Si1153 Data Sheet
Proximity/Ambient Light Sensor IC with I2C Interface
The Si1153-AA00/AA09/AA9x is an ambient light sensor, proximity, and gesture detec-
tor with I2C digital interface and programmable-event interrupt output.
This touchless sensor IC includes dual 23-bit analog-to-digital converters, an integrated
high-sensitivity array of visible and infrared photodiodes, a digital signal processor, and
three integrated LED drivers with programmable drive levels. The Si1153 offers excel-
lent performance under a wide dynamic range and a variety of light sources, including
direct sunlight. The Si1153 can also work under dark glass covers. The photodiode re-
sponse and associated digital conversion circuitry provide excellent immunity to artificial
light flicker noise and natural light flutter noise. With two or more LEDs, the Si1153 is
capable of supporting multiple-axis proximity motion detection. The Si1153 is provided in
a 10-lead 2x2 mm DFN package or in a 10-lead 2.9x4.9 mm LGA module with integra-
ted LED, and is capable of operation from 1.62 to 3.6 V over the –40 to +85 °C tempera-
ture range.
MUX
ADC1
ADC2
.
.
Signal
Processor
and
Control
Internal Osc.
ALS Photodiodes
LED
Drivers
I2C
Engine
INT
SCL
SDA
AD
Regulator
VDD
LED1
LED2 *
LED3 **
(Filter Only in
AA09 & AA9X
versions)
LIGHT
I2C addr sel
** Pull up to VDD with 47 kOhm resistor
* Pull up to VDD with 47 kOhm resistor to select primary I2C address (0x53),
or down to GND for alt I2C address 0x52.
940 nm Bandpass
Filter.
KEY FEATURES
• Proximity detector
•From under 1 cm, to 50 cm without
additional lensing.
• From under 1 cm, to 200 cm with
additional lensing (e.g., 5 mm
hemispherical lens as in our EVB).
• Up to three independent LED drivers.
• 30 current settings from 5.6 mA to 360
mA for each LED driver.
• Operates in direct sunlight with optional
on-die 940 nm passband filter.
• On die 940 bandpass filter that rejects
unwanted visible light and IR from
daylight and other sources (Si1153-
AA09/AA9X).
• Ambient light sensor
• <100 mlx resolution possible, allowing
operation under dark glass.
• Up to 128 klx dynamic range possible
across two ADC range settings.
• Industry’s lowest power consumption
• 1.62 to 3.6 V supply voltage.
• 9 μA average current (LED pulsed 25.6
μs every 800 ms at 180 mA plus 3 μA
Si1153 supply).
• <500 nA standby current.
• 25.6 μs LED “on” time keeps total power
consumption duty cycle low without
compromising performance or noise
community.
• Internal and external wake support.
• Built-in voltage supply monitor and
power-on reset controller.
APPLICATIONS
• Wearables
• Handsets
• Display backlighting control
• Consumer electronics
silabs.com | Building a more connected world. Rev. 1.1
1. Feature List
• Proximity detector
•From under 1 cm to 50 cm without additional lensing.
• From under 1 cm to 200 cm with additional lensing (e.g., 5
mm hemispherical lens).
• Up to three independent LED drivers.
• 30 current settings from 5.6 mA to 360 mA for each LED
driver.
• Operates in direct sunlight with optional on-die 940 nm
passband filter.
• On die 940 bandpass filter that rejects unwanted visible light
and IR from daylight and other sources (Si1153- AA09/
AA9X).
• Ambient light sensor
• <100 mlx resolution possible, allowing operation under dark
glass.
• Up to 128 klx dynamic range possible across two ADC
range settings.
• Industry’s lowest power consumption
•1.62 to 3.6 V supply voltage.
• 9 μA average current (LED pulsed 25.6 μs every 800 ms at
180 mA plus 3 μA Si1153 supply).
• <500 nA standby current.
• 25.6 μs LED “on” time keeps total power consumption duty
cycle low without compromising performance or noise com-
munity.
• Internal and external wake support.
• Built-in voltage supply monitor and power-on reset control-
ler.
• Trim-able internal oscillator with typical 1% accuracy.
•I2C Serial communications
• Up to 3.4 Mbps data rate.
• Slave mode hardware address decoding.
• Two package options:
• 10-lead 2 x 2 x 0.65 mm DFN
• 10-lead 2.9 x 4.9 x1.2 mm LGA module with integrated 940
nm LED
• Temperature Range: –40 to +85 °C
Si1153 Data Sheet
Feature List
silabs.com | Building a more connected world. Rev. 1.1 | 2
2. Ordering Guide
Table 2.1. Ordering Guide
Family DFN
OPNs
Package ALS 940 nm
Filter
Proximity
(# of LED Driv-
ers)
# of LEDs Inclu-
ded
Si1153 Si1153-AA00-GMR 2 x 2 mm DFN Y 3 0
Si1153 Si1153-AA09-GMR 2 x 2 mm DFN Y 3 0
Si1153 Si1153-AA9x-GMR 2.85 x 4.9 mm
LGA Module
Y 3 1
Si1153 Si1153-AA09-AMR
(AECQ100 qualified)
2 x 2 mm DFN Y 3 0
Si1153 Data Sheet
Ordering Guide
silabs.com | Building a more connected world. Rev. 1.1 | 3
3. Functional Description
The Si1153 is an active optical reflectance proximity detector, with ambient light sensors whose operational state is controlled through
registers accessible through the I2C interface. The host can command the Si1153 to initiate on-demand Ambient Light or proximity
measurements. The host can also place the Si1153 in an autonomous operational state where it performs measurements at set inter-
vals and interrupts the host either after each measurement is completed or whenever a set threshold has been crossed. This results in
overall system power saving, allowing the host controller to operate longer in its sleep state instead of polling the Si1153.
MUX
ADC1
ADC2
.
.
Signal
Processor
and
Control
Internal Osc.
ALS Photodiodes
LED
Drivers
I2C
Engine
INT
SCL
SDA
AD
Regulator
VDD
LED1
LED2 *
LED3 **
(Filter Only in
AA09 & AA9X
versions)
LIGHT
I2C addr sel
** Pull up to VDD with 47 kOhm resistor
* Pull up to VDD with 47 kOhm resistor to select primary I2C address (0x53),
or down to GND for alt I2C address 0x52.
940 nm Bandpass
Filter.
Figure 3.1. Functional Block Diagram
Figure 3.2. Si1153 DFN Package Basic Application
Si1153 Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 4
Figure 3.3. Si1153 LGA Module Basic Application
3.1 Ambient Light Sensing
The Si1153 has photodiodes capable of measuring visible and infrared light. However, the visible photodiode is also influenced by infra-
red light. The measurement of illuminance requires the same spectral response as the human eye. If an accurate lux measurement is
desired, the extra IR response of the visible-light photodiode must be compensated. Therefore, to allow the host to make corrections to
the infrared light’s influence, the Si1153 reports the infrared light measurement on a separate channel. The separate visible and IR
photodiodes lend themselves to a variety of algorithmic solutions. The host can then take these two measurements and run an algo-
rithm to derive an equivalent lux level as perceived by a human eye. Having the IR correction algorithm running in the host allows for
the most flexibility in adjusting for system-dependent variables. For example, if the glass used in the system blocks visible light more
than infrared light, the IR correction needs to be adjusted. Si1153 parts with the bandpass 940 nm filter cannot be used for ambient light
sensing.
If the host is not making any infrared corrections, the infrared measurement can be turned off in the CHAN_LIST parameter.
By default, the measurement parameters are optimized for indoor ambient light levels, where it is possible to detect low light levels. For
operation under direct sunlight, the ADC can be programmed to operate in a high signal operation so that it is possible to measure
direct sunlight without overflowing.
For low-light applications, it is possible to increase the ADC integration time. Normally, the integration time is 24.4 µs. By increasing this
integration time, the ADC can detect light levels as low as 100 mlx. The ADC integration time for the Visible Light Ambient measure-
ment can be programmed independently of the ADC integration time of the Infrared Light Ambient measurement. The independent ADC
parameters allow operation under glass covers having a higher transmittance to Infrared Light than Visible Light.
When operating in the lower signal range, or when the integration time is increased, it is possible to saturate the ADC when the ambient
light suddenly increases. Any overflow condition will have the corresponding data registers report a value of 0xFFddFF for 16-bit mode
and 0x7FFFFF for 24-bit mode. The host can adjust the ADC sensitivity to avoid an overflow condition. If the light levels return to a
range within the capabilities of the ADC, the corresponding data registers begin to operate normally.
The Si1153 can initiate ALS measurements either when explicitly commanded by the host or periodically through an autonomous proc-
ess. Refer to Section 4. Operational Modes for additional details.
Two ADCs can be used for simultaneous readings of the visible or proximity photodiode and black dark current reference photodiode.
When subtracted, these differential measurements remove dark current, reducing noise that enables lower light sensitivity.
Si1153 Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 5
3.2 Proximity Sensing
The Si1153 has been optimized for use as either a dual-port or single-port active reflection proximity detector. Over distances of less
than 50 cm, the dual-port active reflection proximity detector has significant advantages over single-port, motion-based infrared sys-
tems, which are only good for triggered events. Motion-based infrared detectors identify objects within proximity, but only if they are
moving. Single-port motion-based infrared systems are ambiguous about stationary objects even if they are within the proximity field.
The Si1153 can reliably detect an object entering or exiting a specified proximity field, even if the object is not moving or is moving very
slowly. However, beyond about 30–50 cm, even with good optical isolation, single-port signal processing may be required due to static
reflections from nearby objects, such as tables, walls, etc. If motion detection is acceptable, the Si1153 can achieve ranges of up to 50
cm, through a single product window.
