AO4452 100V N-Channel MOSFET SDMOS TM General Description Product Summary The AO4452 is fabricated with SDMOSTM trench technology that combines excellent RDS(ON) with low gate charge.The result is outstanding efficiency with controlled switching behavior. This universal technology is well suited for PWM, load switching and general purpose applications. VDS ID (at VGS=10V) 100V 8A RDS(ON) (at VGS=10V) < 25m RDS(ON) (at VGS = 7V) < 31m 100% UIS Tested 100% Rg Tested SOIC-8 Top View D D D Bottom View D D G G S S S S Absolute Maximum Ratings TA=25C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS TA=25C Continuous Drain Current C Units V 25 V 8 ID TA=70C Maximum 100 6.5 A IDM 57 Avalanche Current C IAR 28 A Repetitive avalanche energy L=0.1mH C TA=25C EAR 39 mJ Pulsed Drain Current Power Dissipation B TA=70C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Lead Rev 3: May 2012 3.1 PD TJ, TSTG Symbol t 10s Steady-State Steady-State W 2 RJA RJL www.aosmd.com -55 to 150 Typ 31 59 16 C Max 40 75 24 Units C/W C/W C/W Page 1 of 6 AO4452 Electrical Characteristics (TJ=25C unless otherwise noted) Symbol Parameter STATIC PARAMETERS Drain-Source Breakdown Voltage BVDSS IDSS Zero Gate Voltage Drain Current Conditions Min ID=250A, VGS=0V 100 10 TJ=55C 50 IGSS Gate-Body leakage current VDS=0V, VGS= 25V Gate Threshold Voltage VDS=VGS ID=250A 2 ID(ON) On state drain current VGS=10V, VDS=5V 60 nA 4 V 20.5 25 36 43 VGS=7V, ID=6.5A 25 31 m 1 V 5 A TJ=125C A gFS Forward Transconductance VDS=5V, ID=8A 23 VSD Diode Forward Voltage IS=1A,VGS=0V 0.66 IS Maximum Body-Diode Continuous Current DYNAMIC PARAMETERS Input Capacitance Ciss Crss Reverse Transfer Capacitance Rg Gate resistance Gate Source Charge S 1400 1770 2200 pF 115 165 215 pF 33 55 80 pF VGS=0V, VDS=0V, f=1MHz 0.3 0.65 1.0 14 28 42 nC 4 9 14 nC 10 14 nC VGS=10V, VDS=50V, ID=8A Qgd Gate Drain Charge tD(on) Turn-On DelayTime tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf Turn-Off Fall Time trr 11 16 21 42 60 78 trr IF=8A, dI/dt=500A/s Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge IF=8A, dI/dt=500A/s IF=8A, dI/dt=100A/s Body Diode Reverse Recovery Time 21 27 33 Qrr Body Diode Reverse Recovery Charge IF=8A, dI/dt=100A/s 20 28 36 Qrr m VGS=0V, VDS=50V, f=1MHz SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qgs A 100 Static Drain-Source On-Resistance Output Capacitance Units 3.2 VGS=10V, ID=8A Coss Max V VDS=100V, VGS=0V VGS(th) RDS(ON) Typ 6 VGS=10V, VDS=50V, RL=6, RGEN=3 12 ns 4 ns 17 ns 5 ns ns nC ns nC A. The value of RJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25C. The value in any given application depends on the user's specific board design. B. The power dissipation PD is based on TJ(MAX)=150C, using 10s junction-to-ambient thermal resistance. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150C. Ratings are based on low frequency and duty cycles to keep initialTJ=25C. D. The RJA is the sum of the thermal impedence from junction to lead RJL and lead to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300s pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150C. The SOA curve provides a single pulse rating. COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev 3: May 2012 www.aosmd.com Page 2 of 6 AO4452 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 60 60 8V 10V 50 7V 40 40 30 ID(A) ID (A) VDS=5V 50 6.5V 