November 2009 Doc ID 15179 Rev 2 1/18
18
SPMB250-A1
MOTIONBEE™ family acceleration sensor
Features
■Ready-to-use IEEE 802.15.4 compliant
wireless acceleration sensor
■Integrated three axis MEMS-based linear
accelerometer
■Antenna on board
■No external components required excluding
power supplier
■Possibility to be programmed via SIF connector
with EMZNET ZigBee® protocol stack and
custom applications
■Board fixing with screws or pads for SMD
soldering
■Reset and commissioning push buttons
externally available
■Power connector and power switch externally
available
■Two LEDs externally available for connection
check and debugging
■Board dimensions: 49 x 27 x 5 mm
■CE / FCC compliant
Description
SPMB250-A1 board is a ready-to-use wireless
acceleration sensor based on an IEEE 802.15.4
compliant radio. It is designed to enable
development of applications for remote motion
monitoring in wireless sensor networks systems.
The board is based on the ZigBee® module
SPZB250 which performs both the RF radio and
controlling functions and the three axis linear
accelerometer sensor LIS3LV02DL.
The ZigBee® module contains the SN250 SoC
integrating a fully compliant 802.15.4 radio
together with a microcontroller that can be used to
elaborate sensor data and networking
functionalities. SN250 can be programmed to run
the EMZNET ZigBee® protocol stack from Ember
Corporation. The module is programmable thanks
to the SIF connector available on the SPZB250
module.
The LIS3LV02DL three axis accelerometer is a
low power low voltage linear accelerometer with
digital output that can operate in the user
selectable range +/-2 g or +/-6 g and with
programmable data rate.
The controller inside SPZB250 module handles
all the networking functions and it can be used to
implement custom procedures to elaborate and
send data collected by the acceleration sensor.
The board is ready-to-use, requiring only an
external power supplier to connect to the
integrated standard two pole connector. A switch
is present in series to the supply connection to
power on / off the board.
www.st.com
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Contents SPMB250-A1
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Contents
1 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Connections - pad out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6 Board description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.1 Power supply connector (J1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.2 ON / OFF switch (SW2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.3 SIF connector (J2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.4 Pad description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.5 LED indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7 Board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
9 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
10 Radiation pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
11 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
12 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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SPMB250-A1 RoHS compliance
Doc ID 15179 Rev 2 3/18
1 RoHS compliance
ST modules are RoHS compliant and being based on ST devices comply with ECOPACK®
norms implemented by ST.
2 Connections - pad out
Figure 1. Connections
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Block diagram SPMB250-A1
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3 Block diagram
Figure 2. Block diagram
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41;#DPOUSPMMFS3'

--
4848
3FTFU
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SPMB250-A1 Maximum ratings
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4 Maximum ratings
4.1 Absolute maximum ratings
4.2 Operating ranges
Operating ranges define the limits for functional operation and parametric characteristics of
the module.
Functionality outside these limits is not implied
Table 1. Absolute maximum ratings
Symbol Parameter
Values
Unit
Min Max
VCC Board supply voltage 7 V
TOPmax Operating ambient temperature -40 +85 °C
TSTG Storage temperature -40 +85 °C
Table 2. Operating ranges
Symbol Parameter Conditions
Values
Unit
Min Typ Max
VCC Module supply voltage -40 °C < T < 85 °C 3.6 6 V
TSTG
Operating ambient
temperature -40 +85 °C
IOP Operation current (1)
1. Values indicated in the table are referred to the single states (Standby TX,RX,…); the overall current
depends on the working strategy used by the application
Vin = 4 V stand by 16 μA
Vin = 4 V TX mode 37 mA
Vin = 4 V RX mode 36 mA
Vin = 4 V CPU only 9 mA
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Electrical characteristics SPMB250-A1
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5 Electrical characteristics
5.1 DC I/O specification
Table 3. DC input / output specification
Symbol Parameter Conditions
Values
Unit
Min Typ Max
VIL Low level input voltage
SW1 (Reset) and SW3 Vin = 4 V 0.6 V
VOL Low level output voltage
P8 (L1) and P10 (L2) Vin = 4 V 0.2 V
VOH High level output voltage
P8 (L1) and P10 (L2) Vin = 4 V 2.7 3.3 V
IOLed Vin = 4 V 4 mA
RFin Input frequency range 2405 2480 MHz
RX sens Receiver sensitivity @PER 1 % -92 dBm
RFout Output frequency range 2405 2480 MHz
TXpout Nominal output power @ 2402 – 2480 MHz 0 dBm
FS Acceleration sensor
Measurement Range
±1.7 ±2.0 g
±5.3 ±6.0 g
Dres Acceleration sensor
Resolution
Full-scale = ±2 g
Output data rate = 40 Hz 1.0 mg
So Acceleration sensor
Sensitivity
Full-scale = ±2 g
12 bit representation 920 1024 1126 LSb/g
Full-scale = ±6 g
12 bit representation 306 340 374 LSB/g
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SPMB250-A1 Board description
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6 Board description
6.1 Power supply connector (J1)
When used directly connected to the system to be monitored in terms of vibration /
acceleration the only connection needed is the one related to the power source.