For small objects, the drop in reflectance is as much as the fourth power of the distance. This means that there is less range ambiguity
than with passive motion-based devices. For example, a sixteen fold change in an object's reflectance means only a fifty-percent drop
in detection range.
The Si1153 can drive up to three separate infrared LEDs. When the three infrared LEDs are placed in an L-shaped configuration, it is
possible to triangulate an object within the three-dimensional proximity field. Thus, a touchless user interface can be implemented with
the aid of host software.
The Si1153 can initiate proximity sense measurements when explicitly commanded by the host or periodically through an autonomous
process.
Whenever it is time to make a PS measurement, the Si1153 makes up to six measurements, depending on what is enabled in the
CHLIST parameter. Other ADC parameters for these measurements can also be modified to allow proper operation under different am-
bient light conditions.
The LED choice is programmable for each of these six measurements. Each measurement can select which combination of 3 LEDs are
turned on and which of two LED current setting banks are used to set the LED currents. Optionally, each proximity measurement can
be compared against a host-programmable threshold. With threshold settings for each PS channel, it is also possible for the Si1153 to
notify the host whenever the threshold has been crossed. This reduces the number of interrupts to the host, aiding in efficient software
algorithms.
The Si1153 can also generate an interrupt after a complete set of proximity measurements, ignoring any threshold settings.
Si1153 Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 6
To support different power usage cases dynamically, the LED current of each output is independently programmable. The current can
be programmed anywhere from 5.5 to 354 mA. (See Table 8.8 Typical LED Current vs. LED Code on page 46.) Therefore, the host
can optimize for proximity detection performance or for power saving dynamically. This feature can be useful since it allows the host to
reduce the LED current once an object has entered a proximity sphere, and the object can still be tracked at a lower current setting.
Finally, the flexible current settings make it possible to control the infrared LED currents with a controlled current sink, resulting in high-
er precision. The ADC properties are programmable. For indoor operation, the ADC should be configured for low signal range for best
reflectance sensitivity. When under high ambient conditions, the ADC should be configured for high signal level range operation.
When operating in the lower signal range, it is possible to saturate the ADC when the ambient light level is high. Any overflow condition
is reported with a value of 0xFFFF for 16-bit mode and 0x7FFFFF for 24-bit mode. The host can then adjust the ADC sensitivity to
avoid an overflow condition. If the light levels return to a range within the capabilities of the ADC, the corresponding data registers begin
to operate normally.
The Si1153 can be configured with three different sizes of proximity photodiode to enable the highest sensitivity without saturation.
Proximity detection ranges beyond 50 cm can be achieved with lensing and by selecting a longer integration time. The detection range
may be increased further, even with high ambient light, by averaging multiple measurements.
The Si1153-AA09 version of the Si1153 is designed with an on die 940 nm bandpass filter. It is designed to reject sunlight and to pass
as much of the LED excitation energy as possible. 940 nm is selected as the operating wavelength since it corresponds to a dip in the
energy of the solar spectrum.
Figure 3.4. Typical Si1153-AA09 Filter Response Compared to the Sunlight Energy Spectrum
Si1153 Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 7
3.3 Power Consumption
The Si1153 alternates between three power consumption states: Active, Suspend, and Sleep. (See the diagram below for an illustrata-
tion of each of these states.) The total power consumed by the part depends heavily on the measurement rate, measurement mode,
and measurement gain for the various channels enabled. The power levels for the three modes, as well as the Active Power time per
reading, are provided in this document. The Suspend time (where the A/D and PD are operating) has two parts. One is determined by
the user setup and can be determined by the DECIM_RATE and HW_GAIN setup information in Section 7.2 Channel Specific Setup
Areas of the Parameter Table, while the other (A/D Startup time) is determined by tadstart, shown in Table 8.2 Electrical Performance
Characteristics on page 40.
Sleep Power
Sum is “Processing Time Per
Measurement” (tprocess
)
Suspend Power
(PD & A/D Active)
Reading Init.
Mid Reading Op
Reading Conclude
The A/D time (per
measurement) is determined
by the user’s configuration of
the parameter table.
This complete measurement is repeated at the
rates determined by the user’s configuration of
the parameter table.
Power
Time
Active Power
A/D startup time per
measurement is
determined by the
data sheet (tadstart)
A Phase B Phase
Figure 3.5. Power Consumption States During a Reading
Every A/D conversion has three periods:
155 μs at 4.5 mA (setup time by internal controller)
48.8 μs at 525 μA (setup time by A/D)
48.8 μs * (2HW_GAIN[3:0]) at 525 μA (Actual A/D time that will vary with integration time)
Si1153 Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 8
3.4 Host Interface
The host interface to the Si1153 consists of three pins:
•SCL
• SDA
• INT
SCL and SDA are standard open-drain pins as required for I2C operation.The Si1153 asserts the INT pin to interrupt the host process-
or. The INT pin is an open-drain output. A pull-up resistor is needed for proper operation. As an open-drain output, it can be shared with
other open-drain interrupt sources in the system.
For proper operation, the Si1153 is expected to fully complete its Initialization Mode prior to any activity on the I2C.
The default I2C address of the Si1153 can be changed by pulling the LED pin to ground. This changes the I2C address to 0x52 (the
default value is 0x53).
The INT, SCL, and SDA pins are designed so that it is possible for the Si1153 to enter the Off Mode by software command without
interfering with normal operation of other I2C devices on the bus.
Conceptually, the I2C interface allows access to the Si1153 internal registers.
An I2C write access always begins with a start (or restart) condition. The first byte after the start condition is the I2C address and a
read-write bit. The second byte specifies the starting address of the Si1153 internal register. Subsequent bytes are written to the Si1153
internal register sequentially until a stop condition is encountered. An I2C write access with only two bytes is typically used to set up the
Si1153 internal address in preparation for an I2C read.
The I2C read access, like the I2C write access, begins with a start or restart condition. In an I2C read, the I2C master then continues to
clock SCK to allow the Si1153 to drive the I2C with the internal register contents.The Si1153 also supports burst reads and burst writes.
The burst read is useful in collecting contiguous, sequential registers. The Si1153 register map was designed to optimize for burst
reads for interrupt handlers, and the burst writes are designed to facilitate rapid programming of commonly used fields, such as thresh-
olds registers.
The internal register address is a six-bit (bit 5 to bit 0) plus an Auto increment Disable (on bit 6). The Auto increment Disable is turned
off by default. Disabling the auto incrementing feature allows the host to poll any single internal register repeatedly without having to
keep updating the Si1153 internal address every time the register is read.
It is recommended that the host should read performance measurements (in the I2C Register Map) when the Si1153 asserts INT. Al-
though the host can read any of the Si1153’s I2C registers at any time, care must be taken when reading 2-byte measurements outside
the context of an interrupt handler. The host could be reading part of the 2-byte measurement when the internal sequencer is updating
that same measurement coincidentally. When this happens, the host could be reading a hybrid 2-byte quantity whose high byte and low
byte are parts of different samples. If the host must read these 2-byte registers outside the context of an interrupt handler, the host
should “double-check” a measurement if the measurement deviates significantly from a previous reading.
Si1153 Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 9
Figure 3.6. I2C Bit Timing Diagram
Figure 3.7. Host Interface Single Write
Figure 3.8. Host Interface Single Read
Figure 3.9. Host Interface Burst Write
Figure 3.10. Host Interface Burst Read
Figure 3.11. Si1153 REG ADDRESS Format
The following notes apply for the figures above:
1. Gray boxes are driven by the host to the Si1153.
2. White boxes are driven by the Si1153.
3. A = ACK or “acknowledge”.
4. N = NACK or “no acknowledge”.
5. S = START condition.
6. Sr = repeat START condition.
7. P = STOP condition.
8. AI = Disable Auto Increment when set.
Si1153 Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 10
4. Operational Modes
The Si1153 can be in one of many operational modes at any time. It is important to consider the operation mode, since the mode has
an impact on the overall power consumption of the Si1153. The various modes are:
• Off Mode
• Initialization Mode
• Standby Mode
• Forced Conversion Mode
• Autonomous Mode
4.1 Off Mode
The Si1153 is in the Off Mode when VDD is either not connected to a power supply or if the VDD voltage is below the stated VDD_OFF
voltage described in the electrical specifications. As long as the parameters stated in Table 8.7 Absolute Maximum Ratings on page
45 are not violated, no current will flow through the Si1153. In the Off Mode, the Si1153 SCL and SDA pins do not interfere with other
I2C devices on the bus. Ensure that none of the pins have a voltage larger than the voltage on the VDD pin. If VDD is grounded, for
example, then current flows from system power to system ground through the SCL, SDA, and INT pull-up resistors and the ESD protec-
tion devices. Allowing VDD to be less than VDD_OFF is intended to serve as a hardware method of resetting the Si1153 without a dedi-
cated reset pin.
The Si1153 can also re-enter the Off Mode upon receipt of a software reset sequence. Upon entering Off Mode, the Si1153 proceeds
directly from the Off Mode to the Initialization Mode.
4.2 Initialization Mode
When power is applied to VDD and is greater than the minimum VDD Supply Voltage stated in the electrical specification table, the
Si1153 enters its Initialization Mode. In the Initialization Mode, the Si1153 performs its initial startup sequence. Since the I2C may not
yet be active, it is recommended that no I2C activity occur during this brief Initialization Mode period. The “Start-up time” specification in
the electrical specification table is the minimum recommended time the host needs to wait before sending any I2C accesses following a
power-up sequence. After Initialization Mode has completed, the Si1153 enters Standby Mode. During the Initialization mode, the I2C
address selection is made according to whether LED2 is pulled up or down.
