SFH4500 - OSRAM Opto Semiconductors

SFH 4500

SFH 4505

Leistungsstarke IR-Lumineszenzdiode

High Power Infrar ed Emitter

Vorläufige Daten / Preliminary Data

2003-10-29 1

SFH 4500 SFH 4505

Wesentliche Merkmale

• Leistungsstarke GaAs-LED (40mW)

• Hoher Wirkunsgrad bei kleinen Strömen

• Typische Peakwellenlänge 950nm

• Engwinkliger SMT-Sidelooker

• IR Reflow Löten geeignet

• Feuchte-Empfindlichkeitsstufe 3 nach JEDEC

Standard J-STD-020A

Anwendungen

• Bauteil mit hoher Strahlstärke zur

Oberflächenmontage (SMT)

• Schnelle Datenübertragung mit

Übertragungsraten bis 100 Mbaud

(IR Tastatur, Joystick, Multimed ia)

• Analoge und digitale Hi-Fi Audio- und

Videosignalübertragung

• Alarm- und Sicherungssysteme

• IR Freiraumübertragung

• IR-Scheinwerfer für Kameras

Typ

Type Bestellnummer

Ordering Code Strahlstärkegruppierung 1) (IF = 100mA, tp = 20 ms)

Radiant intensity grouping 1)

Ie (mW/sr)

1) gemessen bei einem Raumw i nk el Ω = 0. 01 s r

measured at a solid angle of Ω = 0. 01 sr

SFH 4500 Q62702-P5163 85 (>25)

SFH 4505 Q62702-P5164 85 (>25)

Features

• High Power GaAs-LED (40mW)

• High Efficiency at low currents

• Typical peak wavelength 950nm

• Narrow angle SMT-Sidelooker

• Suitable for IR reflow soldering

• Moisture Sensitivity Level 3 according to

JEDEC Standard J-STD-020A

Applications

• Device with high radiant intensity suitable for

surface mounting (SMT)

• High data transmission rate up to 100 Mbaud

(IR keyboard, Joystick, Multimedia)

• Analog and digi tal Hi-Fi audi o an d vi deo s ignal

transmission

• Alarm and safety equipment

• IR free air transmission

• IR spotlight for cameras

2003-10-29 2

SFH 4500, SFH 4505

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top; Tstg – 40 … + 100 °C

Sperrspannung

Reverse voltage VR3V

Durchlaßstrom

Forward current IF (DC) 100 mA

Stoßstrom

Surge current

tp = 10 µs, D = 0

IFSM 2.2 A

Verlustleistung

Power dissipation Ptot 180 mW

Wärmewiderstand Sperrschicht - Umgebung,

freie Beinchenlänge max. 10 mm

Thermal resistance junction - ambient,

lead length between package bottom and PCB

max. 10 mm

RthJA 375 K/W

SFH 4500, SFH 4505

2003-10-29 3

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der Strahlung

Wavelength of peak emission

IF = 100 mA, tp = 20 ms

λpeak 950 nm

Spektrale Bandbreite bei 50% von Imax

Spectral bandwidth at 50% of Imax

IF = 100 mA, tp = 20 ms

∆λ 40 nm

Abstrahlwinkel

Half angle ϕ± 10 Grad

deg.

Aktive Chipfläche

Active chip area A0.09 mm2

Abmessungen der aktiven Chipfläche

Dimension of the active chip area L×B

L×W0.3 ×0.3 mm

Schaltzeiten, Ie von 10% auf 90% und

von 90% auf 10%

Switching time s, Ie from 10% to 90% and

from 90% to 10%

IF = 100 mA, tP = 20 ms, RL = 50 Ω

tr, tf10 ns

Kapazität

Capacitance

VR = 0 V, f = 1 MHz

Co 35 pF

Durchlaβspannung

Forward voltage

IF = 100 mA, tp = 20 ms

IF = 1 A, tp = 100 µsVF

1.5 (≤ 1.8)

3.2 (≤ 4.3) V

Sperrstrom

Reverse current

VR = 3 V

IR0.01 (≤ 10) µA

Gesamtstrahlungsfluß

Total radiant flux

IF = 100 mA, tp = 20 ms

Φe40 mW

Temperaturkoeffizient von Ie bzw. Φe

Temperature coefficient of Ie or Φe

IF = 100 mA

TCI – 0.44 %/K

2003-10-29 4

SFH 4500, SFH 4505

Temperaturkoeffizient von VF

Temperature coefficient of VF

IF = 100 mA

TCV– 1.5 mV/K

Temperaturkoeffizient von λ

Temperature coefficient of λ

IF = 100 mA

TCλ+ 0.2 nm/K

Strahlstärke Ie in Achsrichtung

gemessen bei einem Raumwinkel von Ω = 0.01 sr

Radiant Intensity Ie in Axial Direction

measured at a solid angle of Ω = 0.01 sr

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Strahlstärke

Radiant intensity

IF = 100 mA, tp = 20 ms

Ie min

Ie typ

85 mW/sr

mW/sr

Strahlstärke

Radiant intensity

IF = 1 A, tp = 100 µs

Ie typ 550 mW/sr

Lötbedingungen

Soldering Conditions

Reflowlötung

Reflow Soldering Kolbenlötung (mit 1,5-mm-Kolbenspitze)

