AXA2R63061P-M - HONDA CONNECTORS INC

www.honda-connectors.co.jp

AXA2R

ORDERING INFORMATION

Enhanced robustness and EMI resistance

achieved by the laser-welded double-sided metal

shell (SDHC card compatible, with card jump-out

and wrong insertion prevention functions)

SOCKETS FOR

SD MEMORY CARD (R TYPE)

Connect To The Next

Standard type

Reverse type

Metal shell SDIO ground tab

contact supported

(supports SDIO)

Metal shell

Card detection

and write protect

switches

Compliance with RoHS Directive

FEATURES

1. Superior EMI resistance and

terminal coplanarity achieved by the

double-sided metal shell

The laser-welded double-sided shell has

high robustness and shielding

performance. Providing a ground pattern

when mounting the socket is effective for

EMI protection.

The high resistance to reﬂow heat

prevents the reﬂow process from

degrading the terminal coplanarity.

2. The structures of the card detection

and write protection switches prevent

the card thickness from affecting the

detection accuracy.

The side detection system and the highly

dust-resistant V notch contact structure

ensure high contact reliability.

3. Equipped with the card jump-out

prevention function existence

4. Card locking structure for forced

ejection protection

The lock pin in the metal shell prevents

unwanted ejection of the card.

5. Compatible with the SDIO standard

(with ground tab)

Compatible with the SDIO standard,

allowing use for expansion modules with

an interface function

APPLICATIONS

• DSCs, DVCs, PDAs, handheld

terminals, notebook PCs, gaming

consoles, car navigation systems,

portable audio devices, etc. that use

an SD card

• What is V notch construction?

By making contact with the edges and thus

increasing the contact pressure, this

product can eliminate foreign matters more

effectively than conventional products.

[Cross Section of Contacts]

Fixed contact Two-point contact

(edge contact)

Movable

contact

(R type)(Conventional type)

2R: Sockets for SD memory card (R type)

6: On board mounting reverse type (outside terminal)

7: On board mounting standard type (outside terminal)

AXA -M2R 3 1

3: Push-push type

2: Without card jump-out prevention function,

with card detection switch and with write protect switch

6: With card jump-out prevention function,

with card detection switch and with write protect switch

35 pcs. tray package × 20 trays

350 pcs. embossed tape and paper reel package × 2 reels

0: Without standoff

3: Stand off 1.5 mm

1: SMD terminal/With positioning boss

www.honda-connectors.co.jp

AXA2R

PRODUCT TYPES

SPECIFICATIONS

1. Characteristics

Note: *1. The above characteristics cannot be guaranteed when a card other than the speciﬁed ones is used.

2. Material and surface treatment

Product

name Eject type Card detection

switch

Card jump-out

prevention

function

Mounting

type

Standoff

height

(mm)

Part No.

Packing quantity

Inner carton Outer carton

Sockets for

SD memory

card

(R type)

Push-push

type Available

Available

Standard

mounting

type

0 AXA2R73061∗-M

Asterisk “ ∗ ” mark on end of

Part No.;

P: 350 pieces (1 reel)

(Embossed tape package)

T: 35 pieces (1 tray)

(Tray package)

Asterisk “ ∗ ” mark on end of

Part No.;

P: 700 pieces (2 reels)

(Embossed tape package)

T: 700 pieces (20 trays)

(Tray package)

1. 5 AXA2R73361∗-M

Reverse

mounting

type

0 AXA2R63061∗-M

1.5 AXA2R63361∗-M

Not available

Standard

mounting

type

0 AXA2R73021∗-M

1.5 AXA2R73321∗-M

Reverse

mounting

type

0 AXA2R63021∗-M

1.5 AXA2R63321∗-M

Item Speciﬁcations Condition

Electrical

characteristics

Rated Current 0.5 A/1 terminal

Contact resistance

Signal contact portion: Max. 100mΩ (Initial)

Detection contact portion: Max. 150mΩ (Initial)

(Card detection and write protection detection)

Measured based on the HP4338B measurement

method of JIS C5402

Insulation resistance Min. 1,000MΩ (Initial) Using 500V DC megger (applied for 1 min.)