4.3 Standby Mode
The Si1153 spends most of its time in Standby Mode. After the Si1153 completes the Initialization Mode sequence, it enters Standby
Mode. While in Standby Mode, the Si1153 does not perform any Ambient Light measurements or Proximity Detection functions. Howev-
er, the I2C interface is active and ready to accept reads and writes to the Si1153 registers. The internal Digital Sequence Controller is in
its sleep state and does not draw much power. In addition, the INT output retains its state until it is cleared by the host.
I2C accesses do not necessarily cause the Si1153 to exit the Standby Mode. For example, reading Si1153 registers is accomplished
without needing the Digital Sequence Controller to wake from its sleep state.
4.4 Forced Conversion Mode
The Si1153 can operate in Forced Conversion Mode under the specific command of the host processor. The Forced Conversion Mode
is entered when the FORCE command is sent. Upon completion of the conversion, the Si1153 can generate an interrupt to the host if
the corresponding interrupt is enabled. It is possible to initiate both a proximity and ALS measurement.
4.5 Automated Operation Mode
The Si1153 can be placed in the Autonomous Operation Mode where measurements are performed automatically without requiring an
explicit host command for every measurement. The START command is used to place the Si1153 in the Autonomous Operation Mode.
The Si1153 updates the I2C registers for proximity and ALS automatically. The host can also choose to be notified when these new
measurements are available by enabling interrupts. The conversion frequency for autonomous operation is set up by the host prior to
the START command.
The Si1153 can also interrupt the host when the proximity or ALS measurement reach a pre-set threshold. To assist in the handling of
interrupts the registers are arranged so that the interrupt handler can perform an I2C burst read operation to read the necessary regis-
ters, beginning with the interrupt status register, and cycle through the various output registers.
Si1153 Data Sheet
Operational Modes
silabs.com | Building a more connected world. Rev. 1.1 | 11
5. User to Sensor Communication
5.1 Basic I2C Operation
I2C operation is dependent on serial I2C reads and writes to an addressable bank of memory referred to as I2C space. The diagram
below outlines the registers used, some functionality and the direction of data flow. The I2C address is initially fixed but can be program-
med to a new value. This new value is volatile and reverts to the old value on hardware or software reset. Only 7-bit I2C addressing is
supported; 10-bit I2C addressing is not supported. The Si1153 responds to the I2C address of 0x53 or to an alternate address of 0x52.
SDA
SCL
SDA
Engine
PART ID
MFR ID
REV ID
MCU
INPUT3 -> 0
COMMAND
RESPONSE_1
OUTPUT0 to 25
AND
OR INT
6
6
6
IRQ_EN
IRQ_STATUS
RESPONSE_0
Bit7: RUNNING
INFO_0 & 1 (SPARES)
CR
Sequencial Write Group
Sequencial Read Group
Part and Version ID Group
COMMAND_WR_INT Interrupt
Logic
OD
Bit6: SUSPEND
SFR
SPACE
5
I2C
SPACE
Bit5: SLEEP
Figure 5.1. I2C Interface Block Diagram
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 12
5.2 Relationship Between I2C Registers and Parameter Table
Note that most of the Si1153 configuration is accomplished through ‘Parameters’. The Si1153 has an internal MCU with SRAM. The
Parameters are stored in the Si1153 Internal MCU SRAM. The I2C Registers can be viewed as mailbox registers that form an interface
between the host and the internal MCU. The figure below shows the relationship between some of the key interface registers to the
internal Parameters managed by the internal MCU.
•The I2C registers are directly accessible by the host.
• The parameter table is:
• Accessible indirectly via the command register (and others).
• Used during setup to fix the operating modes of the Si1153.
• 0x2C bytes long and is read and written indirectly, one bye at a time, via the command register.
The data stored in the parameter table is volatile and is lost when the part is powered down or software reset command is sent to the
part via the I2C part.
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 13
Figure 5.2. Accessing Parameters through I2C Registers
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 14
5.3 I2C Command Register Operation
Writing the codes shown below in the command summary table signals the sensor to undertake one of several complex operations.
These operations take time and all commands should be followed by a read of the RESPONSE0 register to confirm the operation is
complete by examining the counter and to check for an error in the error bit. The error bit is set in the RESPONSE0 register’s command
counter if there is an error in the previous command (e.g., attempt to write to an illegal address beyond the parameter table, or a chan-
nel and /or burst configuration that exceeds the size of the output field (26 bytes)). If there is no such error, then the counter portion of
the command counter will be incremented.
The RESPONSE_0 register should be read after every command to determine completion and to check for an error. If an error is found,
which should not happen except for a host SW bug, the host should clear the error with a RESET command or a RESET_CMD_CTR
command.
One operating option is to do a RESET_CMD_CTR command before every command.
Two of the commands imply another I2C register contains an argument.
• STORE_NEW_I2C ADDR command implies a new address has been loaded in the parameter table location I2CID PARAMETER.
• PARAM_SET command implies a byte has been stuffed into INPUT0 register.
• The three CHAN_LIST commands imply the CHAN_LIST location in the parameter table has been configured. A valid CHAN_LIST
implies other configuration areas in the parameter table are correctly setup as well.
Two of the commands result in another I2C register containing return arguments (aside from incrementing RESPONSE0).
• PARAM_SET results in the write data being copied in to I2C RESPONSE1 register.
• PARAM_QUERY results in read data in the I2C RESPONSE1 register.
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 15
Table 5.1. Command Summary
Command Register Commands Code Input to Sensor Output of Sensor
RESET_CMD_CTR
Resets RESPONSE0 CMMND_CTR field to 0.
0x00 ----------- -----------
RESET_SW
Forces a Reset, Resets RESPONSE0
CMMND_CTR field to 0xXXX01111.
0x01 ----------- -----------
FORCE
Initiates a set of measurements specified in
CHAN_LIST parameter. A FORCE command will
only execute the measurements which do not
have a meas counter index configured in MEAS-
CONFIGx.
0x11 ----------- -----------
PAUSE
Pauses autonomous measurements specified in
CHAN_LIST.
0x12 ----------- -----------
START
Starts autonomous measurements specified in
CHAN_LIST. A START autonomous command will
only start the measurements which has a counter
index selected in MEASCONFIGx.
0x13 ----------- -----------
PARAM_QUERY
Reads Parameter xxxxxx and store results in RE-
SPONSE1.xxxxxx is a 6 bit Address Field (64
bytes).
0b01xxxxxx RESPONSE1 = result
PARAM_SET
Writes INPUT0 to the Parameter xxxxxx.xxxxxx is
a 6 bit Address Field (64 bytes).
0b10xxxxxx INPUT0 RESPONSE1 = INPUT0
Notes:
1. The successful completion of all commands except RESET_CMD_CTR and RESET_SW causes an increment of the CMD_CTR
field of the RESPONSE0 register (bits [3:0].
2. Resets RESPONSE0 CMMND_CTR field to 0.
3. Forces a Reset, Resets RESPONSE0 CMMND_CTR field to 0xXXX01111.
4. Uses CHAN_LIST in Parameter Space.
5. "xxxxxx" is a 6-bit Address Field (64 bytes).
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 16
5.3.1 Accessing the Parameter Table (PARAM_QUERY & PARAM_SET Commands)
The parameter table is written to by writing the INPUT_0 I2C register and the PARAM_SET command byte to the Command I2C regis-
ter. The format of the PARAM_SET word is such that the 6 LSBits contain the location of the target byte in the parameter table.
Example: To transfer 0xA5 to parameter table location 0b010101.
Read RESPONSE0 (address 0x11) and store the CMMND_CTR field.
Write 0xA5 to INPUT0 (address 0x0A).
Write 0b10010101 to COMMAND (address 0x0B).
Read RESPONSE0 (address 0x11) and check if the CMMND_CTR field incremented.
If there is no increment or error, repeat the “read the RESPONSE0” step until the CMMND_CTR has incremented. If there is an error
send a RESET or a RESET_CMD_CTR command.
The two write commands (to INPUT0 and COMMAND) can be in the same I2C transaction.
Example: To read data from the parameter table location 0b010101.
Read the RESPONSE0 (address 0x11) and store the CMMND_CTR field.
Write 0b01010101 to the COMMAND (address 0x0B).
Read RESPONSE0 (address 0x11) and check if the CMMND_CTR field incremented.
If there is no increment or error, repeat the “read RESPONSE0” step until the CMMND_CTR has incremented.
Read RESPONSE1 (address 0x10) this gives the read result. If there is an error send RESET or a RESET_CMD_CTR com-
mand.
The last two read commands (from RESPONSE0 and RESPONSE1) should not be in the same I2C transaction.
5.3.2 Sensor Operation Initiation Commands
The FORCE, PAUSE, and START commands make use of the information in CHAN_LIST. Configure CHAN_LIST prior to using any of
these commands.
5.3.3 RESET_CMD_CTR Command
Resets RESPONSE0 CMMND_CTR field and does nothing else.
5.3.4 RESET Command
Resets the sensor and puts it into the same state as when powering up. The parameter table and all I2C registers are reset to their
default values.
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 17
5.4 I2C Register Summary
The content of the three MSBits of Response0 after reset will depend on the running state (see the Response0 write up).
Table 5.2. I2C Registers
Register Name I2C Address Direction WRT
Host
Function Value after Reset
(Hard or Soft)
Direction WRT Sen-
sor
PART_ID 0x00 IN Returns DEVID
(0x53 for the
Si1153).
PART_ID OUT
HW_ID 0x01 IN Returns Hardware
ID.
HW_ID OUT
REV_ID 0x02 IN Hardware Rev
(0xMN).
REV_ID OUT
HOSTIN0 0x0A IN/OUT Data for parameter
table on PAR-
AM_SET write to
COMMAND register.
