SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
FEATURES
DStereo Audio DAC and Mono ADC Support
Rates Up to 48kHz
DHigh Quality 95dB Stereo Audio Playback
Performance
DLow Power 19−mW Stereo Audio Playback at
48kHz Sample Rate and 3.3V Analog Supply
Level
DProgrammable Digital Audio
Effects/Bass/Treble/EQ/De−Emphasis Filters
DProgrammable Gain Amplifiers
DMIC Preamp and Hardware Automatic Gain
Control With Up to 59.5dB Gain
D32-Ω Stereo Headphone Driver With Support
for Both Cap or Capless Option
DCellular Headset Interface
D400mW 8-Ω Power Amp With Direct Battery
Supply Connection
D32-Ω Differential Earpiece Driver
DDifferential Interface to Cellular Phone
Module
DAuto-Detection of Headset and Button Press
DProgrammable Audio Routing
D4-Wire Touch Screen Interface
DIntegrated Touch Screen Processor With
Fully Automated Modes of Operation
DProgrammable Converter Resolution, Speed,
and Averaging
DProgrammable Autonomous Timing Control
DDirect Battery Measurement Accepts up to
6−V Input
DBuilt-In Buffer for Touch Screen Data
DSPI Serial Interface
DLow Power
DFull Power-Down Control
D48-Pin QFN Package
APPLICATIONS
DPersonal Digital Assistants
DSmart Cellular Phones
DMP3 Players
DESCRIPTION
The TSC2111 is a low-power highly integrated high
performance codec and touch screen controller, which
supports stereo audio DAC, mono audio ADC and SAR
ADC.
The TSC2111 features a high-performance audio codec
with 16, 20, 24, or 32-bit stereo playback, mono record
functionality at up to 48 ksps. The device integrates
several analog features such as support for headset
interface, cellular headset interface, microphone interface,
and speaker and receiver drivers. The device supports
auto detection of headset and button press without any
glue logic. The TSC2111 has fully programmable audio.
The digital audio data format is programmable to work with
popular audio standard protocols (I2S, DSP, left/right
justified) in master or slave mode, and also includes an
on-chip PLL for flexible clock generation capability.
The TSC2111 contains a 12-bit 4-wire resistive touch
screen converter complete with drivers, and interfaces to
the host controller through a standard SPI serial
interface. The on-chip processor provides extensive
features specifically designed to reduce host processor
and bus overhead, with capabilities that include fully
automated operating modes, programmable conversion
resolution up to 12 bits, programmable sampling rates up
to 125 kHz, programmable conversion averaging, and
programmable on-chip timing generation.
The TSC2111 offers battery measurement inputs capable
of reading battery voltages up to 6 V, while operating at
only 3 V. It also has an on-chip temperature sensor
capable of reading 0.3°C resolution. The TSC2111 is
available in a 48-lead QFN.
US Patent No. 6246394
SPI is a trademark of Motorola.
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Please be aware that an important notice concerning availability, standard warranty , and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
www.ti.com
Copyright 2004 − 2007, Texas Instruments Incorporated
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
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2
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT PACKAGE PACKAGE
DESIGNATOR OPERATING
TEMPERATURE RANGE ORDERING NUMBER TRANSPORT MEDIA
TSC2111
QFN-48
RGZ
−40°C to +85°C
TSC2111IRGZT Tape and Reel, 250
TSC2111
QFN-48
RGZ
−40
°
C to +85
°
C
TSC2111IRGZR Tape and Reel, 2500
PIN ASSIGNMENTS
QFN PACKAGE
(TOP VIEW)
13
DRVSS2
OUT8P
BVDD
OUT8N
DRVSS1
VGND/CP_OUTN
SPKFC
DRVDD
SPK2
SPK1
OUT32N
MIC_DETECT_IN
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
IOVDD
PWR_DN
RESET
GPIO2
GPIO1
AVDD2
AVSS2
AVDD1
X+
Y+
X−
Y− 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37
AVSS1
VREF
VBAT
AUX2
AUX1
BUZZ_IN/CP_INN
CP_OUTP
CP_INP
MICIN_HND
MICBIAS_HND
MICIN_HED
MICBIAS_HED
DVSS
DVDD
BCLK
WCLK
SDIN
SDOUT
MCLK
SCLK
MISO
MOSI
SS
PINTDAV
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3
Terminal Functions
PIN NAME DESCRIPTION PIN NAME DESCRIPTION
1 IOVDD IO Supply 25 MIC_DETECT_IN Microphone detect input
2 PWR_DN Hardware power down 26 OUT32N Receiver driver output
3 RESET Hardware reset 27 SPK1 Headset driver output/receiver driver output
4 GPIO2 General purpose IO 28 SPK2 Headset driver output
5 GPIO1 General purpose IO 29 DRVDD Headphone driver power supply
6 AVDD2 Touch screen drivers, PLL analog
power supply 30 SPKFC Driver feedback/ speaker detect input
7 AVSS2 Analog ground 31 VGND/CP_OUTN Virtual ground for audio output/Inverted output
to cell phone module
8 AVDD1 Audio ADC, DAC, reference, SAR
ADC analog power supply 32 DRVSS1 Driver ground
9 X+ X+ Position input and driver 33 OUT8N Loudspeaker driver output
10 Y+ Y+ Position input and driver 34 BVDD Battery power supply
11 X− X− Position input and driver 35 OUT8P Loudspeaker driver output
12 Y− Y− Position input and driver 36 DRVSS2 Driver ground
13 AVSS1 Analog ground 37 PINTDAV Pin interrupt/data available output
14 VREF Reference voltage 38 SS SPI Slave select input
15 VBAT Battery monitor input 39 MOSI SPI Serial data input
16 AUX2 Secondary auxiliary input 40 MISO SPI Serial data output
17 AUX1 First auxiliary input 41 SCLK SPI Serial clock input
18 BUZZ_IN/CP_INN Buzzer input/Inverting input from
cell phone module 42 MCLK Master clock
19 CP_OUTP Non−inverted output to cell phone
module 43 SDOUT Audio data output
20 CP_INP Non−inverting input from cell phone
module 44 SDIN Audio data input
21 MICIN_HND Handset microphone input 45 WCLK Audio word clock
22 MICBIAS_HND Handset microphone bias voltage 46 BCLK Audio bit clock
23 MICIN_HED Headset microphone input 47 DVDD Digital core supply
24 MICBIAS_HED Headset microphone bias voltage 48 DVSS Digital core and IO ground
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ABSOLUTE MAXIMUM RATINGS
over o p e r ating free-air temperature range unless otherwise noted(1), (2)
UNITS
AVDD1/2 to AVSS1/2 −0.3 V to 3.9 V
DRVDD to DRVSS1/2 −0.3 V to 3.9 V
BVDD to DRVSS1/2 −0.3 V to 4.5 V
IOVDD to DVSS −0.3 V to 3.9 V
Digital input voltage to DVSS −0.3 V to IOVDD + 0.3 V
Analog input (except VBAT) voltage to AVSS1/2 −0.3 V to AVDD + 0.3 V
VBAT input voltage to AVSS1/2 −0.3 V to 6 V
AVSS1/2 to DRVSS1/2 to DVSS −0.1 V to 0.1 V
AVDD1/2 to DRVDD −0.1 V to 0.1 V
Operating temperature range −40°C to 85°C
Storage temperature range −65°C to 105°C
Junction temperature (TJ Max) 105°C
QFN package
Power dissipation (TJ Max − TA)/θJA
QFN package
θJA Thermal impedance (with thermal pad soldered to board) 27°C/W
Lead temperature Infrared (15 sec) 240°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
(2) If the TSC2111 is used to drive high power levels to an 8-Ω load for extended intervals at an ambient temperature above 80 °C, multiple vias should
be used to electrically and thermally connect the thermal pad on the QFN package to an internal heat dissipating ground plane on the user’s PCB.
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
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ELECTRICAL CHARACTERISTICS
At +25°C, AVDD1, AVDD2, DRVDD, IOVDD = 3.3 V, BVDD = 3.9 V, DVDD = 1.8 V, V ref = 2.5 V, Fs (Audio) = 48 kHz, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
T OUCH SCREEN − AUXILIARY ANALOG INPUT
Input voltage range 0 +VREF V
Input capacitance AUX1/2 input selected as input by touch-screen 25 pF
Input leakage current
AUX1/2 input selected as input by touch-screen
1µA
BATTERY MONITOR INPUTS
Input voltage range 0.5 6.0 V
Input leakage current Battery conversion not selected 1µA
Accuracy Variation across temperature after system calibration at 4 V
battery voltage and room temperature 15 mV
TOUCH SCREEN A/D CONVERTER
Resolution Programmable: 8-, 10-,12-bits 8 12 Bits
No missing codes 12-Bit resolution 11 Bits
Integral nonlinearity −5 5 LSB
Offset error −6 6 LSB
Gain error −6 6 LSB
Noise 30 µVrms
VOLTAGE REFERENCE (VREF)
VREF output programmed = 2.5 V 2.3 2.5 2.7
V
Voltage range VREF output programmed = 1.25 V 1.25
V
Voltage range
External reference 1.1 2.5 V
Reference drift Internal VREF = 1.25 V 20 ppm/°C
Current drain Extra current drawn when the internal reference is turned on. 750 µA
AUDIO CODEC
ADC CHANNEL DIGITAL FILTER CHARACTERISTICS
Filter gain from 0 to 0.39 Fs ±0.1 dB
Filter gain at 0.4125 Fs −0.25 dB
Filter gain at 0.45 Fs −0.3 dB
Filter gain at 0.5 Fs −17.5 dB
Filter gain from 0.55 Fs to 64 Fs −75 dB
Group delay 17/Fs sec
MICROPHONE INPUT TO ADC MICIN_HED 1020 Hz sine wave input, Fs = 48 ksps
Full-scale input voltage (0 dB) 0.707 Vrms
Input common mode 1.5 V
SNR Measured as idle channel noise, 0 dB gain, A-weighted 80 90 dBA
THD 0.63 Vrms input, 0-dB gain −81 −72 dB
PSRR
217 Hz, 100 mV on AVDD1/2(1) 55 dB
PSRR
1020 Hz, 100 mV on AVDD1/2(1) 55 dB
Mute attenuation Output code with 0.63 V rms sine wave input at 1 kHz 0000H
Input resistance
Only ADC on 15 50 kΩ
Input resistance
ADC and Sidetone on 8 16 kΩ
Input capacitance 10 pF
(1) ADC PSRR measurement is calculated as:
PSRR +20 log10ǒVSIGsup
VADCOUTǓ
where VSIGsup is the ac signal applied on AVDD1/2, which is 100 mVPP at 1020 Hz, and VADCOUT +Amplitude of Digital Output
Max Possible Digital Amplitude
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ELECTRICAL CHARACTERISTICS (continued)
At +25°C, AVDD1, AVDD2, DRVDD, IOVDD = 3.3 V, BVDD = 3.9 V, DVDD = 1.8 V, Int. V ref = 2.5 V, Fs (Audio) = 48 kHz, unless otherwise
noted (continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
HEADSET MICROPHONE BIAS
Register 1DH/Page 2, D7−D8=00 3.3
Voltage range Register 1DH/Page 2, D7−D8=01 2.5 V
Voltage range
Register 1DH/Page 2, D7−D8=1X 2
V
217 Hz, 100 mV on AVDD1/2 55
PSRR
217 Hz, 100 mV on BVDD 77
dB
PSRR
1020 Hz, 100 mV on AVDD1/2 55
dB
1020 Hz, 100 mV on BVDD 77
Sourcing current Voltage drop <25 mV 5 mA
HANDSET MICROPHONE BIAS
Voltage range
Register 1DH/Page 2, D6=0 2.5
V
Voltage range
Register 1DH/Page 2, D6=1 2
V
PSRR
217 Hz, 100 mV on AVDD1/2 55
dB
PSRR
1020 Hz, 100 mV on AVDD1/2 55
dB
Sourcing current Voltage drop <25 mV 5 mA
DAC INTERPOLATION FILTER
Pass band 20 0.45Fs Hz
Pass band ripple ±0.06 dB
Transition band 0.45Fs 0.55Fs Hz
Stop band 0.55Fs 7.455Fs Hz
Stop band attenuation 65 dB
Filter group delay 21/Fs Sec
De-emphasis error ±0.1 dB
DAC HEADPHONE OUTPUT Load = 16 Ω (single-ended), 50 pF
Full-scale output voltage (0dB) 0.848 Vrms
Output common mode 1.5 V
SNR Measured as idle channel noise, A-weighted 85 95 dBA
THD −1 dBFS Input, 0-dB gain −80 −60 dB
PSRR
217 Hz, 100 mV on AVDD1/AVDD2(2) 65 dB
PSRR
1020 Hz, 100 mV on AVDD1/AVDD2(2) 65 dB
Interchannel isolation Coupling from ADC to DAC 100 dB
Mute attenuation 120 dB
Maximum output power Per channel 44 mW
Digital volume control −63.5 0 dB
Digital volume control step size 0.5 dB
Channel separation Between SPK1 and SPK2 −75 dB
(2) DAC PSRR measurement is calculated as:
PSRR +20 log10ǒVSIGsup
VSPK1ń2Ǔ
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
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ELECTRICAL CHARACTERISTICS (continued)
At +25°C, AVDD1, AVDD2, DRVDD, IOVDD = 3.3 V, BVDD = 3.9 V, DVDD = 1.8 V, V ref = 2.5 V, Fs (Audio) = 48 kHz, unless otherwise noted
(continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
DAC SPEAKER OUTPUT Load = 8 Ω (differential), 50 pF
Full-scale output voltage (0 dB) 1.838 Vrms
Output common mode 1.75 V
SNR Measured as idle channel noise, A-weighted 90 99 dBA
THD −1 dBFS Input, 0-dB gain −75 −55 dB
217 Hz, 100 mV on AVDD1/2 74
PSRR
217 Hz, 100 mV on BVDD 72
dB
PSRR
102 0 H z , 1 0 0 m V o n AVDD1/2 74
dB
1020 Hz, 100 mV on BVDD 72
Interchannel isolation Coupling from ADC to DAC 90 dB
Mute attenuation 120 dB
Maximum output power 400 mW
CELLPHONE
MIC INPUT TO CP_OUT 1020-Hz Sine wave input on MICIN_HND,
load on CP_OUT = 10 kΩ, 50 pF
Full-scale input voltage (0 dB) 0.707 Vrms
Input common mode 1.5 V
Full-scale output voltage (0 dB) 0.707 Vrms
Output common mode 1.5 V
SNR Measured as idle channel noise, A-weighted 89 dBA
THD 0 dBFS Input, 0-dB gain −75 dB
MICSEL T O CP_OUT(Differential)
CP_OUTP−CP_OUTN
1020-Hz Sine wave input on MICIN_HND,
load between CP_OUT−CP_OUTN = 10 kΩ,
50 pF
Full-scale input voltage (0 dB) 0.707 Vrms
Input common mode 1.5 V
Full-scale output voltage (0 dB) 1.414 Vrms
Output common mode 1.5 V
SNR Measured as idle channel noise, A-weighted 80 96 dBA
THD 0 dBFS Input, 0-dB gain −92 −60 dB
PSRR
217 Hz, 100 mV on AVDD1/2 49
dB
PSRR
102 0 H z , 1 0 0 m V o n AVDD1/2 49
dB
Interchannel isolation CP_IN to CP_OUT (Differential) 80 dB
Mute attenuation CP_OUT (Differential) muted 120 dB
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ELECTRICAL CHARACTERISTICS (continued)
At +25°C, AVDD1, AVDD2, DRVDD, IOVDD = 3.3 V, BVDD = 3.9 V, DVDD = 1.8 V, V ref = 2.5 V, Fs (Audio) = 48 kHz, unless otherwise noted
(continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
CP_INP TO 32Ω RECEIVER
(SPK1−OUT32N) 1020-Hz Sine wave input on CP_IN, Load on
SPK1−OUT32N = 32 Ω (differential), 50 pF
Full-scale input voltage (0 dB) 0.707 Vrms
Input common mode 1.5 V
Full-scale output voltage (0 dB) 1.697 Vrms
Output common mode 1.5 V
SNR Measured as idle channel noise, A-weighted 97 dBA
THD 0 dBFs input, 0 dB gain −82 dB
CP_IN (Differential) into 32−W
1020-Hz Sine wave input on
CP_INP−CP_INM. Load is connected between
SPK1−OUT32N.
Load = 32 Ω (Differential), 50 pF
Full-scale input voltage (0 dB) 1.414 Vrms
Input common mode 1.5 V
Full-scale output voltage (0 dB) 1.697 Vrms
Output common mode 1.5 V
SNR Measured as idle channel noise, A-weighted 85 101 dBA
THD 0 dBFs input, 0 dB gain −80 −60 dB
PSRR
217 Hz, 100 mV on AVDD1/AVDD2/DRVDD −74
dB
PSRR
102 0 H z , 1 0 0 m V o n AVDD1/AVDD2/DR VDD −74
dB
Interchannel isolation −85 dB
Mute attenuation 120 dB
Maximum output power 82 mW
DIGITAL INPUT/OUTPUT
Logic family CMOS
Logic level: VIH
IIH = 5 µA, IOVDD >1.6 V 0.7xIOVDD V
Logic level: V
IH IIH = 5 µA, IOVDD <1.6 V IOVDD V
VIL
IIL = +5 µA, IOVDD <1.6 V −0.3 0.3xIOVDD V
V
IL IIL = +5 µA, IOVDD <1.6 V 0 V
VOH IOH = 2 TTL loads 0.8IOVDD V
VOL IOL = 2 TTL loads 0.1IOVDD V
Capacitive load 10 pF
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ELECTRICAL CHARACTERISTICS (continued)
At +25°C, AVDD1, AVDD2, DRVDD, IOVDD = 3.3 V, BVDD = 3.9 V, DVDD = 1.8 V, V ref = 2.5 V, Fs (Audio) = 48 kHz, unless otherwise noted
(continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY REQUIREMENTS
Power supply voltage
AVDD1, AVDD2 3 3.3 3.6 V
DRVDD 3 3.3 3.6 V
BVDD 3 4.2 V
IOVDD Max MCLK = 100 MHz 2 3.6 V
IOVDD
Max MCLK = 50 MHz 1.1 3.6 V
DVDD 1.65 1.8 1.95 V
Touch-screen ADC quiescent current
IAVDD1, host controlled AUX1 conversion at
10 ksps with external reference 58
A
Touch-screen ADC quiescent current
IDVDD, host controlled AUX1 conversion at
10 ksps 68 µ
A
IAVDD1 with loudspeaker output (no signal),
PLL off 2.6
Analog supply current – audio play back only
IBVDD with loudspeaker output (no signal),
PLL off 6.4
mA
Analog supply current – audio play back only
IAVDD1 with headphone output (no signal),
VGND off, PLL off 2.4
mA
IDRVDD with headphone output (no signal),
VGND off, PLL off 3.3
Digital supply current – audio play back only IDVDD, PLL off 2.5 mA
(1)
IAVDD1, headset mic, PLL off 5 mA
Analog supply current − mic record only
(1)
IBVDD, headset mic, PLL off 270 µA
Analog supply current − mic record only(1)
IAVDD1, handset mic, PLL off 5.6 mA
Digital supply current – mic record only IDVDD, PLL off 1.4 mA
Analog supply current IAVDD2, PLL on 1.3 mA
Digital supply current IDVDD, PLL on 0.9 mA
Hardware power down 1
Only headset/button detection enabled 50
Total current Only auto temperature measurement with
5.59 min delay 50 µA
Total current
Headset/button detection and auto
temperature measurement with 5.59 min
delay 70
µA
(1) Mic record currents measured with no load on MICBIAS.
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FUNCTIONAL BLOCK DIAGRAM
Σ−∆
Σ−∆
Touch
Panel
Drivers
Battery
Monitor SAR
ADC
Internal
Reference
−1
−1
Sidetone
DAC
ADC
AGC
Vol Ctl
Vol Ctl
Digital
Audio
Processing
and Serial
Interface
Touch
Screen
Processing
and SPI
Interface
PLL
Headset
detect and
Button
detect
X−
Y+
Y−
X+
VBAT
VREF
MICBIAS_HED
MICBIAS_HND
2.0/2.5/3.3
2.0/2.5
AUX1
MICIN_HED
MICIN_HND
CP_INP
BUZZ_IN/CP_INN
OUT8P
OUT8N
CP_OUTP
OUT32N
SPK1
SPK2
To Detection block
SPKFC
VGND/ 1.5V
SCLK
SS
MOSI
MISO
PINTDAV
RESET
MCLK
PWR_DN
SDOUT
WCLK
SDIN
BCLK
0 to 59.5dB
(0.5dB steps)
0 to 59.5dB
(0.5dB steps)
12 to −34.5dB
(0.5dB steps)
0 to −45dB
(3dB steps)
12 to −34.5dB
(0.5dB steps)
MIC_DETECT_IN To Detection
block
GPIO1
GPIO2
AVDD1 AVDD2 DRVDD BVDD DVDD IOVDD
AVSS2 DRVSS1 DRVSS2 DVSSAVSS1
To ADC and DAC
0 to −63.5dB
(0.5dB steps)
0 to −63.5dB
(0.5dB steps)
AUX2
Temperature
Measurement
OSC
Σ
Σ
Σ
Σ
ΣΣ−∆
DAC
GPIO
Interface
−1
CP_OUTN
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11
SPI TIMING DIAGRAM
ttd
S
S
S
S
S
S
S
E
Lta
MSBOUT BIT6...1 LSBOUT
tsck
tLead tLag
twsck
twsck tr
tf
tvtho tdis
MSB IN BIT6...1 LSB IN
thi
tsu
/SS
SPISELZ
SCLK
SPISELZ
SPICLK
MISO
SPISELZ
MOSI
SPISELZ
TYPICAL TIMING REQUIREMENTS
All specifications typical at 25°C, DVDD = 1.8 V(1)
PARAMETER
IOVDD = 1.1 V IOVDD = 3.3 V
UNITS
PARAMETER
MIN MAX MIN MAX
UNITS
twsck SCLK Pulse width 30 18 ns
tLead Enable Lead T ime 18 15 ns
tLag Enable Lag T ime 18 15 ns
ttd Sequential T ransfer Delay 18 15 ns
taSlave MISO access time 18 15 ns
tdis Slave MISO disable time 18 15 ns
tsu MOSI data setup time 6 6 ns
thi MOSI data hold time 6 6 ns
tho MISO data hold time 4 4 ns
tvMISO data valid time 25 13 ns
trRise Time 6 4 ns
tfFall T ime 6 4 ns
(1) These parameters are based on characterization and are not tested in production.
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AUDIO INTERFACE TIMING DIAGRAMS
ts(DI) th(DI)
td(DO−BCLK)
td(DO−WS)
WCLK
BCLK
SDOUT
SDIN
td(WS)
Figure 1. I2S/LJ/RJ in Master Mode
Typical Timing Requirements (see Figure 1)
PARAMETER(1)
IOVDD = 1.1 V IOVDD = 3.3 V
UNITS
PARAMETER(1)
MIN MAX MIN MAX
UNITS
td(WS) WCLK delay 30 15 ns
td(DO−WS) WCLK to DOUT delay (for LJF mode) 30 15 ns
td(DO−BCLK) BCLK to DOUT delay 30 15 ns
ts(DI) SDIN setup 6 6 ns
th(DI) SDIN hold 6 6 ns
trRise time 18 6 ns
tfFall time 18 6 ns
(1) These parameters are based on characterization and are not tested in production.
ts(DI) th(DI)
td(DO−BCLK)
WCLK
BCLK
SDOUT
SDIN
td(WS) td(WS)
Figure 2. DSP Timing in Master Mode
Typical Timing Requirements (see Figure 2)
PARAMETER(1)
IOVDD = 1.1 V IOVDD = 3.3 V
UNITS
PARAMETER(1)
MIN MAX MIN MAX
UNITS
td(WS) WCLK delay 30 15 ns
td(DO−BCLK) BCLK to DOUT delay 30 15 ns
ts(DI) SDIN setup 6 6 ns
th(DI) SDIN hold 6 6 ns
trRise time 18 6 ns
tfFall time 18 6 ns
(1) These parameters are based on characterization and are not tested in production.
