AP2609GYT-HF Halogen-Free Product Advanced Power Electronics Corp. P-CHANNEL ENHANCEMENT MODE POWER MOSFET Simple Drive Requirement Small Size & Lower Profile RoHS Compliant & Halogen-Free BVDSS RDS(ON) ID D -20V 18m -11.3A G S D Description Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The PMPAK(R) 3x3 package is special for DC-DC converters application and lower 1.0mm profile with backside heat sink. D D D S S S G PMPAK (R) 3x3 Absolute Maximum Ratings Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25 ID@TA=70 Rating Units -20 V +8 V 3 -11.3 A 3 -9 A Continuous Drain Current Continuous Drain Current 1 IDM Pulsed Drain Current -40 A PD@TA=25 Total Power Dissipation 3.57 W TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Rthj-c Rthj-a Parameter Maximum Thermal Resistance, Junction-case Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice 3 Value Unit 6 /W 35 /W 1 201102101 AP2609GYT-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol BVDSS RDS(ON) Parameter Test Conditions Drain-Source Breakdown Voltage Static Drain-Source On-Resistance 2 Min. Typ. VGS=0V, ID=-250uA -20 - - V VGS=-4.5V, ID=-7A - 15 18 m VGS=-2.5V, ID=-5A - 18 24 m VGS=-1.8V, ID=-2A - 23 35 m -1 V VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA gfs Forward Transconductance VDS=-5V, ID=-7A - 25 - S IDSS Drain-Source Leakage Current VDS=-16V, VGS=0V - - -10 uA IGSS Gate-Source Leakage VGS=+8V, VDS=0V - - +100 nA ID=-7A - 26.5 42 nC 2 -0.25 -0.43 Max. Units Qg Total Gate Charge Qgs Gate-Source Charge VDS=-10V - 2.3 - nC Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 7 - nC VDS=-10V - 10 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=-1A - 17 - ns td(off) Turn-off Delay Time RG=3.3 - 90 - ns tf Fall Time VGS=-5V - 75 - ns Ciss Input Capacitance VGS=0V - 2210 3540 pF Coss Output Capacitance VDS=-10V - 305 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 290 - pF Rg Gate Resistance f=1.0MHz - 4.6 9.2 Min. Typ. IS=-2.9A, VGS=0V - - -1.2 V Source-Drain Diode Symbol VSD Parameter 2 Forward On Voltage 2 Test Conditions Max. Units trr Reverse Recovery Time IS=-7A, VGS=0V, - 30 - ns Qrr Reverse Recovery Charge dI/dt=100A/s - 50 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec, 85oC at steady state. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP2609GYT-HF 40 40 30 -5.0V -4.5V -3.5V -2.5V V G = -1.8V -ID , Drain Current (A) -ID , Drain Current (A) T A =25 o C 20 10 T A = 150 o C -5.0V -4.5V -3.5V -2.5V V G = -1.8V 2 4 30 20 10 0 0 0 1 2 3 4 5 0 -V DS , Drain-to-Source Voltage (V) 1 3 5 -V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 30 2.0 I D =-7A V G =-4.5V I D = -2 A T A =25 Normalized RDS(ON) RDS(ON) (m) 26 22 18 1.6 1.2 0.8 14 10 0.4 0 1 2 3 4 5 -50 -V GS , Gate-to-Source Voltage (V) 0 50 100 150 o T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 8 Normalized -VGS(th) (V) 1.6 -IS(A) 6 T j =150 o C 4 T j =25 o C 1.2 0.8 0.4 2 0.0 0 0 0.2 0.4 0.6 0.8 1 -V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.2 -50 0 50 100 150 o T j , Junction Temperature ( C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP2609GYT-HF f=1.0MHz 3200 6 I D = -7 A V DS = -10 V 2400 4 C iss C (pF) -VGS , Gate to Source Voltage (V) 5 3 1600 2 800 1 C oss C rss 0 0 0 10 20 30 40 1 5 Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics 13 17 21 25 Fig 8. Typical Capacitance Characteristics 1 Operation in this area limited by RDS(ON) 100us 10 1ms 10ms 1 100ms 1s 0.1 DC T A =25 o C Single Pulse Normalized Thermal Response (Rthja) 100 -ID (A) 9 -V DS , Drain-to-Source Voltage (V) Duty factor=0.5 0.2 0.1 0.1 0.05 0.02 0.01 PDM t 0.01 T Single Pulse Duty factor = t/T Peak Tj = PDM x Rthja + T a Rthia=85 /W 0.001 0.01 0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000 -V DS , Drain-to-Source Voltage (V) t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG -4.5V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4