0x00 IN
COMMAND 0x0B IN/OUT Initiated action in
Sensor when specif-
ic codes written
here.
0x00 IN
IRQENABLE 0x0F IN/OUT The six least signifi-
cant bits enable In-
terrupt Operation.
0x00 IN
RESPONSE1 0x10 IN Contains the read-
back value from a
param query or a
param set com-
mand.
0x00 IN/OUT
RESPONSE0 0x11 IN The 5th MSB of the
counter is an error
indicator, with the 4
LSBits indicating the
error code when the
MSB is set.
0xXXXX1111 IN/OUT
IRQ_STATUS 0x12 IN The six least signifi-
cant bits show the
interrupt status.
0x00 IN/OUT
HOSTOUT0
to
HOSTOUT25
0x13
to
0x2C
IN Captured Sensor
Data. 0x00 IN/OUT
5.4.1 PART_ID
I2C Address = 0x00;
Contains Part ID, e.g., 0x53 for Si1153.
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 18
5.4.2 HW_ID
I2C Address = 0x01;
Contains the Hardware information.
BITS4:0 = Filter, LED & Module code
BITS7:5 = Silicon HW rev (Steps with silicon mask change)
Part Number Features BITS4:0 code
Si1153-AA00 — 0x00
Si1153-AA09 940 nm filter 0x01
Si1153-AAX9 Module with 940 nm filter & LED 0x02
5.4.3 REV_ID
I2C Address = 0x02;
Contains the product revision, in a 0xMN format where “M” is the major rev and “N” the minor rev.
5.4.4 INFO0
I2C Address = 3;
Contains 0 after a hard reset or a RESET Command.
5.4.5 INFO1
I2C Address = 4;
Contains 0 after a hard reset or a RESET Command.
5.4.6 HOSTIN0
Name I2C Address
HOSTIN0 0x0A
Bit76543210
Name HOSTIN0
Type R/W
Reset 0
Bit Name Function
7:0 HOSTIN0 This Register is the Input to the Sensor and Output of the Host.
Contain 0 after a hard reset or a RESET Command.
5.4.7 COMMAND
I2C Address = 0x0B;
Contains 0 after a hard reset or a RESET Command.
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 19
5.4.8 IRQENABLE
I2C Address = 0x0F;
Contains 0 after a hard reset or a RESET Command.
5.4.9 RESPONSE1
I2C Address = 0x10;
Bit76543210
Name RESPONSE1[7:0]
Type R
Reset00000000
Bit Name Function
7:0 RESPONSE1[7:0] The sensor mirrors the data byte written to the parameter table here for the user to
verify the write was successful.
A parameter read command results in the byte read being available here for the
host.
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 20
5.4.10 RESPONSE0
I2C Address = 0x11;
Bit76543210
Name RUNNING SUSPEND SLEEP CMD_ERR CMD_CTR[4:0]
TypeRRRRRRRR
Reset N/A N/A N/A 0 1 1 1 1
Bit Name Function
7 RUNNING Indicator of MCU state.
6 SUSPEND Indicator of MCU state.
5 SLEEP Indicator of MCU state.
4 CMD_ERR It is cleared by a hardware reset (power up) or a RESET command or a RESET_CMD_CTR.
It is set by a bad command. E.g., an attempt to write beyond the parameter table.
If it is set, the CMMND_CTR field is the error code.
3:0 CMMND_CTR IF CMD_ERR = 0 A counter that increments on every GOOD command (successful
I2C Command Register write and sensor execution of the com-
mand).
It is reset to 0 by the RESET_CMD_CTR command.
It is set to 0b1111 on Power Up or a RESET command. This is how
a user can detect a fresh SW reset or a power up event.
IF CMD_ERR = 1 Code Meaning
0x10 Invalid command.
0x11 Parameter access to an invalid location.
0x12 Saturation of the ADC or overflow of accumulation.
0x13 Output buffer overflow—this can happen when
Burst mode is enabled and configured for greater
than 26 bytes of output.
The RESPONSE0 register will show “RUNNING” immediately after reset and then “SLEEP” after initialization is complete.
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 21
5.4.11 IRQ_STATUS
I2C Address = 0x12;
Bit76543210
Name — IRQ5 IRQ4 IRQ3 IRQ2 IRQ1 IRQ0
Type RSVD CR CR CR CR CR CR
Reset 0 0 0 0 0 0
Bit Name Function
7:6 UNUSED Unused. Read = 00b; Write = Don’t Care.
5 IRQ5 Enables an IRQ for channel 5 result being ready.
4 IRQ4 Enables an IRQ for channel 4 result being ready.
3 IRQ3 Enables an IRQ for channel 3 result being ready.
2 IRQ2 Enables an IRQ for channel 2 result being ready.
1 IRQ1 Enables an IRQ for channel 1 result being ready
0 IRQ0 Enables an IRQ for channel 0 result being ready.
5.4.12 HOSTOUTx
This section covers the twenty-six I2C Host Output Registers. These registers are the output of the sensor and input to the host.
Name I2C Address
HOSTOUT0
to
HOSTOUT25
0x13
to
0x2C
Bit76543210
Name HOSTOUTx
Type R
Reset00000000
Bit Name Function
7:0 HOSTOUTx These registers are the output of the MCU and input to the host. The results of the CHAN_LIST
enabled “active channel” readings are located sequentially in this table. Each channel may use 2
or 3 bytes depending on the setup.
The validity of the various channel outputs located in this table is determined by other factors. Da-
ta is valid when an IRQ status says that it is and remains valid until another reading happens.
This is why it is imperative to service the interrupt before the next measurement cycle begins (Au-
tonomous Mode), unless forced mode is used.
Si1153 Data Sheet
User to Sensor Communication
silabs.com | Building a more connected world. Rev. 1.1 | 22
6. Measurement: Principle of Operation
Operation is based on the concept of channels. Channels are essentially tasks that have been setup by the user.
To setup these channels, the channel specific areas of the parameter table need to be loaded with the correct information as well as the
global area of this table.
The channels’ specific areas are described below, including:
•ADC gain
• The photodiode selected
• The counter selected to time
• How often to make a measurement
• The format of the output (16 vs. 24 bits)
• And other areas
The global area includes global information that affect all tasks, such as:
• The list of channels that are enabled.
• The setup of the two counters that can be used by the channels.
• The three light thresholds that can be selected from by the channels.
The list of channels, CHAN_LIST, in the global area determines what operations are run and how the results are packed in the output
fields.
The packing of the result data in the output fields is totally determined by the enabled channels as they are packed sequentially from
the lowest enabled channel to the highest in the output field (I2C space- HOSTOUT0 to HOSTOUT25). The amount of space used by
each channel is determined by the 16 vs. 24 bit selection made in the channel setup.
Although space in the output buffer is reserved by the CHAN_LIST, the data validity is determined by the IRQ_STATUS register in Au-
tonomous Mode and by elapsed time in Forced Mode. In Burst Mode, a subset of Autonomous Mode, all the expected data is valid.
6.1 Output Field Utilization
In all modes, the CHAN_LIST configuration determines how the data is stacked in the 26 byte output field. It is done on a first-come
first-served basis, with the enabled lower channels taking up the lower addresses. When burst is enabled, the channel arrangement is
just repeated to higher and higher addresses. See the example below.
Si1153 Data Sheet
Measurement: Principle of Operation
silabs.com | Building a more connected world. Rev. 1.1 | 23
Packing of of these
four channels in the
output table is
determined by the four
enabled channels in
the CHANNEL list
above. This is
independent of the
IRQ_ENABLE and
IRQ_STATUS
Channel Specific
Section of
Parameter Table
Output mode
0 Bit 0 Chan 0 16
1 Bit 1 Chan 1 24
0 Bit 2 Chan 2 16
1 Bit 3 Chan 3 16
1 Bit 4 Chan 4 24
1 Bit 5 Chan 5 16
X Bit 6 X X
X Bit 7 X X
Global Section of
Parameter Table
CHAN_LIST
I2C Register I2C
Addresss Content
HOSTOUT0 13 Channel 1 Result: Most Significant Byte
HOSTOUT1 14 Channel 1 Result: Middle Significant Byte
HOSTOUT2 15 Channel 1 Result: Least Significant Byte
HOSTOUT3 16 Channel 3 Result: Most Significant Byte
HOSTOUT4 17 Channel 3 Result: Least Significant Byte
HOSTOUT5 13 Channel 4 Result: Most Significant Byte
HOSTOUT6 14 Channel 4 Result: Middle Significant Byte
HOSTOUT7 1A Channel 4 Result: Least Significant Byte
HOSTOUT8 1B Channel 5 Result: Most Significant Byte
HOSTOUT9 1C Channel 5 Result: Least Significant Byte
HOSTOUT10 1D Unused
HOSTOUT11 1E Unused
HOSTOUT12 1F Unused
HOSTOUT13 20 Unused
HOSTOUT14 21 Unused
HOSTOUT15 22 Unused
HOSTOUT16 23 Unused
HOSTOUT17 24 Unused
HOSTOUT18 25 Unused
HOSTOUT19 26 Unused
HOSTOUT20 27 Unused
HOSTOUT21 28 Unused
HOSTOUT22 29 Unused
HOSTOUT23 2A Unused
HOSTOUT24 2B Unused
HOSTOUT25 2C Unused
Figure 6.1. Output Table Data Packing
Si1153 Data Sheet
Measurement: Principle of Operation
silabs.com | Building a more connected world. Rev. 1.1 | 24
6.2 Autonomous and Forced Modes
In Autonomous Mode, the user uses the timer fields in both the global and channels specific areas in order to set up the timing for
repeated measurements. The user then sends the command to start these autonomous measurements repeatedly. When each chan-
nel's timer is tripped, the measurement for that channel is started. When the channel measurement completes, it is signaled by the
IRQ_STATUS bits and by an interrupt (if the interrupt is enabled). After that signal, the sensor restarts the channel timer and waits for it
to trip and signal the next measurement. The host must read the data before the next reading is generated, or risk losing the reading or
getting garbage data to sample smearing (reading data in the midst of it changing).
