RT9011
1
DS9011-08 April 2011 www.richtek.com
Ordering Information
General Description
The RT9011 is a dual channel, low noise, and low dropout
regulator sourcing up to 300mA at each channel. The range
of output voltage is from 1.2V to 3.6V by operating from
2.5V to 5.5V input.
The RT9011 offers 2% accuracy, extremely low dropout
voltage (240mV @ 300mA), and extremely low ground
current, only 27μA per LDO. The shutdown current is near
zero current which is suitable for battery-power devices.
Other features include current limiting, over temperature,
output short circuit protection.
The RT9011 is short circuit thermal folded back protected.
The IC lowers its OTP trip point from 165°C to 110°C when
output short circuit occurs (VOUT < 0.4V) providing
maximum safety to end users.
The RT9011 can operate stably with very small ceramic
output capacitors, reducing required board space and
component cost. The RT9011 is available in fixed output
voltages in the TSOT-23-6, WDFN-8L 2x2, WDFN-10L 3x3,
WDFN-8L 3x3 and WDFN-6L 1.6x1.6 packages.
Portable Power Management 300mA Dual LDO Regulator
Features
zWide Operating Voltage Ranges : 2.5V to 5.5V
zLow-Noise for RF Application
zNo Noise Bypa ss Capacitor Required
zFast Response in Line/Load Transient
zTTL-Logic-Controlled Shutdown Input
zLow Temperature Coefficient
zz
zz
zDual LDO Outputs (300mA/300mA)
zz
zz
zUltra-low Quiescent Current 27μμ
μμ
μA/LDO
zz
zz
zHigh Output Accuracy 2%
zz
zz
zShort Circuit Protection
zz
zz
zThermal Shutdown Protection
zz
zz
zCurrent Limit Protection
zz
zz
zShort Circuit Thermal Folded Back Protection
zz
zz
zTiny TSOT-23-6 and 6-Lead/8-Lead/10-Lead WDFN
Packages
zz
zz
zRoHS Compliant and 100% Lead (Pb)-Free
Applications
zz
zz
zCDMA/GSM Cellular Handsets
zz
zz
zBattery-Powered Equipment
zz
zz
zLaptop, Palmtops, Notebook Computers
zz
zz
zHand-Held Instruments
zz
zz
zPCMCIA Cards
zz
zz
zPortable Information Appliances
Marking Information
For marking information, contact our sales representative
directly or through a Richtek distributor located in your
area.
Code Voltage Code Voltage Code Voltage
A 3.5 B 1.3 C 1.2
D 1.85 E 2.1 F 1.5
G 1.8 H 2 J 2.5
K 2.6 L 2.7 M 2.8
N 2.85 P 3 Q 3.1
R 3.2 S 3.3 T 2.65
V 2.9 W 1.6 X 3.15
Y 1.9
Available Voltage Version
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
RT9011-
Package Type
J6 : TSOT-23-6
QW : WDFN-8L 2x2 (W-Type)
QWA : WDFN-10L 3x3 (W-Type)
QWB : WDFN-8L 3x3 (W-Type)
QWC : WDFN-6L 1.6x1.6 (W-Type)
Lead Plating System
P : Pb Free
G : Green (Halogen Free and Pb Free)
Output Voltage : VOUT1/VOUT2
VOUT2 > VOUT1 is Recommended
RT9011
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DS9011-08 April 2011www.richtek.com
Functional Pin Description
Pin No. Pi n Name Pin Function
TSOT -23-6 WDFN-8L
2x2 WDFN-10L
3x3 W DFN-8L
3x3 W DFN-6L
1.6x1.6
5 1 1 1 1 VIN Supply Input.
4 2 2 2 2 EN1 Chip Enable1 (Active High).
3 3 3 3 3 EN2 Chip Enable2 (Active High).
2
5,
Exposed
Pad (9)
6,
Exposed
Pad (11)
6,
Exposed
Pad (9)
4,
Expo sed
Pad (7)
GND
Common Ground. The exposed pad must be
soldered to a large PCB and connected to
GND for maximum power dissipation.
1 7 9 5 5 VOUT2 Channel 2 Output Voltage.
6 8 10 8 6 VOUT1 Channel 1 Output Voltage.
-- 4, 6 4, 5, 7, 8 4, 7 -- NC No Internal Connection.