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13
th
(WS) ts(WS)
ts(DI) th(DI)
td(DO−BCLK)
td(DO−WS)
WCLK
BCLK
SDOUT
SDIN
tL(BCLK) tH(BCLK)
tP(BCLK)
Figure 3. I2S/LJF/RJF Timing in Slave Mode
Typical Timing Requirements (see Figure 3)
PARAMETER(1)
IOVDD = 1.1 V IOVDD = 3.3 V
UNITS
PARAMETER(1)
MIN MAX MIN MAX
UNITS
tH(BCLK) BCLK high period 40 35 ns
tL(BCLK) BCLK low period 40 35 ns
ts(WS) WCLK setup 6 6 ns
th(WS) WCLK hold 6 6 ns
td (DO−WS) WCLK to DOUT delay (for LJF mode) 30 18 ns
td(DO−BCLK) BCLK to DOUT delay 30 15 ns
ts(DI) SDIN setup 6 6 ns
th(DI) SDIN hold 6 6 ns
trRise time 5 4 ns
trFall time 5 4 ns
(1) These parameters are based on characterization and are not tested in production.
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th
(WS) ts(WS)
ts(DI) th(DI)
td(DO−BCLK)
WCLK
BCLK
SDOUT
SDIN
tH(BCLK) tL(BCLK)
tP(BCLK)
ts(WS)
th
(WS)
Figure 4. DSP Timing in Slave Mode
Typical Timing Requirements (see Figure 4)
PARAMETER(1)
IOVDD = 1.1 V IOVDD = 3.3 V
UNITS
PARAMETER(1)
MIN MAX MIN MAX
UNITS
tH(BCLK) BCLK high period 40 35 ns
tL(BCLK) BCLK low period 40 35 ns
tP(BCLK) BCLK period 80 80 ns
ts(WS) WCLK setup 6 6 ns
th(WS) WCLK hold 6 6 ns
td(DO−BCLK) BCLK to DOUT delay 30 15 ns
ts(DI) SDIN setup 6 6 ns
th(DI) SDIN hold 6 6 ns
trRise time 5 4 ns
tfFall time 5 4 ns
(1) These parameters are based on characterization and are not tested in production.
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TYPICAL CHARACTERISTICS
−1.5
−1
−0.5
0
0.5
1
1.5
0500 1000 1500 2000 2500 3000 3500 4000
CODE
LSB
AVDD1/AVDD2 = 3.3 V ,
TA = 25C,
IR = 2.5 V
Figure 5. SAR INL (TA = 25C, Internal Reference = 2.5 V, 12 bit, AVDD1/AVDD2 = 3.3 V)
−1
−0.5
0
0.5
1
0500 1000 1500 2000 2500 3000 3500 4000
CODE
LSB
AVDD1/AVDD2 = 3.3 V ,
TA = 25C,
IR = 2.5 V
Figure 6. SAR DNL (TA = 25C, Internal Reference = 2.5 V, 12 bit, AVDD1/AVDD2 = 3.3 V)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
010 20 30 40 50 60 70 80
Power − mW
Sampling Rate − Ksps
AVDD1/AVDD2 = 3.3 V ,
TA = 25C
Figure 7. SAR ADC Power Consumption vs Speed (TA = 25C, External Reference, Host Controlled AUX
Conversion, AVDD1/AVDD2 = 3.3 V)
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−160
−140
−120
−100
−80
−60
−40
−20
0
0500 1000 1500 2000 2500 3000 3500 4000
dB
f − Frequency − Hz
AVDD1/AVDD2 = 3.3 V ,
TA = 25C,
Figure 8. ADC FFT Plot at 8 ksps (TA = 25C, −1 dB, 1 kHz input, AVDD1/AVDD2 = 3.3 V)
−160
−140
−120
−100
−80
−60
−40
−20
0
05000 10000 15000 20000
f − Frequency − Hz
dB
AVDD1/AVDD2 = 3.3 V ,
TA = 25C,
Figure 9. ADC FFT Plot at 48 ksps (TA = 25C, −1 dB, 1 kHz input, AVDD1/AVDD2 = 3.3 V)
86
86.5
87
87.5
88
88.5
89
89.5
90
8 18283848
Dynamic Range − dB
Sampling Rate − Ksps
AVDD1/AVDD2 = 3.3 V ,
TA = 25C,
Figure 10. ADC Dynamic Range vs Sampling Rate (TA = 25C, AVDD1/AVDD2 = 3.3 V)
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−160
−140
−120
−100
−80
−60
−40
−20
0
20
0 5000 10000 15000 20000
dB
f − Frequency − Hz
AVDD1/AVDD2 = 3.3 V ,
TA = 25C,
RL = 16 W
Figure 11. DAC FFT Plot (TA = 25C, −1 dB, 1 kHz Input, AVDD1/AVDD2/DRVDD = 3.3 V, RL = 16 Ω)
−84
−83
−82
−81
−80
−79
−78
−77
5 1015202530354045
Power − mW
THD − Total Hormonic Distortion − dB
AVDD1/AVDD2 = 3.3 V ,
TA = 25C,
RL = 16 W
Figure 12. THD vs Power on SPK1/2 (TA = 25C, 1 kHz Input, AVDD1/AVDD2/DRVDD = 3.3 V, RL = 16 Ω)
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−90
−85
−80
−75
−70
−65
−60
0 50 100 150 200 250 300 350 400
Power − mW
THD − Total Hormonic Distortion − dB
AVDD1/AVDD2/DRDD = 3.3 V,
BVDD = 3.9 V
TA = 25C,
RL = 8 W
Figure 13. THD vs Power on Loudspeaker Driver (TA = 25C, 1 kHz Input, AVDD1/AVDD2/DRVDD = 3.3 V,
BVDD = 3.9 V, RL = 8 Ω)
150
200
250
300
350
400
450
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1
BVDD − V
Max Power Output − mW
Figure 14. Loudspeaker Driver Output Power vs BVDD (TA = 25C, 1 kHz Input,
AVDD1/AVDD2/DRVDD = 3.3 V, RL = 8 Ω, THD v −40 dB)
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OVERVIEW
The TSC2111 is a highly integrated stereo audio DAC and mono audio ADC with touch screen controller for
portable computing, communication and entertainment applications. A register-based architecture eases
integration with microprocessor-based systems through a standard SPI bus. All peripheral functions are
controlled through the registers and on-board state machines.
The TSC2111 consists of the following blocks:
DAudio Codec
DHeadset and Button Detection
DTouch Screen Interface
DBattery Monitors
DAuxiliary Inputs
DTemperature Monitor
Communication to the TSC2111 is via a standard SPI serial interface. This interface requires that the Slave
Select signal (SS) be driven low to communicate with the TSC2111. Data is then shifted into or out of the
TSC2111 under control of the host microprocessor, which also provides the serial data clock.
Control of the TSC2111 and its functions is accomplished by writing to different registers in the TSC2111. A
simple command protocol is used to address the 16-bit registers. Registers control the operation of the SAR
ADC and audio codec.
OPERATION—AUDIO CODEC
AUDIO ANALOG I/O
The TSC2111 has stereo audio DAC and mono audio ADC. It supports a wide range of analog interface to
support different headsets and analog outputs. The TSC2111 has features to interface output drivers (8-Ω,
16-Ω, 32-Ω) and Microphone PGA to Cell-phone. The TSC2111 also has a virtual ground (VGND) output, which
can be optionally used to connect to the ground terminal of a speaker of headphone to eliminate the ac-coupling
capacitor needed at the speaker or headphone output. A special circuit has also been included in the TSC2111
to insert a short keyclick sound into the stereo audio output, even when the audio DAC is powered down. They
keyclick sound is used to provide feedback to the used when a particular button is pressed or item is selected.
The specific sound of the keyclick can be adjusted by varying several register bits that control its frequency,
duration, and amplitude.
AUDIO DIGITAL I/O INTERFACE
Digital audio data samples can be transmitted between the TSC2111 and the CPU via the serial bus (BCLK,
WCLK, SDOUT, SDIN) that can be configured to transfer digital data in four different formats: Right justified
(RJF), Left justified (LJF), I2S and DSP. The four modes are MSB first and operate with variable word length
between 16/20/24/32 bits. The TSC2111’s audio codec can operate in master or slave mode, depending on the
setting of D11 at the register 06h of page 2. The word-select signal (WCLK) and bit clock signal (BCLK) are
configured as inputs when the bus is in slave mode (D11 = 0). They are configured as outputs when the bus
is in master mode (D11 = 1). Under master mode, both clocks start running when the I2S bus needs to be active
(one of the analog input/output paths has been configured and powered up). The WCLK is representative of
the sampling rate of the audio ADC/DAC and is synchronized with SDOUT. Although the SDOUT signal can
contain two channels of information (a left and right channel), the TSC2111 sends the same ADC data in both
channels.
DADC/DAC Sampling Rate
The audio-control-1 register (Register 00H, Page 2) determines the sampling rates of DAC and ADC. The
sampling frequency is scaled down from the reference rate (Fsref). The reference rate is usually either 44.1
kHz or 48 kHz which can be selectable using bit D13 of the register Audio Control 3 (06H/Page2). The ADC
and DAC can operate with either common WCLK (equal sampling rates) or separate GPIO1 (For ADC) and
WCLK (For DAC) for unequal sampling rates. When the audio codec is powered up, it is by default configured
as an I2S slave with both the DAC and ADC operating at Fsref.
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DWord Select Signals
The word select signal (WCLK) indicates the channel being transmitted:
— WCLK = 0: left channel for I2S mode;
— WCLK = 1: right channel for I2S mode.
For other modes refer to the timing diagrams below.
DBitclock (BCLK) Signal
In addition to being programmable as master or slave mode, the BCLK can also be configured in two transfer
modes, 256-S transfer mode and continuous transfer mode, which are described below. These modes are
set using bit D12 of control register 06H/page 2.
D256-S Transfer Mode
In the 256-S mode, the BCLK rate always equals 256 times the WCLK frequency. In the 256-S mode, the
combination o f ADC/DAC sampling rate equal to Fsref (as selected by bit D5D0 of control register 00H/page
2) and left-justified mode is not supported. If IOVDD is equal to 1.1 V, then ADC/DAC sampling rate should be
less than 39 kHz for all modes except the left justified mode where it should be less than 24 kHz.
DContinuous Transfer Mode
In the continuous transfer mode, the BCLK rate always equals two-word length times the frequency of
WCLK.
DRight Justified Mode
In right-justified mode, the LSB of left channel is valid on the rising edge of BCLK preceding, the falling edge
on WCLK. Similarly the LSB of right channel is valid on the rising edge of BCLK preceding the rising edge of
WCLK.
BCLK
WCLK
SDIN/
SDOUT n−1 n−2 1 00 n−1 n−2 1 0
1/fs
LSBMSB
Left Channel Right Channel
n−3 2 2n−3
Figure 15. Timing Diagram for Right-Justified Mode
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DLeft Justified Mode
In left-justified mode, the MSB of right channel is valid on the rising edge of BCLK, following the falling edge on
WCLK. Similarly the MSB of left channel is valid on the rising edge of BCLK following the rising edge of
WCLK.
BCLK
WCLK
SDIN/
SDOUT n−1 n−2 1 0 n−1 n−2 1 0
1/fs
LSBMSB
Left Channel Right Channel
n n−1n−3 2 n−3 2
Figure 16. Timing Diagram for Left-Justified Mode
DI2S Mode
In I2S mode, the MSB of left channel is valid on the second rising edge of BCLK, after the falling edge on
WCLK. Similarly the MSB of right channel is valid on the second rising edge of BCLK, after the rising edge of
WCLK.
BCLK
WCLK
SDIN/
SDOUT n−1 n−2 1 0 n−1 n−2 1 0
1/fs
LSBMSB
Left Channel Right Channel
n
1 clock before MSB
n−3 2 n−3 2
Figure 17. Timing Diagram for I2S Mode
DDSP Mode
In DSP mode, the rising edge of WCLK starts the data transfer with the left channel data first and immediately
followed by the right channel data. Each data bit is valid on the falling edge of BCLK.
BCLK
WCLK
SDIN/
SDOUT n−2 n−3 1 0 n−1 n−2 1 0
1/fs
LSBMSB
Left Channel Right Channel
n−1
MSB LSB
n−4 2 n−3 2
MSBLSB
Figure 18. Timing Diagram for DSP Mode
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AUDIO DATA CONVERTERS
The TSC2111 includes a stereo audio DAC and a mono audio ADC. Both ADC and DAC can operate with a
maximum sampling rate of 53 kHz and support all audio standard rates of 8 kHz, 11.025 kHz, 12 kHz, 16 kHz,
22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, and 48 kHz. By utilizing the flexible clock generation capability and internal
programmable interpolation, a wide variety of sampling rates up to 53 kHz can be obtained from many possible
MCLK inputs. In addition, the DAC and ADC can independently operate at dif ferent sampling rates as indicated
in control register 00H/page 2.
When the ADC or DAC is operating, the TSC2111 requires an applied audio MCLK input. The user should also
set bit D13 of control register 06H/page 2 to indicate which Fsref rate is being used. If the codec ADC or DAC
is powered up, then the touch screen ADC uses MCLK and BCLK for its internal clocking, and the internal
oscillator is powered down to save power.
Typical audio DACs can suf fer from poor out-of-band noise performance when operated at low sampling rates,
such as 8 kHz or 11.025 kHz. The TSC2111 includes programmable interpolation circuitry to provide improved
audio performance at such low sampling rates, by first upsampling low-rate data to a higher rate, filtering to
reduce audible images, and then passing the data to the internal DAC, which is actually operating at the Fsref
rate. This programmable interpolation is determined using bit D5D3 of control register 00H/page 2.
For example, if playback of 11.025 kHz data is required, the TSC2111 can be configured such that Fsref = 44.1
kHz. Then using bit D5D3 of control register/page 2, the DAC sampling rate (Fs) can be set to Fsref/4, or FS
= 11.025 kHz. In operation, the 11.025 kHz digital input data is received by the TSC2111, upsampled to 44.1
kHz, and filtered for images. It is then provided to the audio DAC operating at 44.1 kHz for playback. In reality,
the audio DAC further upsamples the 44.1 kHz data by a ratio of 128 x and performs extensive interpolation
filtering and processing on this data before conversion to a stereo analog output signal.
Phase Locked Loop (PLL)
The TSC2111 has an on chip PLL to generate the needed internal ADC and DAC operational clocks from a wide
variety of clocks that may be available in the system. The PLL supports an MCLK varying from 2 MHz to 100
MHz and is register programmable to enable generation of required sampling rates with fine precision.
ADC and DAC sampling rates are given by
DAC_Fs +Fsref
N1
and
ADC_Fs +Fsref
N2
Where, Fsref must fall between 39 kHz and 53 kHz, and N1, N2=1, 1.5, 2, 3, 4, 5, 5.5, 6 are register
programmable.
The PLL can be enabled or disabled using register programming.
DWhen PLL is disabled
Fsref +MCLK
128 Q
Q = 2, 3…17
— Note: For ADC, with N2 = 1.5 or 5.5, odd values of Q are not allowed.
— In this mode, the MCLK can operate up to 100 MHz, and Fsref should fall between 39 kHz
and 53 kHz.
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DWhen PLL is enabled
Fsref +MCLK K
2048 P
P = 1, 2, 3 … 8
K = J.D
J = 1, 2, 3 ….63
D = 0, 1, 2 … 9999
P, J and D are register programmable. where J is integer part of K before the decimal point, and D
is four-digit fractional part of K after the decimal point, including lagging zeros.
Examples: If K = 8.5, then J = 8, D = 5000
If K = 7.12, then J = 7, D = 1200
If K = 7.012, then J = 7, D = 120
The PLL is programmed through Registers 1BH and 1CH of Page 2.
DWhen PLL is enabled and D = 0, the following conditions must be satisfied
2MHzvMCLK
Pv20 MHz
80 MHz vMCLK K
Pv110 MHz
4Ă vJvĂ55
DWhen PLL is enabled D ≠ 0, the following conditions must be satisfied
10 MHz vMCLK
Pv20 MHz
80 MHz vMCLK K
Pv110 MHz
4Ă vJvĂ11
Example 1:
For MCLK = 12 MHz and Fsref = 44.1 kHz
P = 1, K = 7.5264
J = 7, D = 5264
Example 2:
For MCLK = 12 MHz and Fsref = 48 kHz
P = 1, K = 8.192
J = 8, D = 1920
Table 1. Fsref = 44.1 kHz
MCLK (MHz) P J D ACHIEVED FSREF % ERROR
2.8224 1 32 0 44100.00 0.0000
5.6448 1 16 0 44100.00 0.0000
12.0 1 7 5264 44100.00 0.0000
13.0 1 6 9474 44099.71 −0.0007
16.0 1 5 6448 44100.00 0.0000
19.2 1 4 7040 44100.00 0.0000
19.68 1 4 5893 44100.30 0.0007
48 4 7 5264 44100.00 0.0000
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Table 2. Fsref = 48 kHz
MCLK (MHz) P J D ACHIEVED FSREF % ERROR
2.048 1 48 0 48000.00 0.0000
3.072 1 32 0 48000.00 0.0000
4.096 1 24 0 48000.00 0.0000
6.144 1 16 0 48000.00 0.0000
8.192 1 12 0 48000.00 0.0000
12.0 1 8 1920 48000.00 0.0000
13.0 1 7 5618 47999.71 −0.0006
16.0 1 6 1440 48000.00 0.0000
19.2 1 5 1200 48000.00 0.0000
19.68 1 4 9951 47999.79 −0.0004
48.0 4 8 1920 48000.00 0.0000
To externally observe the PLL function, the GPIO2 pin can be set up as the clock monitor (set D2 = 1, register
22h, page 2). Note that besides setting up the PLL and GPIO2, the audio ADC or DAC must be enabled for
the PLL output to appear at the GPIO2.
Example 1:
DStart from power up (with the proper sequence)
DMake sure MCLK is provided and /PWR_DWN and /RESET are both high
DSet and enable PLL
DConnect and power up (do not unmute anything) ADC or DAC or both, for instance:
− Page2/Reg03h to C530h or C510h (default is C500h) to connect MICSEL to ADC
− Page2/Reg05h to FDFCh (default is FFFCh) to power up ADC.
DSet Page2/Reg22h to 0004h to output PLL to GPIO2 pin.
MONO AUDIO ADC
Analog Front End
The analog front end of the audio ADC consists of an analog MUX and a programmable gain amplifier (PGA).
The MUX can connect either of the Headset Input (MICIN_HED), Handset Input (MICIN_HND), AUX1 and
AUX2 signal through the PGA to the ADC for audio recording. The Cell-phone Input (CP_IN) can also be
connected to ADC through a PGA at the same time. This enables recording of conversation during a cell-phone
call. The TSC2111 also has an option of choosing MICIN_HED/MICIN_HND and AUX1/AUX2 as differential
input pair. The TSC2111 also includes two microphone bias circuits which can source up to 5 mA of current,
and are programmable to a 2 V, 2.5 V or 3.3 V level for Headset and 2 V or 3.3 V level for handset.
Because of the oversampling nature of the audio ADC and the integrated digital decimation filtering,
requirements for analog anti-aliasing filtering are very relaxed. The TSC2111 integrates a second order analog
anti-aliasing filter with 20-dB attenuation at 1 MHz. This filter, combined with the digital decimal filter, provides
sufficient anti-aliasing filtering without requiring any external components.
The PGA, for microphone and AUX Inputs, allows analog gain control from 0 dB to 59.5 dB in steps of 0.5 dB.
The PGA gain changes are implemented with an internal soft-stepping. This soft-stepping ensures that volume
control changes occur smoothly with no audible artifacts. Upon reset, the PGA gain defaults to a mute condition,
and upon power down, the PGA soft-steps the volume to mute before shutting down. A read-only flag (D0
control register 04H/Page 2) is set whenever the gain applied by PGA equals the desired value set by the
register. The soft-stepping control can be disabled by programming D15=1 in register 1DH of Page 2. When
soft stepping is enabled and ADC power down register is written, MCLK should be running to ensure that
soft-stepping to mute has completed. MCLK can be shut down once Mic PGA power down flag is set.
The PGA, for Cell phone Input (CP_IN) allows gain control from –34.5 dB to 12 dB in steps of 0.5 dB. The PGA
gain changes are implemented with an internal soft−stepping. This soft-stepping ensures that volume control
changes occur smoothly with no audible artifacts. Upon reset, the PGA gain defaults to a mute condition, and
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upon power down, the PGA soft-steps the volume to mute before shutting down. A read−only flag (D7 control
register 1FH/Page 2) is set whenever the gain applied by PGA equals the desired value set by the register. The
soft-stepping control can be disabled by the programming D12=1 in register 1DH of Page 2. When soft-stepping
is enabled and ADC power down register is written, MCLK should be running to ensure that soft-stepping to
mute has completed. MCLK can be shut down once Cell PGA power down flag is set.
Delta-Sigma ADC
The analog-to-digital converter has a delta-sigma modulator with a 128 times oversampling ratio. The ADC can
support maximum output rate of 53 kHz.
Decimation Filter
The audio ADC includes an integrated digital decimation filter that removes high frequency content and
downsamples the audio data from an initial sampling rate of 128 times Fs to the final output sampling rate of
Fs. The decimation filter provides a linear phase output response with a group delay of 17/Fs. The –3 dB
bandwidth of the decimation filter extends to 0.45 Fs and scales with the sample rate (Fs).
Programmable High Pass Filter
The ADC channel has a programmable high-pass filter whose cutoff frequency can be programmed through
control register. By default the high pass filter is off. The high-pass filter is a first order IIR filter. This filter can
be used to remove the DC component of the input signal and offset of the ADC channel.
Automatic Gain Control (AGC)
The TSC2111 includes Automatic gain control (AGC) for Microphone Inputs (MICIN_HED or MICIN_HND) and
Cell-phone input (CP_IN). AGC can be used to maintain nominally constant output signal amplitude when
recording speech signals. This circuitry automatically adjusts the PGA gain as the input signal becomes overly
loud or very weak, such as when a person speaking into a microphone moves closer or farther from the
microphone. The AGC algorithm has several programmable settings, including target gain, attack and decay
time constants, noise threshold, and max PGA applicable that allow the algorithm to be fine tuned for any
particular application. The algorithm uses the absolute average of the signal (which is the average of the
absolute value of the signal) as a measure of the nominal amplitude of the output signal.
Target gain represents the nominal output level at which the AGC attempts to hold the ADC output signal level.
The TSC2111 allows programming of eight different target gains, which can be programmed from –5.5 dB to
–24 dB relative to a full-scale signal. Since the TSC2111 reacts to the signal absolute average and not to peak
levels, it is recommended that the target gain be set with enough margin to avoid clipping at the occurrence
of loud sounds.
Attack time determines how quickly the AGC circuitry reduces the PGA gain when the input signal is too loud.
It can be varied from 8 ms to 20 ms.
