The high performance 48A UIQ48T48050 DC-DC converter provides a high
efficiency single output, in a 1/4 brick package. Specifically designed for
operation in systems that have limited airflow and increased ambient
temperatures, the UIQ48T48050 converter utilizes the same pinout and
Input/Output functionality of the industry-standard Quarter bricks. In addition, a
baseplate / heat spreader feature is available (-xDxBx suffix) that provides an
effective thermal interface for coldplate and heat sinking options.
The UIQ48T48050 converter thermal performance is accomplished through the
use advanced circuits, packaging, and processing techniques to achieve ultra-
high efficiency, excellent thermal management, and a low-body profile.
Operating from a wide-range 18-75V input, the UIQ48T48050 converter utilizes
digital control and provides a fully regulated 5.0V output voltage. The designer
can expect reliability improvement over other available converters because of the
UIQ48T48050’s optimized thermal efficiency.
Key Features & Benefits
Industry-standard quarter-brick pin-out
Ultra wide input voltage range
Delivers 240W at 92% efficiency
Paste In Hole (PIH) compatible
Withstands 100V input transient for 100ms
Fixed-frequency operation
On-board input differential LC-filter
Start-up into pre-biased load
No minimum load required
Minimum of 2250 VDC I/O isolation
Fully protected (OTP, OCP, OVP, UVLO)
Positive or negative logic ON/OFF option
Low height of 0.44” (11.18mm)
Weight: 48g without baseplate / heat spreader,
62g with baseplate / heat spreader
High reliability: MTBF = 14.3 million hours, calculated per Telcordia SR-332,
Method I Case 1
Approved to the latest edition of the following standards:
UL/CSA60950-1, IEC60950-1 and EN60950-1.
Designed to meet Class B conducted emissions per FCC and EN55022 when
used with external filter
All materials meet UL94, V-0 flammability rating
Applications
Intermediate Bus Architectures
Data communications/processing
LAN/WAN
Servers, storage, instrumentation, embedded equipment
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1. ELECTRICAL SPECIFICATIONS
Conditions: TA = 25 ºC, Airflow = 300 LFM (1.5 m/s), Vin = 48 VDC, Cin = 100 µF,
unless otherwise specified.
PARAMETER
MIN
TYP
MAX
UNITS
ABSOLUTE MAXIMUM RATINGS
Input Voltage
-0.3
80
VDC
100
VDC
Operating Temperature
(See Derating Curves)
-40
85
°C
-40
125
°C
Storage Temperature
-55
125
°C
ISOLATION CHARACTERISTICS
Isolation Voltage
2250
VDC
1500
VDC
1500
VDC
Isolation Resistance
10
MΩ
Isolation Capacitance
750
pF
FEATURE CHARACTERISTICS
Switching Frequency
250
kHz
Output Overvoltage Protection
115
120
130
%
Over Temperature Shutdown
130
°C
Auto-Restart Period
500
ms
Turn-On Time from Vin
100
130
ms
Turn-On Time from ON/OFF Control
100
130
ms
Turn-On Time from Vin
(w/ Co max.)
100
130
ms
Turn-On Time from ON/OFF Control
(w/ Co max.)
100
130
ms
ON/OFF Control (Positive Logic)
-15
0.8
VDC
2.4
15
VDC
ON/OFF Control (Negative Logic)
2.4
15
VDC
-15
0.8
VDC
INPUT CHARACTERISTICS
Operating Input Voltage Range
18
48
75
VDC
Input Undervoltage Lockout
Turn-on Threshold
16.8
17.2
17.8
VDC
Turn-off Threshold
14.9
15.5
16.1
VDC
Lockout Hysteresis Voltage
0.5
1.7
2.3
VDC
Maximum Input Current
ADC
Input Standby Current
3
5
mA
Input No Load Current
40
100
160
mA
Input Reflected-Ripple Current, ic
2300
mAPK-PK
850
mARMS
Input Reflected-Ripple Current, iS
26
mAPK-PK
3
mARMS
Input Voltage Ripple Rejection
45
dB
1
Reference Figure G for component TC locations.