Breakdown voltage 500V AC for 1 min.

Rated voltage is applied for one minute and check

for short circuit or damage with a detection current

of 1 mA.

Mechanical

characteristics

Vibration resistance

Frequency: 10 to 55 Hz

Acceleration: 20.0 m/s2 {2.0G}

No current interruption for more than 0.1 µs

Card insertion force Max. 40N

Card removal force Min. 1N, Max. 40N

Lifetime

characteristics

Insertion and removal

life of card

Insertion and removal life: 10,000 times

Contact resistance after testing:

Signal contact portion: Max. 100mΩ

Detection contact portion: Max. 150mΩ

(Card detection and write protection detection)

Insertion and removal speed are at a rate of 600

times/hour or less.

Environmental

characteristics

Ambient temperature –25°C to +90°C No freezing or condensation in low temperatures

Storage temperature –40°C to +90°C (The allowable storage temperature is –40°C to +50°C

if unopened from original packaging) No freezing or condensation in low temperatures

Resistance to soldering

heat

Reﬂow soldering: peak temperature 250°C or less

Hand soldering: Soldering iron temperature 300°C, 5 sec. or less

Sockets (shell) surface temperature for using

infrared reﬂow soldering machine

Humidity tolerance

(mated condition)

Contact resistance:

Signal contact portion: Max. 100mΩ

Detection contact portion: Max. 150mΩ

(Card detection and write protection detection)

Insulation resistance: Min. 100 MΩ

MIL-STD-1344A, METHOD 1002

Temperature: 40±2°C, Humidity: 90 to 95%RH,

Test time: 500 hours

Applicable memory card SD memory card*1

Unit weight 2.9g

Portion Material Surface

Signal contact Copper alloy

Contact portion: Ni plating on base, PdNi plating + Au ﬂash plating

Soldering portion: Ni plating on base, Au plating on surface

Detection contact Contact/Soldering portion: Ni plating on base, Au plating on surface

Retention solder tab Stainless steel Soldering portion: Ni strike, Partial Au plating

www.honda-connectors.co.jp

AXA2R

DIMENSIONS (Unit: mm)

1. On board mounting standard type (Without standoff)

Part No.

AXA2R73061∗-M

(With card jump-out prevention function)

AXA2R73021∗-M

(Without card jump-out prevention function)

0.60

1.40

28.40

(29.80)

(14.65)

13.50

28.15

(2.10)

8.10

9.40

18.20

(17.50)

14.55

27.95

(0.625)

1.65±0.1

(Contact pitch) 2.50±0.1

Card center

SD memory card

19.15

17.50

0.625 9.375

2.50

Te rminal coplanarity

(Signal/Detection contact)

(3.40)

1.2

0.70

5.3

2.70

*1 0.08 (Standoff dimensions)

0.10

Detailed internal view View of set card

Pin No.4

Pin No.3

Pin No.1

Pin No.9

Pin No.5

Pin No.7

Pin No.2

Pin No.8

Pin No.6

SD memory card

(24.00)

(0.80) (Push stroke)

(35.10) (Set condition)

(6.00) (Eject stroke)

Circuit schematic

No. 3

No. 2

No. 1

Recommended PC board pattern (TOP VIEW)

PC board both side

Substrate edge

Socket edge

Through hole

2.50±0.05 (Pitch)

0.625±0.05

1.60±0.05

(0.50)

5.30±0.05

1.40±0.05

1.60±0.05

3.30

0.60±0.05

0.40±0.05

1.00±0.05

17.50±0.05

19.15±0.05

1.60±0.05

1.20±0.05

1.10±0.05

0.50±0.05

1.10±0.05

8.10±0.05

10.40±0.05

30.30±0.05

18.20±0.05

9.40±0.05

8.10±0.05

(30.15)

10.37 7.48 1.60

1.60

(15.65)

8.58

12.25±0.05

0.60±0.05

0.40±0.05

1.60±0.05 14.55±0.05

27.95±0.05

1.75±0.05

2.10

1.55±0.05 12.45±0.05

(R)

: Pattern forbidden

area*2

: Pattern insulation

is recommended.

