VMMK-3313
15 - 33 GHz Directional Detector in SMT Package
Data Sheet
Description
The VMMK-3313 is a small and easy-to-use, broadband,
directional detector operating in various frequency bands
from 15 to 33 GHz with typical insertion loss of 0.5 dB. It is
housed in the Avago Technologies’ industry-leading and
revolutionary sub-miniature chip scale package (GaAsCap
wafer scale leadless package) which is small and ultra thin
yet can be handled and placed with standard 0402 pick
and place assembly equipment. The VMMK-3313 provides
a wide detecting power level from -5 to +30 dBm with
excellent input and output return losses. A typical of 15 dB
directivity is provided, and the detector requires only 1.5 V
DC biasing with small current drawn of 0.17 mA.
WLP0402, 1 mm x 0.5 mm x 0.25 mm
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model = 70 V
ESD Human Body Model = 350 V
Refer to Avago Application Note A004R:
Electrostatic Discharge, Damage and Control.
Pin Connections (Top View)
Note:
T = Device Code
“Y = Month Code
Features
 1 x 0.5 mm surface mount package
 Ultrathin (0.25 mm)
 Wide frequency range: 15 to 33 GHz
 Wide dynamic range
 Low Insertion loss
 Directivity: 11-18 dB typ.
 In and output match: 50 ohm
Speci cations (24 GHz, Vb = 1.5 V, Zin = Zout = 50 )
 Bias Current: 0.17 mA typical
 Insertion Loss: 0.5 dB
 Detector output o set voltage: 62 mV typical
 Detector Output voltage at +20 dBm: 1070 mV typical
Applications
 Point-to-Point Radio
 Monitoring Power Ampli er Output Power
 Power Control Loop Detector
TY
TY Output/
Vdet
Input/
Vbias
Input/
Vbias
Output/
Vdet
Detector
2
Electrical Speci cations
Table 1. Absolute Maximum Rating (1)
Sym Parameters/Condition Unit Absolute Max
Vbias Bias Voltage (RF Input) V 2
Ibias Bias Current mA 1
Pin, max CW RF Input Power (RF Input) (2) dBm +31
Tch Max Channel Temperature °C +150
Tstg Storage Temperature °C +150
Notes
1. Operation of this device above any one of these parameters may cause permanent damage
2. With the DC (typical bias) and RF applied to the device at board temperature, Tb = 25° C
Table 2. DC and RF Speci cations
TA = 25° C, Freq = 24 GHz, Vb = 1.5 V, Zin = Zout = 50 unless otherwise speci ed
Symbol Parameters / Condition Unit Min Typical Max
Ibias (1) Bias Current mA 0.11 0.17 0.25
I.L. (1) Insertion Loss
at 15 GHz
at 24 GHz
at 33 GHz
dB
0.3
0.5
0.7
IRL (1) Input Return Loss dB 20
ORL (1) Output Return Loss dB 20
Dir (2) Directivity
at 15 GHz
at 24 GHz
at 33 GHz
dB
11
18
12
Vo set (1,3) Detector Output O set Voltage mV 45 61 75
Vdet (4) Detector Output Voltage at +20 dBm mV 0.90 1.07 1.22
Notes
1. Measured data obtained from wafer-probing, losses from measurement system de-embedded from  nal data, Vbias = 1.5 V applied through a
broadband bias tee.
2. Measured by reversing the detector and applying RF power to the output port. Directivity is de ned as the di erence in dB between the power
applied in the forward direction and the power required in the reverse direction to produce the same Vdet voltage.
3. Vo set is measured with RF input power turned o .
4. Vdet is measured with +20 dBm RF input power at 22 GHz.
3
Product Consistency Distribution Charts at 24 GHz, Vbias = 1.5 V
Ibias: Mean = 0.17 mA, LSL = 0.11 mA, USL = 0.25 mA Vo set: Mean = 61 mV, LSL = 45 mV, USL = 75 mV
Vdet_On @ Pin = +20 dBm: Mean = 1.07 V, LSL = 0.9 V, USL = 1.22 V
7050 60
LSL USL
LSL USL
LSL USL
0.11 0.13 0.15 0.17 0.19 0.250.21 0.23
120011001000900
Notes:
Distribution data sample sized is based on at least 36 Kpcs taken from
MPV lots.
Future wafers allocated to this product may have nominal values
anywhere between the upper and lower limits.