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OUTPUT CHARACTERISTICS
Output Voltage Setpoint
VIN = 48 V, IOUT = 0 A, TA = 25°C
4.90
5.00
5.10
VDC
Output Voltage Trim Range 2
Industry-std. equations4
-20
+10
%
Remote Sense Compensation 3
Percent of VOUT (NOM)4
+10
%
Output Regulation
Over Line
IOUT = 48 A, TA = 25°C
±24
±48
mV
Over Load
VIN = 48 V, TA = 25°C
±15
±30
mV
Output Voltage Range
Over line, load and temperature
4.85
5.15
VDC
Output Ripple and Noise
20 MHz bandwidth, IOUT = 48 A,
CEXT =10 µF tantalum + 1 µF ceramic
100
200
mVPK-PK
25
50
VRMS
Admissible External Load Capacitance 2
IOUT = 48 A (resistive) CEXT
ESR
0
1
6000
µF
m
Output Current Range
0
48
ADC
Current Limit Inception
Non-latching
53
60
67
ADC
RMS Short-Circuit Current
Non-latching Short = 10 mΩ
6
10
ARMS
DYNAMIC RESPONSE
Load Change
50%-75%-50% of IOUT Max (di/dt = 0.1 A/μs)
CEXT = 10µF tantalum + 1µF ceramic + 470µF E-cap
250
mV
Settling Time
to 1% of VOUT
200
µs
EFFICIENCY
@ 100% Load
48VIN, TA = 25°C, 300LFM
92
%
@ 60% Load
92.5
2. ENVIRONMENT AND MECHANICAL SPECIFICATIONS
PARAMETER
NOTES
MIN
TYP
MAX
UNITS
ENVIRONMENTAL
Operating Humidity
Non-condensing
95
%
Storage Humidity
Non-condensing
95
%
MECHANICAL
Weight
Without baseplate / heat spreader
48
g
With baseplate / heat spreader
62
g
Vibration
GR-63-CORE, Sect. 5.4.2
1
g
Shocks
Half Sinewave, 3-axis
50
g
RELIABILITY
MTBF
Telcordia SR-332, Method I Case 1
50% electrical stress, 40°C components
14.3
MHrs
EMI AND REGULATORY COMPLIANCE
Conducted Emissions
CISPR 22 B with external EMI filter network
2
For input voltage >22 V
3
See
“Input Output Impedance”
, Page 4
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3. OPERATIONS
3.1. INPUT AND OUTPUT IMPEDANCE
These power converters have been designed to be stable with no external capacitors when used in low inductance input
and output circuits.
However, in some applications, the inductance associated with the distribution from the power source to the input of the
converter can affect the stability of the converter. A 100 µF electrolytic capacitor with adequate ESR based on input
impedance is recommended to ensure stability of the converter.
In many end applications, a high capacitance value is applied to the converter’s output via distributed capacitors.
The power converter will exhibit stable operation with external load capacitance up to 6,000 µF.
3.2. ON/OFF (PIN 2)
The ON/OFF pin is used to turn the power converter on or off remotely via a system signal. There are two remote control
options available, positive and negative logic, with both referenced to Vin (-). A typical connection is shown in Figure A.
The positive logic version turns on when the ON/OFF pin is at a logic high or left open and turns off when it is at a logic
low. See the Electrical Specifications for logic high/low definitions.
Fig. A: Typ. Circuit configuration for ON/OFF function.
The negative logic version turns on when the ON/OFF pin is at a logic low and turns off when the pin is at logic high. To
enable automatic power up of the converter without the need of an external control signal the ON/OFF pin can be hard
wired directly to Vin (-) for N and left open for P version.