(Whole area)

*1 Standoff dimension is the dimension that takes into account the solder resist

or silk screen printing thickness on the PC board in order to preserve the

dimension from the surface of the PC board to the bottom of the socket.

*2 This is the pattern forbidden area. It is provided to prevent the signal contact

tips from contacting the substrate surface.

Recommended metal mask pattern

Metal mask thickness: 120µm

Metal mask opening area ratio: 75%

Metal mask opening area ratio:100%

Metal mask opening area ratio: 80%

Socket edge

(R)

9-1.0±0.03

17.5±0.05 (2.5×7)

2.5±0.05 (pitch)

1.65±0.05

(R)

29.95±0.05

1.60±0.03

1.31±0.03

6.27±0.05 5.88±0.05

(3.9)

1.55±0.03

1.75±0.03

26.40±0.05

4.20±0.05

5.50±0.05

14.30±0.05

3.30±0.03

1.28±0.03

0.35±0.03

1.2±0.03

0.82±0.03

0.35±0.03

0.82±0.03

Contact status of the card detection and write protect switches

Card attachment

condition

Write protect switch Card detection

switch

Write unable Write enable

Card not attached Open Open Open

Card attached Open Closed Closed

Te r minal number 1–21–3

www.honda-connectors.co.jp

AXA2R

2. On board mounting standard type (Standoff 1.5mm)

Part No.

AXA2R73361∗-M

(With card jump-out prevention function)

AXA2R73321∗-M

(Without card jump-out prevention function)

Card center

SD memory card

Te rminal coplanarity

0.10

(Signal/Detection contact)

0.7

1.2

1.7

5.3

8.10

9.40

18.20

(2.10)

19.15

17.50

2.50

9.3750.625

1.40

(29.80)

28.40

14.6513.50

28.15

(Contact pitch) 2.50±0.1

1.65±0.1

14.55

(0.625)

(17.50)

27.95

0.60

(4.90)

2.70

*1.58 (Standoff dimensions)

Detailed internal view View of set card

Pin No.4

Pin No.3

Pin No.1

Pin No.9

Pin No.5

Pin No.7

Pin No.2

Pin No.8

Pin No.6

SD memory card

(24.00)

(0.80) (Push stroke)

(35.10) (Set condition)

(6.00) (Eject stroke)

Circuit schematic

No. 3

No. 2

No. 1

Recommended PC board pattern (TOP VIEW)

Through hole

PC board both side

Substrate edge

Socket edge

0.60±0.05

0.40±0.05

14.55±0.05

1.60±0.05

1.40±0.05

5.30±0.05

3.30

(0.50)

0.60±0.05

0.40±0.05

12.45±0.05

1.00±0.05

1.10±0.05

0.50±0.05

1.10±0.05

1.55±0.05

12.25±0.05

1.60±0.05

8.10±0.05

9.40±0.05

18.20±0.05

30.30±0.05

1.20±0.05

19.15±0.05

17.50±0.05

0.625±0.05

2.50±0.05 (Pitch)

1.75±0.05

27.95±0.05

1.60±0.05

(R)

*Standoff dimension is the dimension that takes into account the solder resist or

silk screen printing thickness on the PC board in order to preserve the dimension

from the surface of the PC board to the bottom of the socket.

Recommended metal mask pattern

Metal mask thickness: 120µm

Metal mask opening area ratio: 75%

Metal mask opening area ratio:100%

Metal mask opening area ratio: 80%

Socket edge

(R)

9-1.0±0.03

17.5±0.05 (2.5×7)

2.5±0.05 (pitch)

1.65±0.05

(R)

29.95±0.05

1.60±0.03

1.31±0.03

6.27±0.05 5.88±0.05

(3.9)

1.55±0.03

1.75±0.03

26.40±0.05

4.20±0.05

5.50±0.05

14.30±0.05

3.30±0.03

1.28±0.03

0.35±0.03

1.2±0.03

0.82±0.03

0.35±0.03

0.82±0.03

Contact status of the card detection and write protect switches

Card attachment

condition

Write protect switch Card detection

switch

Write unable Write enable

Card not attached Open Open Open

Card attached Open Closed Closed

Te r minal number 1–21–3

www.honda-connectors.co.jp

AXA2R

3. On board mounting reverse type (Without standoff)

Part No.