To have a standard and in the same time miniaturized connection a two pole connector has
been chosen (i.e. Molex 53261-0271 or equivalent)
Figure 3. J1 connector
6.2 ON / OFF switch (SW2)
To power on / off the board a switch has been provided aboard.
Figure 4. SW2 switch
J
1
SW
2
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Board description SPMB250-A1
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6.3 SIF connector (J2)
To allow the user to program the board, a SIF connector is available.
Signals available on this connector are:
Figure 5. SIF - pin description
Figure 6. SIF connector
Vdd 12SIF_MISO
GND 34SIF_MOSI
GND 56SIF_CLK
SIF_LOADB 78RSTB
PTI_EN 910PTI_DATA
J2
1
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SPMB250-A1 Board description
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6.4 Pad description
When used on a motherboard the boundary pads on the SPMB250-A1 can be used to get
the connections with the remaining part of the circuit present on the motherboard itself.
The meaning of the pads is listed in the following table:
6.5 LED indicators
Two LED L2 (Led2) and L3 (Led3) are connected to the GPIO of SPZB250 module to be
used to monitor the module activity. Driving pin of L3 is also available as pad out (P10).
Table 4. Pad description
N. Pin name I/O Description
P1 J1 – Vcc- (GND) Power GND input voltage supply
P2 J1 – Vcc + Power Positive input voltage supply
P3 SW2-O Power Power switch pole connected to the circuit
P4 SW2-I Power Power switch pole connected to Vin +
P5 GND Power
P6 SW1 (RESET /
RSTB) IReset push button. Reset occurs when this pad is tied to
GND
P7 GND Power
P8 GPIO8 I/O GPIO8 of SPZB250 module
P9 SW3 I General purpose push button / commissioning push button.
It can used also as I/O pin
P10 L3 – GPIO13 O Led 3 general purpose (connected to SPZB250 GPIUO13) A
resistor is needed to limit the current
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Board layout SPMB250-A1
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7 Board layout
Figure 7. Board layout
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SPMB250-A1 Soldering
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8 Soldering
Soldering phase has to be carefully carried out: in order to avoid undesired melting
phenomenon, particular attention has to be paid on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Figure 8. Soldering
Table 5. Soldering
Profile feature PB free assembly
Average ramp up rate (TSMAX to TP) 3 °C / sec max
Preheat
Temperature min (TS min)
Temperature max (TS max)
Time (tS min to tS max) (tS)
150 °C
200 °C
60 – 100 sec
Time maintained above:
Temperature TL
Time tL
217 °C
40 – 70 sec
Peak temperature (Tp) 240 + 0 °C
Time within 5 °C of actual peak temperature (tP) 10 – 20 sec
Ramp down rate 6 °C / sec
Time from 25 °C to peak temperature 8 minutes max
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Recommendations SPMB250-A1
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9 Recommendations
●An integrated antenna is present on the board:
– Assembly the board in the application avoiding any shielding of the antenna
– Avoid metallic parts close to the antenna
– Do not use metallic case
●Board fixing can be done with 4 screws:
– In case of fixing on metallic base insert an insulator foil between the board and the
base in order to avoid any potential short circuit
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SPMB250-A1 Radiation pattern
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10 Radiation pattern
SPMB250-A1 is based on the SPZB250 module which incorporates an RF section with an
integrated antenna (Murata ANCV12G44SAA127).
The antenna radiation pattern (as measured on the SPZB250 module) follows.
Figure 9. Measurement direction
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Mechanical dimensions SPMB250-A1
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11 Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
Figure 10. Mechanical dimensions
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SPMB250-A1 Mechanical dimensions
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Figure 11. Recommended land pattern
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Ordering information scheme SPMB250-A1
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12 Ordering information scheme
Table 6. Ordering information scheme
SP MB 250 -A 1
Subsystem product
MOTIONBEE™ family
SN250 -based board
Accelerometer sensor
Version 1
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SPMB250-A1 Revision history
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13 Revision history
Table 7. Document revision history
Date Revision Changes
12-Feb-2009 1 Initial release
03-Nov-2009 2 Added Section 1 on page 3
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SPMB250-A1
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