A properly de-bounced mechanical switch, open-collector transistor, or FET can be used to drive the input of the
ON/OFF pin. The device must be capable of sinking up to 0.2 mA at a low level voltage of 0.8 V. An external voltage
source (±15 V maximum) may be connected directly to the ON/OFF input, in which case it must be capable of sourcing or
sinking up to 1 mA depending on the signal polarity. If optocoupler is used to control the on/off, then the ON/OFF pin
should be tied to a 3V3 rail via 3.3kohm resistor to prevent optocoupler leakage from affecting the on/off function. See
the Startup Information section for system timing waveforms associated with use of the ON/OFF pin.
3.3. SENSE (PINS 5 AND 7)
The remote sense feature of the converter compensates for voltage drops occurring between the output pins of the
converter and the load. The SENSE (-) (Pin 5) and SENSE (+) (Pin 7) pins should be connected at the load or at the point
where regulation is required (see Fig. B).
Rload
Vin
CONTROL
INPUT
Vin
(+)
Vin
(
-
)
ON
/
OFF
Vout
(+)
Vout
(
-
)
TRIM
SENSE
(+)
SENSE
(
-
)
(
Top View
)
UIQ
48
Converter
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Fig. B: Remote sense circuit configuration.
CAUTION
If remote sensing is not utilized, the SENSE (-) pin must be connected to the Vout (-) pin (Pin 4), and the SENSE (+) pin
must be connected to the Vout (+) pin (Pin 8) to ensure the converter will regulate at the specified output voltage. If these
connections are not made, the converter will deliver an output voltage that is higher than the specified data sheet value.
Because the sense leads carry minimal current, large traces on the end-user board are not required. However, sense traces
should be run side by side and located close to a ground plane to minimize system noise and ensure optimum performance.
The converter’s output overvoltage protection (OVP) senses the voltage across Vout (+) and Vout (-), and not across the
sense lines, so the resistance (and resulting voltage drop) between the output pins of the converter and the load should be
minimized to prevent unwanted triggering of the OVP.
When utilizing the remote sense feature, care must be taken not to exceed the maximum allowable output power capability
of the converter, which is equal to the product of the nominal output voltage and the allowable output current for the given
conditions.
When using remote sense, the output voltage at the converter can be increased by as much as 10% above the nominal
rating in order to maintain the required voltage across the load. Therefore, the designer must, if necessary, decrease the
maximum current (originally obtained from the derating curves) by the same percentage to ensure the converter’s actual
output power remains at or below the maximum allowable output power.
3.4. OUTPUT VOLTAGE ADJUST /TRIM (PIN 6)
The output voltage can be adjusted up 10% or down 20%, relative to the rated output voltage by the addition of an
externally connected resistor.
The TRIM pin should be left open if trimming is not being used. To minimize noise pickup, a 0.1 µF capacitor is connected
internally between the TRIM and SENSE (-) pins.
To increase the output voltage, refer to Fig. C. A trim resistor, RT-INCR, should be connected between the TRIM (Pin 6) and
SENSE (+) (Pin 7), with a value of:
kΩ 10.22
1.225Δ
626-Δ)V5.11(100
R NOM-O
INCR-T
where,
INCRTR
Required value of trim-up resistor kΩ]
NOMOV
Nominal value of output voltage [V]
100X
V)V(V
Δ NOM- O
NOM-OREQ-O
[%]
REQOV
Desired (trimmed) output voltage [V].
When trimming up, care must be taken not to exceed the converter‘s maximum allowable output power. See the previous
section for a complete discussion of this requirement.
100
10
Rw
Rw
Rload
Vin
Vin
(+)
Vin
(
-
)
ON
/
OFF
Vout
(+)
Vout
(
-
)
TRIM
SENSE
(+)
SENSE
(
-
)
(
Top View
)
UIQ
48
Converter
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Fig. C: Configuration for increasing output voltage.
