Report Title:
Qualification Test Report
Report Type:
See Attached
Date:
See Attached
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
HMC5445LS6
HMC5622LS7
HMC5805LS6
HMC5840LS6
HMC5846LS6
HMC5879LS7
HMC5927CLS6
HMC5927LS6
HMC5929CLS6
HMC5929LS6
HMC5981LS7
HMC6062LS6
HMC6242LS6
HMC6503LS6
HMC6741LS7
HMC6981LS6
HMC6982LS6
HMC7229LS6
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
1.0 Intr od uction
This qualification procedure is designed to satisfy the package reliability requirements for the 20 lead 7x7mm LCC
surface mount ceramic package. The testing is designed to simulate the worst-case environments the product may
experience during assembly, test and life in the end user application. The device is electrically tested to the appropriate
catalog specifications. The HMC5622LS7 was selected to qualify the LS LCC surface mount ceramic package family
which includes the LS6, .
1.1 General Descr iption
The 20 lead 7x7mm LCC ceramic package uses a high temperature co-fired ceramic body with an epoxy sealed
ceramic lid. The leads are finished with Gold over Nickel plating.
The HMC5622LS 7 is a four stage GaAs pHEMT MMIC 2 Watt Power Amplifier which operates between 27.3 and
33.5 GHz. The HMC5622LS7 provides 23 dB of gain, and +34 dBm of saturated output power and 22% PAE from a
+6V supply. The RF I/Os are DC blocked and matched to 50 Ohms for ease of integration into Multi-Function-
Modules (MFM s). The HMC5622LS7 eliminates the need for wire bonding and allows the use of surface mount
manufacturing techniques.
Figure 1: Typical 20 lead 7x7mm LCC Ceramic Package
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
2.0 Summary of Results
PARA
TEST
QTY IN
QTY OUT
PASS/FAIL
NOTES
3.1.1 Initial Electrical Test 154 154
Pass/No
Failures
3.1.2
MSL3 260°C Reflow
Preconditioning (3 Passes)
154 154 Complete
3.1.3 Temperature Cycling 77 77 Complete
3.1.4
Post Temperature Cycle
Electrical Test
77 77
Pass/No
Failures
3.1.5 Autoclave 77 77 Complete
3.1.6
Post Autoclave Electrical
Test
77 77
Pass/No
Failures
3.2.1 Physical Dimensions 15 15
Pass/No
Failures
3.2.2 Solderability 15 15
Pass/No
Failures
All testing has been completed. There were no failures.
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
3.0 Test Procedure s
3.1 Package Environmental Test s
These tests are designed to demonstrate that the 20L 7x7mm Ceramic LCC surface mount family of packages are
capable of maintaining the specified parameters throughout their useful life under rated operating conditions. The
HMC5622LS7 was selected as the qualification vehicle to qualify the Ceramic LCC surface mount family of packages.
The results of these tests qualify by similarity all other product using the same package.
3.1.1 Initial Characteristics - 154 HMC5622LS7 devices were electrically tested for DC and critical RF parameters.
These tests are performed at ambient temperature (+25°C). This test was performed at Hittite. There were no failures in
this test.
3.1.2 MSL3 260°C Reflow Preconditioning – 154 devices from 3.1.1 were subjected to 192 hours at 30°C/ 60% RH
then a reflow simulation at a peak temperature of 260°C for 3 passes (see Figure 1 for profile).
3.1.3 Temperature Cycle - 77 devices from 3.1.2 were subjected to 500 cycles of non-operating temperature cycling
from -65°C to 150°C. This test is performed at Hittite.
3.1.4 Final Electrical Test - 77 devices from 3.1.3 were electrically tested at ambient temperature to DC and critical
RF parameters. Any out of specification parameter is considered a failure. This test was performed at Hittite. There
were no failures in this test.
3.1.5 Autoclave – 77 devices from 3.1.2 were subjected to 96 hours of humidity (100%), temperature (121°C) and
pressure (15 PSIG). This test is performed at Hittite using an Espec environmental chamber.
3.1.6 Final Electrical Test - 77 devices from 3.1.5 were electrically tested at ambient temperature to DC and critical
RF parameters. Any out of specification parameter is considered a failure. This test was performed at Hittite. There
were no failures in this test.
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
3.2 Package Mechanical Tests
3.2.1 Physical Dimensions - 15 devices were measured to the requirement of the data sheet package outline drawing.
These devices need not be electrically functional. Any out of specification parameter is considered a failure. This test is
performed at Hittite. There were no failures.
3.2.2 Solderability - 15 devices were subjected to steam aging and solderability test in accordance with MIL-STD-883
Method 2003. These devices need not be electrically functional. This test was performed at Hittite. There were no
failures.
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
Figure 2: 20 lead 6x6mm LCC Ceramic Package Outline Drawing
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
Figure 3: 20 lead 7x7mm LCC Ceramic Package Outline Drawing
Package Type: 20L LS7 QTR: 11005P
Package Style: 20L 7x7mm Ceramic LCC Package Rev: 03
Figure 4: 260°C Reflow Profile
Time in Seconds
Temperature
(°C)
