CM1401-03CP - ON Semiconductor

March, 2011 − Rev. 4

1Publication Order Number:

CM1401−03/D

CM1401-03

4-Channel ESD/EMI Filter

Array Plus 4-Channel ESD

Array for USB

Product Description

The CM1401−03 is a multichannel array with four low−pass filter

+ ESD channels and four ESD−only channels. The CM1401−03

reduces EMI/RFI emissions on a data port and protects against ESD on

a USB port. Each EMI/RFI channel integrates a high quality pi−style

filter (C−R−C) that provides greater than 30 dB attenuation in the

800−2700 MHz range relative to the pass band attenuation. These

pi−style filters are bidirectional, controlling EMI both to and from a

data port connector.

The CM1401−03 provides a high−level of ESD protection on all

eight channels for sensitive electronic components that may be

subjected to electrostatic discharge (ESD). The input pins safely

dissipate ESD strikes of ±15 kV, exceeding the maximum requirement

of the IEC 61000−4−2 international standard. Using the

MIL−STD−883 (Method 3015) specification for Human Body Model

(HBM) ESD, the device provides protection for contact discharges to

greater than ±30 kV.

The CM1401−03 is particularly well suited for portable electronics

(e.g., cellular telephones, PDAs, notebook computers) because of its

small package footprint and low weight.

The CM1401−03 incorporates OptiGuardt coating for improved

reliability at assembly and comes in a space−saving, low−profile Chip

Scale Package with RoHS−compliant lead−free finishing.

Features

•Functionally and Pin−Compatible with CSPEMI307A Device

•OptiGuardt Coated for Improved Reliability at Assembly

•Four Channels of Combined EMI/RFI Filtering + ESD Protection

•Four Additional Channels of ESD−Only Protection

•40 dB Absolute Attenuation (Typical) at 1 GHz

•35 dB Attenuation (Typical) at 1 GHz Relative to Pass Band

•±15 kV ESD Protection on All Channels

(IEC 61000−4−2 Level 4, Contact Discharge)

•±30 kV ESD Protection on All Channels (HBM)

•15−Bump, 2.960 mm X 1.330 mm Footprint

•Chip Scale Package (CSP) Features Extremely Low Lead Inductance

for Optimum Filter and ESD Performance

•These Devices are Pb−Free and are RoHS Compliant

Applications

•EMI Filtering and ESD Protection for Both Data and

I/O Ports

•Outer Four Channels Provide ESD Protection for

USB Lines and Other I/O Port Applications

•Wireless Handsets

•Handheld PCs / PDAs

•MP3 Players

•Notebooks

•Desktop PCs

MARKING DIAGRAM

Device Package Shipping†

ORDERING INFORMATION

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CSP−15

(Pb−Free)

3500/Tape & ReelCM1401−03CP

N013 = CM1401−03CP

M = Date Code

G= Pb−Free Package

(Note: Microdot may be in either location)

WLCSP15

CP SUFFIX

CASE 567BS

N013 MG

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

CM1401−03

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BLOCK DIAGRAM

FILTER + ESDn*

GND

(Pins B1−B3)

*See Package/Pinout Diagram for expanded pin information.

100 W

FILTER + ESDn*

1 of 4 EMI/RFI + ESD Channels.

30 pF 30 pF 30 pF

1 of 4 ESD−only Channels

ESDn*

Table 1. PIN DESCRIPTIONS

15−bump CSP Package

Pin Name Description

A1 ESD_1 ESD Channel 1

A2 FILTER + ESD_1 Filter + ESD Channel 1

A3 FILTER + ESD_2 Filter + ESD Channel 2

A4 FILTER + ESD_3 Filter + ESD Channel 3

A5 FILTER + ESD_4 Filter + ESD Channel 4

A6 ESD_2 ESD Channel 2

B1−B3 GND Device Ground

C1 ESD_3 ESD Channel 3

C2 FILTER + ESD_1 Filter + ESD Channel 1

C3 FILTER + ESD_2 Filter + ESD Channel 2

C4 FILTER + ESD_3 Filter + ESD Channel 3

C5 FILTER + ESD_4 Filter + ESD Channel 4

C6 ESD_4 ESD Channel 4

PACKAGE / PINOUT DIAGRAMS

Bottom View

(Bumps Up View)

Top View

(Bumps Down View)