To decrease the output voltage (Fig. D), a trim resistor, RT-DECR, should be connected between the TRIM (Pin 6) and SENSE(-
) (Pin 5), with a value of:
10.22
|Δ|511
RDECRT
[kΩ]
where,
DECRTR
Required value of trim-down resistor [kΩ] and
Δ
is defined above.
NOTE: The above equations for calculation of trim resistor values match those typically used in conventional industry-
standard quarter-bricks.
Fig. D: Configuration for decreasing output voltage.
Trimming/sensing beyond 110% of the rated output voltage is not an acceptable design practice, as this condition could
cause unwanted triggering of the output overvoltage protection (OVP) circuit. The designer should ensure that the difference
between the voltages across the converter’s output pins and its sense pins does not exceed 10% of VOUT(NOM), or:
X NOM-O SENSESENSEOUTOUT 10%V)](V)([V)](V)([V
[V]
This equation is applicable for any condition of output sensing and/or output trim.
Rload
Vin
Vin
(+)
Vin
(
-
)
ON
/
OFF
Vout
(+)
Vout
(
-
)
TRIM
SENSE
(+)
SENSE
(
-
)
R
T
-
INCR
(
Top View
)
UIQ
48
Converter
Rload
Vin
Vin
(+)
Vin
(
-
)
ON
/
OFF
Vout
(+)
Vout
(
-
)
TRIM
SENSE
(+)
SENSE
(
-
)
R
T
-
DECR
(
Top View
)
UIQ
48
Converter
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4. PROTECTION FEATURES
4.1. INPUT UNDERVOLTAGE LOCKOUT (UVLO)
Input undervoltage lockout is standard with this converter. The converter will shut down when the input voltage drops
below a pre-determined voltage.
The input voltage must be typically 17.2V for the converter to turn on. Once the converter has been turned on, it will
shut off when the input voltage drops typically below 15.5V. This feature is beneficial in preventing deep discharging of
batteries used in telecom applications.
4.2. OUTPUT OVERCURRENT PROTECTION (OCP)
The converter is protected against overcurrent or short circuit conditions. Upon sensing an overcurrent condition, the
converter will shut down after entering the constant current mode of operation, regardless of the value of the output
voltage.
Once the converter has shut down, it will enter hiccup mode with attempt to restart every 500 ms until the overload or
short circuit conditions are removed.
4.3. OUTPUT OVERVOLTAGE PROTECTION (OVP)
The converter will shut down if the output voltage across Vout(+) and Vout(-) exceeds the threshold of the OVP circuitry.
Once the converter has shut down, it will attempt to restart every 500 ms until the OVP condition is removed.
4.4. OVERTEMPERATURE PROTECTION (OTP)
The converter will shut down under an overtemperature condition to protect itself from overheating caused by
operation outside the thermal derating curves, or operation in abnormal conditions. The converter will automatically
restart after it has cooled to a safe operating temperature.
4.5. SAFETY REQUIREMENTS
The converters are safety approved to UL/CSA60950-1 2nd Ed, EN60950-1 2nd Ed, and IEC60950-1 2nd Ed. Basic
Insulation is provided between input and output.
The converters have no internal fuse. To comply with safety agencies requirements, an input line fuse must be used
external to the converter. The fuse must not be placed in the grounded input line.
The UIQ48 converter is UL approved for a fuse rating of 20 Amps.
4.6. ELECTROMAGNETIC COMPATIBILITY (EMC)
EMC requirements must be met at the end-product system level, as no specific standards dedicated to EMC
characteristics of board mounted component dc-dc converters exist. However, Bel Power Solutions tests its converters
to several system level standards, primary of which is the more stringent EN55022, Information technology equipment
- Radio disturbance characteristics - Limits and methods of measurement.
An effective internal LC differential filter significantly reduces input reflected ripple current, and improves EMC.