Typical Application Circuit
EN1
EN2
VOUT2
VOUT1
RT9011
GND
VIN
1uF
VOUT1
1uF
VOUT2
1uF
VIN
Chip Enable
CIN COUT1
COUT2
Pin Configurations
(TOP VIEW)
WDFN-8L 3x3
VIN
NC
EN1
VOUT1
NC
GND
VOUT2
EN2
7
6
5
1
2
3
4
8
GND
9
WDFN-6L 1.6x1.6
VIN
EN2
VOUT1
GND
VOUT2EN1
1
2
3
5
4
6
GND
7
WDFN-10L 3x3
VIN
EN1
NC
NC
VOUT1
VOUT2
NC
GND
NC
EN2
9
8
7
9
1
2
3
4
5
10
11
GND
WDFN-8L 2x2
VIN
NC
EN1
VOUT1
VOUT2
NC
GND
EN2
7
6
5
1
2
3
4
8
GND
9
TSOT-23-6
4
23
56
VIN EN1VOUT1
GND EN2VOUT2
RT9011
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DS9011-08 April 2011 www.richtek.com
Function Block Diagram
EN1
Current-Limit
and
Thermal
Protection
MOS Driver
+
-
VOUT1
Shutdown
and
Logic Control
VIN
Error
Amplifier
VREF
GND
EN2
Current-Limit
and
Thermal
Protection
MOS Driver
+
-
VOUT2
Shutdown
and
Logic Control
Error
Amplifier
VREF
GND
0.2uA
0.2uA
RT9011
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DS9011-08 April 2011www.richtek.com
Electrical Characteristics
Parameter Symbol Test Conditions Min Typ Max Unit
Input Voltage VIN = 2.5V to 5.5V 2.5 -- 5.5 V
Dropout Voltage (Note 5) VDROP I
OU T = 300mA -- 240 330 mV
Output voltage range VOUT 1.2 -- 3.6 V
VOUT Accuracy ΔV IOU T = 1mA to 300mA −3 -- +3 %
Line Regulation ΔVLINE VIN = (VOUT + 0.3V) to 5.5V or
VIN > 2.5V, whichever is larger -- -- 0.2 %/V
Load Regulation ΔVLOAD 1mA < IOU T< 300mA -- -- 0.6 %
Current Limit RLOAD = 1Ω 330 450 700 mA
Quiescent Current IQ V
EN > 1.5V -- 58 80 μA
Shutdown Current IQ_SD V
EN < 0.4V -- -- 1
μA
VIH V
IN = 2.5V to 5.5V, Power On 1.5 -- --
EN Threshold
VIL V
IN = 2.5V to 5.5V, Shutdown -- -- 0.4
V
(VIN = VOUT + 1V, VEN = VIN, CIN = COUT = 1μF, TA = −40°C to 85°C, unless otherwise specified.)
To be continued
Recommended Operating Conditions (Note 4)
zSupply Input Voltage ------------------------------------------------------------------------------------------------------ 2.5V to 5.5V
zEnable Input Voltage ------------------------------------------------------------------------------------------------------ 0V to 5.5V
zJunction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
zAmbient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C
Absolute Maximum Ratings (Note 1)
zSupply Input Voltage ------------------------------------------------------------------------------------------------------ −0.3V to 7V
zOther I/O Pin Voltages --------------------------------------------------------------------------------------------------- −0.3V to 7V
zPower Dissipation, PD @ TA = 25°C
TSOT-23-6 ------------------------------------------------------------------------------------------------------------------- 0.455W
WDFN-8L 2x2 -------------------------------------------------------------------------------------------------------------- 0.606W
WDFN-10L 3x3 ------------------------------------------------------------------------------------------------------------- 0.926W
WDFN-8L 3x3 -------------------------------------------------------------------------------------------------------------- 0.926W
WDFN-6L 1.6x1.6 --------------------------------------------------------------------------------------------------------- 0.571W
zPackage Thermal Resistance (Note 2)
TSOT-23-6, θJA ------------------------------------------------------------------------------------------------------------- 220°C/W
WDFN-8L 2x2, θJA --------------------------------------------------------------------------------------------------------- 165°C/W
WDFN-10L 3x3, θJA ------------------------------------------------------------------------------------------------------- 108°C/W
WDFN-8L 3x3, θJA --------------------------------------------------------------------------------------------------------- 108°C/W
WDFN-6L 1.6x1.6, θJA ---------------------------------------------------------------------------------------------------- 175°C/W
zJunction Temperature ----------------------------------------------------------------------------------------------------- 150°C
zLead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
zStorage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
zESD Susceptibility (Note 3)
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ------------------------------------------------------------------------------------------------------ 200V
RT9011
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DS9011-08 April 2011 www.richtek.com
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
Note 6. It is guaranteed by design.