125C 30 20 20 25C 10 10 VGS=6V 0 0 0 1 2 3 4 3 5 5 6 7 2.2 Normalized On On-Resistance 40 35 VGS=7V RDS(ON) (m ) 4 VGS(Volts) Figure 2: Transfer Characteristics (Note E) VDS (Volts) Fig 1: On-Region Characteristics (Note E) 30 25 VGS=10V 20 15 2 VGS=10V ID=8A 1.8 1.6 1.4 1.2 VGS=7V ID=6.5A 1 17 5 2 10 0.8 10 0 6 0 12 18 24 30 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage (Note E) 25 50 75 100 125 150 0 175 Temperature (C) 18Temperature Figure 4: On-Resistance vs. Junction (Note E) 45 1.0E+02 ID=8A 1.0E+01 40 125C 125C IS (A) RDS(ON) (m ) 40 1.0E+00 35 30 1.0E-01 1.0E-02 25 25C 25C 1.0E-03 20 1.0E-04 15 6 8 9 10 VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage (Note E) Rev 3: May 2012 7 1.0E-05 www.aosmd.com 0.0 0.2 0.4 0.6 0.8 1.0 1.2 VSD (Volts) Figure 6: Body-Diode Characteristics (Note E) Page 3 of 6 AO4452 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 10 2500 VDS=50V ID=8A Ciss 2000 Capacitance (pF) VGS (Volts) 8 6 4 1500 1000 Crss 2 500 0 Coss 0 0 5 10 15 20 25 Qg (nC) Figure 7: Gate-Charge Characteristics 30 0 20 40 60 80 VDS (Volts) Figure 8: Capacitance Characteristics 100 IAR (A) Peak Avalanche Current 100 100.0 ID (Amps) TA=25C TA=100C 100s 1.0 1ms TA=150C TJ(Max)=150C TA=25C 0.1 TA=125C 10s RDS(ON) limited 10.0 10ms DC 10s 0.0 10 0.01 0.000001 0.00001 0.0001 0.001 Time in avalanche, tA (s) Figure 9: Single Pulse Avalanche capability (Note C) 0.1 1 10 100 VDS (Volts) Figure 10: Maximum Forward Biased Safe Operating Area (Note F) 10000 TA=25C Power (W) 1000 100 10 1 0.00001 0.001 0.1 10 1000 Pulse Width (s) Figure 11: Single Pulse Power Rating Junction-to-Ambient (Note F) Rev 3: May 2012 www.aosmd.com Page 4 of 6 AO4452 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS Z JA Normalized Transient Thermal Resistance 10 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse D=Ton/T TJ,PK=TA+PDM.ZJA.RJA 1 RJA=75C/W 0.1 PD 0.01 Single Pulse Ton T 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 Pulse Width (s) Figure 12: Normalized Maximum Transient Thermal Impedance (Note F) 300 15 di/dt=800A/s di/dt=800A/s 125C 250 1.6 125C 150 6 trr 25C 1.2 trr (ns) 12 S 9 25C Irm (A) 16 200 125C 20 12 Irm Qrr (nC) 2 24 0.8 8 100 125C 3 Qrr 4 25C 50 0 0 5 10 15 20 25 25C 0 30 0 IS (A) Figure 13: Diode Reverse Recovery Charge and Peak Current vs. Conduction Current 150 30 25C Irm 0 0 200 400 600 800 125C Is=20A 2 25C S 15 10 2 5 -2 0 1000 di/dt (A/ s) Figure 15: Diode Reverse Recovery Charge and Peak Current vs. di/dt Rev 3: May 2012 3 20 6 30 30 40 10 Qrr 0 25 trr (ns) 14 125C 20 IS (A) Figure 14: Diode Reverse Recovery Time and Softness Factor vs. Conduction Current 25 22 18 90 15 trr Irm (A) Qrr (nC) 25C 10 30 125C 120 60 5 26 Is=20A 0.4 S www.aosmd.com 125C 25C 1 S 0 0 200 400 600 800 1000 di/dt (A/ s) Figure 16: Diode Reverse Recovery Time and Softness Factor vs. di/dt Page 5 of 6 AO4452 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC - DUT Vgs Ig Charge Resistive Switching Test Circuit & Waveforms RL Vds Vds Vgs 90% + Vdd DUT VDC - Rg 10% Vgs Vgs td(on) tr td(off) ton tf toff Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L 2 EAR= 1/2 LIAR Vds BVDSS Vds Id + Vdd Vgs Vgs I AR VDC - Rg Id DUT Vgs Vgs Diode Recovery Test Circuit & Waveforms Q rr = - Idt Vds + DUT Vgs Vds Isd Vgs Ig Rev 3: May 2012 L Isd + Vdd t rr dI/dt I RM Vdd VDC - IF Vds www.aosmd.com Page 6 of 6