With the addition of an external filter, the UIQ48T48050 converter will pass the requirements of Class B conducted
emissions per EN55022 and FCC requirements. Refer to Figures 18 – 20 for typical performance with external filter.
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4.7. STARTUP INFORMATION (USING NEGATIVE ON/OFF)
Scenario #1: Initial Startup From Bulk Supply
ON/OFF function enabled, converter started via application of VIN. See Figure E.
Time
Comments
t0
ON/OFF pin is ON; system front-end power is toggled on, VIN to converter begins to rise.
t1
VIN crosses undervoltage Lockout protection circuit threshold; converter enabled.
t2
Converter begins to respond to turn-on command (converter turn-on delay).
t3
Converter VOUT reaches 100% of nominal value.
For this example, the total converter startup time (t3- t1) is typically 100 ms.
Fig. E: Startup scenario #1.
Scenario #2: Initial Startup Using ON/OFF Pin
With VIN previously powered, converter started via ON/OFF pin. See Figure F.
Time
Comments
t0
VIN at nominal value.
t1
Arbitrary time when ON/OFF pin is enabled (converter enabled).
t2
End of converter turn-on delay.
t3
Converter VOUT reaches 100% of nominal value.
For this example, the total converter startup time (t3- t1) is typically 100 ms.
Fig. F: Startup scenario #2.
VIN
ON/OFF
STATE
VOUT
t
t0t1t2t3
ON
OFF
ON/OFF
STATE
VOUT
t0t1t2t3
ON
OFF
VIN
t
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5. CHARACTERIZATION
5.1. GENERAL INFORMATION
The converter has been characterized for many operational aspects, to include thermal derating (maximum load current
as a function of ambient temperature and airflow), efficiency, startup and shutdown parameters, output ripple and noise,
transient response to load step-change, overcurrent, and short circuit.
The following pages contain specific plots or waveforms associated with the converter. Additional comments for
specific data are provided below.
5.2. TEST CONDITIONS
All data presented were taken with the converter soldered to a test board, specifically a 0.060” thick printed wiring
board (PWB) with four layers. The top and bottom layers were not metalized. The two inner layers, comprised of two-
ounce copper, were used to provide traces for connectivity to the converter.
The lack of metallization on the outer layers as well as the limited thermal connection ensured that heat transfer from
the converter to the PWB was minimized. This provides a worst-case but consistent scenario for thermal derating
purposes.
All measurements requiring airflow were made in the vertical and horizontal wind tunnel using Infrared (IR) thermography
and thermocouples for thermometry.
Ensuring components on the converter do not exceed their ratings is important to maintaining high reliability. If one
anticipates operating the converter at or close to the maximum loads specified in the derating curves, it is prudent to
check actual operating temperatures in the application. Thermographic imaging is preferable; if this capability is not
available, then thermocouples may be used. The use of AWG #40 gauge thermocouples is recommended to ensure
measurement accuracy. Careful routing of the thermocouple leads will further minimize measurement error. Refer to
Figure H for the optimum measuring thermocouple location.
5.3. THERMAL DERATING – AIR COOLED
Load current vs. ambient temperature and airflow rates are given in Figures 1 for converter w/o baseplate / heat
spreader, and in Figures 5 for converter with baseplate / heat spreader equipped with a .45” finned heat sink. Ambient
temperature was varied between 25°C and 85°C, with airflow rates from 30 to 500LFM (0.15 to 2.5m/s) and with
VIN=48V.
Load current vs. ambient temperature and airflow rates are given in Figure 3 for a converter w/o baseplate / heat
spreader. Ambient temperature was varied between 25°C and 85°C, with airflow rates from 30 to 500LFM (0.15 to
2.5m/s) and with VIN=24V.
Note that the use of baseplate / heat spreader alone without heatsink or attachment to cold plate provides lower power
rating than open frame due to the restriction of airflow across the module.