4
VMMK-3313 Typical Performance
S-parameter data obtained using 300 m G-S-G probe substrate; bias was brought in via broadband bias tees. Power vs.
Vdet data obtained using CPW PCB (Fig.8). Losses calibrated out to the package reference plane.
(T
A = 25° C, Vbias = 1.5 V, Ibias = 0.14 mA, Zin = Zout = 50 unless otherwise speci ed)
Figure 1. Vdet vs. Input Power Figure 2. Insertion Loss vs. Frequency
Figure 3. Input Return Loss Figure 4. Output Return Loss
Figure 5. Pin vs. Vdet Over Temperature at 24 GHz Figure 6. Pin vs. Vdet Over Vbias at 24 GHz
0.01
0.1
1
10
-10 -5 0 5 10 15 20 25 30
Pin (dBm)
Output DC Voltage (V)
-0.8
-0.6
-0.4
-0.2
0.0
10 15 20 25 30 35
Frequency (GHz)
S21 (dB)
-40
-30
-20
-10
0
10 15 20 25 30 35
Frequency (GHz)
S22 (dB)
-30
-25
-20
-15
-10
-5
0
10 15 20 25 30 35
Frequency (GHz)
S11 (dB)
0.01
0.1
1
10
-10 -5 0 5 10 15 20 25 30
Pin (dBm)
Output DC Voltage (V)
15 GHz
24 GHz
33 GHz
1.5 V
1.2 V
1.8 V
0.01
0.1
1
10
-10 -5 0 5 10 15 20 25 30
Pin (dBm)
Output DC Voltage (V)
25° C
85° C
-40° C
5
Typical Scattering Parameters
Data obtained with 300 m G-S-G probing on 0.016 inch thick PCB substrate, broadband bias tees, losses calibrated out
to the package reference plane. TA = 25° C, Zin = Zout = 50 .
Freq
GHz
S11 S21 S12 S22
dB Mag Phase dB Mag Phase dB Mag Phase dB Mag Phase
2.0 -16.143 0.156 -90.494 -0.192 0.978 -0.747 -0.186 0.979 -0.679 -16.016 0.158 -93.644
3.0 -19.760 0.103 -96.650 -0.132 0.985 -8.728 -0.124 0.986 -8.670 -19.659 0.104 -105.358
4.0 -22.639 0.074 -100.139 -0.128 0.985 -15.231 -0.116 0.987 -15.156 -22.441 0.076 -116.420
5.0 -25.368 0.054 -99.264 -0.122 0.986 -21.092 -0.115 0.987 -21.017 -25.083 0.056 -130.972
6.0 -28.427 0.038 -93.825 -0.126 0.986 -26.725 -0.126 0.986 -26.669 -27.453 0.042 -151.611
7.0 -31.502 0.027 -78.538 -0.139 0.984 -32.188 -0.129 0.985 -32.126 -29.736 0.033 -178.623
8.0 -32.918 0.023 -48.363 -0.145 0.983 -37.503 -0.144 0.984 -37.516 -30.201 0.031 146.185
9.0 -31.634 0.026 -16.396 -0.169 0.981 -42.803 -0.155 0.982 -42.811 -29.020 0.035 115.496
10.0 -28.336 0.038 1.025 -0.174 0.980 -48.135 -0.171 0.981 -48.095 -26.897 0.045 90.525
11.0 -25.713 0.052 6.348 -0.191 0.978 -53.426 -0.185 0.979 -53.345 -24.672 0.058 75.623
12.0 -23.583 0.066 7.497 -0.204 0.977 -58.602 -0.208 0.976 -58.544 -23.312 0.068 62.771
13.0 -22.015 0.079 7.691 -0.225 0.974 -63.871 -0.226 0.974 -63.782 -21.841 0.081 52.793
14.0 -21.100 0.088 7.152 -0.247 0.972 -69.068 -0.240 0.973 -69.014 -21.002 0.089 44.150
15.0 -20.464 0.095 5.699 -0.261 0.970 -74.298 -0.261 0.970 -74.185 -20.612 0.093 34.963
16.0 -19.837 0.102 4.621 -0.288 0.967 -79.432 -0.279 0.968 -79.412 -20.070 0.099 26.214
17.0 -20.229 0.097 4.889 -0.302 0.966 -84.664 -0.300 0.966 -84.646 -20.473 0.095 19.684
18.0 -20.427 0.095 5.722 -0.311 0.965 -89.942 -0.308 0.965 -89.871 -21.130 0.088 12.443