In Forced Mode, all measurements enabled in the CHAN_LIST start as a result of a FORCE command and are only done once. If there
are multiple channels enabled, then the measurements are done back-to-back starting with the lower number channel.The completion
signaling is the same as for autonomous, the IRQ_STATUS and interrupt if it is enabled. The logical difference is that all the enabled
channels are always shown as simultaneously ready in the IRQ_STATUS, whereas in Autonomous Mode this is not true. FORCE com-
mand only works on measurements which do not have a measurement counter selected in MEASCONFIGx.
Si1153 Data Sheet
Measurement: Principle of Operation
silabs.com | Building a more connected world. Rev. 1.1 | 25
The IRQ_STATUS bits
signal which of the
possible fields are updated
with new information. All
other fields should be
considered invalid and
possibly containing wrong
transitory information.
This is despite the
reserved space in the
output table for the
readings that have not yest
happened.
Value Bit Meaning
0 Bit 0 Chan 0
0 Bit 1 Chan 1
0 Bit 2 Chan 2
1 Bit 3 Chan 3
0 Bit 4 Chan 4
1 Bit 5 Chan 5
X Bit 6 X
X Bit 7 X
I2C SPACE
IRQ_STATUS
I2C Register I2C
Addresss Content
HOSTOUT0 13 Channel 1 Result: Most Significant Byte
HOSTOUT1 14 Channel 1 Result: Middle Significant Byte
HOSTOUT2 15 Channel 1 Result: Least Significant Byte
HOSTOUT3 16 Channel 3 Result: Most Significant Byte
HOSTOUT4 17 Channel 3 Result: Least Significant Byte
HOSTOUT5 13 Channel 4 Result: Most Significant Byte
HOSTOUT6 14 Channel 4 Result: Middle Significant Byte
HOSTOUT7 1A Channel 4 Result: Least Significant Byte
HOSTOUT8 1B Channel 5 Result: Most Significant Byte
HOSTOUT9 1C Channel 5 Result: Least Significant Byte
HOSTOUT10 1D Unused
HOSTOUT11 1E Unused
HOSTOUT12 1F Unused
HOSTOUT13 20 Unused
HOSTOUT14 21 Unused
HOSTOUT15 22 Unused
HOSTOUT16 23 Unused
HOSTOUT17 24 Unused
HOSTOUT18 25 Unused
HOSTOUT19 26 Unused
HOSTOUT20 27 Unused
HOSTOUT21 28 Unused
HOSTOUT22 29 Unused
HOSTOUT23 2A Unused
HOSTOUT24 2B Unused
HOSTOUT25 2C Unused
Channel Specific
Section of
Parameter Table
Output mode
0 Bit 0 Chan 0 16
1 Bit 1 Chan 1 24
0 Bit 2 Chan 2 16
1 Bit 3 Chan 3 16
1 Bit 4 Chan 4 24
1 Bit 5 Chan 5 16
X Bit 6 X X
X Bit 7 X X
CHAN_LIST
Global Section of
Parameter Table
Figure 6.2. IRQ_STATUS Shows Which Output Fields Have Valid Data
Si1153 Data Sheet
Measurement: Principle of Operation
silabs.com | Building a more connected world. Rev. 1.1 | 26
6.3 Burst Mode
Burst Mode is always used in Autonomous Mode.
The Burst Mode is enabled by the BURST register’s bit 7. The burst register is in the global area of the parameter table. Bits 6:0 of the
register define the number of readings to be made.
All channels set up in the CHAN_LIST operate in this mode and they operate in unison governed by the MEASRATE register in the
parameter table. The individual channel MEASCONFIGx.COUNTER_INDEX [1:0] value is ignored.
The burst is started by the START command and may be paused by the PAUSE command. All measurements enabled in the
CHAN_LIST are done as a quick set then repeated after the delay determined by the MEASRATE register. The number of repeats are
set by the BURST register.
The measurements called for by the enabled channels are done without an intervening delay, starting with the lower number channel
and ending with the highest channel number.
The burst will proceed until it is complete or until the output buffer is full, after which an interrupt may be generated if enabled and the
IRQ_STATUS bit(s) associated with all the channels in the CHAN_LIST will be set. The user has the time period until the next set of
reads are finished to read back the data in the output field.
The output data will be stacked in the 26 bytes output data field and will be sequential. For example, if the CHAN_LIST enables chan-
nels X, Y, and Z, then the data will be found in the output buffer as multiple sets: X1, Y1, Z1, X2, Y2, Z2... The fields X, Y, and Z are
packed efficiently and are not necessarily the same length since they can be a mix of 16 and 24 bit values.
Si1153 Data Sheet
Measurement: Principle of Operation
silabs.com | Building a more connected world. Rev. 1.1 | 27
In burst mode the I2C
HOSTOUT locations
are updated
simultaneously when
the burst is done.
Only then will the
IRQ_STATUS field be
updates and an int
generated (if the
correct IRQ_ENABLE
bit(s) is set).
Since The CHAN_LIST
shows 4 active
channels we see two
sets of readings
stacked one after
another.
Channel Specific
Section of
Parameter Table
Output mode
0 Bit 0 Chan 0 16
1 Bit 1 Chan 1 24
0 Bit 2 Chan 2 16
1 Bit 3 Chan 3 16
1 Bit 4 Chan 4 24
1 Bit 5 Chan 5 16
X Bit 6 X X
X Bit 7 X X
Global Section of
Parameter Table
CHAN_LIST
I2C Register I2C
Addresss Content
HOSTOUT0 13 Channel 1 Result: Most Significant Byte
HOSTOUT1 14 Channel 1 Result: Middle Significant Byte
HOSTOUT2 15 Channel 1 Result: Least Significant Byte
HOSTOUT3 16 Channel 3 Result: Most Significant Byte
HOSTOUT4 17 Channel 3 Result: Least Significant Byte
HOSTOUT5 13 Channel 4 Result: Most Significant Byte
HOSTOUT6 14 Channel 4 Result: Middle Significant Byte
HOSTOUT7 1A Channel 4 Result: Least Significant Byte
HOSTOUT8 1B Channel 5 Result: Most Significant Byte
HOSTOUT9 1C Channel 5 Result: Least Significant Byte
HOSTOUT10 1D Channel 1 Result: Most Significant Byte
HOSTOUT11 1E Channel 1 Result: Middle Significant Byte
HOSTOUT12 1F Channel 1 Result: Least Significant Byte
HOSTOUT13 20 Channel 3 Result: Most Significant Byte
HOSTOUT14 21 Channel 3 Result: Least Significant Byte
HOSTOUT15 22 Channel 4 Result: Most Significant Byte
HOSTOUT16 23 Channel 4 Result: Middle Significant Byte
HOSTOUT17 24 Channel 4 Result: Least Significant Byte
HOSTOUT18 25 Channel 5 Result: Most Significant Byte
HOSTOUT19 26 Channel 5 Result: Least Significant Byte
HOSTOUT20 27 Unused
HOSTOUT21 28 Unused
HOSTOUT22 29 Unused
HOSTOUT23 2A Unused
HOSTOUT24 2B Unused
HOSTOUT25 2C Unused
Value Bit Meaning
0 Bit 0 Chan 0
1 Bit 1 Chan 1
0 Bit 2 Chan 2
1 Bit 3 Chan 3
1 Bit 4 Chan 4
1 Bit 5 Chan 5
X Bit 6 X
X Bit 7 X
I2C SPACE
IRQ_STATUS When Done
Reading
Set 1
Reading
Set 1
Figure 6.3. Burst Mode Example of Two Sets of Readings
Si1153 Data Sheet
Measurement: Principle of Operation
silabs.com | Building a more connected world. Rev. 1.1 | 28
6.4 Interrupt Operation
The INT output pin is asserted by the sensor when an enabled channel in the CHAN_LIST (which has the corresponding bit in the
RESET register) has finished. In Burst Mode, the interrupt is delayed until the number of readings is reached or the buffer is full.
When the host reads the IRQ_STATUS register to learn which source generated the interrupt, the IRQ_STATUS register is cleared
automatically.
The most efficient method of extracting measurements from the Si1153 is an I2C Burst Read beginning at the IRQ_STATUS register.
6.5 Timing of Channel Measurements
The timing of measurements has two aspects:
1. The length of time to take a measurement.
2. How frequently the measurement is taken.
The amount of time to take the measurement is controlled by factors like HW_GAIN (which is really the integration time), SW_GAIN,
and the decimation rate setting.
Note: Each measurement is composed of two measurement times.
In an ALS measurement, two measurements are always taken and added together. In a proximity measurement, two measurements
are always taken, one without the LED light and one with the LED light. The difference is then created by subtraction. See the timing
diagram below for an example of ALS and proximity measurement timing.