For each set of conditions, the maximum load current was defined as the lowest of:
(i) The output current at which any FET junction temperature does not exceed a maximum temperature of 125°C
as indicated by the thermal measurement, the user should design for TB ≤ 105°C.
(ii) The output current at which the temperature at the thermocouple locations TC1 and TC2 do not exceed 125°C
(Figure G).
(iii) The nominal rating of the converter (48A/240W).
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Fig. G: Locations of the thermocouples for thermal testing.
5.4. EFFICIENCY
Figure 7 shows the efficiency vs. load current plot for ambient temperature (TA) of 25ºC and for converter w/o baseplate
/ heat spreader, air flowing from pin 3 to pin 1 at a rate of 300LFM (1.5m/s) with vertically mounting and input voltages
of 18V, 24V, 36V, 48V, 60V and 75V.
5.5. POWER DISSIPATION
Figure 8 shows the power dissipation vs. load current plot for ambient temperature (TA) of 25ºC and for converter w/o
baseplate / heat spreader, air flowing from pin 3 to pin 1 at a rate of 300 LFM (1.5 m/s) with vertically mounting and
input voltages of 18V, 24V, 36V, 48V, 60V and 75V.
5.6. STARTUP
Output voltage waveforms, during the turn-on transient using the ON/OFF pin for full rated load currents (resistive load)
are shown with and without external load capacitance in Figure 9 and 10, respectively.
5.7. RIPPLE AND NOISE
Figure 13 shows the output voltage ripple waveform, measured at full rated load current with a 10µF tantalum and a
1µF ceramic capacitor across the output. Note that all output voltage waveforms are measured across the 1µF ceramic
capacitor.
The input reflected-ripple current waveforms are obtained using the test setup shown in Figure 14.
The corresponding waveforms are shown in Figure 15 and Figure 16.
Fig. 1: Available load current vs. ambient air temperature and
airflow rates for UIQ48T48050 converter w/o baseplate
mounted vertically with air flowing from pin 3 to pin 1,
MOSFET temperature
≤
125°C, Vin=48V
Fig. 2: Power derating vs. ambient air temperature and
airflow rates for UIQ48T48050 converter w/o baseplate
mounted vertically with air flowing from pin 3 to pin 1,
MOSFET temperature
≤
125°C, Vin=48V
TC1
TC2
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Fig. 3: Available load current vs. ambient air temperature and
airflow rates for UIQ48T48050 converter w/o baseplate
mounted vertically with air flowing from pin 3 to pin 1,
MOSFET temperature
≤
125°C, Vin=24V
Fig. 4: Power derating vs. ambient air temperature and
airflow rates for UIQ48T48050 converter w/o baseplate
mounted vertically with air flowing from pin 3 to pin 1,
MOSFET temperature
≤
125°C, Vin=24V
Fig. 5: Available load current vs. ambient air temperature and
airflow rates for UIQ48T48050 converter with baseplate
equipped with .45" finned heatsink mounted vertically with
air flowing from pin 3 to pin 1, MOSFET temperature
≤
125°C, Vin=48V
Fig. 6: Power derating vs. ambient air temperature and
airflow rates for UIQ48T48050 converter with baseplate
equipped with .45" finned heatsink mounted vertically with
air flowing from pin 3 to pin 1, MOSFET temperature
≤
125°C, Vin=48V
Fig. 7: Efficiency vs. load current and input voltage for
UIQ48T48050 converter w/o baseplate mounted vertically
with air flowing from pin 3 to pin 1 at a rate of 300 LFM (1.5
m/s) and Ta = 25°C.
Fig. 8: Power dissipation vs. load current and input voltage
for UIQ48T48050 converter w/o baseplate mounted vertically
with air flowing from pin 3 to pin 1 at a rate of 300 LFM (1.5
m/s) and Ta = 25°C
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Fig. 9: Turn-on transient at full rated load current (resistive)
with Cout 10
μ
F tantalum + 1
μ
F ceramic atVin = 48 V,
triggered via ON/OFF pin. Top trace: ON/OFF signal (2
V/div.). Bottom trace: output voltage (2V/div.). Time scale: 50
ms/div.
