CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Low-Profile Package
- Low power loss, high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
1AL 1BL 1DL 1GL 1JL 1KL 1ML
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
Cj pF
Trr μs
T
JO
C
T
STG O
C
Document Number: DS_D1405032 Version: M14
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
1.1
5
50
Typical reverse recovery time (Note 3) 1.8
Operating junction temperature range
Storage temperature range - 55 to +175
Note 1: Pulse test with PW=300μs, 1% duty cycle
- 55 to +175
Typical junction capacitance (Note 2) 9
Typical thermal resistance R
θJL
R
θJA
O
C/W
25
85
30
85
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
μA
A
Maximum instantaneous forward voltage (Note 1)
@ 1 A V
F
V
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 1
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
30
S1KL S1ML UNIT
Marking code
Maximum repetitive peak reverse voltage
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL S1AL S1BL S1DL S1GL S1JL
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: Sub SMA Sub SMA
S1AL thru S1ML
Taiwan Semiconductor
Surface Mount Rectifier
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
PART NO.
PART NO.
S1ML
S1ML
S1ML
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405032 Version: M14
S1MLHRU
RU G Green compound
H RU AEC-Q101 qualified
MH Sub SMA 10,000 / 13" Plastic reel (12mm tape)
AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
M2 Sub SMA 7,500 / 13" Plastic reel (12mm tape)
RH Sub SMA 10,000 / 13" Paper reel (12mm tape)
RF Sub SMA 3,000 / 7" Plastic reel (12mm tape)
R2 Sub SMA 7,500 / 13" Paper reel (12mm tape)
MQ Sub SMA 10,000 / 13" Plastic reel (8mm tape)
R3 Sub SMA 1,800 / 7" Plastic reel (12mm tape)
3,000 / 7" Plastic reel (8mm tape)
RT Sub SMA 7,500 / 13" Paper reel (8mm tape)
MT Sub SMA 7,500 / 13" Plastic reel (8mm tape)
S1AL thru S1ML
ORDERING INFORMATION
S1xL
(Note 1)
AEC-Q101
QUALIFIED
RQ
PACKAGE PACKING
Prefix "H"
RU
Suffix "G"
Taiwan Semiconductor
PACKING COD E GREEN COMPOUND
CODE
S1ML RU
S1ML RUG
Sub SMA 1,800 / 7" Plastic reel (8mm tape)
RV Sub SMA
Sub SMA 10,000 / 13" Paper reel (8mm tape)
Note 1: "x" defines voltage from 50V (S1AL) to 1000V (S1ML)
EXAMPLE
PREFERRED P/N
RATINGS AND CHARACTERISTICS CURVES
RU
0
0.2
0.4
0.6
0.8
1
1.2
0 25 50 75 100 125 150 175
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
1
10
100
1 10 100
PEAK FORWARD SURGE CURRENT
(A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single
Half Sine Wave.
0.001
0.01
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2- TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
TJ=75℃
0.01
0.1
1
10
100
0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
INSTANTANEOUS FORWARD CURRENT
(A)
FORWARD VOLTAGE (V)
FIG. 4- TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
Min Max Min Max
B 1.70 1.90 0.067 0.075
C 2.70 2.90 0.106 0.114
D 0.16 0.30 0.006 0.012
E 1.23 1.43 0.048 0.056
F 0.80 1.20 0.031 0.047
G 3.40 3.80 0.134 0.150
H 2.45 2.60 0.096 0.102
I 0.35 0.85 0.014 0.033
J 0.00 0.10 0.000 0.004
P/N = Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405032 Version: M14
Unit (inch)
0.055
0.047
0.122
0.075
0.169
1.9
E4.3
SUGG ESTED PAD LAYO UT
A1.4
B1.2
Symbol Unit (mm)
MARKING DIAGRAM
S1AL thru S1ML
Taiwan Semiconductor
C3.1
D
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
1
10
100
0.01 0.1 1 10 100
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5- TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405032 Version: M14
S1AL thru S1ML
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