AXA2R63061∗-M

(With card jump-out prevention function)

AXA2R63021∗-M

(Without card jump-out prevention function) 0.60

1.40

28.40

(29.80)

14.65 13.50

28.15

8.10

9.40

18.20

17.50

14.55

27.95

(0.625)

1.65±0.1

(Contact pitch) 2.50±0.1

Card center

19.15

17.50

0.625

9.375

2.50

(2.10)

1.20

1.70

0.70

5.30

(3.40)

2.70

SD memory card

0.10

*0.08 (Standoff dimensions)

Te rminal coplanarity

(Signal/Detection contact)

Detailed internal view View of set card

Pin No.4

Pin No.3

Pin No.1

Pin No.9

Pin No.5

Pin No.7

Pin No.2

Pin No.8

Pin No.6

SD memory card

(24.00)

(0.80) (Push stroke)

(35.10) (Set condition)

(6.00) (Eject stroke)

Circuit schematic

No. 3

No. 2

No. 1

Recommended PC board pattern (TOP VIEW)

14.55±0.05

27.95±0.05

0.60±0.05

0.40±0.05

1.60±0.05

PC board both side

: Pattern insulation

is recommended.

(Whole area)

Substrate edge

Socket edge Through hole

30.30±0.05

18.20±0.05

9.40±0.05

8.10±0.05 1.60±0.05

2.50±0.05 (Pitch)

0.625±0.05

1.60±0.05

1.10±0.05

0.50±0.05

1.10±0.05

1.20±0.05

0.50±0.05

0.60±0.05

(0.50)

(R)

5.30±0.05

1.40±0.05

1.60±0.05

3.30

0.40±0.05

17.50±0.05

12.25±0.05

12.45±0.05

1.75±0.05

1.55±0.05

1.00±0.05

(15.65)

19.15±0.05

(30.15)

*Standoff dimension is the dimension that takes into account the solder resist or

silk screen printing thickness on the PC board in order to preserve the dimension

from the surface of the PC board to the bottom of the socket.

Recommended metal mask pattern

Metal mask thickness: 120µm

Metal mask opening area ratio: 80%

Metal mask opening area ratio: 100%

Metal mask opening area ratio: 75%

Socket edge

(R)

9-1.0±0.03

17.5±0.05 (2.5×7)

2.5±0.05 (pitch)

1.65±0.05

29.95±0.05

1.60±0.031.60±0.03

1.31±0.03

(3.9)

6.27±0.05

5.88±0.05

1.75±0.03

1.55±0.03

26.40±0.05

14.30±0.05

5.50±0.05

4.20±0.05

0.82±0.03

1.28±0.03

0.35±0.03

0.82±0.03

0.35±0.03

1.2±0.03

3.30±0.03

Contact status of the card detection and write protect switches

Card attachment

condition

Write protect switch Card detection

switch

Write unable Write enable

Card not attached Open Open Open

Card attached Open Closed Closed

Te r minal number 1–21–3

www.honda-connectors.co.jp

AXA2R

4. On board mounting reverse type (Standoff 1.5mm)

Part No.

