INTRODUCTION
Fast and easy breadboarding of circuits using the PA62DK
is possible with the EK55 evaluation kit. The EK55 includes
both the universal EVAL36 board and the EVAL55 substrate.
The use of EVAL36 and EVAL55 allows for a large area of
breadboarding space to work with while allowing a surface
mount substrate for the PA62DK. The PA62DK amplifier may be
surface mounted directly to the EVAL55, a thermally conductive
but electrically isolated substrate. The PA62DK is soldered to
a DUT foil footprint area the size of the heatslug as shown in
Figure 1. The metal substrate is cost effective and can allow
the PA62DK to dissipate power up to the datasheet rating.
Part# Description Quantity
EVAL36 Universal PC Board 1
EVAL55 Evaluation substrate, PA62DK 1
TSM-116-01-T-SV Terminal Strip, 16 PIN 2
SSW-116-01-T-S Socket Strip, 16 PIN 2
PCE2055CT-ND CAP, 47uF, 50V 4
OX7R105KWN Cap, 200V, 1uF, Ceramic 4
*031606 5V, 10mA, 3.4°C/W
heatsink with fan, AAVID 1
* Parts are not supplied. Parts are application dependant.
Suggested part numbers are provided.
Figure 1
BEFORE YOU GET STARTED
• All Apex amplifiers should be handled using ESD precau-
tion.
• Review the Apex product datasheet and operating condi-
tions.
• Always provide the appropriate heat sinking. Power dis-
sipation must be considered to ensure maximum junction
temperature (TJ) is not exceeded.
• Always use adequate power supply bypass capacitors, Apex
recommends at least 10µF per amp of output current.
• Do not change connections while the circuit is powered
• In case -Vs is disconnected before +Vs, a diode between
-Vs and ground is recommended to avoid damage.
• Initially set all power supplies to the minimum operating
levels allowed in the product datasheet.
• Check for oscillations up to and above the unity gain band-
width of the amplifier.
ASSEMBLY
The PA62DK is a surface mount device and should be
assembled to the EVAL55 substrate using surface mount
processes. Solder paste may be dispensed or screen-printed
on the DUT pads. The heat slug on the back of the PA62DK
provides maximum heat dissipation capabilities when soldered
to the foil footprint area. The PA62DK should be reflowed
to the substrate using a solder reflow furnace. If this is not
available, a heat plate capable of solder reflow temperatures
may be used.
Once the amplifier is mounted on the top
of the substrate, the heat sink fan or selected
heat sink can then be mounted to the back
of the substrate. A heat sink is not supplied
with the kit, but several options are available
through AAVID Thermal Product, Inc. High
thermal conductive thermal grease should
be used when mounting the heat sink fan or
heat sink to the evaluation board.
Review Figure 2 on next page for other
possible assembly methods to construct this
evaluation kit.
NOTE: All grounds must be tied together
on the EVAL36 board.
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
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Figure 2
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
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EVALUATION KIT FOR
PA62DK
EK55
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
EK55U REV A JULY 2003 © 2003 Apex Microtechnology Corp.