Fig. 10: Turn-on transient at full rated load current (resistive)
plus 6000
μ
F at Vin = 48 V, triggered via ON/OFF pin. Top
trace: ON/OFF signal (2V/div.). Bottom trace: output voltage
(2V/div.). Time scale: 50 ms/div.
Fig. 11: Output voltage response to load current step change
(24A – 36A –24A) at Vin = 48 V. Top trace: output
voltage(200mV/div.). Bottom trace: load current (20 A/div.).
Current slew rate: 0.1 A/
μ
s. Co =1
μ
F ceramic + 10
μ
F
tantalum. Time scale: 200
μ
s/div.
Fig. 12: Output voltage response to load current step change
(24 A – 36A –24 A) at Vin = 48V. Top trace: output voltage
(500mV/div.). Bottom trace: load current (10A/div.). Current
slew rate:1A/
μ
s.Co = 1
μ
F ceramic + 6000
μ
F+10uF tantalum.
Time scale: 200
μ
s/div.
Fig. 13: Output voltage ripple (50 mV/div.) at full rated load
current Co = 10
μ
F tantalum + 1
μ
F ceramic and Vin = 48 V.
Time scale: 1
μ
s/div.
Fig. 14: Test setup for measuring input reflected ripple
currents, ic and is.
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Fig. 15: Input reflected ripple current, ic (1 A/div.), measured
at input terminals at full rated load current and Vin = 48 V.
Refer to Fig. 14 for test setup. Time scale: 1
μ
s/div.
Fig. 16: Input reflected ripple current, is (20 mA/div.),
measured through 10
μ
H at the source at full rated load
current and Vin =48 V. Refer to Fig. 14 for test setup. Time
scale: 1
μ
s/div.
Fig. 17: Load current (top trace, 50 A/div.,100 ms/div.) into a10m
Ω
short circuit during restart, at Vin = 48 V. Bottom trace (50
A/div., 10 ms/div.) is an expansion of the on-time portion of the top trace
Fig. 18: Typical input EMI filter circuit to attenuate conducted emissions.
COMP. DES.
DESCRIPTION
C1, C2, C3
2uF, 100V ceramic cap
C6
100uF, 100V electrolytic cap
L1, L2
0.59mH, Pulse P0353NL
C4, C5
4700pF, ceramic cap
C7, C8
4700pF, ceramic cap
C 1 C 2 C 6
L1
C 5
C 4
V in UUT R lo a d
L2
C 3
C 7
C 8
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UIQ48T48050
tech.support@psbel.com
Fig. 19: Vin+ Peak Detector EMI waveform
Fig. 20: Vin- Peak Detector EMI waveform
END OF LIFE
UIQ48T48050
15
Asia-Pacific
+86 755 298 85888
Europe, Middle East
+353 61 225 977
North America
+1 408 785 5200
© 2017 Bel Power Solutions & Protection
BCD.00352_AC
6. PHYSICAL INFORMATION
6.1. UIQ48T PINOUT (THROUGH-HOLE)
TOP VIEW
1.450±0.020 [36.83±0.51]
2.300±0.020 [58.42±0.51]
0.600 [15.24].
