GaAs Beam Lead Schottky Barrier Diodes MA4E2037, MA4E2039, MA4E2040
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Specifications subject to change without notice.
V3.001
Electrical S
ecifications @ TA = +25°C MA4E2037 MA4E2039 MA4E2040
Single Anti -pa r al l e l Seri e s Tee
Symbol Paramete rs and Test C onditions Units Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
CjJunction Capacitance at 0V at 1 MHz pF - .020 - - .0203--.020
3
CtTotal Capacitance at 0V at 1 MHz 1pF .040 .050 .060 0.403.0503.0603.0403.0503.0603
CtTotal Capacitance Difference pF - - - - - - - .005 .010
RsSeries Resistance at +10mA2Ohms - 4 7 - 4 7 - 4 7
Vf1 Forward Voltage at +1mA Volts .60 .70 .80 .60 . 70 .80 .60 .70 .80
VfForward Voltage Difference at 1mA Volts - - - - .005 .010 - .005 .010
Vbr Reverse Breakdown Voltage at -10µAVolts 4.5 7 - - - - 4.5 7 -
1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.
2. Series resistance is determined by measuring the dynamic resistance and subtracting the junction resistance of 2.6 ohms at +10 mA.
3. Capacitance for the MA4E2039 and MA4E2040 is per Schottky diode.
Handlin
Procedures
The following precautions should be observed to avoid damag-
ing these chips:
Cleanliness:
These devices should be handled in a clean environment. Do not
attempt to clean die a f te r installa tion.
Static Sensitivity:
Schottky barrier diodes are ESD sensitive and can be damaged
by static electricity. Proper ESD techniques should be used
when handling these devices.
General Handling:
These devices have a polymer layer which provides scratch
protection for the junction ar ea and the anode air bridge. Beam
lead devices must, however, be handled with care since the leads
may easily be distorted or broken by the normal pressures
exerted when handled by tweezers. A vacuum pencil with a #27
tip is recommended for picking and placing. A sharpened
wooden stick which has been dipped in isopropyl alcohol may
also be used as a pick and place tool.
Mountin
Techni
ues
These devices are designed to be inserted onto hard or soft
substrates. Recommended methods of attachment include ther-
mocompression bonding, parallel-gap welding, solder reflow
and conductive epoxy.
See Application Note M541, “Bonding and Handling Proce-
dures for Chip Diode De v ic es” for Detaile d Instruc tions.
0.00
0.01
0.10
1.00
10.00
100.00
0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00
FORWARD VOLTAGE (V)
FORWARD CURRENT (mA)
T = 125oC
T = 25oC
T = -50oC
T
ical Forward Characteristics