AXA2R63361∗-M

(With card jump-out prevention function)

AXA2R63321∗-M

(Without card jump-out prevention function)

Card center

8.10

9.40

18.20

19.15

17.50

2.50

9.375 0.625

1.40

(29.80)

28.40

14.65 13.50

28.15

17.50

(Contact pitch) 2.50±0.1 1.65±0.1

14.55 (0.625)

27.95

0.60 Te rminal coplanarity

(Signal/Detection contact)

SD memory card

0.10

2.70

0.70

1.20

1.70

5.30

(2.10)

(4.90)

*1.58 (Standoff dimensions)

Detailed internal view View of set card

Pin No.4

Pin No.3

Pin No.1

Pin No.9

Pin No.5

Pin No.7

Pin No.2

Pin No.8

Pin No.6

SD memory card

(24.00)

(0.80) (Push stroke)

(35.10) (Set condition)

(6.00) (Eject stroke)

Circuit schematic

No. 3

No. 2

No. 1

Recommended PC board pattern (TOP VIEW)

PC board both side

Substrate edge

Socket edge Through hole

0.60±0.05

0.40±0.05

14.55±0.05

1.60±0.05

1.40±0.05

5.30±0.05

3.30

(0.50)

0.60±0.05

0.40±0.05

12.45±0.05

1.00±0.05

1.10±0.05

0.50±0.05

1.10±0.05

1.20±0.05

1.55±0.05

12.25±0.05

1.60±0.05

8.10±0.05

9.40±0.05

18.20±0.05

30.30±0.05

19.15±0.05

17.50±0.05

0.625±0.05

2.50±0.05 (Pitch)

1.75±0.05

27.95±0.05

1.60±0.05

(R)

*Standoff dimension is the dimension that takes into account the solder resist or

silk screen printing thickness on the PC board in order to preserve the dimension

from the surface of the PC board to the bottom of the socket.

Recommended metal mask pattern

Metal mask thickness: 120µm

Metal mask opening area ratio: 80%

Metal mask opening area ratio: 100%

Metal mask opening area ratio: 75%

Socket edge

(R)

9-1.0±0.03

17.5±0.05 (2.5×7)

2.5±0.05 (pitch)

1.65±0.05

29.95±0.05

1.60±0.031.60±0.03

1.31±0.03

(3.9)

6.27±0.05

5.88±0.05

1.75±0.03

1.55±0.03

26.40±0.05

14.30±0.05

5.50±0.05

4.20±0.05

0.82±0.03

1.28±0.03

0.35±0.03

0.82±0.03

0.35±0.03

1.2±0.03

3.30±0.03

Contact status of the card detection and write protect switches

Card attachment

condition

Write protect switch Card detection

switch

Write unable Write enable

Card not attached Open Open Open

Card attached Open Closed Closed

Te r minal number 1–21–3

www.honda-connectors.co.jp

AXA2R

EMBOSSED TAPE AND REEL (Unit: mm)

NOTES

• Tape dimensions • Reel dimensions (Conforming to JIS C0806-1995)

(2.00)

(4.00)

1.55±0.05 dia.

Top cover

tape

Emboss

carrier tape

Pocket pitch=36.00

165° to 180°

44.00

40.40

20.20

Socket for SD memory card

(1.75)

Pull-out direction

Label

Emboss carrier tape

Taping reel

Top cover tape

Cavity

Tape

(44.4)

370 dia.

1.Regarding the design of PC board

patterns

Conduct the recommended foot pattern

design, in order to preserve the

mechanical strength of terminal solder

areas.

2. Regarding the socket mounting

1) When reﬂow soldering when the slider

is locked, heat will cause the slider to

deform and not work. Therefore, please

conﬁrm that the slider lock is released

before mounting if you have inserted and

removed a card before soldering.

2) Be aware that during mounting,

external forces may be applied to the

connector contact surfaces and terminals

and cause deformations.

3. Soldering

1) Reﬂow soldering

(1) Screen-printing method is

recommended for cream solder printing.

(2) Use the recommended foot pattern for

cream solder printing (screen thickness:

0.12 mm).

(3) The metal mask opening ratio for the

COM contact (one) and NO contacts

(two) must be 75%.

(4) When applying the different thickness

of a screen, please consult us.

(5) The following diagram shows the

recommended reﬂow soldering

temperature proﬁle.

The recommended conditions for the

reﬂow temperature proﬁle

(6) Measure the temperature at the

connector surface.