Iron Soldering (with 1.5-mm-bit)

Lötzonen-

temperatur

Temperature of

Soldering Zone

Maximale

Durchlaufzeit

Max. Transit Time

Temperatur

des Kolbens

Temperature

of the Solder-

ing Iron

Maximale

zulässige

Lötzeit

Max. Permis-

sible Solder-

ing Time

Abstand

Lötstelle –

Gehäuse

Distance

between

Solder Joint

and Case

245 °C 10 s 300 °C3 s ≥ 1.5 mm

Kennwerte (TA = 25 °C) (cont’d)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

SFH 4500, SFH 4505

2003-10-29 5

Relati ve Sp ectral Emi ssi o n

Ierel = f (λ)

Forward Curr e nt IF = f (VF)

single pu ls e, tp = 20 µs

Permissible Pulse Handling

Capability IF = f (τ), TA = 25 °C,

duty cycle D = parameter

OHF00777

nm800

Ιerel

850 900 950 1000 1100

100

OHF00784

-3

0.5 11.5 22.5 33.5 4.5

-2

-1

OHF00041

10-5

0.005

0.01

0.02

0.05

10-4 10-3 10-2 10-1 100101 2

10s

0.1

0.2

0.5

-1

100

Radiant Intensity Ιe/Ιe (100 mA) = f (IF)

Single pulse , tp = 20 µs

Radiation Characteristic

Ierel = f (ϕ)

e (100 mA)

OHF00809

ΙΙ

10 40

10 10 110 23

-3

-2

-1

0.2

0.4

1.0

0.8

0.6

1.0 0.8 0.6 0.4

0˚10˚20˚40˚ 30˚

OHF01019

50˚

60˚

70˚

80˚

90˚

100˚ 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

Max. Permissible Forward Current

IF = f (TA)

OHF01534

100

125

10 20 30 40 50 60 70 80 ˚C 100

2003-10-29 6

SFH 4500, SFH 4505

Maßzeichnungen

Package Outlines

Maße werden wi e fo lgt angegeben: m m (inc h) / Dim ensions are s pecified as follo ws: mm (inch).

GEOY6960

3.9 (0.154)

4.5 (0.177)

Cathode

7.1 (0.280)

7.7 (0.303)

2.54 (0.100)

spacing

13.1 (0.516)

14.7 (0.579)

5.5 (0.217)

7.5 (0.295)

1.95 (0.077)

2.05 (0.081)

R((3.2) (0.126))

5.4 (0.213)

6.0 (0.236)

((3.2) (0.126))

2.7 (0.106)

2.4 (0.094)

4.4 (0.173)

4.8 (0.189)

((R2.8 (0.110))

(-0.004...0.008)

3.7 (0.146)

3.3 (0.130)

2.8 (0.110)

2.4 (0.094)

Chip position

3.9 (0.154)

4.5 (0.177)

-0.1...0.2

SFH 4500

GEOY6961

3.9 (0.154)

4.5 (0.177)

Cathode

7.1 (0.280)

7.7 (0.303)

2.54 (0.100)

spacing

14.7 (0.579)

15.5 (0.610)

7.4 (0.291)

8.0 (0.315) ((3.2) (0.126))

5.4 (0.213)

6.0 (0.236)

((3.2) (0.126))

2.7 (0.106)

2.4 (0.094)

4.4 (0.173)

4.8 (0.189)

((R2.8 (0.110))

R2.05 (0.081)

1.95 (0.077)

Chip position

3.9 (0.154)

4.5 (0.177)

(-0.006...0.006)

-0.15...0.15

SFH 4505

SFH 4500, SFH 4505

2003-10-29 7

Published by OSRAM Opto Semiconductors GmbH & Co. OHG

Wernerwerkstrasse 2, D-93049 Regensburg

Attention please!

The inform at ion describes the type of co m ponent and sha ll not be c ons idered as assured char ac te ris tics .

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recyc ling operat ors known t o you. We can also help y ou – get in touch wit h your near est sales offic e.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Compo nents use d in life-support de vices or syste ms must be express ly authorize d for such purp ose! Critical

components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.

1 A critica l component is a co mponent usedin a l ife-support devi ce or system whose failure can re asonably be expec ted

to cause t he fail ure of tha t life -suppo rt dev ice or s ystem, or to affe ct i ts saf ety or effecti venes s of t hat device o r sy stem.

2 Life sup port device s or syst ems ar e int ended (a ) to b e imp lanted in t he hu man body , or ( b) to supp ort a nd/or main tain

and sust ain human life. If th ey fail , it is reasonable t o as su m e th at the health of the user m ay be endangered.