SBR2M30P1
2.0A SBR®
SURFACE MOUNT SUPER BARRIER RECTIFIER
PowerDI®123
Features
• Ultra Low Leakage Current
• Excellent High Temperature Stability
• Superior Reverse Avalanche Capability
• Patented Interlocking Clip Design for High Surge Current
Capacity
• Patented Super Barrier Rectifier Technology
• Soft, Fast Switching Capability
• 175ºC Operating Junction Temperature
• ±16KV ESD Protection (HBM, 3B)
• ±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
• Lead Free Finish, RoHS Compliant (Note 1)
• “Green” Molding Compound (No Br, Sb)
• Qualified to AEC-Q 101 Standards for High Reliability
Mechanical Data
• Case: PowerDI®123
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Polarity Indicator: Cathode Band
• Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.018 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VRM 30 V
RMS Reverse Voltage VR(RMS) 21 V
Average Rectified Output Current (See Figure 1) IO 2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load IFSM 75 A
Non-Repetitive Avalanche Energy
(TJ = 25°C, IAS = 5A, L = 8.5 mH) EAS 105 mJ
Repetitive Peak Avalanche Energy
(1µs, 25°C) PARM 1100 W
Thermal Characteristics
Characteristic Symbol Value Unit
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
RθJS
RθJA
RθJA
5
183
125
ºC/W
Operating and Storage Temperature Range TJ, TSTG -65 to +175 ºC
Notes: 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical RӨJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
SBR and PowerDI are registered trademarks of Diodes Incorporated.
SBR2M30P1
Document number: DS30704 Rev. 7 - 2 1 of 4
www.diodes.com October 2008
© Diodes Incorporated