Decay time determines how quickly the PGA gain is increased when the input signal is too low . It can be varied
in the range from 100 ms to 500 ms.
Noise threshold determines level below which if the input speech average value falls, AGC considers it as a
silence and hence brings down the gain to 0 dB in steps of 0.5 dB every FS and sets noise threshold flag. The
gain stays at 0 dB unless the input speech signal average rises above noise threshold setting. This ensures
that noise does not get gained up in the absence of speech. Noise threshold level in the AGC algorithm is
programmable from −30dB to −90 dB for microphone input, and from −30 dB to −60 dB for cell-phone input.
When AGC Noise Threshold is set to −70 dB, −80 dB, or −90 dB, the microphone input Max PGA applicable
setting must be greater than or equal to 11.5 dB, 21.5 dB, or 31.5 dB respectively. This operation includes
debounce and hysteresis to avoid the AGC gain from cycling between high gain and 0 dB when signals are near
the noise threshold level. When noise threshold flag is set, status of gain applied by AGC and saturation flag
should be ignored.
Max PGA applicable allows user to restrict maximum gain applied by AGC. This can be used for limiting PGA
gain i n situations where environment noise is greater than programmed noise threshold. Microphone input Max
PGA can be programmed from 0 dB to 59.5 dB in steps of 0.5 dB. Cell-phone input Max PGA can be
programmed from −34.5 dB to −0.5 dB in steps of 0.5 dB, as well as +12 dB.
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See Table 3 for various AGC programming options. AGC can be used only if microphone input or Cell-phone
input is routed to the ADC channel. When both microphone input and Cell-phone input are connected to the
ADC, AGC is automatically disabled.
Decay Time
Target
Gain
Input
Signal
Output
Signal
AGC
Gain
Attack
Time
Figure 19. AGC Characteristics
Table 3. AGC Settings
MIC HEADSET INPUT MIC HANDSET INPUT CELL-PHONE INPUT
BIT CONTROL
REGISTER BIT CONTROL
REGISTER BIT CONTROL
REGISTER
AGC enable D0 01H D0 1EH D0 24H
Target gain D7−D5 01H D7−D5 1EH D7−D5 24H
T ime constants (attack and decay time) D4−D1 01H D4−D1 1EH D4−D1 24H
Noise threshold D13−D11 24H D13−D11 24H D13−D11 24H
Noise threshold flag D11 04H D11 04H D14 24H
Hysteresis D10−D9 1DH D10−D9 1DH D10−D9 24H
Debounce time (normal to silence mode) D8−D6 26H D8−D6 26H D8−D6 27H
Debounce time (silence to normal mode) D5−D3 26H D5−D3 26H D5−D3 27H
Max PGA applicable D15−D9 26H D15−D9 26H D15−D9 27H
Gain applied by AGC D15−D8 01H D15−D8 1EH D14−D8 1FH
Saturation flag D0 04H D0 04H D7 1FH
Clip stepping disable D3 06H D3 06H D8 24H
NOTE:All settings shown in Table 3 are located in Page 2 of control registers.
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Stereo Audio DAC
Each channel of the stereo audio DAC consists of a digital audio processing block, a digital interpolation filter,
digital delta-sigma modulator, and an analog reconstruction filter. The DAC is designed to provide enhanced
performance at low sample rates through increased oversampling and image filtering, thereby keeping
quantization noise generated within the delta-sigma modulator and signal images strongly suppressed within
the audio band to beyond 20 kHz. This is realized by keeping the upsampled rate constant at 128 x Fsref and
changing the oversampling ratio as the input sample rate is changed. For Fsref of 48 kHz, the digital delta−sigma
modulator always operates at a rate of 6.144 MHz. This ensures that quantization noise generated within the
delta-sigma modulator stays within the frequency band below 20 kHz at all sample rates. Similarly, for Fsref
rate of 44.1 kHz, the digital delta-sigma modulator always operates at a rate of 5.6448 MHz.
Digital Audio Processing
The DAC channel consists of optional filters for de-emphasis and bass, treble, midrange level adjustment, or
speaker equalization. The de-emphasis function is only available for sample rates of 32 kHz, 44.1 kHz, and 48
kHz. The transfer function consists of a pole with time constant of 50ms and a zero with time constant of 15ms.
Frequency response plots are given in the Audio Codec Filter Frequency Responses section of this data sheet.
The DAC digital effects processing block consists of a fourth order digital IIR filter with programmable
coefficients (one set per channel). The filter is implemented as cascade of two biquad sections with frequency
response given by:
ǒN0 )2 N1 z*1)N2 z*2
32768 *2 D1 z*1*D2 z*2Ǔǒ N3 )2 N4 z*1)N5 z*2
32768 *2 D4 z*1*D5 z*2Ǔ
The N and D coefficients are fully programmable, and the entire filter can be enabled or bypassed. The
coefficients for this filter implement a variety of sound effects, with bass-boost or treble boost being the most
commonly used in portable audio applications. The default N and D coefficients in the part are given by:
N0 = N3 = 27619
N1 = N4 = −27034
N2 = N5 = 26461
D1 = D4 = 32131
D2 = D5 = −31506
These coefficients implement a shelving filter with 0 dB gain from dc to approximately 150 Hz, at which point
it rolls off to 3 dB attenuation for higher frequency signals, thus giving a 3-dB boost to signals below 150 Hz.
The N and D coefficients are represented by 16−bit twos complement numbers with values ranging from –32768
to +32767. Frequency response plots are given in the Audio Codec Filter Frequency Responses section of this
data sheet.
Interpolation Filter
The interpolation filter upsamples the output of the digital audio processing block by the required oversampling
ratio. It provides a linear phase output with a group delay of 21/Fs.
In addition, the digital interpolation filter provides enhanced image filtering to reduce signal images caused by
the upsampling process that are below 20 kHz. For example, upsampling an 8-kHz signal produces signal
images at multiples of 8 kHz, i.e., 8 kHz, 16 kHz, 24 kHz, etc. The images at 8 kHz and 16 kHz are below 20
kHz and still audible to the listener, therefore, they must be filtered heavily to maintain a good quality output.
The interpolation filter is designed to maintain at least 65 dB rejection of images that land below 7.455 Fs. In
order to utilize the programmable interpolation capability, the Fsref should be programmed to a higher rate
(restricted to be in the range of 39 kHz to 53 kHz when the PLL is in use), and the actual FS is set using the
dividers in bits D5D3 of control register 00H/page 2. For example, if Fs = 8 kHz is required, then Fsref can be
set to 48 kHz, and the DAC Fs set to Fsref/6. This ensures that all images of the 8-kHz data are sufficiently
attenuated well beyond a 20-kHz audible frequency range. Passband ripple for all sample-rate cases (from 20
Hz to 0.45 Fs) is +0.06 dB maximum.
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Delta-Sigma DAC
The audio digital-to-analog converter incorporates a third order multi-bit delta-sigma modulator followed by an
analog reconstruction filter. The DAC provides high-resolution, low−noise performance, using oversampling
and noise shaping techniques. The analog reconstruction filter design consists of a 6 tap analog FIR filter
followed by a continuous time RC filter. The analog FIR operates at 6.144 MHz (128x48 kHz, for Fsref of 48
kHz) or at 5.6448 MHz (128x44.1 kHz, for Fsref of 44.1 kHz). The DAC analog performance may be degraded
by excessive clock jitter on the MCLK input. Therefore, care must be taken to keep jitter on this clock to a
minimum (less than 50 ps).
DAC Digital Volume Control
The DAC has a digital volume control block, which implements programmable gain. The volume level can be
varied from 0 dB to –63.5 dB in 0.5 dB steps, in addition to a mute bit, independently for each channel. The
volume level of both channels can also be changed simultaneously by the master volume control. The gain is
implemented with a soft−stepping algorithm, which only changes the actual volume by one step per input
sample, either up or down, until the desired volume is reached. The rate of soft-stepping can be slowed to one
step per two input samples through D1 of control register 04H/Page 2.
Because of soft-stepping, the host does not know when the DAC has been completely muted. This may be
important if the host wishes to mute the DAC before making a significant change, such as changing sample
rates. In order to help with this situation, the part provides a flag back to the host via a read-only register bit
(D2−D3 of control register 04H/page 2) that alerts the host when the part has completed the soft-stepping, and
the actual volume has reached the desired volume level. The soft-stepping feature can be disabled by
programming D14=1 in register 1DH in Page 2. If soft-stepping is enabled, the MCLK signal should be kept
applied to the device, until the DAC power-down flag is set. When this flag is set, the internal soft-stepping
process and power down sequence is complete, and the MCLK can be stopped if desired.
The TSC2111 also includes functionality to detect when the user switches on or of f the de-emphasis or digital
audio processing functions, then (1) soft-mute the DAC volume control, (2) change the operation of the digital
effects processing and (3) soft-unmute the part. This avoids any possible pop/clicks in the audio output due to
instantaneous changes in the filtering. A similar algorithm is used when first powering up or down the DAC. The
circuit begins operation at power-up with the volume control muted, then soft-steps it up to the desired volume
level. At power-down, the logic first soft-steps the volume down to a mute level, then powers down the circuitry.
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DAC Powerdown
The DAC powerdown flag (D4D3 of control register 05H/page 2) along with D10 of control register 05H/page
2 denotes the powerdown status of the DAC according to Table 4.
Table 4. DAC Powerdown Status
D10, D4, D3 POWERUP/POWERDOWN STATE OF DAC
0,0,0 DAC left and right are in stable powerup state.
0,0,1 DAC left is in stable powerup state.
DAC right is in the process of powering up. The length of this state is determined by PLL and output driver powerup delays
controlled by register programming.
0,1,0 DAC left is in the process of powering up. The length of this state is determined by PLL and output driver powerup delays
controlled by register programming.
DAC right is in stable powerup state.
0,1,1 DAC left and right are in the process of powering up. The length of this state is determined by PLL and output driver
powerup delays controlled by register programming.
1,0,0 DAC left and right are in the process of powering down. The length of this state is determined by soft−stepping of volume
control block.
1,0,1 DAC left is in the process of powering down. The length of this state is determined by soft−stepping of volume control block.
DAC right is in stable powerdown state.
1,1,0 DAC left is in stable powerdown state.
DAC right is in the process of powering down. The length of this state is determined by soft−stepping of volume control
block.
1,1,1 DAC left and right are in stable powerdown state.
Analog Outputs
The TSC2111 has the capability to route the DAC output to any of the selected analog outputs. The TSC2111
provides various analog routing capabilities. All analog outputs other than the selected ones are powered down
for optimal power consumption.
DHeadphone Drivers
The TSC2111 features stereo headphone drivers (SPK1 and SPK2) that can deliver 44 mW per channel at
3.3-V supply, into 16-Ω loads. The TSC2111 provides flexibility to connect either of the DAC channels to either
of the headphone driver outputs. It also allows mixing of signals from dif ferent DAC channels. The headphones
can be connected in a single ended configuration using ac-coupling capacitors, or the capacitors can be
removed and virtual ground (VGND) powered for a cap-less output connection. Note that the VGND amplifier
must be powered up if the cap-less configuration is used.
In the case of an ac-coupled output, the value of the capacitors is typically chosen based on the amount of
low−frequency cut that can be tolerated. The capacitor in series with the load impedance forms a high-pass
filter with –3 dB cutoff frequency of 1/(2πRC) in Hz, where R is the impedance of the headphones. Use of an
overly small capacitor reduces low-frequency components in the signal output and lead to low-quality audio.
When driving 16-Ω headphones, capacitors of 220-µF (a commonly used value) result in a high-pass filter cutoff
frequency of 45 Hz, although reducing these capacitors to 5 0 µF results in a cutoff frequency of 199 Hz, which
is generally considered noticeable when playing music. The cutoff frequency is reduced to half of the above
values if 32-Ω headphones are used instead of 16-Ω.
The TSC2111 programmable digital effects block can be used to help reduce the size of capacitors needed by
implementing a low frequency boost function to help compensate for the high-pass filter introduced by the
ac-coupling capacitors. For example, by using 50-µF capacitors and setting the TSC2111 programmable filter
coefficients as shown below, the frequency response can be improved as shown in Figure 21.
Filter coefficients (use the same for both channels):
N0 = 32767, N1 = −32346, N2 = 31925, N3 = 32767, N4 = 0, N5 = 0
D0 = 32738, D1 = −32708, D4 = 0, D5 =0
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−20
−18
−16
−14
−12
−10
−8
−6
−4
−2
0
0 200 400 600 800 1000
f − Frequency − Hz
Gain − dB
Figure 20. Uncompensated Response For 16-Ω Load and 50-mF Decoupling Capacitor
−20
−18
−16
−14
−12
−10
−8
−6
−4
−2
0
0200 400 600 800 1000
f − Frequency − Hz
Gain − dB
Figure 21. Frequency Response For 16-Ω Load and 50-mF Decoupling Capacitor After Gain
Compensation Using Above Set of Coefficients For Audio Effects Filter
Using the capless output configuration eliminates the need for these capacitors and removes the accompanying
high-pass filter entirely. However, this configuration does have one drawback – if the RETURN terminal of the
headphone jack (which is wired to the TSC2111 VGND pin) is ever connected to a ground that is shorted to the
TSC2111 ground pin, then the VGND amplifier enters short-circuit protection, and the audio output does not
function properly.
The TSC2111 incorporates a programmable short-circuit detection/protection function. In case of short circuit,
all analog outputs are disabled and a read only bit D1 of control register 1DH/page 2 is set. In such cases, there
are two ways to return to normal operation:
− Hardware or software reset
− Power down all the output drivers, which can be achieved by setting bits D12, D11, D 8, D7, and D6 of control
register 05H/page 2 and then wait for driver power down status flags (bits D15−D10 of control register
25H/page 2) to become 1. The wait time is typically less than 50 ms after which, output drivers can be
programmed as desired.
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For the cap interface, this feature can be disabled by setting bit D0 of control register 20H/page 2. In the case
of the cap-less interface, VGND short circuit protection must also be disabled, which can be achieved by setting
bit D4 of control register 21H/page 2.
The TSC2111 implements a pop reduction scheme to reduce audible artifacts during powerup and powerdown
of headphone drivers. The scheme can be controlled by programming bits D5 and D4 of control register
25H/page 2. By default, the driver pop reduction scheme is enabled and can be disabled by programming bit
D5 of control register 25H/page 2 to 1. When this scheme is enabled and the virtual ground connection is not
used (VGND amplifier is powered down), the audio output driver slowly charges up any external ac-coupling
capacitors to reduce audible artifacts. Bit D4 of control register 25H/page 2 provides control of the charging time
for the ac-coupling capacitor as either 0.8 sec or 4 sec. When the virtual ground amplifier is powered up and
used, the external ac-coupling capacitor is eliminated, and the powerup time becomes 1 ms. This scheme takes
effect whenever any of the headphone drivers are powered up.
DSpeaker Driver
The TSC2111 has an integrated speaker driver (OUT8P−OUT8N) capable of driving an 8 Ω differential load.
The speaker driver, powered directly from the battery supply (3.5 V to 4.2 V) on the BVDD pin can deliver 400
mW at 3.9 V supply. It allows connecting one or both DAC channel to speaker driver. The TSC2111 also has a
short circuit protection feature for the speaker driver which can be enabled by setting bit D5 of control register
21H/page 2.
DReceiver Driver
The TSC2111 includes a receiver driver (SPK1−OUT32N), which can drive a 32 Ω differential load. It is
capable of delivering 82 mW into a 32 Ω load. The TSC2111 does not allow both the receiver driver and
headphone drivers to be turned on at the same time. Also, when the receiver driver is being used, the
headphone driver load must be disconnected.
DSimultaneous DAC Playback to Headphone and Speaker Outputs
The TSC2111 allows simultaneous DAC playback by using the BUZZ_IN PGA to route the SPL1 and SPK2
signals to the OUT8P and OUT8N drivers (bits D7 and D6, Register 25h, page 2). By utilizing the BUZZ_IN
PGA fully independent volume control of the headphone and of the speaker driver outputs are achieved.
Headset Interface
The TSC2111 supports all standard headset interfaces. It is capable of interfacing with 3-wire stereo headset,
3-wire cellular headset and 4-wire stereo-cellular headsets. It supports both capacitor-coupled (cap) and
capacitor-less (capless) interface for headset through software programming.
DCapless Interface
Figure 22 shows the connection diagram to the TSC2111 for capless interface. VGND acts as a ground of
headset jack. Voltage at VGND is 1.5 V and MICBIAS_HED voltage is programmed to 3.3 V. With this, the
voltage across microphone is configured to be 1.8 V. In order to minimize the e ffect of routing resistance on
VGND inside the device and on the printed circuit board (PCB), SPKFC should be shorted to VGND at the
jack. This reduces crosstalk from speaker to microphone because of common ground as VGND.
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−1
−1
MICBIAS_HED
MICBIAS_HND
2.5
MICIN_HED
MICIN_HND
OUT8P
OUT8N
OUT32N
SPK1
SPK2
To Detection
block
SPKFC
VGND 1.5 V
MIC_DETECT_IN To Detection block
LOUDSPEAKER
RECEIVER
s
s
gm
sgms
sgStereo
Cellular
Stereo +
Cellular
m = mic
s = stere
g = ground/midbias
3.3V
Figure 22. Connection Diagram for Capless Interface
DCap Interface
Figure 23 shows connection diagram to device for cap interface.
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−1
−1
MICBIAS_HED
MICBIAS_HND
2.5V
MICIN_HED
MICIN_HND
OUT8P
OUT8N
OUT32N
SPK1
SPK2
To Detection
block
SPKFC
VGND 1.5 V
MIC_DETECT_IN To Detection block
LOUDSPEAKER
RECEIVER
s
s
gm
sgm s
sgStereo
Cellular
Stereo +
Cellular
m = mic
s = stere
g = ground/midbias
2.5V
Figure 23. Connection Diagram for Cap Interface
DAuto Detection
The TSC2111 has built in monitors to automatically detect the insertion and removal of headsets. The detection
scheme can differentiate between stereo, cellular and stereo-cellular headsets. Upon detection of headset
insertion or removal, the TSC2111 updates read-only bit D12 of control register 22H/Page 2. The TSC2111 can
be programmed to send an active high interrupt for insertion and removal of headsets to the host-processor
over GPIO1 using bit D3 of control register 22H/Page 2 and GPIO2 using bit D4 of control register 22H/Page
2. The headset detection feature can be enabled by setting bit D15 of control register 22H/Page 2. When
headset detection is enabled and headset is not detected, SPK2, VGND and MICBIAS_HED are turned off
irrespective of control register settings. The TSC2111 also has the capability to detect button press on the
headset microphone. It consumes less than 50 µA while waiting for button press with everything else powered
down. Upon button press, the TSC2111 updates read-only bit D11 of control register 22H/Page 2. It can also
send an active high interrupt for indicating button press to the processor over GPIO1 using bit D1D0 of control
register 22H/Page 2. The TSC2111 provides debounce programmability for headset and button detect.
Debounce programmability can be used to reject glitches generated, and hence avoids false detection, while
inserting headset or pressing button.
Figure 24 shows terminal connections and jack configuration required for various headsets. Care should be
taken to avoid any dc path from MIC_DETECT_IN to ground, when a headset is not inserted.
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s
g
s
mm
s
gg
ss
s
gms
Stereo +
Cellular ssgStereo
s
gmCellular
Figure 24. Connection Diagram for Jacks
DHeadset Detection
− Interrupt polarity: Active high.
− Typical interrupt duration: 1.75 ms.
− Debounce programmability on bits D10 and D9 in control register 22H/Page 2:
− 00 => 16 ms duration (with 2 ms clock resolution)
− 01 => 32 ms duration (with 4 ms clock resolution)
− 10 => 64 ms duration (with 8 ms clock resolution)
− 11 => 128 ms duration (with 16 ms clock resolution)
− Headset detect flag is available till headset is connected.
DButton Detection
− Interrupt polarity: Active high.
− Typical interrupt duration: Button pressed time + clock resolution. Clock resolution depends upon
debounce programmability.
− Typical interrupt delay from button: Debounce duration + 0.5ms
− Debounce programmability:
− 00 => No glitch rejection
− 01 => 8 ms duration (with 1 ms clock resolution)
− 10 => 16 ms duration (with 2 ms clock resolution)
− 11 => 32 ms duration (with 4 ms clock resolution)
− Button detect flag is set when button is pressed. It gets clear when flag read is done after button press
removal.
AUDIO ROUTING
Audio Interface for Smart-Phone Applications
The TSC2111 supports audio routing features to combine various analog inputs and route them to analog
outputs or the ADC for smart−phone applications. In smart-phone applications, the TSC2111 can be used to
interface the cell-phone module to microphones and speakers. The TSC2111 allows the input from the
cell-phone module to be routed to different speakers through a PGA which supports a range of 12 dB to –34.5
dB in steps of 0.5 dB. The cell-phone input can also be mixed with the microphone input for recording through
the ADC. The microphone or DAC audio can be routed to the cell-phone output. The buzzer input from
cell-phone can be routed to the speakers through a PGA. The buzzer input supports PGA range of 0 dB to –45
dB in steps of 3 dB. The mixing and PGA are under full software control. The mixing feature can be used even
when both ADC and DAC are powered down. Cell-phone PGA, microphone PGA and buzzer PGA includes
soft-stepping logic. Soft-stepping logic works on Fsref if DAC is powered up otherwise; it works on internal
oscillator clocks.
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Differential Smart Phone Interface
The TSC2111 provides a pin−compatible upgrade to TSC2101. One improvement is the ability to connect
differentially t o a cell phone module, which improves noise immunity in the customers system. When configured
as differential input (bit D10, Register 06h, page 2) the CP_INP pin and BUZZ_IN/CP_INN pin function as a
differential input to the CP_INP PGA. In this mode, the gain of the CP_IN PGA is increased by +6 dB over the
default mode, so the PGA gain range is −28.5 dB to +18 dB. Also, in differential input mode. BUZZ_IN must
be disconnected from the BUZZ_IN PGA (bit D8, Register 25h, page 2).
When configured as differential output (bit D9, Register 06h, page 2), the CP_OUTP and VGND/CP_OUTN
pins function as a differential output pair. This differential output will only allow the signal on MICSEL (bits
D7−D5, Register 03h, page 2) to be routed out. When dif ferential mode is used, capless headphone output must
be disabled (bit D3, Register 21h, page 2) and VGND must be powered down (bit D8, Register 05h, page 2).
Analog Mixer
The analog mixer can be used to route the analog input selected for the ADC through an analog volume control
and then mix it with the audio DAC output. The analog mixer feature is available only if the single ended
microphone input or the AUX input is selected as the input to the ADC, not when the ADC input is configured
in fully-differential mode. This feature is available even if the ADC and DAC are powered down. The analog
volume control has a range from +12 dB to –34.5 dB in 0.5 dB steps plus mute and includes soft−stepping logic.
The internal oscillator is used for soft−stepping whenever the ADC and DAC are powered down.
Keyclick
A special circuit has been included for inserting a square−wave signal into the analog output signal path based
on register control. This functionality is intended for generating keyclick sounds for user feedback. Register
04H/Page 2 contains bits that control the amplitude, frequency, and duration of the square−wave signal. The
frequency of the signal can be varied from 62.5 Hz to 8 kHz and its duration can be programmed from 2 periods
to 32 periods. Whenever this register is written, the square wave is generated and coupled into the audio output.
The keyclick enable bit D15 of control register 04H/Page 2 is reset after the duration of a keyclick is played out.
This capability is available even when the ADC and DAC are powered down.