0.300 [7.62] 2X
2.000 [50.80]
0.430 [10.92]
0.145 [3.68]
0.150 [3.81]x4
PAD/PIN CONNECTIONS
PAD/PIN #
FUNCTION
1
VIN (+)
2
ON/OFF
3
VIN (-)
4
VOUT (-)
5
VOUT (-) Sense
6
Trim
7
VOUT (+) Sense
8
VOUT (+)
HEIGHT [HT]
MIN
CLEARANCE
[CL]
SPECIAL
FEATURES
D
0.440” [11.18] Max
0.028” [0.71]
0
0.500” +/-0.020
[12.70 +/-0.51]
0.028” [0.71]
B
PIN OPTION
PIN LENGTH [PL]
±0.005” [±0.13]
A
0.188” [4.78]
B
0.145” [3.68]
CL
PL CUSTOMER PCB
HT(-xDxBx)
SIDE VIEW
CL
PL CUSTOMER PCB
HT(-xDx0x)
SIDE VIEW
NO BASEPLATE/HEAT SPREADER
WITH BASEPLATE/HEAT SPREADER
UIQ48T Platform Notes
All dimensions are in inches [mm]
Pins 1,2,3,5,6,7 are Ø 0.040” [1.02] with Ø 0.076” [1.93] shoulder
Pins 4 and 8 are Ø 0.062” [1.57] with are Ø 0.096” [2.44] shoulder
Pin Material: Brass Alloy 360
Pin Finish: Tin over Nickel
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UIQ48T48050
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6.2. BASEPLATE / HEAT SPREADER INTERFACE INFORMATION
DEPTH NOTE:
SCREW LENGTH MUST BE SELECTED TO
LIMIT HEAT SPREADER PENETRANTION TO 0.08[2.0] MAX.
2.300± 0.020 [58.42± 0.51]
.220 [5.59]
1.860 [47.24]
1.03[26.17]0.210[5.33] 1.450±0.020[36.83±0.51]
M3 x 0.5P 2x
SEE DEPTH NOTE
PIN 1 INDICATOR
PIN 1
6.3. CONVERTER PART NUMBERING/ORDERING INFORMATION
PRODUCT
SERIES
INPUT
VOLTAGE
MOUNTING
SCHEME
RATED
CURRENT
OUTPUT
VOLTAGE
ON/OFF
LOGIC
MAXIMUM
HEIGHT [HT]
PIN LENGTH
[PL]
SPECIAL
FEATURES
RoHS
UIQ
48
T
48
050
-
N
D
A
B
G
Quarter
Brick
Format
18-75 V
T
Through-
hole
48
48 ADC
050
5.0 V
N
Negative
P
Positive
D
0.440”
for
–xDx0x
0.520”
for
–xDxBx
Through hole
A 0.188”
B 0.145”
0
Standard
B
Baseplate
option
G RoHS
compliant
for all six
substances
The example above describes P/N UIQ48T48050-NDABG: 18-75V input, through-hole, 48A@5V output, negative ON/OFF logic,
maximum height of 0.52”, 0.188” pin length with baseplate / heat spreader option, RoHS compliant for all 6 substances. Consult
factory for availability of other options.
END OF LIFE
UIQ48T48050
17
Asia-Pacific
+86 755 298 85888
Europe, Middle East
+353 61 225 977
North America
+1 408 785 5200
© 2017 Bel Power Solutions & Protection
BCD.00352_AC
7. SOLDERING INFORMATION
7.1. THROUGH HOLE SOLDERING
Below table lists the temperature and duration for wave soldering
WAVE SOLDER PROCESS SPECIFICATION
PB-FREE
SN/PB EUTECTIC
Maximum Preheat Temperature
130°C
110°C
Maximum Pot Temperature
265°C
255°C
Maximum Solder Dwell Time
7 Sec
6 Sec
7.2. LEAD FREE REFLOW SOLDERING
The unit is Paste In Hole (PIH) compatible. The profile below is provided as a guideline for Pb-free reflow only. There
are many other factors which will affect the result of reflow soldering. Please check with your process engineer
thoroughly.
Fig. 21: Lead Free solder reflow profile
For PIH reflow process, the unit has a MSL rating of 1.
NUCLEAR AND MEDICAL APPLICATIONS - Products are not designed or intended for use as critical components in life support
systems, equipment used in hazardous environments, or nuclear control systems.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change
depending on the date manufactured. Specifications are subject to change without notice.
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