin 3 to 6

Cch =40pF

(1) Pin 2 to 7

(2) Pin 1 to 8

(3) Pin 3 to 6

Fig 3. IP4264CZ8-20-TTL: Frequency response

curves Fig 4. IP4264CZ8-40-TTL: Fre qu ency response

curves

018aaa017

−20

−30

−10

S21

(dB)

−40

f (MHz)

10−1104

103

110

(1)

(2)

(3)

018aaa018

−20

−30

−10

S21

(dB)

−40

f (MHz)

10−1104

103

110

(1)

(2)

(3)

Product data sheet Rev. 2 — 12 October 2011 7 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

7.2 Crosstalk

The setup for mea su rin g cro ss talk betwee n ch an ne ls in a 50  system is shown in

Figure 5. The crosstalk for IP4264CZ8-10-TTL is shown in Figure 6, for

IP4264CZ8-20-TTL in Figure 7 and for IP4264CZ8-40-TTL in Figure 8. Unused channels

are terminated with a 50  resistor to ground.

The crosstalk between any pin and pin 4 and pin 5 is similar to the crosstalk between the

channels.

Cch =10pF

(1) Pin 1 to 7

(2) Pin 2 to 6

(3) Pin 3 to 8

Fig 5. Crosstalk measurement setup Fig 6. IP4264CZ8-10-TTL: Crosstalk behavior

018aaa019

50 Ω

Vgen

50 Ω

DUT OUT2IN1

TEST BOARD

50 Ω

OUT1

50 Ω

IN2

018aaa146

–60

–30

S21

(dB)

–90

f (MHz)

10–1 104

103

110

(1)

(2)(3)

Product data sheet Rev. 2 — 12 October 2011 8 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

Cch =20pF

(1) Pin 1 to 7

(2) Pin 2 to 6

(3) Pin 3 to 8

Cch =40pF

(1) Pin 1 to 7

(2) Pin 2 to 6

(3) Pin 3 to 8

Fig 7. IP4264CZ8-20-TTL: Cros stalk behavior Fig 8. IP4264CZ8-40-TTL: Crosstalk behavior

018aaa020

−60

−40

−80

−20

S21

(dB)

−100

f (MHz)

10−1104

103

110

(1)

(2)

(3)

018aaa021

−60

−40

−80

−20

S21

(dB)

−100

f (MHz)

10−1104

103

110

(1)

(2)

(3)

Product data sheet Rev. 2 — 12 October 2011 9 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

7.3 USIM and SIM interface application schematic

The application schematic diagram depicted in Figure 9 demonstrates how the three

NXP SIM card EMI filter and ESD protection devices are used in a typical USIM interface

application.

For example, in case a standard SIM interface without USB 1.1 is used, the two single

diodes (pins 4 and 5) can protect the VSIM line.

It is only one example depende nt on la yout con straint s. For example, cha nnels 1 to 8 can

be swapped with channels 3 to 6.

Also, the USB interface ESD pr otection pins 4 and 5 can be exchanged. Due to both sides

of the devices containing identical protection diodes, ba seband an d SIM card side can be

swapped, too (pin 1 with pin 8, pin 2 with pin 7 etc.).

A standard SIM interface application is depicted in Figure 10. In this case, both

ESD protection diodes (pins 1 and 8) are used to protect VSIM.

Fig 9. USIM application schematic

BASEBAND

VSIM

RST

CLK

CENTER GROUND PAD

SIM CARD

D+

D–

USB

VSIM

protection

diode

I/O

100 Ω

47 Ω

018aaa147

VCC GND

RST SPU

AUX 1 AUX 2

CLK I/O

Product data sheet Rev. 2 — 12 October 2011 10 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

7.4 Compatible devices in WLCSP

The IP4264CZ8-10-TTL and IP4264CZ8-20-TTL are optimized for SIM and USIM

interfaces. Comparab le de vic es ar e also av aila ble in WLCSP:

•IP4064CX8, 0.5 mm pitch SIM interface device compatible with IP4264CZ8-20-TTL

•IP4364CX8, 0.4 mm pitch SIM interface device compatible with IP4264CZ8-20-TTL

•IP4366CX8/P, 0.4 mm pitch SIM interface device compatible with IP4264CZ8-10-TTL

•IP4365CX11/P, 0.4 mm pitch USIM interface device compatible with

IP4264CZ8-10-TTL

Fig 10. SIM application schematic

CENTER GROUND PAD

SIM CARD

BASEBAND

VSIM

RST

CLK

I/O

100 Ω

47 Ω

018aaa148

VCC GND

RST SPU

AUX 1 AUX 2

CLK I/O

Product data sheet Rev. 2 — 12 October 2011 11 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

8. Package outline

Fig 11. Package outline SOT1166-1 (HUSON8)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT1166-1 - - -

- - -

sot1166-1_po

10-03-18

10-03-22

Unit(1)

mm max

nom

min

0.55 0.05

0.00

0.25

0.20

0.15

1.8

1.7

1.6

1.3

1.2

1.1

1.45

1.35

1.25 0.4 1.2 0.30

0.25

0.20 0.05

Dimensions

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads;

8 terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-1

A1c

0.127

bDD

hEE

0.45

0.40

0.35

0.2

0.1

0.05

0 1 2 mm

scale

tiebars are indicated on

arbitrary location and size

detail X

A1c

terminal 1

index area

terminal 1

index area

eAC B

vCw

Product data sheet Rev. 2 — 12 October 2011 12 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

9. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

IP4264CZ8-10_20_40-TTL v.2 20111012 Product data sheet - IP4264CZ8-10_20_40-TTL v.1

Modifications: •Figure 2: corrected title

•Section 10 “Legal information”: updated

IP4264CZ8-10_20_40-TTL v.1 20110708 Product data sheet - -

Product data sheet Rev. 2 — 12 October 2011 13 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond tho se described in the

Product data sheet.

10.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from competent authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development .

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 12 October 2011 14 of 15

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

10.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors IP4264CZ8-10/20/40-TTL

Integrated (U)SIM card passive filter array with ESD protection

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 12 October 2011

Document identifier : I P42 64CZ8-10_20_4 0-TTL

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Application information. . . . . . . . . . . . . . . . . . . 5

7.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.2 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.3 USIM and SIM interface application

schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

7.4 Compatible devices in WLCSP. . . . . . . . . . . . 10

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

11 Contact information. . . . . . . . . . . . . . . . . . . . . 14

12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15