www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GF_1100SF_0712
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Gap Filler 1100SF (Two-Part)
Thermally Conductive, Silicone-Free, Liquid Gap Filling Material
Gap Pad®: U.S. Patent 5,679,457 and others
Features and Benefits
• Thermal conductivity: 1.1 W/m-K
• No silicone outgassing or extraction
• Ultra-conforming, designed for fragile and
low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
Gap Filler 1100SF is the thermal solution for
silicone-sensitive applications.The material is
supplied as a two-part component, curing at
room or elevated temperatures.The material
exhibits low modulus properties then cures
to a soft, flexible elastomer, helping reduce
thermal cycling stresses during operation and
virtually eliminating stress during assembly of
low-stress applications.
The two components are colored to assist
as a mix indicator (1:1 by volume).The mixed
system will cure at ambient temperature.
Unlike cured thermal pad materials, the liquid
approach offers infinite thickness variations with
little or no stress during assembly displacement.
Gap Filler 1100SF, although exhibiting some
natural tack characteristics, is not intended for
use in thermal interface applications requiring
a mechanical structural bond.
Application
Gap Filler 1100SF can be mixed and dispensed
using dual-tube cartridge packs with static
mixers and manual or pneumatic gun or high
volume mixing and dispensing equipment
(application of heat may be used to
reduce viscosity).
Typical Applications Include:
• Silicone-sensitive optic components • Hard disk assemblies
• Silicone-sensitive electronics • Dielectric for bare-leaded devices
• Filling various gaps between heat-generating devices to heat sinks and housings
• Mechanical switching relay
Configurations Available:
• Supplied in cartridge or kit form
Building a Part Number Standard Options
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GF1100SF = Gap Filler 1100SF Material
GF1100SF 00 240 400cc NA
Note: To build a
p
art number, visit our website at www.ber
gq
uistcom
p
an
y
.com.
00 = No spacer beads
07 = 0.007" spacer beads
Pot Life: 240 = 240 minutes
Cartridges: 50cc=50.0cc, 400cc = 400.0cc
Kits: 1200cc = 1200.0cc, or 10G = 10 gallon
– – – –
TYPICAL PROPERTIES OF GAP FILLER 1100SF
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A Yellow Yellow Visual
Color / Part B Red Red Visual
Viscosity as Mixed (cps) (1) 450,000 450,000 ASTM D2196
Density (g/cc) 2.0 2.0 ASTM D792
Mix Ratio 1:1 1:1 —
Shelf Life @ 25°C (months) 6 6 —
PROPERTY AS CURED
Color Orange Orange Visual
Hardness (Shore 00) (2) 60 60 ASTM D2240
Heat Capacity (J/g-K) 0.9 0.9 ASTM E1269
Continuous Use Temp (°F) / (°C) -76 to 257 -60 to 125 —
ELECTRICAL AS CURED
Dielectric Strength (V/mil) 400 400 ASTM D149
Dielectric Constant (1000 Hz) 5.0 5.0 ASTM D150
Volume Resistivity (Ohm-meter) 1010 1010 ASTM D257
Flame Rating V-O V-O U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K) 1.1 1.1 ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (3) 240 min (4 hr) 240 min (4 hr) —
Cure @ 25°C (hrs) (4) 24 24 —
Cure @ 100°C (min) (4) 10 10 —
1) Brookfield RV, Heli-Path, Spindle TF @ 2 rpm, 25°C.
2) Thirty second delay value Shore 00 hardness scale.
3) Time for viscosity to double.
4) Cure schedule (rheometer - time to read 90% cure)
TEMPERATURE DEPENDENCE OF VISCOSITY
The viscosity of the Gap Filler 1100SF material is tempera-
ture dependent.The table below provides the multiplication
factor to obtain viscosity at various temperatures.To obtain
the viscosity at a given temperature, look up the multiplica-
tion factor at that temperature and multiply the corre-
sponding viscosity at 25°C.
Temperature Multiplication Factor
°C Part A Part B
20 1.43 1.57
25 1.00 1.00
35 0.58 0.50
45 0.39 0.30
50 0.32 0.24
Example - Viscosity of Part A @ 45°:
Viscosity of Part A at 25°C is 450,000 cp. The multipli-
cation factor for part A at 45°C is 0.39. Therefore:
(450,000) x (0.39) = 175,500 cps