OPERATION—TOUCH SCREEN
A resistive touch screen works by applying a voltage across a resistor network and measuring the change in
resistance at a given point on the matrix where a screen is touched by an input stylus, pen, or finger. The change
in the resistance ratio marks the location on the touch screen.
The TSC2111 supports the resistive 4-wire configurations (see Figure 25). The circuit determines location in
two coordinate pair dimensions, although a third dimension can be added for measuring pressure.
The 4-Wire Touch Screen Coordinate Pair Measurement
A 4-wire touch screen is constructed as shown in Figure 25. It consists of two transparent resistive layers
separated by insulating spacers.
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Conductive Bar
T ransparent Conductor (ITO)
Bottom Side
X+
X−
Y+
Y−
T ransparent Conductor (ITO)
Top Side
Insulating Material (Glass)
ITO= Indium Tin Oxide
Silver Ink
Figure 25. 4-Wire Touch Screen Construction
The 4-wire touch screen panel works by applying a voltage across the vertical or horizontal resistive network.
The ADC converts the voltage measured at the point the panel is touched. A measurement of the Y position
of the pointing device is made by connecting the X+ input to an ADC, turning on the Y drivers, and digitizing
the voltage seen at the X+ input. The voltage measured is determined by the voltage divider developed at the
point of touch. For this measurement, the horizontal panel resistance in the X+ lead does not affect the
conversion due to the high input impedance of the ADC.
Voltage is then applied to the other axis, and the ADC converts the voltage representing the X position on the
screen. This provides the X and Y coordinates to the associated processor.
Measuring touch pressure (Z) can also be done with the TSC2111. To determine pen or finger touch, the
pressure of the touch needs to be determined. Generally, it is not necessary to have very high performance
for this test; therefore, the 8-bit resolution mode is recommended (however, calculations are shown with the
12-bit resolution mode). There are several different ways of performing this measurement. The TSC2111
supports two methods. The first method requires knowing the X-plate resistance, measurement of the
X-Position, and two additional cross panel measurements (Z 2 and Z1) of the touch screen (see Figure 26).
Using Equation (1) calculates the touch resistance:
RTOUCH +RX–plate X–position
4096 ǒZ2
Z1–1Ǔ
The second method requires knowing both the X-plate and Y-plate resistance, measurement of X-Position and
Y-Position, and Z1. Using Equation (2) also calculates the touch resistance:
RTOUCH +RX−plate X−position
4096 ǒ4096
Z1*1Ǔ*RY−plate ǒ1*Y−position
4096 Ǔ
i
Measure X-Position
Y+
Y−
X-Position
X−
X+
Touch
Measure Z1-Position
Touch
Y+
Y−X−
X+
Z1-Position
Y+
Y−
X−
X+
Touch
Z2-Position
Measure Z2-Positi
on
Figure 26. Pressure Measurement
When the t ouch panel is pressed or touched, and the drivers to the panel are turned on, the voltage across the
touch panel often overshoots and then slowly settles (decays) down to a stable DC value. This is due to
mechanical bouncing which is caused by vibration of the top layer sheet of the touch panel when the panel is
(1)
(2)
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pressed. This settling time must be accounted for, or else the converted value will be in error. Therefore, a delay
must be introduced between the time the driver for a particular measurement is turned on, and the time
measurement is made.
In some applications, external capacitors may be required across the touch screen for filtering noise picked up
by the touch screen, i.e., noise generated by the LCD panel or back-light circuitry. The value of these capacitors
provides a low-pass filter to reduce the noise, but causes an additional settling time requirement when the panel
is touched.
Several solutions to this problem are available in the TSC2111. A programmable delay time is available which
sets the delay between turning the drivers on and making a conversion. This is referred to as the panel voltage
stabilization time, and is used in some of the modes available in the TSC2111. In other modes, the TSC2111
can be commanded to turn on the drivers only without performing a conversion. T ime can then be allowed before
the command is issued to perform a conversion.
The TSC2111 touch screen interface can measure position (X, Y) and pressure (Z). Determination of these
coordinates is possible under three different modes of the ADC: (1) conversion controlled by the TSC2111,
initiated by detection of a touch; (2) conversion controlled by the TSC2111, initiated by the host responding to
the PINTDAV signal; or (3) conversion completely controlled by the host processor.
Touch Screen ADC Converter
The analog inputs of the TSC2111 are shown in Figure 27. The analog inputs (X, Y, and Z touch panel
coordinates, battery voltage monitors, chip temperature and auxiliary input) are provided via a multiplexer to
the successive approximation register (SAR) analog-to-digital (A/D) converter. The ADC architecture is based
on capacitive redistribution architecture, which inherently includes a sample/hold function.
A unique configuration of low on-resistance switches allows an unselected ADC input channel to provide power
and an accompanying pin to provide ground for driving the touch panel. By maintaining a differential input to
the converter and a differential reference input architecture, it is possible to negate errors caused by the driver
switch on- resistances.
The ADC is controlled by an ADC control register. Several modes of operation are possible, depending upon
the bits set in the control register. Channel selection, scan operation, averaging, resolution, and conversion rate
may all be programmed through this register. These modes are outlined in the sections below for each type of
analog input. The results of conversions made are stored in the appropriate result register.
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VREF
IN+
IN−
REFP
REFM
CONVERTER
AVSS1
AUX2
AUX1
VBAT
Y−
Y+
X−
X+
PINTDAV AVDD1 VREF
Figure 27. Simplified Diagram of the Analog Input Section
Data Format
The TSC2111 output data is in unsigned Binary format and can be read from registers over the SPI interface.
Reference
The TSC2111 has an internal voltage reference that can be set to 1.25 V or 2.5 V, through the reference control
register.
The internal reference voltage should only be used in the single-ended mode for battery monitoring,
temperature measurement, and for utilizing the auxiliary inputs. Optimal touch-screen performance is achieved
when using a ratiometric conversion, thus all touch-screen measurements are done automatically in the
ratiometric mode.
An external reference can also be applied to the VREF pin, and the internal reference can be turned off.
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Variable Resolution
The TSC2111 provides three different resolutions for the ADC: 8, 10 or 12 bits. Lower resolutions are often
practical for measurements such as touch pressure. Performing the conversions at lower resolution reduce the
amount of time it takes for the ADC to complete its conversion process, which lowers power consumption.
Conversion Clock and Conversion Time
The TSC2111 contains an internal 8 MHz clock, which is used to drive the state machines inside the device that
perform the many functions of the part. This clock is divided down to provide a clock to run the ADC. The division
ratio for this clock is set in the ADC control register. The ability to change the conversion clock rate allows the
user to choose the optimal value for resolution, speed, and power. If the 8 MHz clock is used directly, the ADC
is limited to 8-bit resolution; using higher resolutions at this speed does not result in accurate conversions. Using
a 4 MHz conversion clock is suitable for 10-bit resolution; 12-bit resolution requires that the conversion clock
run at 1 or 2 MHz.
Regardless of the conversion clock speed, the internal clock runs nominally at 8 MHz. The conversion time of
the TSC2111 is dependent upon several functions (see the section Touch Screen Conversion Initiated at Touch
Detect in this data sheet). While the conversion clock speed plays an important role in the time it takes for a
conversion to complete, a certain number of internal clock cycles are needed for proper sampling of the signal.
Moreover, additional times, such as the panel voltage stabilization time, can add significantly to the time it takes
to perform a conversion. Conversion time can vary depending upon the mode in which the TSC2111 is used.
Throughout this data sheet, internal and conversion clock cycles are used to describe the times that many
functions take to execute. Considering the total system design, these times must be taken into account by the
user.
When both the audio ADC and DAC are powered down, the touch screen ADC uses an internal oscillator for
conversions. However, to save power whenever audio ADC or DAC are powered up, the internal oscillator is
powered down and MCLK and BCLK are used to clock the touch screen ADC.
The TSC211 1 uses the programmed value of bit D13 in control register 06H/page 2 and the PLL programmability
to derive a clock from MCLK. The various combinations are listed in Table 5.
Table 5. Conversion Clock Frequency
D13=0 (in control register 06H/page 2) D13=1 (in control register 06H/page 2)
PLL enabled 160 13
×
××
PK
MCLK 192 17
×
××
PKMCLK
PLL disabled 1013
×
×
Q
MCLK 1217
×
×
Q
MCLK
Touch Detect/Data Available
The pen interrupt/data available (PINTDAV) output function is detailed in Figure 28. While in the power-down
mode, the Y– driver is ON and connected to AVSS2 and the X+ pin is connected through an on−chip pull-up
resistor to AVDD2. In this mode, the X+ pin is also connected to a digital b uffer and mux to drive the PINTDAV
output. When the panel is touched, the X+ input is pulled to ground through the touch screen and pen-interrupt
signal goes LOW due to the current path through the panel to AVSS2, initiating an interrupt to the processor.
During the measurement cycles for X− and Y− position, the X+ input is disconnected from the pen-interrupt
circuit to prevent any leakage current from the pull-up resistor flowing through the touch screen, and thus
causing conversion errors.
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Y+
X+
Y−
ON
Y+ or X+ DRIVERS ON OR
TEMP1 , TEMP2
MEASUREMENTS ACTIVATED
TEMP DIODE
HIGH EXCEPT WHEN
TEMP1. TEMP2
ACTIVATED
PINTDAV DATAV
TEMP1 TEMP2
AVDD1
50 kΩ
Figure 28. PINTDAV Functional Block Diagram
In modes where the TSC211 1 needs to detect if the screen is still touched (for example, when doing a PINTDAV
initiated X, Y, and Z conversion), the TSC2111 must reset the drivers so that the 50 KΩ resistor is connected.
Because of the high value of this pull-up resistor, any capacitance on the touch screen inputs causes a long
delay time, and may prevent the detection from occurring correctly. To prevent this, the TSC2111 has a circuit
that allows any screen capacitance to be precharged, so that the pull-up resistor does not have to be the only
source for the charging current. The time allowed for this precharge, as well as the time needed to sense if the
screen is still touched, can be set in the configuration control register D5−D0 of register 05H/Page 1.
This does point out, however, the need to use the minimum capacitor values possible on the touch screen
inputs. These capacitors may be needed to reduce noise, but too large a value will increase the needed
precharge and sense times, as well as panel voltage stabilization time.
The function of PINTDAV output is programmable and controlled by writing to the bits D15−D14 of control
register 01H/Page 1 as described in the Table 6.
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Table 6. Programmable PINTDAV Functionality
D15−D14 PINTDAV FUNCTION
00 Acts as PEN interrupt (active low) only. When PEN touch is detected, PINTDAV goes low.
01 Acts as data available (active low) only. The PINTDAV goes low as soon as one set of ADC conversions are completed for data
of X,Y, XYZ, battery input, or auxiliary input selected by D13−D10 in control register 00H/Page 1. The resulting ADC output is stored
in the appropriate registers. The PINTDAV remains low and goes high only after this complete set of registers selected by D13−D10
in control register 00H/Page 1 is read out.
10
11 Acts as both PEN interrupt and data available. When PEN touch is detected, PINTDAV goes low and remains low . The PINTDAV
goes high only after one set of A/D conversions is completed for data of X,Y, XYZ, battery input, or auxiliary input selected by
D13−D10 in control register 00H/Page 1.
NOTE:See the section, Conversion Time Calculations for the TSC2111 in this data sheet for the timing diagrams.
Pen-touch detect circuit is disabled during hardware power down.
Touch Screen Measurements
The touch screen ADC can be either controlled by the host processor or can be self−controlled to offload
processing from the host processor. Bit D12 of control register 01H/Page 1 sets the control mode of the
TSC2111 touch screen ADC.
Conversion Controlled by the TSC2111 Initiated at Touch Detect
In this mode, the TSC2111 detects when the touch panel is touched and causes the PINTDAV line to go low.
At the same time, the TSC2111 starts up its internal clock. Assuming the part was configured to convert XY
coordinates, it then turns on the Y drivers, and after a programmed panel voltage stabilization time, powers up
the ADC and converts the Y coordinate. If averaging is selected, several conversions may take place; when
data averaging is complete, the Y coordinate result is stored in the Y register.
If the screen is still touched at this time, the X drivers are enabled, and the process repeats, but measuring
instead the X coordinate, storing the result in the X register.
If only X and Y coordinates are to be measured, then the conversion process is complete. The time it takes to
complete this process depends upon the selected resolution, internal conversion clock rate, averaging selected,
panel voltage stabilization time, and precharge and sense times.
If the pressure of the touch is also to be measured, the process continues in the same way, measuring the Z1
and Z2 values, and placing them in the Z1 and Z2 registers. As before, this process time depends upon the
settings described above.
See the section Conversion Time Calculation for the TSC2111 in this data sheet for timing diagrams and
conversion time calculations.
Conversion Controlled by the TSC2111 Initiated by the Host
In this mode, the TSC2111 detects when the touch panel is touched and causes the PINTDAV line to go low.
The host recognizes the interrupt request, and then writes to the ADC control register (D13−D10 of control
register 00H/Page 1) to select one of the touch screen scan functions. The host can either choose to initiate
one of the scan functions, in which case the TSC2111 controls the driver turn−on and wait times (e.g. upon
receiving the interrupt the host can initiate the continuous scan function X−Y−Z1−Z2 after which the TSC2111
controls the rest of conversion). The host can also choose to control each aspect of conversion by controlling
the driver turn-on and start of conversions. For example, upon receiving the interrupt request, the host turns
on the X drivers. After waiting for the settling time, the host then addresses the TSC2111 again, this time
requesting an X coordinate conversion, and so on.
The main difference between this mode and the previous mode is that the host, not the TSC2111, controls th e
touch screen scan functions.
See the section Conversion Time Calculation for the TSC2111 in this data sheet for timing diagrams and
conversion time calculations.
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Temperature Measurement
In some applications, such as battery charging, a measurement of ambient temperature is required. The
temperature measurement technique used in the TSC2111 relies on the characteristics of a semiconductor
junction operating at a fixed current level. The forward diode voltage (VBE) has a well-defined characteristic
versus temperature. The ambient temperature can be predicted in applications by knowing the 25°C value of
the VBE voltage and then monitoring the variation of that voltage as the temperature changes.
The TSC2111 offers two modes of temperature measurement. The first mode requires a single reading to
predict the ambient temperature. A diode, as shown in Figure 29, is used during this measurement cycle. This
voltage is typically 600 mV at +25°C with a 20-µA current through it. The absolute value of this diode voltage
can vary a few millivolts. The temperature coefficient of this voltage is typically 2 mV/°C. During the final test
of the end product, the diode voltage at a known room temperature should be stored in nonvolatile memory.
Further calibration can be done to calculate the precise temperature coefficient of the particular. This method
has a temperature resolution of approximately 0.3°C/LSB and accuracy of approximately ±2°C with
two-temperature calibration. Figure 30 and Figure 31 shows typical plots with single and two-temperature
calibration respectively.
TEMP0 TEMP1
Temperature Select
X+
MUX A/D
Converter
Figure 29. Functional Block Diagram of Temperature Measurement Mode
−10
−8
−6
−4
−2
0
2
4
6
8
10
−40 −20 0 20 40 60 80 100
Error in Measurement −
TA − Free-Air Temperature − C
C
°
Figure 30. Typical Plot of Single Measurement Method After Calibrating for Offset at Room Temperature
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−1.20
−1
−0.80
−0.60
−0.40
−0.20
0
0.20
−40 −20 0 20 40 60 80 100
Error in Measurement −
TA − Free-Air Temperature − C
C
°
Figure 31. Typical Plot of Single Measurement Method After Calibrating for Offset and Gain At Two
Temperatures
The second mode uses a two-measurement (differential) method. This mode requires a second conversion with
a current 82 times larger. The voltage dif ference between the first (TEMP1) and second (TEMP2) conversion,
using 82 times the bias current, is represented by:
kT
q ln(N)
where:
N is the current ratio = 82
k = Boltzmann’s constant (1.38054 • 10−23 electrons volts/degrees Kelvin)
q = the electron charge (1.602189 • 10−19 °C)
T = the temperature in degrees Kelvin
The equation for the relation between di fferential code and temperature may vary slightly from device to device
and can be calibrated at final system test by the user. This method provides resolution of approximately
1.5°C/LSB and accuracy of approximately ±4°C after calibrating at room temperature.
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−4
−3
−2
−1
0
1
2
3
4
−40 −20 0 20 40 60 80 100
Error in Measurement −
TA − Free-Air Temperature − C
C
°
Figure 32. Typical Plot of Differential Measurement Method After Calibrating for Offset at Room
Temperature
The TSC2111 supports programmable auto-temperature measurement mode, which can be enabled using
control register 0CH/page 1. In this mode, the TSC2111 can auto-start the temperature measurement after a
programmable interval. The user can program minimum and maximum threshold values through a register. If
the measurement goes outside the threshold range, the TSC2111 sets a flag in the read only control register
0CH/page 1, which gets cleared after the flag is read. The TSC2111 can also be configured to send and active
high interrupt over GPIO1 by setting D9 in control register 0CH/page 1. The duration of the interrupt is
approximately 2 ms.
Temperature measurement can only be done in host controlled mode.
Battery Measurement
An added feature of the TSC2111 is the ability to monitor the battery voltage on the other side of a voltage
regulator (dc/dc converter), as shown in Figure 33. The battery voltage can vary from 0.5 V to 6 V while
maintaining the analog supply voltage to the TSC2111 at 3.0 V to 3.6 V. The input voltage (VBAT) is divided
down by a factor of 5 so that a 6.0 V battery voltage is represented as 1.2 V to the ADC. In order to minimize
the power consumption, the divider is only on during the sampling of the battery input.
If the battery conversion results in A/D output code of B, the voltage at the battery pin can be calculated as:
VBAT +B
2N 5 VREF
Where:
N is the programmed resolution of A/D
VREF is the programmed value of internal reference or the applied external reference.
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ADC
VBAT
8 kΩ2 kΩ
R
LDO or DC-DC
Converter 3.0 V to 3.6 V
VDD
+
−
Battery
0.5 to 6 V
Figure 33. Battery Measurement Functional Block Diagram
Battery measurement can only be done in host−controlled mode.
See the section Conversion Time Calculation for the TSC2111 and subsection Non Touch Measurement
Operation in this data sheet for timing diagrams and conversion time calculations.
For increased protection and robustness, TI recommends a minimum 100−Ω resistor be added in series
between the system battery and the VBAT pin. The 100-Ω resistor will cause an approximately 1% gain change
in the battery voltage measurement, which can easily be corrected in software when the battery conversion data
is read by the operating system.
Auxiliary Measurement
The auxiliary voltage inputs (AUX1 and AUX2) can be measured in much the same way as the battery inputs
except th e d i fference that input voltage is not divided. Applications might include external temperature sensing,
ambient light monitoring for controlling the backlight, or sensing the current drawn from the battery. The auxiliary
input can also be monitored continuously in scan mode.
The TSC2111 provides feature to measure resistance using auxiliary inputs. It has two modes of operation: (1)
External bias resistance measurement (2) Internal bias resistance measurement. Internal bias resistance
measurement mode does not need an external bias resistance of 50 kΩ, but provides less accuracy because
of on chip resistance variation, which is typically ±20%. Figure 34 shows connection diagram for resistance
measurement mode on AUX1.
AUX1
R
SAR
VREF
a. Internal bias, Resistance Measurement
Vsar SAR
VREF
b. External bias, Resistance Measurement
Vsar
AUX1
R
50 k Ω
50 kΩ
50 kΩ
Figure 34. Connection DIagram for Resistance Measurement
Resistance can be calculated using following formula:
R+50 KW Vsar
VREF*Vsar
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Where:
VREF is the SAR ADC reference
Vsar is input to the SAR ADC
The TSC2111 supports programmable auto−auxiliary measurement mode, which can be enabled using control
register 0CH/page 1. In this mode, the TSC2111 can auto start the auxiliary measurement after a programmable
interval. The user can program minimum and maximum threshold values through a register. If the measurement
goes outside the threshold range, the TSC2111 sets a flag in the read only control register 0CH/page 1, which
gets cleared after the flag is read. The TSC2111 can also be configured to send an active high interrupt over
GPIO1 by setting D9 of control register 0CH/page 1. The duration of the interrupt is approximately 2 ms.
Auxiliary measurement can only be done in host−controlled mode.
See the section Conversion Time Calculation for the TSC2111 and subsection Non Touch Measurement
Operation in this data sheet for timing diagram and conversion time calculation
Port Scan
If making measurements of VBAT, AUX1, and AUX2 is desired on a periodic basis, the Port Scan mode can
be used. This mode causes the TSC2111 to sample and convert battery input and both auxiliary inputs. At the
end of this cycle, the battery and auxiliary result registers contain the updated values. Thus, with one write to
the TSC2111, the host can cause three different measurements to be made.
Port Scan can only be done in host-controlled mode. See the section Issues at the end of this data sheet for
details of a known issue with this mode.
See the section Conversion Time Calculation for the TSC2111 and subsection Port Scan Operation in this data
sheet for timing diagrams and conversion time calculations.
Buffer Mode
The TSC2111 supports a programmable buffer mode, which is applicable for both touch screen related
conversion (X, Y, Z1, Z2) and nontouch screen related conversion (BAT, AUX1, AUX2, TEMP1, TEMP2). Buf fer
mode is implemented using a circular FIFO wit h a depth of 64. The number of interrupts required to be serviced
by a host processor can be reduced significantly buf fer mode. Buf fer mode can be enabled using control register
02H/page1.
Figure 35. Circular Buffer
Converted data is automatically written into the FIFO. To control the writing, reading and interrupt process, a
write pointer (WRPTR), a read pointer (RDPTR) and a trigger pointer (TGPTR) are used. The read pointer
always shows the location, which will be read next. The write pointer indicates the location, in which the next
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converted data is going to be written. The trigger pointer indicates the location at which an interrupt will be
generated if the write pointer reaches that location. Trigger level is the number of the data points needed to be
present in the FIFO before generating an interrupt. For e.g., X−Y continuous scan mode with trigger level set
to 8, the TSC2111 generates interrupt after writing (X1, Y1), (X2, Y2), (X3, Y3), (X4, Y4) i.e. 4 data-pairs or 8
data. Figure 35 shows the case when trigger level is programmed as 32. On resetting buffer mode, RDPTR
moves to location 1, WRPTR moves to location 1, and TGPTR moves to location equal to programmed trigger
level.
The user can select the input or input sequence, which needs to be converted, from the ADCSM bits of control
register 00H/page 1. The converted values are written in a predefined sequence to the circular buf fer. The user
has flexibility to program a specific trigger level in order to choose the configuration which best fits the
application. When the number of converted data, written in FIFO, becomes equal to the programmed trigger
level then the device generates an interrupt signal on /PINTDAV pin. In buffer mode, the user should program
this pin as Data Available (DATA_AVA ). In buffer mode, touch screen related conversions (X, Y, Z1, Z2) are
allowed only in self-controlled mode and nontouch screen related conversions (BAT, AUX1, AUX2, TEMP1,
TEMP2) are allowed only in host-controlled mode.
Buffer mode can be used in single-shot conversion or continuous conversion mode.
In single shot conversion mode, once the number of data written reaches programmed trigger level, the
TSC2111 generates an interrupt and waits for the user to start reading. As soon as the user starts reading the
first data from the last converted set, the TSC2111 clears the interrupt and starts a new set of conversions and
the trigger pointer is incremented by the programmed trigger level. An interrupt is generated again when the
trigger condition is satisfied.
In continuous conversion mode, once number of data written reaches the programmed trigger level, the
TSC2111 generates an interrupt. It immediately starts a new set of conversions and the trigger pointer is
incremented by the programmed trigger level. An interrupt gets cleared either by writing the next converted data
into the FIFO or by starting to read from the FIFO.