Si1153 Data Sheet
Measurement: Principle of Operation
silabs.com | Building a more connected world. Rev. 1.1 | 29
Figure 6.4. Example of Measurement Timing
Si1153 Data Sheet
Measurement: Principle of Operation
silabs.com | Building a more connected world. Rev. 1.1 | 30
7. Parameter Table
Table 7.1. Parameter Table
Address Name Description
0x00 I2C_ADDR I2C Address (Temp) Global Area: Affects all Channels
0x01 CHAN_LIST Channel List
0x02 ADCCONFIG0 Channel 0 Setup Channel Areas: Specific Channel Setup
0x03 ADCSENS0
0x04 ADCPOST0
0x05 MEASCONFIG0
0x06 ADCCONFIG1 Channel 1 Setup
0x07 ADCSENS1
0x08 ADCPOST1
0x09 MEASCONFIG1
0x0A ADCCONFIG2 Channel 2 Setup
0x0B ADCSENS2
0x0C ADCPOST2
0x0D MEASCONFIG2
0x0E ADCCONFIG3 Channel 3 Setup
0x0F ADCSENS3
0x10 ADCPOST3
0x11 MEASCONFIG3
0x12 ADCCONFIG4 Channel 4 Setup
0x13 ADCSENS4
0x14 ADCPOST4
0x15 MEASCONFIG4
0x16 ADCCONFIG5 Channel 5 Setup
0x17 ADCSENS5
0x18 ADCPOST5
0x19 MEASCONFIG5
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 31
Address Name Description
0x1A MEASRATE_H MEASURE RATE Global Area: Affects all Channels
0x1B MEASRATE_L
0x1C MEASCOUNT0 MEASCOUNT
0x1D MEASCOUNT1
0x1E MEASCOUNT2
0x25 THRESHOLD0_H THRESHOLD SETUP
0x26 THRESHOLD0_L
0x27 THRESHOLD1_H
0x28 THRESHOLD1_L
0x29 THRESHOLD2_H
0x2A THRESHOLD2_L
0x2B BURST BURST
7.1 Global Area of the Parameter Table
The Global Area represents resources that are shared among the six channels. See the next section for specific channel properties,
and for channel-specific parameter setup.
Table 7.2. Global Area of the Parameter Table
Parameter Parameter Address
MEASRATE[1] 0x1A MEASRATE[15:8] Main Measurement Rate
Counter
Governs how much time be-
tween measurement groups.
One count represents an 800
μs time period.
MEASRATE[0] 0x1B MEASRATE[7:0]
MEASCOUNT0 0x1C MEASCOUNT0[7:0] Three Measurement Rate
extension counters available
for setting the rate.
Each of 6 channel setups se-
lected which of these coun-
ters to use via the MEAS-
CONFIG::COUNTER_IN-
DEX[1:0] bits:
MEASCOUNT1 0x1D MEASCOUNT1[7:0]
MEASCOUNT2 0x1E MEASCOUNT2[7:0]
THRESHOLD0[1] 0x25 THRESHOLD0[15:8] THRESHOLD0 One of these three (or none)
us Chosen by MEASCON-
FIGx.THRESH_SEL[1:0]
THRESHOLD0[0] 0x26 THRESHOLD0[7:0]
THRESHOLD1[1] 0x27 THRESHOLD1[15:8] THRESHOLD1
THRESHOLD1[0] 0x28 THRESHOLD1[7:0]
THRESHOLD2[1] 0x29 THRESHOLD2[15:8] THRESHOLD2
THRESHOLD2[0] 0x2A THRESHOLD2[7:0]
BURST 0x2B BURST[7:0] Bit 7 is Burst Enable while
BURST_COUNT[6:0] are the
count
CHAN_LIST 0x01 CHAN_LIST[5:0] The six least significant bits
enable the 6 possible chan-
nels.
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 32
7.2 Channel Specific Setup Areas of the Parameter Table
Below is the summary of the four-byte channel-specific area in the parameter table. There are six copies in the table corresponding to
up to six tasks/channels assigned to the sensor. They are located between addresses 0x02 and 0x18 hex.
Table 7.3. Channel Specific Setup Areas of the Parameter Table
76543210
ADCCONFIGx RSRVD DECIM_RATE[1:0] ADCMUX[4:0]
ADCSENSx HSIG SW_GAIN[2:0] HW_GAIN[3:0]
ADCPOSTx RSRVD 24BIT_OUT POSTSHIFT[2:0] UNUSED THRESH_SEL[1:0]
MEASCONFIGx COUNTER_INDEX[1:0] LED_TRIM[1:0] BANK_SEL LED2 En. LED3 En. LED1 En.
The following figure illustrates how to use the channel-specific registers in the parameter table above.
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 33
Figure 7.1. THRESH_SEL, COUNTER_INDEX Fields in Each Channel Specific Register Area Points to Global Area Register
THRESHOLDx and MEASCOUNTx (Respectively)
Note: In the figure above, the counter selected (1, 2, or 3) defines the number of 800 µs periods to have between readings when the
channel runs. The threshold selected (0, 1, or 2) defines the threshold used.
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 34
7.2.1 ADCCONFIGx
Parameter Addresses: 0x02, 0x06, 0x0A, 0x0E, 0x12, 0x16
Bit76543210
Name Reserved DECIM_RATE[1:0] ADCMUX[4:0]
Reset00000000
Bit Name Function
7 RESERVED Must remain at 0.
6:5 DEC-
IM_RATE[1:0]
Selects Decimations rate of A/Ds. This setting affects the number of clocks used per measurements. Deci-
mation rate is an A/D optimization parameter. The most common decimation value is 0 for a 1024 clocks
and 48.8 μs min measurement time. Consult the related application notes for more details.
Increasing the reading time by using more clocks does not cause the ADC count to be larger.
Value No of 21 MHz
Clocks
Measurement time at
HW_GAIN[3:0] = 0
Measurement time at
HW_GAIN[3:0] = n
Usage
Note: All measurements are repeated 2X inter-
nally for ADC offset cancellation purposes. The
times below represent the integration time for
one of these measurement pairs.
0 1024 48.8 μs 48.8*(2**n) μs Normal
1 2048 97.6 μs 97.6*(2**n) μs Useful for longer short
measurement times
2 4096 195 μs 195*(2**n) μs Useful for longer short
measurement times
3 512 24.4 μs 24.4*(2**n) μs Useful for very short
measurement times
4:0 ADCMUX[4:0] The ADC Mux selects which photodiode(s) are connected to the ADCs for measurement.
See Photodiode Section for more information regarding the location of the photodiodes.
ADCMUX[4:0] Optical Functions Operation Comments
0 0 0 0 0 Small IR D1b
0 0 0 0 1 Medium IR D1b + D2b
0 0 0 1 0 Large IR D1b + D2b + D3b +
D4b
0 1 0 1 1 White D1
0 1 1 0 1 Large White D1 + D4
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 35
7.2.2 ADCSENSx
Parameter Addresses: 0x03, 0x07, 0x0B, 0x0F, 0x13, 0x17
Bit76543210
Name HSIG SW_GAIN[2:0] HW_GAIN[2:0]
Reset00000000
Bit Name Function
7 HSIG This is the Ranging bit for the A/D. Normal gain at 0 and High range (sensitivity is divided
by 14.5) when set to 1.
6:4 SW_GAIN[2:0] Causes an internal accumulation of samples with no pause between readings when in
FORCED Mode. In Autonomous mode the the accumulation happens at the measurement
rate selected.
The calculations are accumulated in 24 bits and an optional shift is applied later. See ADC-
POSTx.ADC_MISC[1:0]
Value Number of Measurements
0 1
1 2
2 4
3 8
4 16
5 32
6 64
7 128
3:0 HW_GAIN[3:0] Value Nominal Measurement time for 512 clocks
0 24.4 µs
1 48.8 µs
2 97.5 µs
…… ……
10 25 ms
11 50 ms
12 to 15 unused
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 36
7.2.3 ADCPOSTx
Parameter Addresses: 0x04, 0x08, 0x0C, 0x10, 0x14, 0x18
Bit 76543210
Name Reserved 24BIT_OUT POSTSHIFT[2:0] UNUSED THRESH_EN[1:0]
Reset 00000000
Bit Name Function
7 RESERVED Must be set to 0
6 24BIT_OUT Determines the size of the fields in the output registers.
Value Bits/Result Output
0 16 Unsigned integer
1 24 Signed Integer
5:3 POSTSHIFT[2:0] The number of bits to shift right after SW accumulation. Allows the results of many additions not to
overflow the output. Especially useful when the output is in 16 bit mode.
2 UNUSED
1:0 THRESH_EN [1:0] Value Operation
0 Do not use THRESHOLDs
1 Interrupt when the measurement is larger than the THRESHOLD0 Global Parameters
2 Interrupt when the measurement is larger than the THRESHOLD1 Global Parameters
3 Interrupt when the measurement is larger than the THRESHOLD2 Global Parameters
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 37
7.2.4 MEASCONFIGx
Parameter Addresses: 0x05, 0x0A, 0x0D, 0x11, 0x15, 0x19
Bit76543210
Name COUNTER_INDEX[1:0] LED_TRIM[1:0] BANK_SEL LED2_EN LED3_EN LED1_EN
Reset00000000
Bit Name Function
7:6 COUNTER_INDEX[1:0] Selects which of the three counters (MEASCOUNTx) in the global parameter list is in use by
this channel. These counters control the period/frequency of measurements. When the
channel uses the COUNTER_INDEX[1:0] to select a MEASCOUNTk register in the parame-
ter table, then the time between measurements for this channel is = 800 us * MEASRATE *
MEASCOUNTk.
A value of zero in MEASRATE will prevent autonomous mode from working. Similarly a zero
in MEASCOUNTk will prevent the autonomous mode from working for the concerned chan-
nel
Value Results
0 Measurement not be performed except in BURST or Forced
modes
1 Selects MEASCOUNT0
2 Selects MEASCOUNT1
3 Selects MEASCOUNT2
5:4 LED_TRIM[1:0] Value Results
0 Nominal LED Currents
1 UNDEFINED
2 LED Currents Increased by 9%
3 LED Currents decreased by 10%
3 BANK_SEL Value LED Current Registers Selected in Global Register Area
0 LED1_A, LED2_A, LED3_A
1 LED1_B, LED2_B, LED3_B
2 LED2_EN One value enables the LED
1 LED3_EN One value enables the LED
0 LED1_EN One value enables the LED
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 38
7.3 Photodiode Selection
The ADCCONFIGx.ADCMUX [4:0] Register controls the photodiode selection.