Parameter Symbol Test Conditions Min Typ Max Unit
Output Voltage TC -- 100 -- ppm/°C
VOU T Discharge Resistance in
Shutdown (Note 6) VIN = 5V, EN1 = EN2 = GND -- 3 -- kΩ
EN Pull Low Current IEN -- 0.2 -- μA
Thermal Shutdown TSD -- 170 --
°C
Thermal Shutdown Hysteresis ΔTSD -- 40 -- °C
f = 100Hz -- 70 --
f = 1kHz -- 70 --
f = 10kHz -- 70 --
f = 100kHz -- 54 --
f = 200kHz -- 45 --
PSRR
VIN = VOUT + 1V, COUT = 2.2μF
ILOAD = 50mA
PSRR
f = 300kHz -- 38 --
dB
Output Voltage Noise COU T1 = COUT2 = 10uF, 10Hz to
100kHz, IOUT1 = IOUT2 = 1mA -- 100 -- uVrms
RT9011
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DS9011-08 April 2011www.richtek.com
Typical Operating Characteristics
Quiescent Current vs. Temperature
50
55
60
65
70
-50 -25 0 25 50 75 100 125
Temperature
Quiescent Current (uA)
RT9011-GS
VIN = VEN = 4.3V
CIN = COUT1 = COUT2 = 1uF/X7R
(°C)
Dropout Voltage vs. Load Curre nt
0
50
100
150
200
250
300
350
0 50 100 150 200 250 300
Load Current (mA)
Dropout Voltage (mV)
RT9011-GS, VOUT2
TJ = 25°C
TJ = -40°C
TJ = 125°C
Power-On
Time (10μs/Div)
RT9011-FM
Both ILOAD = 10mA
VEN
(5V/Div)
VOUT2
(2V/Div)
VOUT1
(1V/Div)
POR
(5V/Div)
Output Voltage vs. Temperature
1.7
1.75
1.8
1.85
1.9
-50 -25 0 25 50 75 100 125
Temperature
Output Voltage (V)
RT9011-GS, VOUT1
(°C)
Output Voltage vs. Temperature
3.2
3.25
3.3
3.35
3.4
-50 -25 0 25 50 75 100 125
Temperature
Output Voltage (V)
RT9011-GS, VOUT2
(°C)
RT9011-GS, Both ILOAD = 1mA
VIN = 3.8V to 4.8V
Line Transient Response
VIN
(V)
Time (100μs/Div)
VOUT1
(10mV/Div)
4.8
3.8
VOUT2
(10mV/Div)
RT9011
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DS9011-08 April 2011 www.richtek.com
Load Transient Response
Time (250μs/Div)
IOUT
(100mA/Div)
VOUT2
(20mV/Div)
VOUT1
(20mV/Div)
RT9011-GS, ILOAD = 10mA to 100mA
VIN = VEN = 4.3V
CIN = COUT1 = COUT2 = 1uF/X7R
RT9011-GS, Both ILOAD = 100mA
VIN = 3.8V to 4.8V
Line Transient Response
VIN
(V)
Time (100μs/Div)
VOUT1
(10mV/Div)
4.8
3.8
VOUT2
(10mV/Div)
RT9011-GS, Both ILOAD = 10mA
VIN = 3.8V to 4.8V
Line Transient Response
VIN
(V)
VOUT1
(10mV/Div)
4.8
3.8
VOUT2
(10mV/Div)
Time (100μs/Div)
RT9011-GS, Both ILOAD = 50mA
VIN = 3.8V to 4.8V
Line Transient Response
VIN
(V)
Time (100μs/Div)
VOUT1
(10mV/Div)
4.8
3.8
VOUT2
(10mV/Div)
Load Transient Response
Time (250μs/Div)
IOUT
(50mA/Div)
VOUT2
(20mV/Div)
VOUT1
(20mV/Div)
RT9011-GS, ILOAD = 10mA to 50mA
VIN = VEN = 4.3V
CIN = COUT1 = COUT2 = 1uF/X7R
Start Up
Time (5μs/Div)
RT9011-FM, VIN = 5V
IOUT1 = IOUT2 = 50mA
(5V/Div)
(1V/Div)
VEN
VOUT1
VOUT2
RT9011
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DS9011-08 April 2011www.richtek.com
EN Pin Shutdown Response
Time (50μs/Div)
RT9011-FM, VIN = 5V
IOUT1 = IOUT2 = 50mA
(5V/Div)
(1V/Div)
VEN
VOUT1
VOUT2
Noise
Time (10ms/Div)
RT9011-GS, ILOAD = 50mA
VIN = VEN = 4.5V(By battery)
CIN = COUT1 = COUT2 = 1uF/X7R
Noise (μV/Div)
300
200
100
0
-100
-200
-300
Noise
Time (10ms/Div)
RT9011-GS, No LOAD
VIN = VEN = 4.5V(By battery)
CIN = COUT1 = COUT2 = 1uF/X7R
Noise (μV/Div)
150
100
50
0
-50
-100
-150
EN2 Pin Response
(1V/Div)
VEN1
VOUT1
VOUT2
VEN2
VEN1
(2V/Div)
VEN2
(2V/Div)
VEN1
(2V/Div)
(1V/Div)
VEN1
VOUT1
VOUT2
EN1 Pin Response
VEN2
VEN2
(2V/Div)
Time (10ms/Div) Time (10ms/Div)
PSRR
-80
-60
-40
-20
0
20
10 100 1000 10000 100000 100000
0
Frequency(Hz)
PSRR(dB)
IOUT = 50mA
PSRR
1M100k10k1k
RT9011
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DS9011-08 April 2011 www.richtek.com
Applications Information
Like any low-dropout regulator, the external capacitors used
with the RT9011 must be carefully selected for regulator
stability and performance. Using a capacitor whose value