See the section Conversion Time Calculation for the TSC2111 and subsection Buffer Mode Operation in this
data sheet for timing diagrams and conversion time calculations.
Depending upon how the user is reading data, the FIFO can become empty or full. If the user is trying to read
data even if the FIFO is empty, then RDPTR keeps pointing to same location. If the FIFO gets full then the next
location is overwritten with newly converted data and the read pointer is incremented by one.
While reading the FIFO, the TSC2111 provides FIFO empty and full status flags along with the data. The user
can also read a status flag from control register 02H/page 1.
DIGITAL INTERFACE
RESET
The device requires reset after power up. This requires a low-to-high transition on the RESET pin after power
up for correct operation. Reset initializes all the internal registers, counters and logic.
Hardware Power-Down
Hardware power-down powers down all the internal circuitry to save power. All the register contents are
maintained. Putting the TSC2111 into hardware power-down circuit also disables the pen-touch detect circuit.
General Purpose I/O
The TSC2111 has two general purpose I/O (GPIO1 and GPIO2), which can be programmed either as inputs
or outputs. As outputs they can be programmed to control external logic through the TSC2111 registers or send
interrupts to the host processor on events like button detect, headset insertion, headset removal,
Auxiliary/temperature outside threshold range etc. As inputs they can be used by the host-processor to monitor
logic states of signals on the system through the TSC2111 registers.
SPI Digital Interface
All TSC2111 control registers are programmed through a standard SPI bus. The SPI allows full-duplex,
synchronous, serial communication between a host processor (the master) and peripheral devices (slaves).
The SPI master generates the synchronizing clock and initiates transmissions. The SPI slave devices depend
on a master to start and synchronize transmissions.
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A transmission begins when initiated by a master SPI. The byte from the master SPI begins shifting in on the
slave MOSI pin under the control of the master serial clock. As the byte shifts in on the MOSI pin, a byte shifts
out on the MISO pin to the master shift register.
The idle state of the serial clock for the TSC2111 i s lo w, which corresponds to a clock polarity setting of 0 (typical
microprocessor SPI control bit CPOL = 0). The TSC2111 interface is designed so that with a clock phase bit
setting of 1 (typical microprocessor SPI control bit CPHA = 1), the master begins driving its MOSI pin and the
slave begins driving its MISO pin on the first serial clock edge. The SS pin can remain low between
transmissions; however, the TSC2111 only interprets command words which are transmitted after the falling
edge of SS.
TSC2111 COMMUNICATION PROTOCOL
Register Programming
The TSC2111 is entirely controlled by registers. Reading and writing these registers is controlled by an SPI
master and accomplished by the use of a 16-bit command, which is sent prior to the data for that register . Th e
command is constructed as shown in Figure 36.
The command word begins with an R/W bit, which specifies the direction of data flow on the SPI serial bus. The
following 4 bits specify the page of memory this command is directed to, as shown in Table 7. The next six bits
specify the register address on that page of memory to which the data is directed. The last five bits are reserved
for future use and should be written only with zeros.
Table 7. Page Addressing
PG3 PG2 PG1 PG0 PAGE ADDRESSED
0 0 0 0 0
0 0 0 1 1
0 0 1 0 2
0 0 1 1 3
0 1 0 0 Reserved
0 1 0 1 Reserved
0 1 1 0 Reserved
0 1 1 1 Reserved
1 0 0 0 Reserved
1 0 0 1 Reserved
1 0 1 0 Reserved
1 0 1 1 Reserved
1 1 0 0 Reserved
1 1 0 1 Reserved
1 1 1 0 Reserved
1 1 1 1 Reserved
To read all the first page of memory, for example, the host processor must send the TSC2111 the command
0x8000 – this specifies a read operation beginning at page 0, address 0. The processor can then start clocking
data out of the TSC2111. The TSC2111 automatically increments its address pointer to the end of the page;
if the host processor continues clocking data out past the end of a page, the TSC2111 sends back the value
0xFFFF.
Likewise, writing to page 1 of memory would consist of the processor writing the command 0x0800, which
specifies a write operation, with PG0 set to 1, and all the ADDR bits set to 0. This results in the address pointer
pointing at the first location in memory on page 1. See the section on the TSC2111 memory map for details of
register locations.
BIT 15
MSB BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
LSB
R/W* PG3 PG2 PG1 PG0 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0 0 0 0 0 0
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Figure 36. TSC2111 Command Word
COMMAND WORD DATA DATA
SS
SCLK
MOSI
Figure 37. Register Write Operation
COMMAND WORD
SS
SCLK
MOSI
DATA DATA
MOSO
Figure 38. Register Read Operation
TSC2111 Memory Map
The TSC2111 has several 16-bit registers which allow control of the device as well as providing a location for
results from the TSC2111 to be stored until read by the host microprocessor. These registers are separated
into four pages of memory in the TSC2111: a data page (page 0), control pages (page 1 and page 2) and a buf fer
data page (page 3). The memory map is shown in Table 8.
Table 8. Memory Map
PAGE 0: TOUCH
SCREEN DATA
REGISTER
PAGE 1: T OUCH SCREEN
CONTROL REGISTERS PAGE 2: AUDIO CONTROL REGISTERS PAGE 3: BUFFER
DATA REGISTERS
ADDR REGISTER ADDR REGISTER ADDR REGISTER ADDR REGISTER
00 X 00 TSC ADC 00 Audio Control 1 00 Buffer Location
01 Y 01 Status 01 Headset PGA Control 01 Buffer Location
02 Z1 02 Buffer Mode 02 DAC PGA Control 02 Buffer Location
03 Z2 03 Reference 03 Mixer PGA Control 03 Buffer Location
04 Reserved 04 Reset Control Register 04 Audio Control 2 04 Buffer Location
05 BAT 05 Configuration 05 Power Down Control 05 Buffer Location
06 Reserved 06 Temperature Max 06 Audio Control 3 06 Buffer Location
07 AUX1 07 Temperature Min 07 Digital Audio Effects Filter Coefficients 07 Buffer Location
08 AUX2 08 AUX1 Max 08 Digital Audio Effects Filter Coefficients 08 Buffer Location
09 TEMP1 09 AUX1 Min 09 Digital Audio Effects Filter Coefficients 09 Buf fer Location
0A TEMP2 0A AUX2 Max 0A Digital Audio Ef fects Filter Coefficients 0A Buf fer Location
0B Reserved 0B AUX2 Min 0B Digital Audio Effects Filter Coefficients 0B Buffer Location
0C Reserved 0C Measurement Configuration 0C Digital Audio Ef fects Filter Coefficients 0C Buf fer Location
0D Reserved 0D Programmable Delay 0D Digital Audio Ef fects Filter Coefficients 0D Buf fer Location
0E Reserved 0E Reserved 0E Digital Audio Effects Filter Coefficients 0E Buf fer Location
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PAGE 3: BUFFER
DATA REGISTERS
PAGE 2: AUDIO CONTROL REGISTERS
PAGE 1: T OUCH SCREEN
CONTROL REGISTERS
PAGE 0: T OUCH
SCREEN DATA
REGISTER
REGISTERADDRREGISTERADDRREGISTERADDRREGISTERADDR
0F Reserved 0F Reserved 0F Digital Audio Ef fects Filter Coefficients 0F Buf fer Location
10 Reserved 10 Reserved 10 Digital Audio Ef fects Filter Coefficients 10 Buffer Location
11 Reserved 11 Reserved 11 Digital Audio Ef fects Filter Coefficients 11 Buffer Location
12 Reserved 12 Reserved 12 Digital Audio Ef fects Filter Coefficients 12 Buffer Location
13 Reserved 13 Reserved 13 Digital Audio Ef fects Filter Coefficients 13 Buffer Location
14 Reserved 14 Reserved 14 Digital Audio Ef fects Filter Coefficients 14 Buffer Location
15 Reserved 15 Reserved 15 Digital Audio Ef fects Filter Coefficients 15 Buffer Location
16 Reserved 16 Reserved 16 Digital Audio Ef fects Filter Coefficients 16 Buffer Location
17 Reserved 17 Reserved 17 Digital Audio Ef fects Filter Coefficients 17 Buffer Location
18 Reserved 18 Reserved 18 Digital Audio Ef fects Filter Coefficients 18 Buffer Location
19 Reserved 19 Reserved 19 Digital Audio Ef fects Filter Coefficients 19 Buffer Location
1A Reserved 1A Reserved 1A Digital Audio Effects Filter Coefficients 1A Buf fer Location
1B Reserved 1B Reserved 1B PLL Programmability 1B Buf fer Location
1C Reserved 1C Reserved 1C PLL Programmability 1C Buffer Location
1D Reserved 1D Reserved 1D Audio Control 4 1D Buffer Location
1E Reserved 1E Reserved 1E Handset PGA Control 1E Buffer Location
1F Reserved 1F Reserved 1F Cell & Buzzer PGA Control 1F Buffer Location
20 Reserved 20 Reserved 20 Audio Control 5 20 Buffer Location
21 Reserved 21 Reserved 21 Audio Control 6 21 Buffer Location
22 Reserved 22 Reserved 22 Audio Control 7 22 Buffer Location
23 Reserved 23 Reserved 23 GPIO Control 23 Buffer Location
24 Reserved 24 Reserved 24 AGC−CP_IN Control 24 Buffer Location
25 Reserved 25 Reserved 25 Driver Powerdown Status 25 Buffer Location
26 Reserved 26 Reserved 26 Mic AGC control 26 Buffer Location
27 Reserved 27 Reserved 27 Cell-phone AGC Control 27 Buf fer Location
28 Reserved 28 Reserved 28 Reserved 28 Buffer Location
29 Reserved 29 Reserved 29 Reserved 29 Buffer Location
2A Reserved 2A Reserved 2A Reserved 2A Buffer Location
2B Reserved 2B Reserved 2B Reserved 2B Buffer Location
2C Reserved 2C Reserved 2C Reserved 2C Buffer Location
2D Reserved 2D Reserved 2D Reserved 2D Buffer Location
2E Reserved 2E Reserved 2E Reserved 2E Buffer Location
2F−3F Reserved 2F−3F Reserved 2F−3F Reserved 2F−3F Buffer
Locations
TSC2111 Control Registers
This section describes each of the registers shown in the memory map of Table 8. The registers are grouped
according to the function they control. Note that in the TSC2111, bits in control registers may refer to slightly
different functions depending upon if you are reading the register or writing to it.
TSC2111 Data Registers (Page 0)
The data registers of the TSC2111 hold data results from conversion of touch screen ADC. All of these registers
default to 0000H upon reset. These registers are read only.
X, Y, Z1, Z2, BAT, AUX1, AUX2, TEMP1 and TEMP2 Registers
The results of all ADC conversions are placed in the appropriate data register. The data format of the result
word, R, of these registers is right-justified, as follows:
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Bit 15
MSB Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
LSB
0 0 0 0 R11
MSB R10 R9 R8 R7 R6 R5 R4 R3 R2 R1 R0
LSB
PAGE 1 CONTROL REGISTER MAP
REGISTER 00H: Touch-Screen ADC Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 PSTCM 0 R/W Pen Status/Control Mode.
READ
0 => There is no screen touch (default).
1 => The pen is down
WRITE
0 => Host controlled touch screen conversions (default).
1 => The TSC2111 controlled touch screen conversions.
D14 ADST 1(for read)
0 (for write) R/W ADC STATUS.
READ
0 =>ADC is busy
1 => ADC is not busy (default).
WRITE
0 => Normal mode (default).
1 => Stop conversion and power down.
D13−D10 ADCSM 0000 R/W ADC Scan Mode.
0000 => No scan
0001 = > Touch screen scan function: X and Y coordinates are converted and the results returned
to X and Y data registers. Scan continues until either the pen is lifted or a stop bit is
sent.
0010 = > Touch screen scan function: X, Y, Z1 and Z2 coordinates are converted and the results
returned to X, Y, Z1 and Z2 data registers. Scan continues until either the pen is lifted
or a stop bit is sent.
0011 = > Touch screen scan function: X coordinate is converted and the results returned to X data
register.
0100 => Touch screen scan function: Y coordinate is converted and the results returned to Y data
register.
0101 => Touch screen scan function: Z1 and Z2 coordinates are converted and the results
returned to Z1 and Z2 data registers
0110 => BAT input is converted and the results returned to the BAT data register.
0111 => AUX2 input is converted and the results returned to the AUX2 data register
1000 => AUX1 input is converted and the results returned to the AUX1 data register.
1001 => Auto Scan function: For AUX1, AUX2, TEMP1 or TEMP2 as chosen using control
register 0CH/page 1. Scan continues until stop bit is sent or D13−D10 are changed.
1010 => TEMP1 input is converted and the results returned to the TEMP1 data register.
1011 => Port scan function: BA T, AUX1, AUX2 inputs are measured and the results returned to
the appropriate data registers.
1100 => TEMP2 input is converted and the results returned to the TEMP2 data register.
1101 => T urn on X+, X− drivers
1110 => T urn on Y+, Y− drivers
1111 => Turn on Y+, X− drivers
D9−D8 RESOL 00 R/W Resolution Control. The ADC resolution is specified with these bits.
00 => 12-bit resolution
01 => 8-bit resolution
10 => 10-bit resolution
11 => 12-bit resolution
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BIT FUNCTION
READ/
WRITE
RESET
VALUE
NAME
D7−D6 ADAVG 00 R/W Converter A veraging Control. These two bits allow user to specify the number of averages the
converter will perform selected by bit D0, which selects either Mean Filter or Median Filter.
Mean Filter Median Filter
00 => No average No average
01 => 4-data average 5-data average
10 => 8-data average 9-data average
11 => 16-data average 15-data average
D5−D4 ADCR 00 R/W Conversion Rate Control. These two bits specify the internal clock rate, which the ADC uses to
control performing a single conversion. These bits are the same whether reading or writing.
tconv +N)4
ƒINTCLK
Where f INTCLK is the internal clock frequency. For example, with 12-bit resolution and a 2 MHz
internal clock frequency, the conversion time is 8 µs. This yields an ef fective throughput rate of
125 kHz.
00 => 8 MHz internal clock rate (use for 8-bit resolution only)
01 =>4 MHz internal clock rate (use for 8-bit/10-bit resolution only)
10 =>2 MHz internal clock rate
11 =>1 MHz internal clock rate
D3−D1 PVSTC 000 R/W Panel Voltage Stabilization Time Control. These bits allow user to specify a delay time from the
time the touch screen drivers are enabled to the time the voltage is sampled and a conversion
is started. This allows the user to adjust for the settling of the individual touch panel and external
capacitances.
000 => 0 µs stabilization time
001 => 100 µs stabilization time
010 => 500 µs stabilization time
011 => 1 ms stabilization time
100 => 5 ms stabilization time
101 => 10 ms stabilization time
110 => 50 ms stabilization time
111 => 100 ms stabilization time
D0 AVGFS 0 R/W Average Filter Select
0 => Mean Filter
1 => Median Filter
REGISTER 01H: Status Register
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D14 PINTDAV 10 R/W Pen Interrupt or Data A vailable. These two bits program the function of the PINTDAV pin.
00 => Acts as PEN interrupt (active low) only. When PEN touch is detected, PINTDAV goes low.
01 => Acts as data available (active low) only. The PINTDAV goes low as soon as one set of ADC
conversion(s) is completed. For scan mode, PINTDAV remains low as long as all the
appropriate registers have not been read out.
10 => Acts as both PEN interrupt and data available. When PEN touch is detected, PINTDAV goes
low. PINTDAV goes high once all the selected conversions are over.
11 => Same as 10
D13 PWRDN 0 R TSC−ADC Power down status
0 => TSC−ADC is active
1 => TSC−ADC stops conversion and powers down
D12 HCTLM 0 R Host Controlled Mode Status
0 => Host controlled mode
1 => Self (TSC2111) controlled mode
D11 DAVAIL 0 R Data Available Status
0 => No data available.
1 => Data is available(i.e one set of conversion is done)
Note:− This bit gets cleared only after all the converted data have been completely read out. This bit
is not valid in case of buffer mode.
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BIT FUNCTION
READ/
WRITE
RESET
VALUE
NAME
D10 XSTAT 0 R X Data Register Status
0 => No new data is available in X−data register
1 => New data for X−coordinate is available in register
Note: This bit gets cleared only after the converted data of X coordinate has been completely read
out of the register. This bit is not valid in case of buffer mode.
D9 YSTAT 0 R Y Data Register Status
0 => No new data is available in Y−data register
1 => New data for Y−coordinate is available in register
Note: This bit gets cleared only after the converted data of Y coordinate has been completely read
out of the register. This bit is not valid in case of buffer mode.
D8 Z1STAT 0 R Z1 Data Register Status
0 => No new data is available in Z1−data register
1 => New data is available in Z1−data register
Note: This bit gets cleared only after the converted data of Z1 coordinate has been completely read
out of the register. This bit is not valid in case of buf fer mode.
D7 Z2STAT 0 R Z2 Data Register Status
0 => No new data is available in Z2−data register
1 => New data is available in Z2−data register
Note: This bit gets cleared only after the converted data of Z2 coordinate has been completely read
out of the register. This bit is not valid in case of buf fer mode.
D6 BSTAT 0 R BAT Data Register Status
0 => No new data is available in BAT data register
1 => New data is available in BAT data register
Note: This bit gets cleared only after the converted data of BAT has been completely read out of the
register. This bit is not valid in case of buffer mode.
D5 0 R Reserved
D4 AX1STAT 0 R AUX1 Data Register Status
0 => No new data is available in AUX1−data register
1 => New data is available in AUX1−data register
Note: This bit gets cleared only after the converted data of AUX1 has been completely read out of
the register. This bit is not valid in case of buffer mode.
D3 AX2STAT 0 R AUX2 Data Register Status
0 => No new data is available in AUX2−data register
1 => New data is available in AUX2−data register
Note: This bit gets cleared only after the converted data of AUX2 has been completely read out of
the register. This bit is not valid in case of buffer mode.
D2 T1STAT 0 R TEMP1 Data Register Status
0 => No new data is available in TEMP1−data register
1 => New data is available in TEMP1−data register
Note: This bit gets cleared only after the converted data of TEMP1 has been completely read out of
the register. This bit is not valid in case of buf fer mode.
D1 T2STAT 0 R TEMP2 Data Register Status
0 => No new data is available in TEMP2−data register
1 => New data is available in TEMP2−data register
Note: This bit gets cleared only after the converted data of TEMP2 has been completely read out of
the register. This bit is not valid in case of buf fer mode.
D0 0 R Reserved
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REGISTER 02H: Buffer Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 BUFRES 0 R/W Buffer Reset.
0 => Buf fer mode is disabled and RDPTR, WRPTR & TGPTR set to their reset value.
1 => Buffer mode is enabled.
D14 BUFCONT 0 R/W Buffer Mode Selection
0 => Continuous conversion mode.
1 => Single shot mode.
D13−D11 BUFTL 000 R/W T rigger Level TL selection of Buffer used for SAR ADC
000 => 8
001 => 16
010 => 24
011 => 32
100 => 40
101 => 48
110 => 56
111 => 64
D10 BUFOVF 0 R Buffer Full Flag
0 => Buf fer is not full.
1 => Buf fer is full. This means buffer contains 64 unread converted data.
D9 BUFEMF 1 R Buffer Empty Flag
0 => Buf fer is not empty.
1 => Buffer is empty. This means there is no unread converted data in the buffer.
D8−D0 0’s R Reserved
REGISTER 03H: Reference Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D6 0’s R Reserved
D5 0 R/W Reserved. Always write 0 to this bit.
D4 VREFM 0 R/W Voltage Reference Mode. This bit configures the VREF pin as either external reference or internal
reference.
0 => External reference
1 => Internal reference
D3−D2 RPWUDL 00 R/W Reference Power Up Delay. These bits allow for a delay time for measurements to be made after
the reference powers up, thereby assuring that the reference has settled
00 => 0 µs
01 => 100 µs
10 => 500 µs
11 => 1000 µs
Note: This will be valid only when device is programmed for internal reference and Bit D1 = 1, i.e.,
reference is powered down between the conversions if not required.
D1 RPWDN 1 R/W Reference Power Down. This bit controls the power down of the internal reference voltage.
0 => Powered up at all times.
1 => Powered Down between conversions.
Note: When D4 = 0 i.e. device is in external reference mode then the internal reference is powered
down always.
D0 IREFV 0 R/W Internal Reference Voltage. This bit selects the internal voltage for TSC ADC.
0 => VREF = 1.25 V
1 => VREF = 2.50 V
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REGISTER 04H: Reset Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D0 RSALL R/W FFFFH Reset All. Writing the code 0xBB00, as shown below, to this register causes the TSC2111 to reset
all its control registers to their default, power−up values.
1011101100000000 => Reset all control registers
Others => Do not write other sequences to the register.
REGISTER 05H: Configuration Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D7 0’s R Reserved
D6 SWPDTD 0 R/W Software Powerdown Control for Pen Touch Detection
0 => Pen touch detection is enabled.
1 => Pen touch detection is disabled.
D5−D3 PRECTM 000 R/W Precharge Time. These bits set the amount of time allowed for precharging any pin capacitance on
the touch screen prior to sensing if a screen touch is happening.
000 => 20 µs
001 => 84 µ
010 => 276 µ
011 => 340 µs
100 => 1.044 ms
101 => 1.108 ms
110 => 1.300 m
111 => 1.364 ms
D2−D0 RPWUDL 000 R/W Sense Time. These bits set the amount of time the TSC211 1 need to wait to sense a screen touch
between coordinate axes.
000 => 32 µs
001 => 96 µs
010 => 544 µs
011 => 608 µs
100 => 2.080 ms
101 => 2.144 m
110 => 2.592 ms
111 => 2.656 ms
REGISTER 06H: Temperature Max Threshold Measurement
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D13 0’s R Reserved
D12 TMXES 0 R/W Max Temperature (TEMP1 or TEMP2) threshold check enable for Auto/Non−Auto−Scan
Measurement.
0 => Max Temperature threshold check is disabled.
1 => Max Temperature threshold check is enabled.
Only valid for TEMP1 or TEMP2. Depends on bit TSCAN of control register 0CH/page 1 in case
of auto−scan measurement and depends on bits ADCSM of control register 00H/page 1 in case
of non−auto−scan measurement.
D11−D0 TTHRESH FFFH R/W Temperature Max Threshold. When code due to temperature measurement goes above or equal
to programmed threshold value, interrupt is generated.
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REGISTER 07H: Temperature Min Threshold Measurement
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D13 0’s R Reserved
D12 TMNES 0 R/W Min Temperature (TEMP1 or TEMP2) threshold check enable for Auto/Non−Auto−Scan
Measurement.
0 => Min Temperature threshold check is disabled.
1 => Min Temperature threshold check is enabled.
Only valid for TEMP1 or TEMP2. Depends on bit TSCAN of control register 0CH/page 1 in case
of auto−scan measurement and depends on bits ADCSM of control register 00H/page 1 in case
of non−auto−scan measurement.
D11−D0 TTHRESL 000H R/W Temperature Min Threshold. When code due to temperature measurement goes below or equal to
programmed threshold value, interrupt is generated.
REGISTER 08H: AUX1 Max Threshold Measurement
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D13 0’s R Reserved
D12 A1MXES 0 R/W Max AUX1 threshold check enable for Auto/Non−Auto−Scan Measurement.
0 => Max AUX1 threshold check is disabled.
1 => Max AUX1 threshold check is enabled.
D11−D0 A1THRESH FFFH R/W AUX1 Threshold. When code due to AUX1 measurement goes above or equal to programmed
threshold value, interrupt is generated.