Figure 7.2. Photodiode Locations
Si1153 Data Sheet
Parameter Table
silabs.com | Building a more connected world. Rev. 1.1 | 39
8. Electrical Specifications
Table 8.1. Recommended Operating Conditions
Parameter Symbol Condition Min Typ Max Unit
VDD Supply Voltage VDD 1.62 — 3.6 V
VDD OFF Supply Voltage VDD_OFF OFF mode –0.3 1.0 V
VDD Supply Ripple Voltage VDD = 3.3 V
1 kHz – 10 MHz
— — 50 mVpp
Operating Temperature T –40 25 85 °C
SCL, SDA, Input High Logic Volt-
age
I2CVIH VDD x 0.7 — VDD V
SCL, SDA Input Low Logic
Voltage
I2CVIL 0 — VDD x 0.3 V
Start-Up Time VDD above 1.62 V 25 — — ms
LED Supply Voltage VLED 5.5 V
Table 8.2. Electrical Performance Characteristics
Parameter Symbol Condition1Min Typ Max Unit
IDD Standby Mode (sleep) Isb No ADC Conversions
No I2C Activity
VDD = 1.8 V
— 125 — nA
Isb No ADC Conversions
No I2C Activity
VDD = 3.3 V
— 1.25 — µA
IDD Suspend Mode Isus Autonomous Operation
(RTC On)
ADC conversion in Pro-
gress
No I2C Activity
VDD = 1.8 V
— 0.550 — mA
Isus Autonomous Operation
(RTC On)
ADC conversion in Pro-
gress
No I2C Activity
VDD = 3.3 V
— 0.525 — mA
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 40
Parameter Symbol Condition1Min Typ Max Unit
I active, but not measuring I active Responding to com-
mands, Preparing and
calculating results of
readings.
VDD = 1.8 V
4.25 — mA
I active Responding to com-
mands, Preparing and
calculating results of
readings.
VDD = 3.3 V
4.5 — mA
INT, SCL, SDA
Leakage Current
VDD = 3.3 V –1 — 1 µA
Processing Time per Measurement
(During this time the current is I Ac-
tive)
tprocess ALS or Prox 155 µs
A/D startup time per measurement
(During this time the current is I
Suspend)
tadstart ALS or Prox — 48.8 — µs
Ratio of readings with HSIG=0 and
HSIG=1 for the shallow PD.
525 nm, Internal
ADCMUX=11,
ADC_GAIN=0
— 15.2 — units
Ratio of readings with HSIG=0 and
HSIG=1 for the deep PD.
940 nm
ADCMUX=0,
ADC_GAIN=0
— 15.2 — units
SCL, SDA VOL — — VDD * 0.2 V
INT VOL — — 0.4 V
Notes:
1. Unless specifically stated in the Condition column, electrical data assumes ambient light levels < 1 klx.
2. Guaranteed by design and characterization.
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 41
Table 8.3. Optical Performance Characteristics: Si1153-AA00
Parameter Symbol Condition Min Typ Max Unit
White minus Dark Shallow Photo-
diode Response
ADCMUX=11
DECIM=0
ADC_RANGE=0
HSIG=0
460 nm (blue) — 190 — ADC
Counts /(W/m2)
525 nm (green) — 160 —
625 nm (red) — 100 —
850 nm (IR) — 30
940 nm (IR) — 10 —
Dual White minus Dual Dark Photo-
diode Response
ADCMUX=13
DECIM=0
ADC_GAIN = 0
HSIG=0
460 nm (blue) — 380 — ADC
Counts /(W/m2)
525 nm (green) — 320 —
625 nm (red) — 200 —
850 nm (IR) — 60 —
940 nm (IR) — 20 —
Deep minus Dark
Photodiode Response
ADCMUX=0
DECIM=0
ADC_GAIN =0
HSIG=0
460 nm (blue) — 90 — ADC
Counts /(W/m2)
525 nm (green) — 260 —
625 nm (red) — 510 —
850 nm (IR) — 690 —
940 nm (IR) — 490 —
Dual Deep Photodiode minus Dual
Dark
Photodiode Response
ADCMUX=1
DECIM=0
ADC_GAIN =0
HSIG=0
460 nm (blue) — 190 — ADC
Counts /(W/m2)
525 nm (green) — 520 —
625 nm (red) — 1000 —
850 nm (IR) — 1280 —
940 nm (IR) — 860 —
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 42
Table 8.4. Optical Performance Characteristics: Si1153-AA09
Parameter Symbol Condition Min Typ Max Unit
White minus Dark Shallow Photo-
diode Response
ADCMUX=11
DECIM=0
ADC_RANGE=0
HSIG=0
460 nm (blue) — 0 — ADC
Counts /(W/m2)
525 nm (green) — 0 —
625 nm (red) — 0 —
850 nm (IR) — 0
940 nm (IR) — 10 —
Dual White minus Dual Dark Photo-
diode Response
ADCMUX=13
DECIM=0
ADC_GAIN = 0
HSIG=0
460 nm (blue) — 0 — ADC
Counts /(W/m2)
525 nm (green) — 0 —
625 nm (red) — 10 —
850 nm (IR) — 0 —
940 nm (IR) — 20 —
Deep minus Dark
Photodiode Response
ADCMUX=0
DECIM=0
ADC_GAIN =0
HSIG=0
460 nm (blue) — 0 — ADC
Counts /(W/m2)
525 nm (green) — 0 —
625 nm (red) — 10 —
850 nm (IR) — 40 —
940 nm (IR) — 410 —
Dual Deep Photodiode minus Dual
Dark
Photodiode Response
ADCMUX=1
DECIM=0
ADC_GAIN =0
HSIG=0
460 nm (blue) — 0 — ADC
Counts /(W/m2)
525 nm (green) — 0 —
625 nm (red) — 10 —
850 nm (IR) — 80 —
940 nm (IR) — 710 —
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 43
Table 8.5. I2C Timing Specifications
Parameter Symbol Min Typ Max Unit
Clock Frequency fSCL — — 400 KHz
Clock Pulse Width Low tLOW 1.3 — — μs
Clock Pulse Width High tHIGH 0.6 — — μs
Rise Time tR20 — 300 ns
Fall Time tF20 *
(VDD / 5.5)
— 300 ns
Start Condition Hold Time tHD:STA 0.6 — — μs
Start Condition Setup Time tSU:STA 0.6 — — μs
Input Data Setup Time tSU:DAT 100 — — ns
Data Hold Time tHD:DAT 0 — — ns
Output Data Valid Time tVD:DAT — — 0.9 μs
Stop Setup Time tSU:STO 0.6 — — μs
Bus Free Time tBUF 1.3 — — μs
Suppressed Pulse Width tSP — — 40 ns
Bus Capacitance Cb— — 400 pF
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 44
Table 8.6. LED Optical Characteristics
Parameter Symbol Test Condition Min Typ Max Unit
Forward voltage Vf1 If = 10 μA 0.8 — — V
Forward voltage Vf2 If = 50 mA — 1.4 1.8 V
Reverse current Ir Vr = 10 V — — 5.0 μA
Peak wavelength λp If = 50 mA 925 940 955 nm
Spectral half-width Δλ If = 50 mA — 30 — nm
Radiant flux Po If = 50 mA 10 — — mW
Radiant Intensity Ie If = 50 mA 17 23 30 mW/sr
Half Angle ϕ — 25 — °C
Note:
1. All specifications measured at 25 °C.
Table 8.7. Absolute Maximum Ratings
Parameter Condition Min Typ Max Unit
VDD Supply Voltage –0.3 — 4 V
Operating Temperature –40 — 85 °C
Storage Temperature –65 — 85 °C
INT, SCL, SDA Voltage at VDD = 0 V, TA < 85 °C –0.5 — 3.6 V
ESD Rating Human Body Model
Machine Model
Charged-Device Model
—
—
—
—
—
—
2
225
2
kV
V
kV
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 45
Table 8.8. Typical LED Current vs. LED Code
Order No. LED Code Current
0 0x00 5.5
1 0x08 11
2 0x10 17
3 0x18 22
4 0x20 28
5 0x28 33
6 0x30 39
7 0x38 44
8 0x12 50
9 0x21 55
10 0x29 66
11 0x31 77
12 0x22 83
13 0x39 88
14 0x2A 100
15 0x23 111
16 0x32 116
17 0x3A 133
18 0x24 138
19 0x33 155
20 0x2C 166
21 0x3B 177
22 0x34 194
23 0x2D 199
24 0x3C 221
25 0x35 232
26 0x3D 265
27 0x36 271
28 0x3E 310
29 0x3F 354
Note:
1. At trim bit = 0.
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 46
Figure 8.1. Typical LED Currents as a Function of LED Code and the Trim Bit
Note: In the figure above, the LED configuration happens in the Global Area registers, LED[1,2,3]_[A,B], and in the MEASCONFIGx
register of the channel-specific registers.
Figure 8.2. ADC Out as a Function of Distance
Note: The above graph is created under the following conditions: (LED I = 16.6 mA, t = 24.4 μs, Range = low). Grey 18% reflector. Dual
Section photodiode. LED beam ½ power is at ±30 °C. Output is 5 mW total.