is > 1μF on the RT9011 input and the amount of capacitance
can be increased without limit. The input capacitor must
be located a distance of not more than 0.5 inch from the
input pin of the IC and returned to a clean analog ground.
Any good quality ceramic or tantalum can be used for this
capacitor. The capacitor with larger value and lower ESR
(equivalent series resistance) provides better PSRR and
line-transient response.
The output capacitor must meet both requirements for
minimum amount of capacitance and ESR in all LDOs
application. The RT9011 is designed specifically to work
with low ESR ceramic output capacitor in space-saving
and performance consideration. Using a ceramic capacitor
whose value is at least 1μF with ESR is > 20mΩ on the
RT9011 output ensures stability. The RT9011 still works
well with output capacitor of other types due to the wide
stable ESR range. Figure 1. shows the curves of allowable
ESR range as a function of load current for various output
capacitor values. Output capacitor of larger capacitance
can reduce noise and improve load transient response,
stability, and PSRR. The output capacitor should be located
not more than 0.5 inch from the VOUT pin of the RT9011
and returned to a clean analog ground.
Figure 1. Stable Cout ESR Range
VOUT Short to GND
0.4V
VOUT
IOUT
TSD
OTP Trip Point
170 C
°110 C
°
110 C
°
80 C
°
IC Temperature
Figure 2. Short Circuit Thermal Folded Back Protection
when Output Short Circuit Occurs (Patent)
Thermal Considerations
Thermal protection limits power dissipation in RT9011.
When the operation junction temperature exceeds 170°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turns on
again after the junction temperature cools by 40°C.
RT9011 lowers its OTP trip level from 170°C to 110°C
when output short circuit occurs (VOUT < 0.4V) as shown
in Figure 2. It limits IC case temperature under 100°C and
provides maximum safety to customer while output short
circuit occurring.
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
PD = (VIN-VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = ( TJ(MAX) - TA ) /θJA
Where TJ(MAX) is the maximum operation junction
temperature, TA is the ambient temperature and the θJA is
the junction to ambient thermal resistance.
Region of Stable COUT ESR vs. Load Current
0.001
0.01
0.1
1
10
100
0 50 100 150 200 250 300
Load Current (mA)
Region of Stable C OUT ESR (Ω)
Region of Stable COUT ESR (Ω)
Unstable Range
Stable Range
Simulation Verify
RT9011-FM, VIN = 5V
CIN = COUT1 = COUT2 = 1uF/X7R
RT9011
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DS9011-08 April 2011www.richtek.com
For recommended operating conditions specification of
RT9011, the maximum junction temperature is 125°C. The
junction to ambient thermal resistance ( θ
JA is layout
dependent ) for TSOT-23-6 is 220°C/W, WDFN-8L 2x2 is
165°C/W, WDFN-10L 3x3 is 108°C/W, WDFN-8L 3x3 is
108°C/W and WDFN-8L 1.6x1.6 is 175°C/W on the
standard JEDEC 51-3 single-layer thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by following formula :
PD(MAX) = ( 125°C − 25°C ) / (220°C/W) = 0.455W for
TSOT-23-6 packages
PD(MAX) = ( 125°C − 25°C ) / (165°C/W) = 0.606W for
WDFN-8L 2x2 packages
PD(MAX) = ( 125°C − 25°C ) / (108°C/W) = 0.926W for
WDFN-10L 3x3 packages
PD(MAX) = ( 125°C − 25°C ) / (108°C/W) = 0.926W for
WDFN-8L 3x3 packages
PD(MAX) = ( 125°C − 25°C ) / (175°C/W) = 0.571W for
WDFN-6L 1.6x1.6 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9011 packages, the Figure 3 of de-
rating curves allows the designer to see the effect of rising
ambient temperature on the maximum power allowed.