REGISTER 09H: AUX1 Min Threshold Measurement
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D13 0’s R Reserved
D12 A1MNES 0 R/W Min AUX1 threshold check enable for Auto/Non−Auto−Scan Measurement.
0 => Min AUX1 threshold check is disabled.
1 => Min AUX1 threshold check is enabled.
D11−D0 A1THRESL 000H R/W AUX1 Threshold. When code due to AUX1 measurement goes below or equal to programmed
threshold value, interrupt is generated.
REGISTER 0AH: AUX2 Max Threshold Measurement
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D13 0’s R Reserved
D12 A2MXES 0 R/W Max AUX2 threshold check enable for Auto/Non−Auto−Scan Measurement.
0 => Max AUX2 threshold check is disabled.
1 => Max AUX2 threshold check is enabled.
D11−D0 A1THRESH FFFH R/W AUX2 Threshold. When code due to AUX2 measurement goes above or equal to
programmed threshold value, interrupt is generated.
REGISTER 0BH: AUX2 Max Threshold Measurement
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D13 0’s R Reserved
D12 A2MNES 0 R/W Min AUX2 threshold check enable for Auto/Non−Auto−Scan Measurement.
0 => Min AUX2 threshold check is disabled.
1 => Min AUX2 threshold check is enabled.
D11−D0 A2THRESL 000H R/W AUX2 Threshold. When code due to AUX2 measurement goes below or equal to programmed
threshold value, interrupt is generated.
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REGISTER 0CH: Measurement Configuration
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 TSCAN 0 R/W TEMP Configuration when Auto−Temperature is selected
0 => TEMP1 is used for auto−temperature function
1 => TEMP2 is used for auto−temperature function
D15 A1CONF 0 R/W AUX1 Configuration.
0 => AUX1 is used for voltage measurement.
1 => AUX1 is used for resistance measurement.
D14 A2CONF 0 R/W AUX2 Configuration.
0 => AUX2 is used for voltage measurement.
1 => AUX2 is used for resistance measurement.
D12 ATEMES 0 R/W Auto Temperature (TEMP1 or TEMP2) measurement enable
0 => Auto temperature measurement is disabled.
1 => Auto temperature measurement is enabled.
TEMP1 or TEMP2 selection is depends on TSCAN bit.
D11 AA1MES 0 R/W Auto AUX1 measurement enable
0 => Auto AUX1 measurement is disabled.
1 => Auto AUX1 measurement is enabled.
D10 AA2MES 0 R/W Auto AUX2 measurement enable
0 => Auto AUX2 measurement is disabled.
1 => Auto AUX2 measurement is enabled.
D9 IGPIO1 0 R/W Enable GPIO1 for Auto/Non−Auto−Scan interrupt (this programmability is valid only if D11 & D9
of control register 23H/page 2 are 0’s)
0 => GPIO1 is not selected for interrupt.
1 => GPIO1 is used to send an interrupt. Interrupt is generated when any of TEMP (TEMP1 or
TEMP2), AUX1 or AUX2 are not passing threshold
D8 THMXFL 0 R Max threshold flag for Temperature (TEMP1 or TEMP2) measurement.
0 => Temperature measurement is less than max threshold setting.
1 => Temperature measurement is greater than or equal to max threshold setting.
D7 THMNFL 0 R Min threshold flag for Temperature (TEMP1 or TEMP2) measurement.
0 => Temperature measurement is greater than min threshold setting.
1 => Temperature measurement is less than or equal to max threshold setting.
D6 A1HMXFL 0 R Max threshold flag for AUX1measurement.
0 => AUX1 measurement is less than max threshold setting.
1 => AUX1 measurement is greater than or equal to max threshold setting.
D5 A1HMNFL 0 R Min threshold flag for AUX1 measurement.
0 => AUX1 measurement is greater than min threshold setting.
1 => AUX1 measurement is less than or equal to max threshold setting.
D4 A2HMXFL 0 R Max threshold flag for AUX2measurement.
0 => AUX2 measurement is less than max threshold setting.
1 => AUX2 measurement is greater than or equal to max threshold setting.
D3 A2HMNFL 0 R Min threshold flag for AUX2 measurement.
0 => AUX2 measurement is greater than min threshold setting.
1 => AUX2 measurement is less than or equal to max threshold setting.
D2 EXTRES 0 R/W External Bias Resistance Measurement mode
0 => Internal bias resistance measurement mode is enabled.
1 => External bias resistance measurement mode is enabled.
D1−D0 0’s R Reserved
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REGISTER 0DH: Programmable Delay In-Between Continuous Conversion
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 NTSPDELE
N0 R/W Programmable delay for non−touch screen auto measurement mode
0 => Programmable delay is disabled for non−touch screen auto measurement mode.
1 => Programmable delay is enabled for non−touch screen auto measurement mode.
D14−D12 NTSPDINTV 010 R/W Programming delay in−between conversion for non−touch screen auto measurement
mode
000 => 1.12 min
001 => 3.36 min
010 => 5.59 min
011 => 7.83 min
100 => 10.01 min
101 => 12.30 min
110 => 14.54 min
111 => 16.78 min
Note: These delays are from end of one set of conversion to the start of another set of
conversion.
D11 TSPDELEN 0 R/W Programmable delay for touch screen measurement
0 => Programmable delay mode is disabled for touch screen measurement.
1 => Programmable delay mode is enabled for touch screen measurement.
Note: This mode is valid only for touch screen related conversion in self−controlled mode
and in host−controlled mode valid for only continuous scan for X & Y coordinates or for
X, Y, Z1 & Z2 coordinates.
D10−D8 TSPDINTV 010 R/W Programming delay in−between conversion for touch screen measurement
000 => 1 ms
001 => 3 ms
010 => 5 ms
011 => 6.5 ms
100 => 8.5 ms
101 => 10 ms
110 => 12.5 ms
111 => 15 ms
Note: These delays are from end of one set of conversion to the start of another set of
conversion.
D7 CLKSEL 0 R/W Clock selection for the touch screen controller
0 => Internal oscillator clock is selected.
1 => External MCLK is selected.
Note: External clock is used only to control the delay programmed in between the
conversion.
D6−D0 CLKDIV 0000001 R/W Clock Division used to divide MCLK for getting 1 MHz clock for programmable delay , i.e.
MCLK/CLKDIV = 1 MHz,
0000000 => 128,
0000001 => 1,
0000010 => 2,
……
1111110 => 126,
1111111 => 127
REGISTER 0EH: Reserved
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D8 RESV FFh R/W Reserved. W rite only FFh to these bits.
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PAGE 2 CONTROL REGISTER MAP
REGISTER 00H: Audio Control 1
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D14 ADCHPF 00 R/W ADC High Pass Filter
00 => Disabled
01 => −3db point = 0.0045xFs
10 => −3dB point = 0.0125xFs
11 => −3dB point = 0.025xFs
Note: Fs is ADC sample rate
D13−D12 0’s R Reserved
D11−D10 WLEN 00 R/W Codec Word Length
00 => Word length = 16−bit
01 => Word length = 20−bit
10 => Word length = 24−bit
11 => Word length = 32−bit
D9−D8 DATFM 00 R/W Digital Data Format
00 => I2S Mode
01 => DSP Mode
10 => Right Justified
11 => Left Justified
Note: Right justified valid only when the ratio between DAC and ADC sample rate is an integer. e.g.
ADC = 32 kHz and DAC = 24 kHz or vice−versa is invalid for right justified Mode.
D7−D6 0’s R Reserved
D5−D3 DACFS 000 R/W DAC Sampling Rate
000 => DAC FS = Fsref/1
001 => DAC FS = Fsref/(1.5)
010 => DAC FS = Fsref/2
011 => DAC FS = Fsref/3
100 => DAC FS = Fsref/4
101 => DAC FS = Fsref/5
110 => DAC FS = Fsref/(5.5)
111 => DAC FS = Fsref/6
Note: Fsref is set between 39 kHz and 53 kHz
D2−D0 ADCFS 000 R/W ADC Sampling Rate
000 => ADC FS = Fsref/1
001 => ADC FS = Fsref/(1.5)
010 => ADC FS = Fsref/2
011 => ADC FS = Fsref/3
100 => ADC FS = Fsref/4
101 => ADC FS = Fsref/5
110 => ADC FS = Fsref/(5.5)
111 => ADC FS = Fsref/6
Note: Fsref is set between 39 kHz and 53 kHz
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REGISTER 01H: Gain Control for Headset/Aux Input
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 ADMUT_HED 1 R/W Headset/Aux Input Mute
1 => Headset/Aux Input Mute
0 => Headset/Aux Input not muted
Note: I f AGC is enabled and Headset/Aux Input is selected then ADMUT_HED+ADPGA_HED
reflects gain b e i n g a p p l i e d b y A G C .
D14−D8 ADPGA_HED 1111111 R/W ADC Headset/Aux PGA Settings
0000000 => 0 dB
0000001 => 0.5 dB
0000010 => 1.0 dB
………
1110110 => 59.0 dB
..........
1111111 => 59.5 dB
Note: I f AGC is enabled and Headset/Aux Input is selected then ADMUT_HED+ADPGA_HED
reflects gain b e i n g a p p l i e d b y A G C .
If AGC is on, the decoding for read values is as follows
01110111 => +59.5 dB
01110110 => +59.0 dB
………
00000000 => 0 dB
……….
11101001 => −11.5 dB
11101000 => −12 dB
D7−D5 AGCTG_HED 000 R/W AGC Target Gain for Headset/Aux Input. These three bits set the AGC’s targeted ADC output
level.
000 => −5.5 dB
001 => −8.0 dB
010 => −10 dB
011 => −12 dB
100 => −14 dB
101 => −17 dB
110 => −20 dB
111 => −24 dB
D4−D1 AGCTC_HED 0000 R/W AGC Time Constant for Headset/Aux Input. These four bits set the AGC attack and decay time
constants. Time constants remain same irrespective of any sampling frequency
Attack time Decay time
(ms) (ms)
0000 8 100
0001 11 100
0010 16 100
0011 20 100
0100 8 200
0101 11 200
0110 16 200
0111 20 200
1000 8 400
1001 11 400
1010 16 400
1011 20 400
1100 8 500
1101 11 500
1110 16 500
1111 20 500
D0 AGCEN_HED 0 R/W AGC Enable for Headset/Aux Input
0 => AGC is off for Headset/Aux Input
(ADC Headset/Aux PGA is controlled by ADMUT_HED+ADPGA_HED)
1 => AGC is on for Headset/Aux Input
(ADC Headset/Aux PGA is controlled by AGC)
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REGISTER 02H: CODEC DAC Gain Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 DALMU 1 R/W DAC Left Channel Mute
1 => DAC Left Channel Muted
0 => DAC Left Channel not muted
D14−D8 DALVL 1111111 R/W DAC Left Channel V olume Control
0000000 => DAC left channel volume = 0 dB
0000001 => DAC left channel volume = −0.5 dB
…..
1111110 => DAC left channel volume = −63.0 dB
1111111 => DAC left channel volume = −63.5 dB
D7 DARMU 1 R/W DAC Right Channel Mute
1 => DAC Right Channel Muted
0 => DAC Right Channel not muted
D6−D0 DARVL 1111111 R/W DAC Right Channel Volume Control
0000000 => DAC right channel volume = 0 dB
0000001 => DAC right channel volume = −0.5 dB
…..
1111110 => DAC right channel volume = −63.0 dB
1111111 => DAC right channel volume = −63.5 dB
REGISTER 03H: Mixer PGA Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 ASTMU 1 R/W Analog Sidetone Mute Control
1 => Analog sidetone mute
0 => Analog sidetone not muted
D14−D8 ASTG 1000101 R/W Analog Sidetone Gain Setting
0000000 => Analog sidetone = −34.5 dB
0000001 => Analog sidetone = −34 dB
0000010 => Analog sidetone = −33.5 dB
...
1000101 => Analog sidetone = 0 dB
1000110 => Analog sidetone = 0.5 dB
...
1011100 => Analog sidetone = 11.5 dB
1011101 => Analog sidetone = 12 dB
1011110 => Analog sidetone = 12 dB
1011111 => Analog sidetone = 12 dB
11xxxxx => Analog sidetone = 12 dB
D7−D5 MICSEL 000 R/W Selection for Mic Input and Aux Input for ADC/Cell phone−output/Analog side−tone.
000 => Single-ended input MICIN_HED selected
001 => Single-ended input MICIN_HND selected
010 => Single-ended input AUX1 selected
011 => Single-ended input AUX2 selected
100 => Dif ferential input MICIN_HED and AUX1 connected to ADC.
101 => Dif ferential input MICIN_HED and AUX2 connected to ADC.
110 => Dif ferential input MICIN_HND and AUX1 connected to ADC.
111 => Dif ferential input MICIN_HND and AUX2 connected to ADC.
Note: When D7=1 (differential input selected), analog side−tone path is not valid
D4 MICADC 0 R/W Selection of ADC input
0 => Nothing connected
1 => Input selected by MICSEL connected to ADC.
D3 CPADC 0 R/W Connects Cell phone input to ADC
0 => Cell phone input not connected to ADC.
1 => Cell phone input connected to ADC.
D2−D1 Reserved 0’s R Reserved
D0 ASTGF 0 R Analog Sidetone PGA Flag (Read Only)
0 => Gain Applied ≠ PGA Register setting
1 => Gain Applied = PGA register setting.
Note: This flag indicates when the soft−stepping for analog sidetone is completed.
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REGISTER 04H: Audio Control 2
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 KCLEN 0 R/W Keyclick Enable
0 => Keyclick Disabled
1 => Keyclick Enabled
Note: This bit is automatically cleared after giving out the keyclick signal length equal to the
programmed value.
D14−D12 KCLAC 100 R/W Keyclick Amplitude Control
000 => Lowest Amplitude
….
100 => Medium Amplitude
….
111 => Highest Amplitude
D11 APGASS 0 R/W Headset/Aux or Handset PGA Soft−stepping control
0 => 0.5 dB change every WCLK or ADWS
1 => 0.5 dB change every 2 WCLK or 2 ADWS
When AGC is enabled for Headset/Aux or Handset, this bit is read only and acts as Noise Threshold
Flag. The read value indicates the following
0 => signal power greater than noise threshold
1 => signal power is less than noise threshold
D10−D8 KCLFRQ 100 R/W Keyclick Frequency
000 => 62.5 Hz
001 => 125 Hz
010 => 250 Hz
011 => 500 Hz
100 => 1 kHz
101 => 2 kHz
110 => 4 kHz
111 => 8 kHz
D7−D4 KCLLN 0001 R/W Keyclick Length
0000 => 2 periods key click
0001 => 4 periods key click
0010 => 6 periods key click
0011 => 8 periods key click
0100 => 10 periods key click
0101 => 12 periods key click
0110 => 14 periods key click
0111 => 16 periods key click
1000 => 18 periods key click
1001 => 20 periods key click
1010 => 22 periods key click
1011 => 24 periods key click
1100 => 26 periods key click
1101 => 28 periods key click
1110 => 30 periods key click
1111 => 32 periods key click
D3 DLGAF 0 R DAC Left Channel PGA Flag
0 => Gain applied ≠ PGA register setting
1 => Gain applied = PGA register setting.
Note: This flag indicates when the soft−stepping for DAC left channel is completed
D2 DRGAF 0 R DAC Right Channel PGA Flag
0 => Gain applied ≠ PGA register setting
1 => Gain applied = PGA register setting.
Note: This flag indicates when the soft−stepping for DAC right channel is completed
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BIT FUNCTION
READ/
WRITE
RESET
VALUE
NAME
D1 DASTC 0 R/W DAC Channel PGA Soft−stepping control
0 => 0.5 dB change every WCLK
1 => 0.5 dB change every 2 WCLK
D0 ADGAF 0 R Headset/Aux or Handset PGA Flag
1 => Gain applied = PGA register setting.
0 => Gain applied ≠ PGA Register setting
Note: This flag indicates when the soft−stepping for PGA is completed.
When AGC is enabled for Headset/Aux or Handset, this bit is read−only and acts as Saturation
Flag. The read value of this bit indicates the following
0 => AGC is not saturated
1 => AGC is saturated (PGA has reached –12 dB or max PGA applicable).
REGISTER 05H: CODEC Power Control
BIT NAME RESET VALUE READ/WRITE FUNCTION
D15 MBIAS_HND 1 R/W MICBIAS_HND Power−down Control
0 => MICBIAS_HND is powered up.
1 => MICBIAS_HND is powered down.
D14 MBIAS_HED 1 R/W MICBIAS_HED Power−down Control
0 => MICBIAS_HED is powered up.
1 => MICBIAS_HED is powered down.
D13 ASTPWD 1 R/W Analog Sidetone Power−down Control
0 => Analog sidetone powered up
1 => Analog sidetone powered down
D12 SP1PWDN 1 R/W SPK1(Single−Ended)/OUT32N(Differential) Power−down Control
0 => SPK1/OUT32N is powered up
1 => SPK1/OUT32N is powered down
D11 SP2PWDN 1 R/W SPK2 Power−down Control
0 => SPK2 is powered up
1 => SPK2 is powered down
D10 DAPWDN 1 R/W DAC Power−down Control
0 => DAC powered up
1 => DAC powered down
D9 ADPWDN 1 R/W ADC Power−down Control
0 => ADC powered up
1 => ADC powered down
D8 VGPWDN 1 R/W Driver V irtual Ground Power−down Control
0 => VGND is powered up
1 => VGND is powered down
D7 COPWDN 1 R/W CP_OUT Power−down Control
0 => CP_OUT is powered up
1 => CP_OUT is powered down
D6 LSPWDN 1 R/W Loudspeaker (8−Ω Driver) Power−down Control
0 => Loudspeaker (8−Ω driver) is powered up
1 => Loudspeaker (8−Ω driver) is powered down
D5 ADPWDF 1 R ADC Power Down Flag
0 => ADC power down is not complete
1 => ADC power down is complete
D4 LDAPWDF 1 R DAC Left Power Down Flag
0 => DAC left power down is not complete
1 => DAC left power down is complete
D3 RDAPWDF 1 R DAC Right Power Down Flag
0 => DAC right power down is not complete
1 => DAC right power down is complete
D2 ASTPWF 1 R Analog Sidetone Power Down Flag
0 => Analog sidetone power down is not complete
1 => Analog sidetone power down is complete
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BIT FUNCTIONREAD/WRITERESET VALUENAME
D1 EFFCTL 0 R/W Digital Audio Effects Filter
0 => Disable digital audio ef fects filter
1 => Enable digital audio ef fects filter
D0 DEEMPF 0 R/W De−emphasis Filter Enable
0 => Disable de−emphasis filter
1 => Enable de−emphasis filter
NOTE:D15−D6 are all 1’s, then full codec section is powered down.
REGISTER 06H: Audio Control 3
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D14 DMSVOL 00 R/W DAC Channel Master Volume Control
00 => Left channel and right channel have independent volume controls
01 => Left channel volume control is the programmed value of the right channel volume control.
10 => Right channel volume control is the programmed value of the left channel volume control.
11 => same as 00
D13 REFFS 0 R/W Reference Sampling Rate
Note: This setting controls the coefficients in the de−emphasis filter, the time−constants in AGC,
and internal divider values that generate the clock for the touch screen measurement ADC. If an
Fsref above 48 kHz is being used, then it is recommended to set this to the 48−kHz setting,
otherwise either setting can be used.
0 => Fsref = 48.0 kHz
1 => Fsref = 44.1 kHz
D12 DAXFM 0 R/W Master Transfer Mode
0 => Continuous data transfer mode
1 => 256−s data transfer mode
D11 SLVMS 0 R/W CODEC Master Slave Selection
0 => The TSC2111 is slave codec
1 => The TSC2111 is master codec
D10 CPIDF 0 R/W Differential CP_INN
0 = > Select Single−ended input for CP_INN
1 = > Select Differential input for CP_INN
D9 CPODF 0 R/W Differential CP_OUTP
0 = > Select Single−ended input for CP_OUTP
1 = > Select Differential input for CP_OUTP
D8 ADCOVF 0 R ADC Channel Overflow Flag
0 => ADC channel data is within saturation limits
1 => ADC channel data has exceeded saturation limits.
Note: This flag gets reset after register read.
D7 DALOVF 0 R DAC Left Channel Overflow Flag
0 => DAC left channel data is within saturation limits
1 => DAC left channel data has exceeded saturation limits
Note: This flag gets reset after register read.
D6 DAROVF 0 R DAC Right Channel Overflow Flag
0 => DAC right channel data is within saturation limits
1 => DAC right channel data has exceeded saturation limits
Note: This flag gets reset after register read.
D5−D4 00 R/W Reserved.
D3 CLPST 0 R/W MIC AGC Clip Stepping Disable
0 => Disabled
1 => Enabled
Note: Valid only when AGC is selected for the Headset/Aux or Handset input.
D2−D0 REVID XXX R TSC2111 Device Revision ID
REGISTER 07H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_N0 27619 R/W Left channel bass-boost coefficient N0.
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REGISTER 08H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_N1 −27034 R/W Left channel bass-boost coef ficient N1.
REGISTER 09H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_N2 26461 R/W Left channel bass-boost coefficient N2.
REGISTER 0AH: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_N3 27619 R/W Left channel bass-boost coefficient N3.
REGISTER 0BH: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_N4 −27034 R/W Left channel bass-boost coef ficient N4.
REGISTER 0CH: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_N5 26461 R/W Left channel bass-boost coefficient N5.
REGISTER 0DH: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_D1 32131 R/W Left channel bass-boost coefficient D1.
REGISTER 0EH: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_D2 −31506 R/W Left channel bass-boost coef ficient D2.
REGISTER 0FH: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_D4 32131 R/W Left channel bass-boost coefficient D4.
REGISTER 10H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 L_D5 −31506 R/W Left channel bass-boost coef ficient D5.
REGISTER 11H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_N0 27619 R/W Right channel bass-boost coefficient N0.
REGISTER 12H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_N1 −27034 R/W Right channel bass-boost coefficient N1.
REGISTER 13H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_N2 26461 R/W Right channel bass-boost coefficient N2.
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REGISTER 14H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_N3 27619 R/W Right channel bass-boost coefficient N3.
REGISTER 15H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_N4 −27034 R/W Right channel bass-boost coefficient N4.
REGISTER 16H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_N5 26461 R/W Right channel bass-boost coefficient N5.
REGISTER 17H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_D1 32131 R/W Right channel bass-boost coefficient D1.
REGISTER 18H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_D2 −31506 R/W Right channel bass-boost coefficient D2.
REGISTER 19H: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_D4 32131 R/W Right channel bass-boost coefficient D4.
REGISTER 1AH: Digital Audio Effects Filter Coefficients
BIT NAME RESET VALUE
(IN DECIMAL) READ/
WRITE FUNCTION
D15−D0 R_D5 −31506 R/W Right channel bass-boost coefficient D5.
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REGISTER 1BH: PLL Programmability
BIT NAME RESET VALUE READ/WRITE FUNCTION
D15 PLLSEL 0 R/W PLL Enable
0 => Disable PLL.
1 => Enable PLL.
D14−D11 QVAL 0010 R/W Q value: Valid when PLL is disabled
0000 => 16,
0001 => 17,
0010 => 2,
0011 => 3,
…….
1100 => 12,
1101 => 13,
1110 => 14,
1111 => 15,
D10−D8 PVAL 000 R/W P value: Valid when PLL is enabled
000 => 8,
001 => 1,
010 => 2,
011 => 3,
100 => 4,
101 => 5,
110 => 6,
111 => 7
D7−D2 J_VAL 000001 R/W J value: Valid when PLL is enabled
000000 => Not valid,
000001 => 1,
000010 => 2,
000011 => 3,
……..