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 47
Figure 8.3. Si115-AA9X LED Radiant Intensity vs. Angle (Indicative)
Figure 8.4. Si115-AA9X LED Radiant Intensity vs. Forward Current (Indicative)
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 48
Figure 8.5. Si1153-AA00 Shallow and Deep Photodiode Spectral Response (Indicative)
Figure 8.6. Typical Angular Sensitivity of the Photodiodes (%)
Si1153 Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 49
9. Pin Descriptions
9.1 DFN Pin Description
Figure 9.1. 10-Pin DFN
Table 9.1. Pin Descriptions
Pin Name Type Description
1 SDA Bidirectional I2C Data.
2 SCL Input I2C Clock.
3 VDD Power Power Supply.
Voltage source.
4 INT Bidirectional Interrupt Output.
Open-drain interrupt output pin. Must be at logic level high during power-up se-
quence to enable low power operation.
5 DNC Do Not Connect.
This pin is electrically connected to an internal Si1153 node. It should remain un-
connected.
6 AD / LED2 Bidirectional LED2 output.
It is sensed during startup. Pull up to VDD with 47 k Resistor for default I2C ad-
dress (0x53). Pull down with 47 k Resistor to select alternate I2C address (0c52)
and do not use it as an LED driver in that case.
7 LED3 Bidirectional LED3 output.
Always connect to VDD through a pull-up resistor. Connect to an LED cathode if
that output is used. Must be at logic level high during power-up sequence to allow
normal operation.
8 GND Power Ground.
Reference voltage.
9 LED1 Output Connect to VDD.
Connect to VDD through a pull-up resistor when not in use.
10 DNC Do Not Connect.
This pin is electrically connected to an internal Si1153 node. It should remain un-
connected.
Si1153 Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.1 | 50
9.2 Module Pin Description
Figure 9.2. 2 x 2 mm QFN
Table 9.2. Pin Descriptions
Pin Name Type Description
1 DNC Do Not Connect.
This pin is electrically connected to an internal Si1153 node. It should remain un-
connected.
2 SDA Bidirectional I2C Data.
3 SCL Input I2C Clock.
4 VDD Power Power Supply.
Voltage source.
5 INT Bidirectional Interrupt Output.
Open-drain interrupt output pin. Must be at logic level high during power-up se-
quence to enable low power operation.
6 AD / LED2 Bidirectional LED2 output.
It is sensed during startup. Pull up to VDD with 47 k Resistor for default I2C ad-
dress (0x53). Pull down with 47 k Resistor to select alternate I2C address (0c52)
and do not use it as an LED driver in that case.
7 LED3 Bidirectional LED3 output.
Always connect to VDD through a pull-up resistor. Connect to an LED cathode if
that output is used. Must be at logic level high during power-up sequence to allow
normal operation.
8 GND Power Ground.
Reference voltage.
9 LED1 Output Connect to VDD.
Connect to VDD through a pull-up resistor when not in use.
10 LEDA LED Anode Supply. Connect to VLED.
Si1153 Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.1 | 51
10. Modules Outline
10.1 10-Pin 2x2 mm DFN
DFN Package Diagram Dimensions illustrates the package details for the Si1153 DFN package lists the values for the dimensions
shown in the illustration.
Figure 10.1. DFN Package Diagram Dimensions
Table 10.1. Package Diagram Dimensions
Dimension Min Nom Max
A 0.55 0.65 0.75
b 0.20 0.25 0.30
D 2.00 BSC.
e 0.50 BSC.
E 2.00 BSC.
L 0.30 0.35 0.40
aaa 0.10
bbb 0.10
ccc 0.08
ddd 0.10
Notes:
1. All dimensions shown are in millimeters (mm).
2. Dimensioning and Tolerance per ANSI Y14.5M-1994.
Si1153 Data Sheet
Modules Outline
silabs.com | Building a more connected world. Rev. 1.1 | 52
10.2 10-Pin LGA Module
The figure below illustrates the package details for the Si1153 DFN package while the table lists the values for the dimensions shown in
the illustration.
Figure 10.2. DFN Package Diagram Dimensions
Si1153 Data Sheet
Modules Outline
silabs.com | Building a more connected world. Rev. 1.1 | 53
Table 10.2. 10-Pin LGA Module Package Diagram Dimensions
Dimension Min Nom Max
A 1.10 1.20 1.30
A1 0.28 0.30 0.32
b 0.55 0.60 0.65
D 4.90 BSC
D1 4.00 BSC
e 1.00 BSC
E 2.85 BSC
E1 1.95 BSC
f 1.56 BSC
g 1.44 BSC
H1 0.98 1.03 1.08
H2 1.19 1.24 1.29
L 0.55 0.60 0.65
y 3° REF
aaa 0.10
bbb 0.10
ccc 0.08
ddd 0.10
eee 0.10
fff 0.10
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Si1153 Data Sheet
Modules Outline
silabs.com | Building a more connected world. Rev. 1.1 | 54
11. Land Patterns
11.1 2x2 mm DFN Land Pattern
See the figure and table below for the suggested 2 x 2 mm DFN PCB land pattern.
Figure 11.1. 2 x 2 mm DFN PCB Land Pattern
Table 11.1. Land Pattern Dimensions
Dimension mm
C1 1.90
C2 1.90
E 0.50
X 0.30
Y 0.80
Notes:
General
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri-
cation Allowance of 0.05 mm.
Solder Mask Design
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm
minimum, all the way around the pad.
Stencil Design
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
Si1153 Data Sheet
Land Patterns
silabs.com | Building a more connected world. Rev. 1.1 | 55
11.2 10-Pin LGA Module
Figure 11.2. 10-Pin LGA Module Land Pattern
Table 11.2. Land Pattern Dimensions
Dimension mm
C 2.20
E 1.00
X 1.15
Y 0.65
Notes:
General
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri-
cation Allowance of 0.05 mm.
Solder Mask Design
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm
minimum, all the way around the pad.
Stencil Design
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
Si1153 Data Sheet
Land Patterns
silabs.com | Building a more connected world. Rev. 1.1 | 56
12. Document Change List
12.1 Revision 0.9
December 4, 2015
•Initial release.
12.2 Revision 1.0
September 29, 2016
• Updated Register in Table 8.2 Electrical Performance Characteristics on page 40 from Reset to IRQENABLE.
• Swapped position on LED2_EN and LED_3 EN.
• Added Max VLED voltage to 5.5 V.
12.3 Revision 1.1
October 5, 2017
• Added OPN Si1153-AA09-AMR.
Si1153 Data Sheet
Document Change List
silabs.com | Building a more connected world. Rev. 1.1 | 57
Table of Contents
1. Feature List ................................2
2. Ordering Guide ..............................3
3. Functional Description............................4
3.1 Ambient Light Sensing ...........................5
3.2 Proximity Sensing ............................6
3.3 Power Consumption ............................8
3.4 Host Interface ..............................9
4. Operational Modes ............................ 11
4.1 Off Mode ...............................11
4.2 Initialization Mode ............................11
4.3 Standby Mode..............................11
4.4 Forced Conversion Mode ..........................11
4.5 Automated Operation Mode .........................11
5. User to Sensor Communication ....................... 12
5.1 Basic I2C Operation ............................12
5.2 Relationship Between I2C Registers and Parameter Table ...............13
5.3 I2C Command Register Operation .......................15
5.3.1 Accessing the Parameter Table (PARAM_QUERY & PARAM_SET Commands) .....17
5.3.2 Sensor Operation Initiation Commands ...................17
5.3.3 RESET_CMD_CTR Command ......................17
5.3.4 RESET Command ..........................17
5.4 I2C Register Summary ...........................18
5.4.1 PART_ID .............................18
5.4.2 HW_ID ..............................19
5.4.3 REV_ID ..............................19
5.4.4 INFO0 ..............................19
5.4.5 INFO1 ..............................19
5.4.6 HOSTIN0 .............................19
5.4.7 COMMAND ............................19
5.4.8 IRQENABLE ............................20
5.4.9 RESPONSE1 ............................20
5.4.10 RESPONSE0 ...........................21
5.4.11 IRQ_STATUS ...........................22
5.4.12 HOSTOUTx ............................22
6. Measurement: Principle of Operation ..................... 23
6.1 Output Field Utilization ...........................23
6.2 Autonomous and Forced Modes........................25
6.3 Burst Mode ...............................27
Table of Contents 58
6.4 Interrupt Operation ............................29
6.5 Timing of Channel Measurements .......................29
7. Parameter Table ............................. 31
7.1 Global Area of the Parameter Table ......................32
7.2 Channel Specific Setup Areas of the Parameter Table ................33
7.2.1 ADCCONFIGx ...........................35
7.2.2 ADCSENSx ............................36
7.2.3 ADCPOSTx ............................37
7.2.4 MEASCONFIGx ...........................38
7.3 Photodiode Selection ...........................39
8. Electrical Specifications .......................... 40
9. Pin Descriptions ............................. 50
9.1 DFN Pin Description............................50
9.2 Module Pin Description ...........................51
10. Modules Outline ............................. 52
10.1 10-Pin 2x2 mm DFN ...........................52
10.2 10-Pin LGA Module ...........................53
11. Land Patterns.............................. 55
11.1 2x2 mm DFN Land Pattern .........................55
11.2 10-Pin LGA Module ...........................56
12. Document Change List .......................... 57
12.1 Revision 0.9 ..............................57
12.2 Revision 1.0 ..............................57
12.3 Revision 1.1 ..............................57
Table of Contents 59
http://www.silabs.com
Silicon Laboratories Inc.
400 West Cesar Chavez
Austin, TX 78701
USA
Smart.
Connected.
Energy-Friendly.
Products
www.silabs.com/products
Quality
www.silabs.com/quality
Support and Community
community.silabs.com
Disclaimer
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes
without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included
information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted
hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of
Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant
personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass
destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®,
EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®,
Gecko®, ISOmodem®, Micrium, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri and others are trademarks or registered
trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other
products or brand names mentioned herein are trademarks of their respective holders.