Figure 3. Derating Curves for RT9011 Packages
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 25 50 75 100 125
Ambient Temperature (°C)
Power Dissipation (W)
WDFN-8L 2x2
TSOT-23-6
WDFN-8L 3x3
WDFN-10L 3x3
Single Layer PCB
WDFN-6L 1.6x1.6
RT9011
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DS9011-08 April 2011 www.richtek.com
Outline Dimension
TSOT-23-6 Surface Mount Package
Dimensions In Millimeters Dimensions In Inches
Symbol Min Max Min Max
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.300 0.559 0.012 0.022
C 2.591 3.000 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024
AA1
e
b
B
D
C
H
L
RT9011
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DS9011-08 April 2011www.richtek.com
W-Type 8L DFN 2x2 Package
Dimensions In Millimeters Dimension s In Inch es
Symbol Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.200 0.300 0.008 0.012
D 1.950 2.050 0.077 0.081
D2 1.000 1.250 0.039 0.049
E 1.950 2.050 0.077 0.081
E2 0.400 0.650 0.016 0.026
e 0.500 0.020
L 0.300 0.400
0.012 0.016
11
2
2
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
DETAIL A
Pin #1 ID and Tie Bar Mark Options
D
1
E
A3
A
A1
D2
E2
L
b
e
SEE DETAIL A
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DS9011-08 April 2011 www.richtek.com
Dimensions In Millimeters Dimension s In Inch es
Symbol Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.180 0.300 0.007 0.012
D 2.950 3.050 0.116 0.120
D2 2.300 2.650 0.091 0.104
E 2.950 3.050 0.116 0.120
E2 1.500 1.750 0.059 0.069
e 0.500 0.020
L 0.350 0.450
0.014 0.018
W-Type 10L DFN 3x3 Package
11
2
2
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
DETAIL A
Pin #1 ID and Tie Bar Mark Options
D
1
E
A3
A
A1
D2
E2
L
b
e
SEE DETAIL A
RT9011
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DS9011-08 April 2011www.richtek.com
Dimensions In Millimeters Dimension s In Inch es
Symbol Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.200 0.300 0.008 0.012
D 2.950 3.050 0.116 0.120
D2 2.100 2.350 0.083 0.093
E 2.950 3.050 0.116 0.120
E2 1.350 1.600 0.053 0.063
e 0.650 0.026
L 0.425 0.525
0.017 0.021
W-Type 8L DFN 3x3 Package
11
2
2
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
DETAIL A
Pin #1 ID and Tie Bar Mark Options
D
1
E
A3
A
A1
D2
E2
L
b
e
SEE DETAIL A
RT9011
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DS9011-08 April 2011 www.richtek.com
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
Richtek Technology Corporation
Headquarter
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789 Fax: (8863)5526611
Richtek Technology Corporation
Taipei Office (Marketing)
5F, No. 95, Minchiuan Road, Hsintien City
Taipei County, Taiwan, R.O.C.
Tel: (8862)86672399 Fax: (8862)86672377
Email: marketing@richtek.com
Dime nsio ns In M illimeters Dim ensions In Inch e s
Symbol Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250
0.007 0.010
b 0.200 0.300 0.008 0.012
D 1.550 1.650 0.061 0.065
D2 0.950 1.050 0.037 0.041
E 1.550 1.650 0.061 0.065
E2 0.550 0.650 0.022 0.026
e 0.500 0.020
L 0.190 0.290
0.007 0.011
W-Type 6L DFN 1.6x1.6 Package
D
1
E
A3
A
A1
eb
L
D2
E2
SEE DETAIL A
11
2
2
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
DETAIL A
Pin #1 ID and Tie Bar Mark Options