111100 => 60,
111101 => 61,
111110 => 62,
111111 => 63
D1−D0 00 R Reserved (Write only 00)
REGISTER ICH: PLL Programmability
BIT NAME RESET VALUE READ/WRITE FUNCTION
D15−D2 D_VAL 0
(decimal) R/W D value: Valid when PLL is enabled
D value is valid from 0000 to 9999 in decimal.
Greater than 9999 is treated as 9999.
D1−D0 Reserved 0 R Reserved (Write only 00)
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REGISTER IDH: Audio Control 4
BIT NAME RESET VALUE READ/WRITE FUNCTION
D15 ADSTPD 0 R/W Headset/Aux or Handset PGA Soft−stepping Control
0 => Enable soft−stepping
1 => Disable soft−stepping
D14 DASTPD 0 R/W DAC PGA Soft−stepping Control
0 => Enable soft−stepping
1 => Disable soft−stepping
D13 ASSTPD 0 R/W Analog Sidetone PGA Soft−stepping Control
0 => Enable soft−stepping
1 => Disable soft−stepping
Note: When soft−stepping is enabled gain is changed 0.5 dB per Fsref.
D12 CISTPD 0 R/W Cell−phone PGA Soft−stepping Control
0 => Enable soft−stepping
1 => Disable soft−stepping
Note: When soft−stepping is enabled gain is changed 0.5 dB per Fsref.
D11 BISTPD 0 R/W Buzzer PGA Soft−stepping Control
0 => Enable soft−stepping
1 => Disable soft−stepping
Note: When soft−stepping is enabled gain is changed 3 dB per Fsref.
D10−D9 AGCHYS 00 R/W MIC AGC Hysteresis selection
00 => 1 dB
01 => 2 dB
10 => 4 dB
11 => No Hysteresis
Note: Valid only when AGC is selected for Headset/Aux or Handset input
D8−D7 MB_HED 00 R/W Micbias for Headset
00 => MICBIAS_HED = 3.3 V
01 => MICBIAS_HED = 2.5 V
10 => MICBIAS_HED = 2.0 V
11 => MICBIAS_HED = 2.0 V
D6 MB_HND 0 R/W Micbias for Handset
0 => MICBIAS_HND = 2.5 V
1 => MICBIAS_HND = 2.0 V
D5−D2 0’s R Reserved (Write only 0000)
D1 SCPFL 0 R Driver Short Circuit Protection Flag.
0 => No short circuit happened.
1 => Short circuit detected on headphone outputs.
D0 X R Reserved (Write only 0)
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REGISTER 1EH: Gain Control for Handset Input
BIT NAME RESET VALUE READ/WRITE FUNCTION
D15 ADMUT_HND 1 R/W Handset Input Mute
1 => Handset Input Mute
0 => Handset Input not muted
Note: If AGC is enabled and handset Input is selected then
ADMUT_HND+ADPGA_HND will reflect gain being applied by AGC.
D14−D8 ADPGA_HND 1111111 R/W ADC Handset PGA Settings
0000000 => 0 dB
0000001 => 0.5 dB
0000010 => 1.0 dB
....
1110110 => 59.0 dB
.............
1111111 => 59.5 dB
Note: If AGC is enabled and handset Input is selected then
ADMUT_HND+ADPGA_HND will reflect gain being applied by AGC.
If AGC is on, the decoding for read values is as follows
01110111 => +59.5 dB
01110110 => +59.0 dB
………
00000000 => 0 dB
……….
11101000 => −12 dB
D7−D5 AGCTG_HND 000 R/W AGC Target Gain for Handset Input.
These three bits set the AGC’s targeted ADC output level.
000 => −5.5 dB
001 => −8.0 dB
010 => −10 dB
011 => −12 dB
100 => −14 dB
101 => −17 dB
110 => −20 dB
111 => −24 dB
D4−D1 AGCTC_HND 0000 R/W AGC Time Constant for Handset Input.
These four bits set the AGC attack and decay time constants. Time
constants remain the same irrespective of any sampling frequency.
Attack time Decay time
(ms) (ms)
0000 8 100
0001 11 100
0010 16 100
0011 20 100
0100 8 200
0101 11 200
0110 16 200
0111 20 200
1000 8 400
1001 11 400
1010 16 400
1011 20 400
1100 8 500
1101 11 500
1110 16 500
1111 20 500
D0 AGCEN_HND 0 R/W AGC Enable for Handset Input
0 => AGC is off for Handset Input
(ADC PGA is controlled by ADMUT_HND+ADPGA_HND)
1 => AGC is on for Handset Input
(ADC PGA is controlled by AGC)
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REGISTER 1FH: Gain Control for Cell Phone Input and Buzzer Input
BIT NAME RESET VALUE READ/WRITE FUNCTION
D15 MUT_CP 1 R/W Cell phone Input PGA Power−down
1 => Power−down cell-phone input PGA
0 => Power−up cell phone input PGA
D14−D8 CPGA 1000101 R/W Cell−phone Input PGA Settings.
0000000 => −34.5 dB
0000001 => −34 dB
0000010 => −33.5 dB
...
1000101 => 0 dB
1000110 => 0.5 dB
...
1011100 => 11.5 dB
1011101 => 12 dB
1011110 => 12 dB
1011111 => 12 dB
11xxxxx => 12 dB
Note: These bits are read−only when AGC is enabled for CP_IN (cell-phone input)
and reflect the gain applied by the AGC.
D7 CPGF 0 R Cell phone Input PGA Flag (Read Only)
0 => Gain applied ≠ PGA register setting
1 => Gain applied = PGA register setting.
Note: This flag indicates when the soft−stepping for cell-phone input is completed.
When AGC is enabled for Cell−phone input, this bit is read−only and acts as
Saturation Flag. The read value of this bit indicates the following
0 => AGC is not saturated
1 => AGC is saturated (PGA has reached –34.5 dB or max PGA applicable).
D6 MUT_BU 1 R/W Buzzer Input PGA Power−down
1 => Power−down buzzer input PGA
0 => Power−up buzzer input PGA
D5−D2 BPGA 1111 R/W Buzzer Input PGA settings.
1111 => 0 dB
1110 => −3 dB
1101 => −6 dB
1100 => −9 dB
1011 => −12 dB
1010 => −15 dB
1001 => −18 dB
1000 => −21 dB
0111 => −24 dB
0110 => −27 dB
0101 => −30 dB
0100 => −33 dB
0011 => −36 dB
0010 => −39 dB
0001 => −42 dB
0000 => −45 dB
D1 BUGF 0 R Buzzer PGA Flag (Read Only)
0 => Gain Applied ≠ PGA Register setting
1 => Gain Applied = PGA register setting.
Note: This flag indicates when the soft−stepping for buzzer input is completed.
D0 0 R Reserved (Write only 0)
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REGISTER 20H: Audio Control 5
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 DIFFIN 0 R/W Single-ended or Differential Output Selection.
0 => Single-ended output (headset/lineout) selected for SPK1 and SPK2 drivers
1 => Differential output (handset) selected for SPK1 and OUT32N drivers
Note: When bit D15=1, both SPK1 and OUT32N drivers should be power−up. Otherwise the
TSC2111 automatically power−down both SPK1 and OUT32N drivers.
D14−D13 DAC2SPK1 00 R/W DAC Channel Routing to SPK1 (Single-ended)/ SPK1−OUT32N (Differential)
00 => No routing from DAC to SPK1/ SPK1−OUT32N
01 => DAC left routed to SPK1/SPK1−OUT32N
10 => DAC right routed to SPK1/SPK1−OUT32N
11 => DAC (left + right)/2 routed to SPK1/SPK1−OUT32N
D12 AST2SPK1 0 R/W Analog Sidetone Routing to SPK1 (Single-ended)/SPK1−OUT32N (Differential)
0 => No routing from analog sidetone to SPK1/SPK1−OUT32N
1 => Analog sidetone routed to SPK1/SPK1−OUT32N
D11 BUZ2SPK1 0 R/W Buzzer PGA Routing to SPK1 (Single-ended)/ SPK1−OUT32N (Differential)
0 => No routing from buzzer PGA to SPK1/SPK1−OUT32N
1 => Buzzer PGA routed to SPK1/ SPK1−OUT32N
D10 KCL2SPK1 0 R/W Keyclick Routing to SPK1 (Single-ended)/SPK1−OUT32N (Differential)
0 => No routing from keyclick to SPK1/SPK1−OUT32N
1 => Keyclick routed to SPK1/SPK1−OUT32N
D9 CPI2SPK1 0 R/W Cell−phone Input Routing to SPK1 (Single-ended)/SPK1−OUT32N (Differential)
0 => No routing from cell-phone input to SPK1/SPK1−OUT32N
1 => Cell phone input routed to SPK1/SPK1−OUT32N
D8−D7 DAC2SPK2 00 R/W DAC Channel Routing to SPK2 (Valid for Only Single-ended)
00 => No routing from DAC to SPK2
01 => DAC left routed to SPK2
10 => DAC right routed to SPK2
11 => DAC (left + right)/2 routed to SPK2
D6 AST2SPK2 0 R/W Analog Sidetone Routing to SPK2 (Valid for Only Single-ended)
0 => No routing from analog sidetone to SPK2
1 => Analog sidetone routed to SPK2
D5 BUZ2SPK2 0 R/W Buzzer PGA Routing to SPK2 (Valid for Only Single-ended)
0 => No routing from buzzer PGA to SPK2
1 => Buzzer PGA routed to SPK2
D4 KCL2SPK2 0 R/W Keyclick Routing to SPK2 (Valid for Only Single-ended)
0 => No routing from keyclick to SPK2
1 => Keyclick routed to SPK2
D3 CPI2SPK2 0 R/W Cell−phone Input Routing to SPK2 (Valid for Only Single-ended)
0 => No routing from cell-phone input to SPK2
1 => Cell−phone input routed to SPK2
D2 MUTSPK1 1 R/W Mute Control for SPK1 (Single-ended)/SPK1−OUT32N (Differential)
0 => SPK1/SPK1−OUT32N is not muted.
1 => SPK1/SPK1−OUT32N is muted.
D1 MUTSPK2 1 R/W Mute Control for SPK2 (V alid for Only Single-ended)
0 => SPK2 is not muted.
1 => SPK2 is muted.
D0 HDSCPTC 0 W Headphone Short−circuit Protection Control
0 => Enable short−circuit protection
1 => Disable short−circuit protection
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REGISTER 21H: Audio Control 6
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 SPL2LSK 0 R/W Routing Selected for SPK1 Goes to OUT8P−OUT8N (Loudspeaker) Also.
0 => None of the routing selected for SPK1 goes to OUT8P−OUT8N.
1 => Routing selected for SPK1 using D14−D9 of control register 20H/page 2 goes to
OUT8P−OUT8N.
Note: This programming is valid only if SPK1/OUT32N and SPK2 are powered down.
D14 AST2LSK 0 R/W Analog Sidetone Routing to OUT8P−OUT8N (Loudspeaker)
0 => No routing from analog sidetone to OUT8P−OUT8N
1 => Analog sidetone routed to OUT8P−OUT8N
D13 BUZ2LSK 0 R/W Buzzer PGA Routing to OUT8P−OUT8N (Loudspeaker)
0 => No routing from buzzer PGA to OUT8P−OUT8N
1 => Buzzer PGA routed to OUT8P−OUT8N
D12 KCL2LSK 0 R/W Keyclick Routing to OUT8P−OUT8N (Loudspeaker)
0 => No routing from keyclick to OUT8P−OUT8N
1 => Keyclick routed to OUT8P−OUT8N
D11 CPI2LSK 0 R/W Cell−phone Input Routing to OUT8P−OUT8N (Loudspeaker)
0 => No routing from cell-phone input to OUT8P−OUT8N
1 => Cell−phone input routed to OUT8P−OUT8N
D10 MIC2CPO 0 R/W MICSEL (Programmed Using Control Register 04H/Page 2) Routed to Cell-phone Output.
0 => No routing from MICSEL to CP_OUT.
1 => MICSEL routed to CP_OUT.
D9 SPL2CPO 0 R/W Routing Selected for SPK1 (Other Than Cell−phone Input) Goes to Cell-phone Output Also.
0 => None of the routing selected for SPK1 goes to cell-phone output.
1 => Routing selected for SPK1 using D14−D10 of control register 20H/page 2 goes to
CP_OUT.
Note: This programming is valid even if SPK1/OUT32N and SPK2 are powered down.
D8 SPR2CPO 0 R/W Routing Selected for SPK2 Goes to Cell−phone Output Also (Valid for Only Single-ended).
0 => None of the routing selected for SPK2 goes to cell-phone output.
1 => Routing selected for SPK2 using D8−D3 of control register 20H/page2 goes to CP_OUT.
Note: 1. This programming is valid even if SPK2 is power-down.
2. This programming is not valid when routing selected for SPK1 is routed to loudspeaker
D7 MUTLSPK 1 R/W Mute Control for OUT8P−OUT8N Loudspeaker
0 => OUT8P−OUT8N is not muted.
1 => OUT8P−OUT8N is muted.
D6 MUTSPK2 1 R/W Mute Control for Cell−phone Output
0 => CPOUT is not muted.
1 => CPOUT is muted.
D5 LDSCPTC 1 R/W Loudspeaker Short−circuit Protection Control
0 => Enable short−circuit protection for loudspeaker
1 => Disable short−circuit protection for loudspeaker
D4 VGNDSCPTC 0 R/W VGND Short−circuit Protection Control
0 => Enable short−circuit protection for VGND driver
1 => Disable short−circuit protection for VGND driver
D3 CAPINTF 0 R/W Cap/Cap−less Interface Select for Headset.
0 => Select cap−less interface.
1 => Select cap interface.
D2−D0 0’s R Reserved (Write only 000)
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REGISTER 22H: Audio Control 7
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 DETECT 0 R/W Headset Detection
0 => Disable headset detection
1 => Enable headset detection
D14−D13 HESTYPE 00 R Type of Headset Detected.
00 => No headset detected.
01 => Stereo headset detected.
10 => Cellular headset detected
11 => Stereo+cellular headset detected
Note: These two bits are valid only if the headset detection is enabled.
D12 HDDETFL 0 R Headset Detection Flag.
0 => Headset is not detected
1 => Headset is detected.
D11 BDETFL 0 R Button Press Detection Flag.
0 => Button press is not detected
1 => Button press is detected.
D10−D9 HDDEBNPG 01 R/W De−bouncing Programmability for Glitch Rejection During Headset Detection.
00 => 16 ms duration (with 2 ms clock resolution)
01 => 32 ms duration (with 4 ms clock resolution)
10 => 64 ms duration (with 8 ms clock resolution)
11 => 128 ms duration (with 16 ms clock resolution)
D8 0 R Reserved (Write only 0)
D7−D6 BDEBNPG 00 R/W De−bouncing Programmability for Glitch Rejection During Button Press Detection.
00 => No glitch rejection.
01 => 8 ms duration (with 1 ms clock resolution)
10 => 16 ms duration (with 2 ms clock resolution)
11 => 32 ms duration (with 4 ms clock resolution)
D5 0 R Reserved (Write only 0)
D4 DGPIO2 0 R/W Enable GPIO2 for Headset Detection Interrupt
0 => Disable GPIO2 for headset detection interrupt
1 => Enable GPIO2 for headset detection interrupt
Note: This programmability is valid only if D15 and D13 of control register 23H/page 2 are set to
0
D3 DGPIO1 0 R/W Enable GPIO1 for Headset Detection Interrupt
0 => Disable GPIO1 for Detection interrupt
1 => Enable GPIO1 for Detection interrupt
Note: This programmability is valid only if D11 and D9 of control register 23H/page 2 are set to
0
D2 CLKGPIO2 0 R/W Enable GPIO2 for CLKOUT
0 => Disable GPIO2 for CLKOUT mode.
1 => Enable GPIO2 for CLKOUT mode.
In CLKOUT mode the frequency of output signal is equal to the 256xDAC_FS if DAC_FS is faster
than ADC_FS otherwise equal to the 256xADC_FS.
Note: This programmability is valid only if PLL is enabled, D15 and D13 of register 23H/page 2
are set to 0 and GPIO2 is not enabled for detection interrupt.
D1−D0 ADWSF 00 R/W ADWS Selection
0X => GPIO1 pin output is three−stated.
10 => GPIO1 pin acts as button press detect interrupt.
11 => GPIO1 pin acts as ADC word−select (ADWS).
Note: 1. This programmability is valid only if D11 and D9 of control register 23H/page 2 are set
to 0.
2. These bits should be programmed ‘11’ only if dif ferent ADC and DAC sample rates are desired.
In this mode WCLK acts as DAWS i.e. DAC sample rate and GPIO1 acts as ADWS i.e. ADC
sample rate.
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REGISTER 23H: GPIO Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 GPO2EN 0 R/W GPIO2 Enable for General Purpose Output Port
0 => GPIO2 is not programmed as general purpose output port
1 => GPIO2 programmed as general purpose output port
D14 GPO2SG 0 R/W GPIO2 Output Signal Programmability
0 => GPIO2 goes to low if GPIO2 enable for general purpose output port
1 => GPIO2 goes to high if GPIO2 enable for general purpose output port
D13 GPI2EN 0 R/W GPIO2 Enable for General Purpose Input Port
0 => GPIO2 is not programmed as general purpose input port
1 => GPIO2 programmed as general purpose input port
D12 GPI2SGF 0 R GPIO2 Input Signal Flag
0 => GPIO2 input is low.
1 => GPIO2 input is high.
Note: Valid only if GPIO2 is enable for general purpose input port
D11 GPO1EN 0 R/W GPIO1 Enable for General Purpose Output Port
0 => GPIO1 is not programmed as general purpose output port
1 => GPIO1 programmed as general purpose output port
D10 GPO1SG 0 R/W GPIO1 Output Signal Programmability
0 => GPIO1 goes to low if GPIO1 enable for general purpose output port
1 => GPIO1 goes to high if GPIO1 enable for general purpose output port
D9 GPI1EN 0 R/W GPIO1 Enable for General Purpose Input Port
0 => GPIO1 is not programmed as general purpose input port
1 => GPIO1 programmed as general purpose input port
D8 GPI1SGF 0 R GPIO1 Input Signal Flag
0 => GPIO1 input is low.
1 => GPIO1 input is high.
Note: Valid only if GPIO1 is enable for general purpose input port
D7−D0 0 R Reserved (Write only 00000000)
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REGISTER 24H: AGC for Cell-Phone Input Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 0 R Reserved (Write only 0)
D14 AGCNF_CELL 0 R Noise Threshold Flag.
The read values indicate the following
0 => Signal power greater than noise threshold
1 => Signal power is less than noise threshold
Note: Valid only if AGC is selected for the Cell−phone input (CP_IN).
D13−D11 AGCNL 000 R/W AGC Noise Threshold.
These settings apply to both Headset/Aux/Handset and Cell−phone input.
000 => −30 dB
001 => −30 dB
010 => −40 dB
011 => −50 dB
100 => −60 dB
101 => −70 dB (not valid for Cell−phone AGC)
110 => −80 dB (not valid for Cell−phone AGC)
111 => −90 dB (not valid for Cell−phone AGC)
D10−D9 AGCHYS_CELL 00 R/W AGC Hysteresis Selection for Cell−phone Input
00 => 1 dB
01 => 2 dB
10 => 4 dB
11 => No Hysteresis
D8 CLPST_CELL 0 R/W AGC Clip Stepping Disable for Cell−phone Input
0 => Disable clip stepping for cell-phone input
1 => Enable clip stepping for cell-phone input
D7−D5 AGCTG_CELL 000 R/W AGC Target Gain for Cell−phone Input.
These three bits set the AGC’s targeted ADC output level.
000 => −5.5 dB
001 => −8.0 dB
010 => −10 dB
011 => −12 dB
100 => −14 dB
101 => −17 dB
110 => −20 dB
111 => −24 dB
D4−D1 AGCTC_CELL 0000 R/W AGC T ime Constant for Cell Input.
These four bits set the AGC attack and decay time constants. Time constants remain
the same irrespective of any sampling frequency
Attack time Decay time
(ms) (ms)
0000 8 10
0001 11 100
0010 16 100
0011 20 100
0100 8 200
0101 11 200
0110 16 200
0111 20 200
1000 8 400
1001 11 400
1010 16 400
1011 20 400
1100 8 500
1101 11 500
1110 16 500
1111 20 500
D0 AGCEN_CELL 0 R/W AGC Enable for Cell−phone Input
0 => AGC is off for Cell−phone input
1 => AGC is on for Cell−phone input
(Cell PGA is controlled by AGC
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REGISTER 25H: Driver Power-Down Status
Note: All values reflected in control register 25H/page2 are valid only if short circuit is not detected (bit D1 of
control register 1DH/page2 is set to 0)
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 SPK1FL 1 R SPK1 Driver Power-down Status
0 => SPK1 driver not powered down.
1 => SPK1 driver powered down.
D14 SPK2FL 1 R SPK2 Driver Power-down Status
0 => SPK2 driver not powered down.
1 => SPK2 driver powered down.
D13 HNDFL 1 R OUT32N (Handset) Driver Power-down Status
0 => OUT32N driver not powered down.
1 => OUT32N driver powered down.
D12 VGNDFL 1 R VGND Driver Power-down Status
0 => VGND driver not powered down.
1 => VGND driver powered down.
D11 LSPKFL 1 R Loudspeaker Driver Power-down Status
0 => Loudspeaker driver not powered down.
1 => Loudspeaker driver powered down.
D10 CELLFL 1 R Cell−phone Output (CP_OUT) Driver Power-down Status
0 => Cell-phone output driver not powered down.
1 => Cell-phone output driver powered down.
D9 DPOP 0 R/W DAC Headphone POP Reduction
0 => Enable DAC Headphone Pop Reduction
1 => Disable DAC Headphone Pop Reduction
D8 BZPGA 0 R/W BUZZ_IN Routing to BUZZ_IN PGA
0 => Routing from SPK2 to BUZZ_PGA enabled
1 => Routing from SPK2 to BUZZ_PGA disabled
D7 SP2PGA 0 R/W SPK2 Routing to BUZZ_IN PGA
0 => Routing from SPK2 to BUZZ_PGA disabled
1 => Routing from SPK2 to BUZZ_PGA enabled
D6 SPIPGA 0 R/W SPK1 Routing to BUZZ_IN PGA
0 => Routing from SPK1 to BUZZ_PGA disabled
1 => Routing from SPK1 to BUZZ_PGA enabled
D5 PSEQ 0 R/W Disable Drivers (SPK1/SPK2/OUT32N/VGND) Pop Sequencing
0 => Enable drivers pop sequencing
1 => Disable drivers pop sequencing
D4 PSTIME 0 R/W Drivers (SPK1/SPK2) Pop Sequencing Duration in Cap Mode
0 => 802 ms.
1 => 4006 ms.
D3−D0 0000 R Reserved (Write only 0000)
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REGISTER 26H: Mic AGC Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D9 MMPGA 1111111 R/W Max PGA Value Applicable for Headset/Aux or Handset AGC
0000000 => 0 dB
0000001 => 0.5 dB
0000010 => 1.0 dB
....
1110110 => 59.0 dB
............
1111111 => 59.5 dB
D8−D6 MDEBNS 000 R/W Debounce Time for Transition from Normal Mode to Silence Mode (Input Level is Below Noise
Threshold Programmed by AGCNL). This is Valid for Headset/Aux or Handset AGC.