N013

CM1401−03

CSP Package

Orientation

Marking

123

ESD_3

456

Orientation

Marking

C2 C3 C4 C5 C6

A2 A3 A4 A5 A6

B1 B3

FILTER+ESD_2 FILTER+ESD_4

FILTER+ESD_3FILTER+ESD_1 ESD_4

GND GND GND

ESD_1 FILTER+ESD_2 FILTER+ESD_4

FILTER+ESD_3FILTER+ESD_1 ESD_2

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range –65 to +150 °C

DC Power per Resistor 100 mW

DC Package Power Rating 600 mW

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range –40 to +85 °C

CM1401−03

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Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol Parameter Conditions Min Typ Max Units

R Resistance 80 100 120 W

C Capacitance At 2.5 V DC 24 30 36 pF

TCR Temperature Coefficient of Resistance 1200 ppm/°C

TCC Temperature Coefficient of Capacitance At 2.5 V DC −300 ppm/°C

VDIODE Diode Voltage (reverse bias) IDIODE = 10 mA6.0 V

ILEAK Diode Leakage Current (reverse bias) VDIODE = 3.3 V 100 nA

VSIG Signal Voltage

Positive Clamp

Negative Clamp

ILOAD = 10 mA

5.6

−1.5

6.8

–0.8

9.0

−0.4

VESD In−system ESD Withstand Voltage

a) Human Body Model, MIL−STD−883,

Method 3015

b) Contact Discharge per IEC 61000−4−2

Level 4

(Note 2)

±30

±15

VCL Clamping Voltage during ESD Discharge

MIL−STD−883 (Method 3015), 8 kV

Positive Transients

Negative Transients

(Notes 2 and 3)

+10

–5

fCCut−off Frequency

ZSOURCE = 50 W, ZLOAD = 50 W

R = 100 W, C = 30 pF

MHz

1. TA = 25°C unless otherwise specified.

2. ESD applied to input and output pins with respect to GND, one at a time.

3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping

voltage is measured at Pin C2.

CM1401−03

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PERFORMANCE INFORMATION

Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)

Figure 1. Insertion Loss vs. Frequency (A2−C2 to GND B2)

Figure 2. Insertion Loss vs. Frequency (A3−C3 to GND B2)

CM1401−03

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PERFORMANCE INFORMATION (Cont’d)

Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)

Figure 3. Insertion Loss vs. Frequency (A4−C4 to GND B2)

Figure 4. Insertion Loss vs. Frequency (A5−C5 to GND B2)

CM1401−03

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PERFORMANCE INFORMATION (Cont’d)

Typical Filter Performance (TA = 255C, 50 W Environment)

Figure 5. Comparison of Filter Response Curves for CM1401−03CS with DC Bias

CM1401−03

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PERFORMANCE INFORMATION (Cont’d)

Figure 6. Filter Capacitance vs. Input Voltage over Temperature

(normalized to capacitance at 2.5 VDC and 255C)

Figure 7. Resistance vs. Temperature

(normalized to resistance at 255C)

CM1401−03

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APPLICATION INFORMATION

Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS

Parameter Value

Pad Size on PCB 0.240 mm

Pad Shape Round

Pad Definition Non−Solder Mask defined pads

Solder Mask Opening 0.290 mm Round

Solder Stencil Thickness 0.125 − 0.150 mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round

Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish OSP (Entek Cu Plus 106A)

Tolerance − Edge To Corner Ball ±50 mm

Solder Ball Side Coplanarity ±20 mm

Maximum Dwell Time Above Liquidous (183°C) 60 seconds

Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C

Non−Solder Mask Defined Pad

0.240 mm DIA.

Solder Stencil Opening

0.300 mm DIA.

Solder Mask Opening

0.290 mm DIA.

Figure 8. Recommended Non−Solder Mask Defined Pad Illustration

Figure 9. Lead−free (SnAgCu) Solder Ball Reflow Profile

CM1401−03

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PACKAGE DIMENSIONS

WLCSP15, 2.96x1.33

CASE 567BS−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

DIM

MIN MAX

0.56

MILLIMETERS

D2.96 BSC

b0.29 0.35

eD 0.50 BSC

0.65

ÈÈ

PIN A1

REFERENCE

A0.05 BC

0.03 C

0.05 C

15X b

456

0.05 C

0.21 0.27

1.33 BSC

eE 0.435 BSC

0.25

15X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

0.87

0.44

0.05 C

2X TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.40 REF

RECOMMENDED

PACKAGE

OUTLINE

123 789

PITCH

eD/2

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

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PUBLICATION ORDERING INFORMATION

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

CM1401−03/D

OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC).

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