(7) If the reverse side of the board

undergoes reﬂow soldering after the

socket is reﬂow-soldered, ﬁx the socket

with tape or adhesive; otherwise, the

socket may drop. The socket can

withstand two iterations of reﬂow

soldering.

2) Hand soldering

• Set the soldering tip to 300°C, and

solder for no more than 5 seconds.

• Be aware that for the 0 mm standoff

type, solder creeping at the retention

solder tab sections may occur if soldering

is conducted for long periods or if too

much solder is used.

4. Cleaning after soldering

Inside the socket there is a slider section

and card detection contact/write

protection mechanism. If anything such

as ﬂux remains inside after washing,

insertion and removal will be hampered

and contact will be faulty. Therefore, do

not use methods that involve submersion

when cleaning. (Partial cleaning of the

PC board and soldered terminals is

possible.)

5. After PC board mounting

1) Warping of the PC board should be no

more than 0.03 mm for the entire

connector length.

2) When assembling PC boards or

storing them in block assemblies, make

sure that undue weight is not exerted on

a stacked socket.

3) Be sure not to allow external pressure

to act on sockets when assembling PC

boards or moving in block assemblies.

6. Handling single components

1) Make sure not to drop or allow parts to

fall from work bench

2) Be cautious when handling because

excessive force applied to the terminals

will cause deformation and loss of

terminal coplanarity.

3) Repeated bending of the terminals

may break them.

7. Card ﬁtting

1) These products are made for the

design of compact and lightweight

devices and therefore the molded part is

very thin. For this reason, design the

device to prevent undue wrenching forces

from being applied to the product during

use.

2) The sockets are constructed to prevent

reverse card insertion. Caution is

required because repeated, mistaken

reverse insertion may damage the socket

and card.

3) When not soldered, be careful not to

insert and remove the socket’s card.

Doing so will cause a decrease in

anchoring ability of the molded part and

loss of coplanarity.

4) Forcibly removing a ﬁtted card may

degrade the card removal prevention

lock. To remove a card, be sure to push

the card in the insertion direction to

release the slider lock before pulling out

the card.

5) Please include notes to the following

effect in your user manuals.

6) The card ejection protection lock does

not work for MMC.

7) The socket does not have a wrong

insertion protection structure for MMC.

Be careful about the insertion direction.

8) If an MMC is inserted, it is possible

that a short circuit between the socket’s

signal contacts No. 7 and 8 and the

MMC’s contact No. 7 may be caused.

60 to 120 sec.

Preheating

Time

Temperature

Peak temperature

180 to 200°C

155 to 165°C

250°C max.

Within 30 sec.

www.honda-connectors.co.jp

AXA2R

8 Printed in JapanSpecifications are subject to change without notice.

Address : 6-18-12, Megurohoncho, Meguro-Ku, Tokyo 152-8520, Japan / Telephone : +81-3-3714-1166/1161 / Fax : +81-3-5721-7090

8. Device design

1) Contact failure may result if dust or dirt

enters the contact section. Please take

appropriate measures when designing

the device to prevent this from

happening, for example by adding a

cover.

2) To ensure smooth insertion and

removal of cards, please design the

chassis so that no force is applied to the

metal shell on top of the socket. If a force

is present that pushes down on the metal

shell, the card will be pressed, which

might prevent ejection.

3) Please provide a guide or similar to

keep the socket from having force applied

to it when inserting and removing.

9. Card jump-out prevention function

1) This socket has a card jump-out

prevention function that works under

deﬁned conditions. However, we strongly

recommend that you instruct users to

carefully handle the product to avoid

accidents due to improper use or product

liability risks.

2) The life of the card jump-out prevention

function is not guaranteed under the

following conditions: (1) while the card is

inserted incompletely, (2) while the card

is inserted in the wrong direction, and (3)

after the card is inserted in the wrong

direction

3) In order to prevent card jump-out,

resistance has been added that affects

card insertion and removal. Therefore,

you will feel resistance when inserting

and removing the card. This is normal.

10. Others

If you coat the PC board after soldering

for insulation and to prevent wear, make

sure that the coating does not adhere to

the connector.