19.0 -20.346 0.096 4.424 -0.331 0.963 -95.142 -0.334 0.962 -95.072 -21.190 0.087 3.542
20.0 -21.391 0.085 7.308 -0.346 0.961 -100.462 -0.345 0.961 -100.384 -22.651 0.074 -0.777
21.0 -22.441 0.076 10.427 -0.361 0.959 -105.667 -0.355 0.960 -105.641 -24.716 0.058 -5.533
22.0 -23.491 0.067 10.306 -0.377 0.958 -110.947 -0.376 0.958 -110.951 -25.900 0.051 -11.559
23.0 -25.304 0.054 23.895 -0.401 0.955 -116.285 -0.401 0.955 -116.288 -29.473 0.034 -2.535
24.0 -26.448 0.048 41.694 -0.416 0.953 -121.674 -0.419 0.953 -121.646 -34.943 0.018 31.366
25.0 -28.427 0.038 51.641 -0.453 0.949 -127.022 -0.455 0.949 -127.007 -35.189 0.017 74.893
26.0 -27.787 0.041 75.394 -0.472 0.947 -132.447 -0.476 0.947 -132.366 -29.168 0.035 83.707
27.0 -26.707 0.046 90.267 -0.505 0.944 -137.920 -0.505 0.944 -137.910 -25.547 0.053 87.920
28.0 -27.872 0.040 108.771 -0.517 0.942 -143.371 -0.519 0.942 -143.334 -25.161 0.055 86.868
29.0 -27.131 0.044 110.745 -0.550 0.939 -148.819 -0.546 0.939 -148.784 -22.722 0.073 68.734
30.0 -26.430 0.048 123.049 -0.576 0.936 -154.323 -0.582 0.935 -154.356 -21.650 0.083 61.896
31.0 -27.171 0.044 141.654 -0.614 0.932 -160.111 -0.612 0.932 -160.110 -21.300 0.086 51.421
32.0 -27.702 0.041 157.497 -0.643 0.929 -165.730 -0.640 0.929 -165.797 -20.211 0.098 37.365
33.0 -27.412 0.043 175.942 -0.665 0.926 -171.312 -0.664 0.926 -171.290 -19.404 0.107 18.402
34.0 -23.414 0.068 -159.594 -0.722 0.920 -177.364 -0.715 0.921 -177.358 -19.437 0.107 -1.031
35.0 -21.351 0.086 -142.243 -0.726 0.920 176.755 -0.724 0.920 176.769 -18.062 0.125 -17.686
36.0 -19.164 0.110 -145.966 -0.812 0.911 170.964 -0.814 0.911 171.148 -17.329 0.136 -32.214
37.0 -16.815 0.144 -142.957 -0.866 0.905 164.889 -0.887 0.903 165.274 -16.340 0.152 -48.123
38.0 -15.080 0.176 -138.352 -1.004 0.891 159.328 -0.935 0.898 159.556 -15.396 0.170 -62.771
39.0 -14.239 0.194 -142.217 -1.047 0.886 153.991 -1.022 0.889 154.016 -14.624 0.186 -72.930
40.0 -13.011 0.224 -143.357 -1.124 0.879 148.264 -1.084 0.883 148.305 -13.936 0.201 -85.368
6
VMMK-3313 Biasing Information
Biasing and Operation
The VMMK-3313 is a 3 terminal device consisting of a
“through 50 ohm line connecting directly between the RF
Input and RF Output ports and a directional coupler with a
full wave detector that provides a DC output proportional
to RF power input. As with any high frequency device,
good grounding is required on the common port under
the device for it to produce low loss in the “through mode.
A suggested PCB layout with appropriate grounding will
be cover later in this application section.
With only 3 terminals available, the DC bias and detected
voltage are internally DC coupled to the input and output
terminals respectively. The key to successful operation
of the VMMK-3313 is the use of low loss bias decoupling
networks connected to both the RF Input and the RF
Output ports. Figure 7 shows a simple biasing circuit.
