
UPR5e3, UPR10e3, UPR15e3
2.5 Amp Hi
h Efficienc
Ultrafast Rectifier
DESCRIPTION
The Microsemi UPR5e3, UPR10e3, and UPR15e3 Powermite® high
efficiency rectifiers are RoHS compliant and offers optimized forward
voltage characteristics with reverse blocking capabilities up to 150 Volts.
They are ideal for surface mount applications that operate at high
frequencies.
In addition to its size advantages, Powermite® package features include a
full metallic bottom that eliminates possibility of solder flux entrapment
during assembly and a unique locking tab acts as an efficient heat path
from die to mounting plane for external heat sinking with very low thermal
resistance junction to case (bottom). Its innovative design makes this
device ideal for use with automatic insertion equipment.
IMPORTANT: For the most current data, consult MICROSEMI’ s website: http://www.microsemi.com
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value Unit
Working Peak Reverse Voltage UPR5e3
Working Peak Reverse Voltage UPR10e3
Working Peak Reverse Voltage UPR15e3
VRWM
VRWM
VRWM
50
100
150
V
V
V
Average Rectified Output Current (at rated
VRWM, TC =75ºC) Io2.5 A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half-sine wave IFSM 25 A
Storage Temperature TSTG -55 to +150 ºC
Junction Temperature TJ-55 to +150 ºC
KEY FEATURES
Low thermal resistance DO-216 package for
higher current operation
Utrasfast recovery time of 25 ns
RoHS Compliant with e3 suffix part number
Efficient heat path with Integral locking
bottom metal tab
Low forward voltage
Full metallic bottom eliminates flux
entrapment
WWW.Microsemi .COM
Compatible with automatic insertion
Low profile-maximum height of 1mm
Options for screening in accordance with
MIL-PRF-19500 for JAN, JANTX, JANTXV,
and JANS are available by adding MQ, MX,
MV, or MSP prefixes respectively to part
numbers. For example, designate
MXUPR5e3 for a JANTX (consult factory for
Tin-Lead plating).
Optional 100% avionics screening available
by adding MA prefix for 100% temperature
cycle, thermal impedance and 24 hours
HTRB (consult factory for Tin-Lead plating)
APPLICATIONS/BENEFITS
Switching and Regulating Power Supplies.
Charge Pump Circuits
Reduces reverse recovery loss with low IRM
Small 8.45 mm2 foot print
(See mounting pad details next page)
MECHANICAL & PACKA G I N G
• CASE: Void-free transfer molded
thermosetting epoxy compound meeting
UL94V-0
• FINISH: Annealed matte-Tin plating over
copper and readily solderable per MIL-
STD-750 method 2026 (consult factory for
Tin-Lead plating)
• POLARITY: See figure (left)
• MARKING: UPR5e3: R05•
UPR10e3: R10•
UPR15e3: R15•
• WEIGHT: 0.016 grams (approx.)
• Package dimension on last page
THERMAL CHARACTERISTIC S
(UNLESS OTHERWISE SPECIFIED)
Thermal Resistance
Junction-to-case (bottom) RθJC 10 ºC/ Watt
Junction-to-ambient (1) RθJA 240 ºC/ Watt
DO-216
See further details and dimensions on last page
(1) When mounted on FR-4 PC board using 1 oz copper with recommended m i nimum foot print
U
UP
PS
S1
14
40
0E
E3
3
• Tape & Reel option: 12 mm tape per
Standard EIA-481-B, 3000 on 7 inch reel
and 12,000 on 13” reel
Microsemi
Copyright © 2005
10-20-2005 Rev A
Page 1