000 => 0 ms
001 => 0.5 ms
010 => 1.0 ms
011 => 2.0 ms
100 => 4.0 ms
101 => 8.0 ms
110 => 16.0 ms
111 => 32.0 ms
D5−D3 MDEBSN 000 R/W De−bounce Time for Transition from Silence Mode to Normal Mode. This is Valid for Headset/Aux
or Handset AGC.
000 => 0 ms
001 => 0.5 ms
010 => 1.0 ms
011 => 2.0 ms
100 => 4.0 ms
101 => 8.0 ms
110 => 16.0 ms
111 => 32.0 ms
D2−D0 000 R Reserved (Write only 000)
REGISTER 27H: Cell-Phone AGC Control
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15−D9 CMPGA 1111111 R/W Max. Cell‘−phone input PGA value applicable for Cell‘−phone AGC
0000000 => −34.5 dB
0000001 => −34 dB
0000010 => −33.5 dB
...
1000100 => −0.5 dB
1000101 => invalid
1000110 => invalid
...
1011100 => Invalid
1011101 => 12 dB
1011110 => 12 dB
1011111 => 12 dB
11xxxxx => 12 dB
D8−D6 CDEBNS 000 R De−bounce T ime for Transition from Normal Mode to Silence Mode (Input Level is
Below Noise Threshold Programmed by AGCNL). This is Valid for Cell−phone AGC.
000 => 0 ms
001 => 0.5 ms
010 => 1.0 ms
011 => 2.0 ms
100 => 4.0 ms
101 => 8.0 ms
110 => 16.0 ms
111 => 32.0 ms
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BIT FUNCTION
READ/
WRITE
RESET
VALUE
NAME
D5−D3 CDEBSN 000 R De−bounce T ime for Transition from Silence Mode to Normal Mode. This is Valid for
Cell−phone AGC.
000 => 0 ms
001 => 0.5 ms
010 => 1.0 ms
011 => 2.0 ms
100 => 4.0 ms
101 => 8.0 ms
110 => 16.0 ms
111 => 32.0 ms
D2−D0 000 R Reserved (Write only 000)
TSC2111 Buffer Data Registers (Page 3)
The buffer data registers of the TSC211 1 hold data results from the SAR ADC conversions in buffer mode. Upon
reset, bit D15 is set to 0, bit D14 is set to 1 and the remaining bits are don’t−care. These registers are read only.
If buffer mode is enabled, then the results of all ADC conversions are placed in the buffer data register. The
data format of the result word (R) of these registers is right-justified which is as follows:
D15
MSB D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
LSB
FUF EMF X ID R11
MSB R10 R9 R8 R7 R6 R5 R4 R3 R2 R1 R0
LSB
BIT NAME RESET
VALUE READ/
WRITE FUNCTION
D15 FUF 0 R Buffer Full Flag
This flag indicates that all the 64 locations of the buffer are having unread data.
D14 EMF 1 R Buffer Empty Flag
This flag indicates that there is no unread data available in FIFO. This is generated while reading the
last converted data.
D13 X R Reserved
D12 ID X R Data Identification
0 => X or Z1 coordinate or BAT or AUX2 data in R11−R0
1 => Y or Z2 coordinate or AUX1 or TEMP data in R11−R0
Order for Writing Data in Buffer When Multiple Inputs are Selected
For XY Conversion: Y, X
For XYZ1Z2 Conversion: Y, X, Z1, Z2
For Z1Z2 Conversion: Z1, Z2
For Auto Scan Conversion: AUX1 (if selected), AUX2 (if selected), TEMP (if selected)
For Port Scan Conversion: BAT, AUX1, AUX2
D11−D0 R11−R0 X’s R Converted Data
LAYOUT
The following layout suggestions should provide optimum performance from the TSC2111. However, many
portable applications have conflicting requirements concerning power, cost, size, and weight. In general, most
portable devices have fairly clean power and grounds because most of the internal components are very low
power. This situation would mean less bypassing for the converter’s power and less concern regarding
grounding. Still, each situation is unique and the following suggestions should be reviewed carefully.
For optimum performance, care should be taken with the physical layout of the TSC2111 circuitry. The basic
SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground
connections, and digital inputs that occur just prior to latching the output of the analog comparator. Therefore,
during any single conversion for an n-bit SAR converter, there are n windows in which large external transient
voltages can easily affect the conversion result. Such glitches might originate from switching power supplies,
nearby digital logic, and high power devices. The degree of error in the digital output depends on the reference
voltage, layout, and the exact timing of the external event. The error can change if the external event changes
in time with respect to the timing of the critical n windows.
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79
With this in mind, power to the TSC211 1 should be clean and well bypassed. A 0.1 µF ceramic bypass capacitor
should be placed as close to the device as possible. A 1 µF to 10 µF capacitor may also be needed if the
impedance of the connection between the TSC2111 supply pins and system power supply is high.
A 1 µF bypass capacitor should be placed on the VREF pin if the SAR ADC is intended to be used with the
internal reference voltagel. If an external reference voltage originates from an op amp, make sure that it can
drive any bypass capacitor that is used without oscillation.
The TSC2111 architecture offers no inherent rejection of noise or voltage variation in regards to using an
external reference input. This is of particular concern when the reference input is tied to the power supply. Any
noise and ripple from the supply appears directly in the digital results. While high frequency noise can be filtered
out, voltage variation due to line frequency (50 Hz or 60 Hz) can be difficult to remove.
The ground pins should be connected to a clean ground point. In many cases, this is the analog ground. Avoid
connections, which are too near the grounding point of a microcontroller or digital signal processor. If needed,
run a ground trace directly from the converter to the power supply entry or battery connection point. The ideal
layout includes an analog ground plane dedicated to the converter and associated analog circuitry.
In the specific case of use with a resistive touch screen, care should be taken with the connection between the
converter and the touch screen. Since resistive touch screens have fairly low resistance, the interconnection
should be as short and robust as possible. Loose connections can be a source of error when the contact
resistance changes with flexing or vibrations.
As indicated previously, noise can be a major source of error in touch-screen applications (e.g., applications
that require a back-lit LCD panel). This EMI noise can be coupled through the LCD panel to the touch screen
and cause flickering of the converted ADC data. Several things can be done to reduce this error , such as utilizing
a touch screen with a bottom−side metal layer connected to ground. This couples the majority of noise to
ground. Additionally, filtering capacitors, from Y+, Y–, X+, and X– to ground, can also help. Note, however , that
the use of these capacitors increases screen settling time and require longer panel voltage stabilization times,
as well as increased precharge and sense times for the PINTDAV circuitry of the TSC2111.
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CONVERSION TIME CALCULATIONS FOR THE TSC2111
Touch Screen Conversion Initiated at Touch Detect
The time needed to get a converted X/Y coordinate for reading can be calculated by (not including the time
needed to send the command over the SPI bus):
tcoordinate +2 ȧ
ȱ
Ȳ
ǒtPRE)tSNS )tPVSǓ
125 ns ȧ
ȳ
ȴ tOSC )2 NJNAVGƪǒNBITS )1Ǔ 8MHz
ƒconv )n1)12ƫ)1Nj
tOSC )18 tOSC )n2 tOSC )n3 tOSC
where:
tcoordinate = time to convert X/Y coordinate
tPVS = Panel voltage stabilization time
tPRE = precharge time
tSNS = sense time
NAVG = number of averages; for no averaging, NAVG = 1
NBITS = number of bits of resolution
ƒconv = A/D converter clock frequency
tOSC = Oscillator clock period
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 4 ; if tPVS = 0 µs
0 ; if tPVS ≠ 0 µs
n3 = 0 ; if tSNS = 32 µs
2 ; if tSNS ≠ 32 µs
tPGDEL = Programmable delay in between conversion for touch screen measurement
= 0: if programmable delay mode is disabled for touch screen measurement
(1)tPGDEL delay is generated by using: Internal oscillator clock whose typical frequency is 1 MHz, in internal clock
mode, or MCLK/CLKDIV (as programmed in control register 14H/pag1) in external clock mode.
(2)The above formula is valid exactly only when the codec is powered down. Also after touch detect the formula holds
true from second conversion onwards.
(3)If D15−D14 of control register 01H/page 1 = 00, then in case of continuous touch PINTDAV remains high for
ǒtPRE )tSNSǓ tOSCń125 ns . If D15−D14 of control register 01H/page 1 = 10/11, then in case of continuous touch
PINTDAC remains high for ǒtPRE )tSNSǓ tOSCń125 ns)tPGDEL .
Programmed
for Self
Controlled
X−Y Scan
Mode
Detecting Touch Sample,Conversion &
Averaging for
Y−Coordinate
Reading
X−Data
Register
Reading
Y−Data
Register
Detecting
Touch
Sample,Conversion &
Averaging for
X−Coordinate
Detecting
Touch
Sample,Conversion &
Averaging for
Y−Coordinate
Detecting
Touch
SS DEACTIVATED
Touch Is Detected
(As PENIRQ
[D15−D14 = 00])
PINTDAV
(As PENIRQ & DATA_AVA
[D15−D14 = 10/11])
PINTDAV Touch Is Detected
Touch Is Detected
(As DATA_AVA
[D15−D14 = 01])
PINTDAV
The time for a complete X/Y/Z1/Z2 coordinate conversion is given by(not including the time needed to send
the command over the SPI bus):
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Programmed
for Host
Controlled
Mode
Detecting Touch Sample,Conversion &
Averaging for
Y−Coordinate
Reading
X−Data
Register
Reading
Y−Data
Register
Detecting
Touch
Sample,Conversion &
Averaging for
X−Coordinate
Detecting
Touch
Sample,Conversion &
Averaging for
Y−Coordinate
Detecting
Touch
Touch Is Detected Touch Is Detected
REG−00 of
PAGE−01
Is Updated
for
X−Y Scan
Mode
Waiting for Host to
Write into REG−00 of
PAGE−01
SS DEACTIVATED
(As PENIRQ
[D15−D14 = 00])
PINTDAV
(As PENIRQ & DATA_AVA
[D15−D14 = 10/11])
PINTDAV
Touch Is Detected
(As DATA_AVA
[D15−D14 = 01])
PINTDAV
tcoordinate +3 ȧ
ȱ
Ȳ
ǒtPRE)tSNS )tPVSǓ
125 ns ȧ
ȳ
ȴ tOSC )4 NJNAVGƪǒNBITS )1Ǔ 8MHz
ƒconv )n1)12ƫ)1Nj
tOSC )33 tOSC )n2 tOSC )n3 tOSC )tPGDEL
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 4 ; if tPVS = 0 µs
0 ; if tPVS ≠ 0 µs
n3 = 0 ; if tSNS = 32 µs
3 ; if tSNS ≠ 32 µs
Programmed
for Self
Controlled
X−Y−Z1−Z2
Scan
Mode
Detecting TouchSample,Conversion &
Averaging for
Y−Coordinate
Reading
X−Data
Register
Reading
Y−Data
Register
Detecting
Touch
Sample,Conversion &
Averaging for
X−Coordinate
Detecting
Touch
Sample,Conversion &
Averaging for
Z1−Coordinate & Z2−Coordinate
Reading
Z1−Data
Register
Reading
Z2−Data
Register
Detecting
Touch
Sample,Conversion &
Averaging for
Y−Coordinate
Detecting
Touch
SS DEACTIVATED
(As PENIRQ
[D15−D14 = 00])
PINTDAV
(As PENIRQ & DATA_AVA
[D15−D14 = 10/11])
PINTDAV
Touch Is Detected Touch Is Detected Touch Is Detected
Touch Is Detected
(As DATA_AVA
[D15−D14 = 01])
PINTDAV
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The time needed to convert any single coordinate either X or Y under self-controlled (not including the time needed to send
the command over the SPI bus) is given by:
tcoordinate +ȧ
ȱ
Ȳ
ǒtPRE )tSNS )tPVSǓ
125 ns ȧ
ȳ
ȴ tOSC )NJNAVGƪǒNBITS )1Ǔ 8MHz
ƒconv )n1)12ƫ)1Nj
tOSC )16 tOSC )n2 tOSC )n3 tOSC )tPGDEL
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 2 ; if tPVS = 0 µs
0 ; if tPVS ≠ 0 µs
n3 = 0 ; if tSNS = 32 µs
0 ; if tSNS ≠ 32 µs
Programmed
for Self
Controlled
X Scan
Mode
Detecting Touch Sample,Conversion &
Averaging for
X−Coordinate
Reading
X−Data Register
Detecting
Touch
Sample,Conversion &
Averaging for
X−Coordinate
Touch is detected
/SS DEACTIVATED
Touch is detected
/PINTDAV
(As /PENIRQ
[D15−D14 = 00])
/PINTDAV
(As DATA_AVA
[D15−D14 = 01]) /PINTDAV
(As /PENIRQ & DATA_AVA
[D15−D14 = 10/11])
Touch is detected
The time needed to convert the Z coordinate under self-controlled mode (not including the time needed to send the
command over the SPI bus) is given by:
tcoordinate +ȧ
ȱ
Ȳ
ǒtPRE )tSNS )tPVSǓ
125 ns ȧ
ȳ
ȴ tOSC )2 NJNAVGƪǒNBITS )1Ǔ 8MHz
ƒconv )n1)12ƫ)1Nj
tOSC )22 tOSC )n2 tOSC )n3 tOSC )tPGDEL
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 2 ; if tPVS = 0 µs
0 ; if tPVS ≠ 0 µs
n3 = 0 ; if tSNS = 32 µs
1 ; if tSNS ≠ 32 µs
Programmed
for Self
Controlled
Z Scan
Mode
Detecting Touch Sample,Conversion &
Averaging for
Z1−Coordinate & Z2−Coordinate
Reading
Z1−Data
Register
Detecting
Touch
Sample,Conversion &
Averaging for
Z1−Coordinate & Z2−Coordinate
Touch is detected
/SS DEACTIVATED
Touch is detected
/PINTDAV
(As /PENIRQ
[D15−D14 = 00])
/PINTDAV
(As DATA_AVA
[D15−D14 = 01]) /PINTDAV
(As /PENIRQ & DATA_AVA
[D15−D14 = 10/11])
Touch is detected
Reading
Z2−Data
Register
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Touch Screen Conversion Initiated by the Host
The time needed to convert any single coordinate either X or Y under host-controlled mode (not including the time
needed to send the command over the SPI bus) is given by:
tcoordinate +ȧ
ȱ
Ȳ
ǒtPVSǓ
125 nsȧ
ȳ
ȴ tOSC )NJNAVGƪǒNBITS)1Ǔ 8MHz
ƒconv )n1)12ƫ)1Nj
tOSC )14 tOSC )n2 tOSC
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 2 ; if tPVS = 0 µs
0 ; if tPVS ≠ 0 µs
Programmed
for Host
Controlled
Mode
Detecting Touch Sample,Conversion &
Averaging for
X−Coordinate
Reading
X−Data
Register
Touch is still there
Touch is detected
/PINTDAV
(As /PENIRQ
[D15−D14 = 00])
/PINTDAV
(As /DATA_AVA
[D15−D14 = 01]) /PINTDAV
(As /PENIRQ & DATA_AVA
[D15−D14 = 10/11])
Waiting for Host to write
into REG−00 of PAGE−01 Waiting for Host to write into
REG−00 of PAGE−01
REG−00 of
PAGE−01
is updated
for
X Scan
Mode
/SS DEACTIVATED
Detecting
Touch
tcoordinate +ȧ
ȱ
Ȳ
ǒtPVSǓ
125 nsȧ
ȳ
ȴ tOSC )2 NJNAVGƪǒNBITS )1Ǔ 8MHz
ƒconv )n1)12ƫ)1Nj
tOSC )20 tOSC )n2 tOSC
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 2 ; if tPVS = 0 µs
0 ; if tPVS ≠ 0 µs
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Programmed
for Host
Controlled
Mode
Detecting Touch Sample,Conversion &
Averaging for
Z1−Coordinate & Z2−Coordinate
Reading
Z1−Data
Register
Touch is still there
Touch is detected
/PINTDAV
(As /PENIRQ
[D15−D14 = 00])
/PINTDAV
(As /DATA_AVA
[D15−D14 = 01]) /PINTDAV
(As /PENIRQ & DATA_AVA
[D15−D14 = 10/11])
Waiting for Host to write
into REG−00 of PAGE−01 Waiting for Host to write into
REG−00 of PAGE−01
REG−00 of
PAGE−01
is updated
for
Z1−Z2 Scan
Mode
Reading
Z2−Data
Register
/SS DEACTIVATED
Detecting
Touch
Programmed
for Host
Controlled
Mode
Detecting Touch Sample,Conversion &
Averaging for
Y−Coordinate
Reading
X−Data
Register
Reading
Y−Data
Register
Detecting
Touch
Sample,Conversion &
Averaging for
X−Coordinate
Detecting
Touch
Sample,Conversion &
Averaging for
Y−Coordinate
Detecting
Touch
Touch Is Detected Touch Is Detected
REG−00 of
PAGE−01
Is Updated
for
X−Y Scan
Mode
Waiting for Host to
Write into REG−00 of
PAGE−01
SS DEACTIVATED
(As PENIRQ
[D15−D14 = 00])
PINTDAV
(As PENIRQ & DATA_AVA
[D15−D14 = 10/11])
PINTDAV
Touch Is Detected
(As DATA_AVA
[D15−D14 = 01])
PINTDAV
Non-Touch Screen Measurement Operation
The time needed to make temperature, auxiliary, or battery measurements is given by:
t+NJNAVGƪǒNBITS )1Ǔ 8MHz
ƒconv )n1)n2ƫ)1Nj tOSC )15 tOSC )n3 tOSC
where:
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 24 ; if measurement is for TEMP1 case
12 ; if measurement is for other than TEMP1 case
400 ns; if measurement is for the external/internal resistance using AUX1/AUX2
n3 = 0 ; if external reference mode is selected
3 ; if tREF = 0 µs or reference is programmed for power up all the time.
1 + tREF /125 ns; if tREF ≠ 0 µs and reference needs to power down between conversions.
tREF is the reference power up delay time.
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Programmed for
Host Controlled
Mode With Invalid
A/D Function
Selected
Detecting Touch Sample,Conversion &
Averaging for
BAT1 input
Reading
BAT1−Data
Register
Waiting for Host to Write
into REG−00 of PAGE−01
Waiting for Host to
Write into REG−00
of PAGE−01
REG−00 of
PAGE−01
Is Updated
for
BAT1 Scan
Mode
Wait for Reference Power-Up Delay in Case
of Internal Ref Mode if Applicable
(As DATA_AVA
[D15−D14 = 01])
PINTDAV
SS DEACTIVATED
The time needed for continuous autoscan mode is given by:
t+NINP ǒNJNAVGƪǒNBITS )1Ǔ 8MHz
ƒconv )n1)12ƫ)1Nj tOSC )8 tOSCǓ
)n2 tOSC )tDEL)n3)tOSC )n4 tOSC
where:
NINP = 1; if autoscan is selected for only one input AUX1, AUX2, TEMP1 or TEMP2
= 2; if autoscan is selected for two inputs AUX1−AUX2, AUX1−TEMP1, AUX1−TEMP2 etc
= 3; if autoscan is selected for three inputs AUX1−AUX2−TEMP1 or AUX1−AUX2−TEMP2
n1 = 6 ; if fconv = 8 MHz
7 ; if fconv p 8 MHz
n2 = 12 ; if one of the input selected is TEMP1
0 ; if measurement is for other than TEMP1
n3 = 0 ; if external reference mode is selected or tDEL = 0.
3 ; if tREF = 0 ms or reference is programmed for power up all the times.
1 + tREF/125 ns ; if tREF p 0us and reference needs to power down between conversions.
tREF is the reference power up delay time.
n4 = 0 ; if tDEL = 0.
= 7 ; if tDEL p 0
tDEL = Programmable delay in between conversion for nontouchscreen measurement
= 0 ; if programmable delay mode is disabled for nontouchscreen measurement
(1)The above equation is valid only from second conversion onwards.
(2)tDEL delay is generated by using internal oscillator clock whose typical frequency is 1 MHz in internal clock mode,
or MCLK/CLKDIV (as programmed in control register 14H/page 1) in external clock mode.
Programmed for
Host Controlled
Mode With Invalid
A/D Function
Selected
Detecting Touch Sample,Conversion &
Averaging for
AUX input
Waiting for Host to
Write into REG−00
of PAGE−01
REG−00 of
PAGE−01
Is Updated
for Continous
AUX SCAN
Mode
Reading
AUX−Data
Register
Sample,Conversion &
Averaging for
AUX input
Sample,Conversion &
Averaging for
AUX input
Reading
AUX−Data
Register
(As DATA_AVA
[D15−D14 = 01])
PINTDAV
SS DEACTIVATED
Wait for Reference Power-Up Delay in Case
of Internal Ref Mode if Applicable
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
www.ti.com
86
Port Scan Operation
The time needed to complete one set of port scan conversions is given by:
tcoordinate +3 NJNAVGƪǒNBITS )1Ǔ 8MHz
ƒconv )n1)12ƫ)1Nj tOSC )31 tOSC )n2 tOSC
where:
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 0 ; if external reference mode is selected
3 ; if tREF = 0 µs or reference is programmed for power up all the time.
1 + tREF /125 ns; if tREF ≠ 0 µs and reference needs to power down between conversions.
tREF is the reference power up delay time.
Programmed for
Host Controlled
Mode With Invalid
A/D Function
Selected
Detecting Touch Sample,Conversion &
Averaging for
BAT1 & BAT2 & AUX input
Reading
BAT1−
Data
Register
Waiting for Host to
Write into REG−00
of PAGE−01
Waiting for Host to Write into REG−00
of PAGE−01
REG−00 of
PAGE−01
is updated
for
PORT SCAN
Mode
Reading
BAT2−
Data
Register
Reading
AUX−Data
Register
(As DATA_AVA
[D15−D14 = 01])
PINTDAV
SS DEACTIVATED
Wait for Reference Power-Up Delay in Case
of Internal Ref Mode if Applicable
ADC CHANNEL DIGITAL FILTER FREQUENCY RESPONSES
Figure 39. Pass-Band Frequency Response of ADC Digital Filter
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
www.ti.com
87
Figure 40. Frequency Response of ADC High-Pass Filter (Fcutoff = 0.0045 Fs)
Figure 41. Frequency Response of ADC High-Pass Filter (Fcutoff = 0.0125 Fs)
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
www.ti.com
88
Figure 42. Frequency Response of ADC High-Pass Filter (Fcutoff = 0.025 Fs)
DAC CHANNEL DIGITAL FILTER FREQUENCY RESPONSES
Figure 43. DAC Channel Digital Filter Frequency Response
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
www.ti.com
89
Figure 44. DAC Channel Digital Filter Pass-Band Frequency Response
Figure 45. Default Digital Audio Effects Filter Frequency Response at 48 Ksps
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
www.ti.com
90
Figure 46. De-Emphasis Filter Response at 32 Ksps
Figure 47. De-Emphasis Error at 32 Ksps
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
www.ti.com
91
Figure 48. De-Emphasis Filter Frequency Response at 44.1 Ksps
Figure 49. De-Emphasis Error at 44.1 Ksps
SLAS495A− JUNE 2006 − REVISED OCTOBER 2007
www.ti.com
92
Figure 50. De-Emphasis Frequency Response at 48 Ksps
Figure 51. De-Emphasis Error at 48 Ksps
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TSC2111IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TSC2111IRGZRG4 ACTIVE VQFN RGZ 48 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TSC2111IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TSC2111IRGZTG4 ACTIVE VQFN RGZ 48 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TSC2111IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2
TSC2111IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Feb-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TSC2111IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6
TSC2111IRGZT VQFN RGZ 48 250 336.6 336.6 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Feb-2012
Pack Materials-Page 2
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