The bias decoupling networks provide a low loss AC
coupled RF path to the device, a means of biasing the
device on the input, and a means of extracting the detected
voltage on the output of the device. The detector needs
2 DC blocking caps, C1 and C2, on the input and output
ports. This can be accomplished by printing coupled lines
on the PCB or using SMT capacitors (ATC 600 series) with
bias
detector
R1
C1
R2
C2
C4 R3
VdetVb
C3
RFin RFout
Component Description
C1, C2 0.2 pF to 0.4 pF
(ATC 600 or printed coupled lines)
R1 (Vb -1.5) / 0.00014
R2 10 k
C3, C4 1 pF
R3 External load resistor (optional)
Figure 7. Biasing the VMMK-3313 Detector Module
values chosen for the frequency of operation. All SMT
components are recommended to be no larger than 0402
size. Nominal bias voltage of 1.5 V or 0.14 mA is required
for proper operation. Biasing on the input is by a way of a
large value resistor R1. Its value can be computed using
the following equation:
R1 = (Vb -1.5)/0.00014
where Vb is the supply voltage.
Detected DC voltage is extracted on the output by a way
of a large value resistor R2, in the range of 10 k. Bypassing
capacitors C3 and C4 are needed to prevent RF in uence
on the dc lines. Suggested value for bypass capacitors is
1 pF.
At zero RF input power, and at 1.5 V supply bias, a nominal
63 mV o set voltage appears at the detected output port.
The internal output source resistance for the detector is
approximately 20 k. Resistor R3 can be used as an
external load resistor for the detector. Its value can be
optimized for the desired Vout vs. RF input curve.
Figure 8 shows a VMMK-3313 characterization PCB used
to obtain the Vdet vs. Input Power characterization data
from 15 to 33 GHz. For ease in broadband characteriza-
tion, two external 45 MHz – 50 GHz Bias Networks (HP
11612B) were used.
Figure 8. VMMK-3313 Characterization Board
7
S Parameter Measurements
The S-parameters are measured on a 0.016 inch thick
RO4003 printed circuit test board, using 300 m G-S-G
(ground signal ground) probes. Coplanar waveguide is
used to provide a smooth transition form the probes to
the device under test. The presence of the ground plane
on top of the test board results in excellent grounding
at the device under test. A combination of SOLT (Short –
Open – Load – Thru) and TRL (Thru – Re ect – Line) cali-
bration techniques are used to correct for the e ects of
the test board, resulting in accurate device S parameters.
Package and Assembly Notes
For detailed description of the device package and
assembly notes, please refer to Application Note 5378.
Ordering Information
Part Number
Devices Per
Container Container
VMMK-3313-BLKG 100 Antistatic Bag
VMMK-3313-TR1G 5000 7” Reel
Package Dimension Outline
CARRIER TAPE
USER FEED
DIRECTION
REEL
Reel Orientation Device Orientation
Dimensions
Symbol Min (mm) Max (mm)
E 0.500 0.585
D 1.004 1.085
A 0.225 0.275
Note:
All dimensions are in mm
A
E
D
TOP VIEW END VIEW
TY
TY
TY
TY
8 mm
4 mm
USER FEED DIRECTION
Notes:
T = Device Code
“Y = Month Code
ESD Precautions
Note: These devices are ESD sensitive. The following pre-
cautions are strongly recommended. Ensure that an ESD
approved carrier is used when die are transported from
one destination to another. Personal grounding is to be
worn at all times when handling these devices. For more
detail, refer to Avago Application Note A004R: Electro-
static Discharge Damage and Control.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-2916EN - April 25, 2011
Notice:
1. 10 Sprocket hole pitch cumulative tolerance is ±0.1 mm.
2. Pocket position relative to sprocket hole measured as true position
of pocket not pocket hole.
3. Ao & Bo measured on a place 0.3 mm above the bottom of the
pocket to top surface of the carrier.
4. Ko measured from a plane on the inside bottom of the pocket to
the top surface of the carrier.
5. Carrier camber shall be not than 1 m per 100 mm through a length
of 250 mm.
Unit: mm
Symbol Spec.
K1
Po 4.0±0.10
P1 4.0±0.10
P2 2.0±0.05
Do 1.55±0.05
D1 0.5±0.05
E 1.75±0.10
F 3.50±0.05
10Po 40.0±0.10
W 8.0±0.20
T 0.20±0.02
Note: 2
P2
Note: 1
Po
Do B
B
Note: 2
E
F
W
AA
P1 D1
R0.1
Ao
5° (Max)
Scale 5:1
AA SECTION
Ao = 0.73±0.05 mm
Bo = 1.26±0.05 mm
Ko = 0.35 +0.05 mm
+0
Scale 5:1
BB SECTION
5° (Max)
Bo
Ko
T
Tape Dimensions